Micro light emitting diode device package module and display device

Abstract

This application provides a micro-LED device packaging module and a display device. The micro-LED chip in the packaging module includes multiple spaced-apart pixel units. Multiple light-transmitting units of the packaging module correspond one-to-one with the multiple pixel units and are spaced apart. Each light-transmitting unit is disposed on the light-emitting surface side of the multiple pixel units, and each light-transmitting unit is an inclined structure extending outward in a direction away from the micro-LED chip. A gap region is formed between two adjacent light-transmitting units. A filling structure is located on the light-emitting surface side of the multiple pixel units and disposed within each gap region. Light emitted from the pixel units is incident into the light-transmitting unit and reflected at the interface between the light-transmitting unit and the filling structure. Based on this, the packaging module and display device of this application have superior display performance.

Description

Technical Field

[0001] This application relates to the field of semiconductor light-emitting technology, specifically to a micro light-emitting diode device packaging module and display device. Background Technology

[0002] Micro-LED (Micro-Light Emitting Diode) display technology miniaturizes and arrays the traditional LED (Light Emitting Diode) structure, and uses CMOS (Complementary Metal Oxide Semiconductor) or TFT (Thin Film Transistor) to create the driving circuit, thereby achieving addressing control and individual driving of each pixel structure.

[0003] The display performance of Micro-LED display modules based on related technologies is not good, and there is room for improvement. Utility Model Content

[0004] The purpose of this application is to provide a miniature light-emitting diode (LED) device packaging module and a display device.

[0005] To address the aforementioned problems, firstly, this application provides a miniature light-emitting diode (LED) device packaging module, comprising:

[0006] A miniature light-emitting diode chip, comprising multiple pixel units spaced apart;

[0007] Multiple light-transmitting units are arranged in a one-to-one correspondence with multiple pixel units and spaced apart. Each light-transmitting unit is disposed on the light-emitting surface side of the multiple pixel units, and each light-transmitting unit is an inclined structure that expands outward in a direction away from the micro light-emitting diode chip; wherein a gap region is formed between two adjacent light-transmitting units; and

[0008] A filling structure is located on the light-emitting surface side of the plurality of pixel units and disposed in each of the gap regions. Light emitted by the pixel units is incident into the light-transmitting unit and is reflected at the interface between the light-transmitting unit and the filling structure.

[0009] Optionally, the packaging module further includes:

[0010] A light-transmitting cover plate is disposed and connected to the side of the light-transmitting unit opposite to the micro light-emitting diode chip, and supports the light-transmitting unit.

[0011] Optionally, the filling structure includes:

[0012] Multiple filling units, each of which is disposed in a gap region, wherein the refractive index of the light-transmitting unit is greater than the refractive index of the adjacent filling unit.

[0013] Optionally, the filling unit comprises a low extinction structure; or,

[0014] The filling unit includes a high extinction structure for absorbing light emitted by the pixel unit that propagates from the light-emitting surface and the interface between the high extinction structure.

[0015] Optionally, the plurality of light-transmitting units and the plurality of filling units form an encapsulation structure; wherein,

[0016] The encapsulation structure is connected to the light-emitting surface via an adhesive structure; or, the filling unit includes an adhesive structure, and the encapsulation structure is connected to the light-emitting surface via the filling unit.

[0017] Optionally, the filling structure further includes:

[0018] Multiple sidewall units, each sidewall unit being disposed in a gap region and surrounding and attached to the side of a light-transmitting unit, the sidewall unit forming a reflective structure and used to reflect light incident into the light-transmitting unit to the outside of the encapsulation module.

[0019] Optionally, the plurality of the light-transmitting units form a microlens array structure.

[0020] Optionally, at least some of the light-transmitting units may comprise quantum dot structures.

[0021] Optionally, each of the light-transmitting units includes a top surface connected to the light-emitting surface, wherein the absolute value of the difference in refractive index between the light-emitting surface and the top surface is less than the absolute value of the difference in refractive index between the light-emitting surface and air.

[0022] Secondly, this application also provides a display device, including a micro light-emitting diode device packaging module as described in any of the preceding claims.

[0023] Based on the above technical solution, in the micro LED device packaging module and display device provided in this application, the light emitted by the pixel unit of the micro LED chip enters the light-transmitting unit from the light-emitting surface, and is reflected at the interface between the light-transmitting unit and the filling structure, and finally exits outside the packaging module. Since the light emitted by the pixel unit propagates outward from the light-emitting surface in a wide-viewing-angle light pattern, under the constraint of the light-transmitting unit of the inclined structure that expands outward in the direction away from the micro LED chip in this application, the wide-viewing-angle light pattern is transformed into a positive-viewing-angle light pattern and propagates to the outside of the packaging module. The positive-viewing-angle light pattern makes the packaging module of this application have higher color and brightness consistency at different angles and better viewing angle consistency, thereby improving the display effect of the packaging module and display device. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely some embodiments of this application. Those skilled in the art can obtain other drawings based on these drawings without any creative effort.

[0025] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0026] Figure 1 This is a schematic diagram of the structure of the miniature light-emitting diode device packaging module provided in the embodiments of this application;

[0027] Figure 2 This is a schematic diagram of the structure of the miniature light-emitting diode chip provided in the embodiments of this application;

[0028] Figure 3 This is a schematic diagram of the optical path of the micro light-emitting diode device packaging module provided in the embodiments of this application;

[0029] Figure 4 This is a schematic diagram of the structure of the driver chip provided in the embodiments of this application;

[0030] Figure 5 This is a schematic diagram of the structure of the miniature light-emitting diode device provided in the embodiments of this application;

[0031] Figure 6 This is another structural schematic diagram of the micro light-emitting diode device packaging module provided in the embodiments of this application;

[0032] Figure 7 This is another structural schematic diagram of the micro light-emitting diode device packaging module provided in the embodiments of this application;

[0033] Figure 8This is another optical path diagram of the micro light-emitting diode device packaging module provided in the embodiments of this application;

[0034] Figure 9 This is another optical path schematic diagram of the micro light-emitting diode device packaging module provided in the embodiments of this application;

[0035] Figure 10 A schematic diagram of the structure of a display device provided in an embodiment of this application. 。

[0036] The reference numerals in the attached figures are as follows:

[0037] 10. Packaging module; 20. Miniature light-emitting diode device; 30. Display device; 100. Miniature light-emitting diode chip; 200. Light-transmitting unit; 300. Gap region; 400. Driver chip; 500. Light-transmitting cover plate; 600. Filling structure; 101. Pixel unit; 102. Light-emitting surface; 111. First substrate; 112. Buffer layer; 113. First semiconductor layer; 114. Light-emitting layer; 115. Second semiconductor layer; 116. Current diffusion layer; 117. First electrode layer; 118. Second electrode layer; 119. Solder joint structure; 211. Top surface; 212. Side surface; 213. Bottom surface; 411. Second substrate; 412. Driver circuit; 413. Driver pad; 414. Electrical connection part; 610. Filling unit; 620. Sidewall unit. Detailed Implementation

[0038] The following will refer to the appendices in this application. Figure 1 To be continued Figure 10 The technical solutions in this application are clearly and completely described in conjunction with the embodiments. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0039] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0040] With the continuous development of Micro-LED display technology, it is gradually moving towards smaller size and higher resolution. Micro-LED micro-display modules are often encapsulated using encapsulating adhesives or films. However, the pixel units 101 in these modules tend to propagate light outwards at a relatively wide viewing angle. This can cause variations in brightness and color when viewed from different angles, resulting in a poor user experience.

[0041] To solve the above-mentioned technical problems, this application provides a micro light-emitting diode device packaging module 10 (hereinafter referred to as packaging module 10) and a display device 30. The light-transmitting unit 200 of the packaging module 10 can narrow the light pattern emitted by the pixel unit 101 of the micro light-emitting diode chip 100, so that the light emitted by the pixel unit 101 changes from a wide viewing angle light pattern to a positive viewing angle light pattern, thereby improving the display effect of the packaging module 10 and the display device 30.

[0042] The following detailed description is based on specific embodiments. It should be noted that the embodiments of this application can be presented in various forms, and some examples will be described below.

[0043] Please refer to Figure 1 , Figure 1 This is a schematic diagram of the structure of the micro light-emitting diode device packaging module 10 provided in the embodiment of this application. The packaging module 10 includes a micro light-emitting diode chip 100, a plurality of light-transmitting units 200 and a filling structure 600.

[0044] The micro LED chip 100 includes a plurality of spaced-apart pixel units 101, each pixel unit 101 emitting light. A plurality of light-transmitting units 200 are disposed on one side of the light-emitting surface 102 of the pixel units 101, forming a light-transmitting structure. The plurality of light-transmitting units 200 are spaced apart, and the interval between the plurality of light-transmitting units 200 is equal to the interval between the plurality of pixel units 101. The plurality of light-transmitting units 200 are arranged in a one-to-one correspondence with the plurality of pixel units 101, forming a light-transmitting structure. Each light-transmitting unit 200 is an inclined structure that expands outward in a direction away from the micro LED chip 100. A gap region 300 is formed between two adjacent light-transmitting units 200, and a filling structure 600 is located on one side of the light-emitting surface 102 of the plurality of pixel units 101 and disposed within each gap region 300. Light emitted from the pixel units 101 is incident into the light-transmitting units 200 and reflected at the interface between the light-transmitting units 200 and the filling structure 600.

[0045] It is understood that the micro LED chip 100 includes a buffer layer 112, a plurality of spaced pixel units 101 disposed on one side of the buffer layer 112, and a filling structure 600 and a plurality of light-transmitting units 200 disposed on the other side of the buffer layer 112. Please refer to... Figure 2 , Figure 2 This is a schematic diagram of the structure of a micro LED chip 100 provided in an embodiment of this application. The micro LED chip 100 includes a first substrate 111, and a buffer layer 112, a first semiconductor layer 113, a light-emitting layer 114, a second semiconductor layer 115, a current diffusion layer 116, a first electrode layer 117, a second electrode layer 118, and a solder joint structure 119 formed on the first substrate 111. The first semiconductor layer 113, the light-emitting layer 114, the second semiconductor layer 115, the current diffusion layer 116, the first electrode layer 117, and the solder joint structure 119 connected thereto can form a plurality of spaced pixel units 101. When the micro LED chip 100 is bonded to the driving chip 400 (described later), the first substrate 111 can be peeled off, at which point the buffer layer 112 is located on the outermost layer of the micro LED chip 100.

[0046] It is understood that the buffer layer 112 includes a first surface and a second surface disposed opposite to each other along the thickness direction of the micro LED chip 100. A plurality of pixel units 101 are disposed on one side of the first surface and connected to it. A plurality of light-transmitting units 200 are disposed on one side of the second surface and connected to it. Light emitted by the pixel units 101 is emitted from the second surface, which serves as the light-emitting surface 102 of the plurality of pixel units 101. Therefore, the light-transmitting structure is disposed on one side of the light-emitting surface 102 of the buffer layer 112.

[0047] It is understood that the light-transmitting structure and light-transmitting unit 200 have high light transmittance, allowing light emitted from pixel unit 101 to pass through the light-transmitting structure and light-transmitting unit 200 and be emitted to the outside. The shape and distribution of the light-transmitting unit 200 are consistent with the shape and distribution of the pixel unit 101. For example, when the pixel openings of pixel unit 101 are arranged in a circular pattern, the light-transmitting unit 200 is a frustum or cylindrical structure. Each light-transmitting unit 200 includes a top surface 211, a side surface 212, and a bottom surface 213. The top surface 211 is connected to the second surface (i.e., the light-emitting surface 102) of the buffer layer 112. The side surface 212 forms an interface with the filling structure 600. The side surface 212 is located between the top surface 211 and the bottom surface 213. The side surface 212 is inclined outward from the direction from the top surface 211 to the bottom surface 213. The projection of the bottom surface 213 on the buffer layer 112 covers the projection of the top surface 211 on the buffer layer 112. The light-transmitting unit 200 forms an inclined structure that is narrow near the pixel unit 101 and wide away from the pixel unit 101 (i.e., narrow at the top and wide at the bottom).

[0048] It is understood that the filling structure 600 can be, but is not limited to, air, colloid, metal, etc. The filling structure 600 can completely fill each gap region 300, or the filling structure 600 can fill a portion of the space in each gap region 300. The filling structure 600 includes an adjacent region adjacent to the side surface 212 of the light-transmitting unit 200, which has the characteristic of easily forming reflections, making it easier for light to be reflected at the interface between the light-transmitting unit 200 and the filling structure 600. For example, please refer to... Figure 3 , Figure 3 This is a schematic diagram of the optical path of the micro-LED device packaging module 10 provided in this application embodiment. The second surface of the buffer layer 112 forms the light-emitting surface 102, and the top surface 211 of the light-transmitting unit 200 forms the incident surface. The light emitted by the pixel unit 101 is emitted outward from the second surface of the buffer layer 112—that is, the light-emitting surface 102—and is refracted at the incident surface, reflected at the side surface 212 of the light-transmitting unit 200, and finally propagates to the outside of the packaging module 10. Since the light-transmitting unit 200 is an inclined structure that expands outward in the direction away from the micro-LED chip 100, the light-transmitting unit 200 can constrain the wide-viewing-angle light pattern emitted by the pixel unit 101 and form a positive-viewing-angle light pattern. The packaging module 10 has high consistency in color and brightness at different angles and good viewing angle consistency.

[0049] It is understood that, in some examples, the light-transmitting unit 200 may be, but is not limited to, materials such as silicon oxide, silicon nitride, niobium oxide, zirconium oxide, polymethyl methacrylate (PMMA), polyvinyl chloride (PVCD), or mixtures thereof. In some examples, the light-transmitting structure and its multiple light-transmitting units 200 are bonded to the second surface of the buffer layer 112 via an adhesive structure. In other examples, the light-transmitting structure and its multiple light-transmitting units 200 are formed on the second surface of the buffer layer 112 using conventional microstructure array fabrication techniques such as plasma-enhanced chemical vapor deposition (PECVD), spin coating, photolithography, etching, inkjet printing, and nanoimprinting.

[0050] In this embodiment of the micro-LED device packaging module 10, the light emitted from the pixel unit 101 of the micro-LED chip 100 enters the light-transmitting unit 200 from the light-emitting surface 102, and is reflected at the interface between the light-transmitting unit 200 and the filling structure 600, and finally exits outside the packaging module 10. Since the light emitted by the pixel unit 101 propagates towards the light-emitting surface 102 with a wide viewing angle, under the constraint of the light-transmitting unit 200 of the inclined structure that expands outward in the direction away from the micro-LED chip 100 in this application, the wide viewing angle light pattern is transformed into a positive viewing angle light pattern and propagates to the outside of the packaging module 10. The positive viewing angle light pattern makes the color and brightness of the packaging module 10 of this application more consistent at different angles and the viewing angle consistency better, thereby making the display effect of the packaging module 10 better.

[0051] It should be noted that the accompanying drawings in this application are only for illustrating the packaging module 10 and are not intended to limit the structure of the packaging module 10.

[0052] Please refer to this again. Figure 2 The first substrate 111 of the micro LED chip 100 supports the film structure thereon. The first substrate 111 can be a sapphire substrate, a silicon substrate, or a silicon carbide substrate, etc. After the micro LED chip 100 is bonded to the driver chip 400 (described later), the first substrate 111 can be peeled off. The buffer layer 112 can alleviate the stress caused by lattice mismatch and thermal expansion coefficient mismatch between its upper film layer and the first substrate 111. The buffer layer 112 can be, but is not limited to, a silicon nitride layer, a silicon oxide layer, a gallium nitride layer, or an aluminum nitride layer. The light-emitting layer 114 is a quantum well layer, for example, an indium gallium nitride quantum well layer or an indium gallium nitride / gallium nitride multi-quantum well layer. The first semiconductor layer 113 is one of an N-type semiconductor layer and a P-type semiconductor layer, and the second semiconductor layer 115 is the other of an N-type semiconductor layer and a P-type semiconductor layer. The N-type semiconductor layer is an N-type gallium nitride layer or an N-type gallium arsenide layer, and the P-type semiconductor layer is a P-type gallium nitride layer or a P-type aluminum gallium nitride layer. A first electrode layer 117 is disposed on the side of the second semiconductor layer 115 opposite to the light-emitting layer 114 and is electrically connected to the second semiconductor layer 115. A second electrode layer 118 is disposed in the exposed area of ​​the first semiconductor layer 113 and is electrically connected to the first semiconductor layer 113. The current diffusion layer 116 can distribute the current very uniformly throughout the entire first semiconductor layer 113, thereby effectively improving the luminous efficiency of the micro LED chip 100. Solder joint structure 119 is connected to the first electrode layer 117 and the second electrode layer 118. Solder joint structure 119 can be made of metals such as indium (In), aluminum (Al), tin (Sn), silver (Ag), gold (Au), gold-tin alloy, nickel-gold alloy, etc. Solder joint structure 119 is used to bond with driver chip 400.

[0053] In some examples, the package module 10 also includes a driver chip 400, which is bonded to the micro LED chip 100. Please refer to [reference needed]. Figure 4 and Figure 5 , Figure 4 This is a schematic diagram of the structure of the driver chip 400 provided in the embodiments of this application. Figure 5This is a schematic diagram of the structure of the micro-light-emitting diode device 20 provided in this application embodiment. The driving chip 400 includes a second substrate 411, a driving circuit 412 formed on the second substrate 411, and one or more driving pads 413. The driving circuit 412 can be, but is not limited to, a CMOS circuit structure or a TFT circuit structure. The driving pads 413 can be, but are not limited to, made of metals such as In, Al, Sn, Ag, Au, gold-tin alloy, and nickel-gold alloy. The driving chip 400 also includes an electrical connection portion 414 electrically connected to a circuit board. One or more driving pads 413 are configured and bonded one-to-one with one or more solder joint structures 119 of the micro-light-emitting diode chip 100, and the driving chip 400 and the micro-light-emitting diode chip 100 are bonded together to form the micro-light-emitting diode device 20. At this time, the first substrate 111 of the micro-light-emitting diode chip 100 can be peeled off, and the thickness of the micro-light-emitting diode device 20 is thinner.

[0054] Please refer to this again. Figure 1 In this embodiment, multiple light-transmitting units 200 form a microlens array (MLA) structure. Each light-transmitting unit 200 is a microlens structure at the micrometer scale, and multiple micrometer-scale microlenses are arranged in a specific array. This embodiment can be formed using, but is not limited to, thermal reflow, nanoimprinting, inkjet printing, laser direct writing, and self-assembly processes. Because each light-transmitting unit 200 in the microlens array structure is at the micrometer scale, the unit size of the microlens array structure is small, resulting in high integration and improving the compactness of the packaging module 10. Simultaneously, the microlens array structure has collimation and focusing functions, enabling beam shaping and homogenization, improving beam uniformity and quality.

[0055] Please refer to this again. Figure 1 The packaging module 10 in this embodiment of the application also includes a light-transmitting cover plate 500. The light-transmitting cover plate 500 is disposed on the side of the filling structure 600, the light-transmitting structure and the light-transmitting unit 200 that is away from the micro light-emitting diode chip 100. The light-transmitting cover plate 500 is connected to the filling structure 600, the light-transmitting structure and the light-transmitting unit 200, and supports the filling structure 600, the light-transmitting structure and the light-transmitting unit 200.

[0056] It is understandable that the light-transmitting cover plate 500 serves as the base for the light-transmitting structure and the light-transmitting unit 200. The light-transmitting cover plate 500 has high light transmittance and can be, but is not limited to, transparent glass, anti-reflective glass, transparent polyimide (TPI), etc.

[0057] In this embodiment, the encapsulation module 10 is provided with a light-transmitting cover plate 500 to support the light-transmitting unit 200. The light-transmitting unit 200 and the light-transmitting cover plate 500 are more tightly integrated, resulting in better stability of the light-transmitting unit 200. Furthermore, the light-transmitting cover plate 500 can also protect the light-transmitting unit 200 and the micro-LED chip 100, improving the waterproof and impact-resistant performance of the encapsulation module 10. Moreover, the light-transmitting cover plate 500, the light-transmitting unit 200 disposed thereon, and the filling structure 600 together form a microstructure array encapsulation cover plate. Through the encapsulation integration method, the viewing angle and light pattern of the micro-LED chip 100 can be adjusted.

[0058] In some examples, the filling structure 600 includes a plurality of filling units 610, each filling unit 610 being disposed within a gap region 300. The refractive index of the light-transmitting unit 200 is greater than that of the adjacent filling unit 610, such that light emitted from the light pixel unit 101 is incident into the light-transmitting unit 200 and reflected at the interface between the light-transmitting unit 200 and the filling unit 610.

[0059] It is understood that the refractive index of the light-transmitting unit 200 is greater than that of the adjacent filling unit 610, and the difference between their refractive indices is greater than or equal to 0.1. In this case, the refractive index difference between the light-transmitting unit 200 and the filling unit 610 is significant. After light enters the light-transmitting unit 200, it can be reflected from the side 212 adjacent to the light-transmitting unit 200 and the filling unit 610 and exit outside the encapsulation module 10. This light is less likely to pass through the side 212 and enter the filling unit 610. Therefore, this embodiment of the application allows more light to exit outside the encapsulation module 10 after passing through the light-transmitting unit 200, further improving the light extraction efficiency.

[0060] It is understood that the filling structure 600 and filling unit 610 can be filled in the gap region 300 using conventional microstructure array fabrication processes such as spin coating, photolithography, etching, inkjet printing, and nanoimprinting. Furthermore, the surfaces of the filling structure 600 and filling unit 610 near the micro-LED chip 100 can be connected to the second surface of the buffer layer 112. In some examples, the surfaces of the filling structure 600 and filling unit 610 near the micro-LED chip 100 are flush with the top surface 211 of the light-transmitting unit 200, and the surfaces of the filling structure 600 and filling unit 610 away from the micro-LED chip 100 are flush with the bottom surface 213 of the light-transmitting unit 200. Thus, the filling structure 600 and the light-transmitting unit 200 can form a neatly arranged microstructure array and a package structure.

[0061] The filling structure 600 of this embodiment can work together with the light-transmitting unit 200 to protect the buffer layer 112, thereby improving the lifespan of the micro LED chip 100. Furthermore, compared to a solution where the gap region 300 does not have a physical structure, the filling structure 600 of this application can also increase the structural strength of the encapsulation structure formed by the filling structure 600 and the light-transmitting unit 200, thus improving the structural stability of the encapsulation module 10.

[0062] In some examples, please refer to Figure 6 , Figure 6 This is another structural schematic diagram of the miniature light-emitting diode device packaging module 10 provided in an embodiment of this application. The filling unit 610 of the filling structure 600 may, but is not limited to, a low extinction structure. For other examples, please refer to... Figure 7 , Figure 7 This is another structural schematic diagram of the micro light-emitting diode device packaging module 10 provided in the embodiments of this application. The filling unit 610 may be, but is not limited to, a high extinction structure. The high extinction structure is used to absorb the light emitted by the pixel unit 101 that propagates from the interface between the buffer layer 112 (or the light-emitting surface 102) and the high extinction structure.

[0063] Understandably, the distinction between low-extinction and high-extinction structures primarily depends on the extinction ratio. The extinction ratio, in an optical system, is the ratio of the light intensity in one polarization direction to the light intensity in another orthogonally polarized direction, usually expressed in dB. Generally, high-extinction structures typically have an extinction ratio above 25 dB, while low-extinction structures typically have an extinction ratio around 10 dB. For example, a low-extinction structure can be, but is not limited to, a low-refractive-index transparent adhesive as the filling medium. Conversely, a high-extinction structure can also be, but is not limited to, a black adhesive as the filling medium.

[0064] In this embodiment, when the filling unit 610 is a low extinction structure, some of the light generated by the pixel unit 101 and propagated through the buffer layer 112 can be reflected at the interface between the buffer layer 112 and the low extinction structure, or the light can pass through the filling unit 610 and exit outside the packaging module 10. In this case, the light is not absorbed, and the brightness of the packaging module 10 can be guaranteed. When the filling unit 610 is a high extinction structure, some of the light generated by the pixel unit 101 and propagated through the buffer layer 112 can be absorbed by the high extinction structure when it is incident on the filling unit 610. Thus, the filling unit 610 can reduce the crosstalk between the light generated from different pixel units 101 after propagation through the buffer layer 112, and improve the light crosstalk defect of the micro light-emitting diode chip 100.

[0065] In this embodiment, multiple light-transmitting units 200 and multiple filling units 610 form an encapsulation structure. In some examples, the encapsulation structure is connected to the buffer layer 112 or the light-transmitting surface 102 via an adhesive structure. In other examples, the filling unit 610 includes an adhesive structure, and the encapsulation structure is connected to the buffer layer 112 or the light-transmitting surface 102 through the adhesive filling unit 610. It is understood that in some examples, the filling unit 610 only fills the gap region 300. In other examples, the filling unit 610 fills the gap region 300 and the gap between the filling unit 610, the light-transmitting unit 200, and the buffer layer 112. In this embodiment, the filling unit 610 serves both to increase the structural strength of the encapsulation module 10 and to provide adhesive fixation. The filling unit 610 is reusable, simplifying the manufacturing process of the encapsulation module 10.

[0066] Please refer to this again. Figure 6 and Figure 7 Please refer to Figure 8 and Figure 9 , Figure 8 This is another optical path diagram of the miniature light-emitting diode device packaging module 10 provided in the embodiments of this application. Figure 9 This is another optical path diagram of the micro LED device packaging module 10 provided in this application embodiment. The filling structure 600 of this application embodiment also includes a sidewall structure, which includes a plurality of sidewall units 620. Each sidewall unit 620 is disposed within the gap region 300, and the sidewall unit 620 surrounds and adheres to the side surface 212 of a light-transmitting unit 200. The sidewall unit 620 is used to form a reflective structure and to reflect light incident into the light-transmitting unit 200 to the outside of the packaging module 10.

[0067] Understandably, in some examples, the filling structure 600 includes only the filling unit 610 and not the sidewall unit 620, in which case the refractive index of the light-transmitting unit 200 is greater than the refractive index of the adjacent filling unit 610. In other examples, the filling structure 600 includes only the sidewall unit 620 and not the filling structure 600, in which case the sidewall unit 620 is attached to the side 212 of the light-transmitting unit 200, and the sidewall unit 620 is disposed within the gap region 300 (the other areas of the gap region 300 are air). Of course, in other examples, the encapsulation module 10 includes both the sidewall unit 620 and the filling structure 600.

[0068] Understandably, the sidewall unit 620 exhibits high reflectivity. The sidewall unit 620 can be, but is not limited to, silver, aluminum, inorganic materials, or mixtures thereof. The sidewall unit 620 can be formed on the side surface 212 of the light-transmitting unit 200 using conventional thin-film deposition and patterning processes such as PECVD, spin coating, evaporation, sputtering, photolithography, and etching. When the sidewall unit 620 is metallic, due to its strong light-reflecting effect, the refractive index of the filling unit 610 can be greater than, less than, or equal to the refractive index of the light-transmitting unit 200, thus allowing for a wider range of choices for the filling unit 610.

[0069] The packaging module 10 in this embodiment of the application, such as Figure 8 and Figure 9 As shown, the light emitted by the pixel unit 101 enters the light-transmitting unit 200 from the second surface of the buffer layer 112 and is reflected by the side wall unit 620. Thus, under the action of the light-transmitting unit 200 and the side wall unit 620, the total internal reflection of light at the light-emitting interface can be reduced, the light emission efficiency can be improved, the angle light pattern can be narrowed and a positive viewing angle light pattern can be formed, and the display effect of the encapsulation module 10 is better.

[0070] Among them, such as Figures 1 to 9 As shown, in some examples, the absolute value of the difference in refractive index between the buffer layer 112, or the light-emitting surface 102, and the top surface 211 of the light-transmitting unit 200, is less than the absolute value of the difference in refractive index between the buffer layer 112, or the light-emitting surface 102, and air. In this case, the light emitted by the pixel unit 101 is more easily refracted into the interior of the light-transmitting unit 200 at the second surface (i.e., the light-emitting surface 102) of the buffer layer 112 and the top surface 211 of the light-transmitting unit 200, rather than reflected into the micro-LED chip 100. Consequently, more light can enter the light-transmitting unit 200, improving the light extraction efficiency of the packaging module 10.

[0071] In some examples, at least some of the light-transmitting units 200 in this application embodiment are quantum dot structures. Quantum dot structures are a type of nanoconductor material with unique photoelectric properties; when excited by external energy (such as light or electricity), they emit light of a specific frequency. The color of the emitted light can be controlled by adjusting the size of the quantum dots. In some examples, all the light-transmitting units 200 are quantum dot structures that produce light of the same color. In other examples, different light-transmitting units 200 in at least some of the light-transmitting units 200 are different quantum dot structures to produce two, three, or even more colors of light. In this case, this application embodiment utilizes quantum dot structures as light-transmitting units 200. By setting the color of the light generated by the quantum dot structures, the encapsulation module 10 can achieve monochrome or color display, improving the display diversity of the encapsulation module 10.

[0072] Based on the above description, this application also provides a display device 30, please refer to... Figure 10 , Figure 10 This is a schematic diagram of a display device 30 provided in an embodiment of this application. The display device 30 can be applied to electronic devices to realize extended reality (XR) technologies such as augmented reality (AR), virtual reality (VR), and mixed reality (MR). In implementation, the display device 30 can be a projection part of an electronic device, such as a projector or head-up display (HUD). Alternatively, the display device 30 can also be a display part of an electronic device, such as a smartphone, smartwatch, laptop, tablet, dashcam, navigator, head-mounted device, or any device with a display screen. Furthermore, the display device 30 can also be a lighting part of an electronic device, such as a vehicle or streetlight, or any device with lighting components.

[0073] It is understood that the display device 30 in this application embodiment includes the miniature light-emitting diode device packaging module 10 of any of the above embodiments. Therefore, the display device 30 of this application has better viewing angle consistency and superior display effect. It should be noted that the miniature light-emitting diode device packaging module 10 and the display device 30 in this application embodiment are different subjects under the same inventive concept, and features not detailed in each embodiment can be found in the descriptions of other embodiments.

[0074] It should be noted that the term "multiple" in this application generally refers to two or more. Furthermore, the directional terms used in the embodiments of this application, such as "up," "down," "front," "back," "left," "right," "inner," "outer," and "side," are only for reference to the accompanying drawings. Therefore, the directional terms used are for illustrating and understanding the embodiments of this application, and not for limiting the embodiments of this application. In the various drawings, structurally similar units are represented by the same reference numerals. For clarity, the various parts in the drawings are not drawn to scale. Additionally, some related parts may not be shown in the drawings.

[0075] It should be understood that in the description of this application, terms such as "first" and "second" are used only to distinguish similar objects and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated.

[0076] It is understood that those skilled in the art, guided by the above embodiments, can combine various implementation methods in the above embodiments to obtain technical solutions with multiple implementation methods. The above descriptions are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

[0077] The foregoing has provided a detailed description of the miniature light-emitting diode (LED) device packaging module and display device provided in this application. Specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are merely for the purpose of aiding understanding this application. Furthermore, those skilled in the art will recognize that, based on the ideas of this application, there may be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this application.

Claims

1. A miniature light-emitting diode (LED) device packaging module, characterized in that, include: A miniature light-emitting diode chip, comprising multiple pixel units spaced apart; Multiple light-transmitting units are arranged in a one-to-one correspondence with multiple pixel units and spaced apart. Each light-transmitting unit is disposed on the light-emitting surface side of the multiple pixel units, and each light-transmitting unit is an inclined structure that expands outward in a direction away from the micro light-emitting diode chip; wherein a gap region is formed between two adjacent light-transmitting units; and A filling structure is located on the light-emitting surface side of the plurality of pixel units and disposed in each of the gap regions. Light emitted by the pixel units is incident into the light-transmitting unit and is reflected at the interface between the light-transmitting unit and the filling structure.

2. The micro light-emitting diode device packaging module according to claim 1, characterized in that, The packaging module also includes: A light-transmitting cover plate is disposed and connected to the side of the light-transmitting unit opposite to the micro light-emitting diode chip, and supports the light-transmitting unit.

3. The micro light-emitting diode device packaging module according to claim 1, characterized in that, The filling structure includes: Multiple filling units, each of which is disposed in a gap region, wherein the refractive index of the light-transmitting unit is greater than the refractive index of the adjacent filling unit.

4. The micro light-emitting diode device packaging module according to claim 3, characterized in that, The filling unit comprises a low extinction structure; or... The filling unit includes a high extinction structure for absorbing light emitted by the pixel unit that propagates from the light-emitting surface and the interface between the high extinction structure.

5. The miniature light-emitting diode device packaging module according to claim 3, characterized in that, The plurality of light-transmitting units and the plurality of filling units form an encapsulation structure; wherein, The encapsulation structure is connected to the light-emitting surface via an adhesive structure; or, the filling unit includes an adhesive structure, and the encapsulation structure is connected to the light-emitting surface via the filling unit.

6. The micro light-emitting diode device packaging module according to any one of claims 1 to 5, characterized in that, The filling structure further includes: Multiple sidewall units, each sidewall unit being disposed in a gap region and surrounding and attached to the side of a light-transmitting unit, the sidewall unit forming a reflective structure and used to reflect light incident into the light-transmitting unit to the outside of the encapsulation module.

7. The micro light-emitting diode device packaging module according to any one of claims 1 to 5, characterized in that, Multiple light-transmitting units form a microlens array structure.

8. The micro light-emitting diode device packaging module according to any one of claims 1 to 5, characterized in that, At least some of the light-transmitting units comprise quantum dot structures.

9. The micro light-emitting diode device packaging module according to any one of claims 1 to 5, characterized in that, Each of the light-transmitting units includes a top surface connected to the light-emitting surface, wherein the absolute value of the difference in refractive index between the light-emitting surface and the top surface is less than the absolute value of the difference in refractive index between the light-emitting surface and air.

10. A display device, characterized in that, Includes the micro light-emitting diode device packaging module as described in any one of claims 1 to 9.

Images