Wafer level package chip extraction flip position device

Abstract

The utility model provides a kind of wafer level packaging chip extraction flip position setting equipment, it is related to chip processing field;Including workbench, the top end sliding connection of workbench has sliding seat, and the top end fixed mounting of sliding seat has fixed block, the inside of fixed block is provided with adjusting mechanism;The adjusting mechanism includes sleeve, the axial outer wall of sleeve is fixedly installed in sliding seat, and the inside of sleeve is penetrated with the bar that penetrates, and one end of the bar that penetrates is fixedly installed with flip motor.The utility model cooperates through flip motor, first air cylinder, driving motor, threaded rod, sliding block and second air cylinder, can automatically extract, flip and position setting to chip, fixed by the form of negative pressure formed by micro vacuum pump suction simultaneously, avoid to cause damage to chip outer wall by using clamp fixed, to cause waste condition, and cooperate coil and core, can let first air cylinder displacement reserve second air cylinder stroke space.

Description

Technical Field

[0001] This utility model relates to the field of chip processing, specifically a wafer-level packaged chip extraction, flipping, and positioning device. Background Technology

[0002] Wafer-level chip manufacturing involves creating an uncut wafer-level interconnect substrate, on which pre-designed conventional dies are integrated and packaged to form a single, massive chip. This method enables the construction of large-scale integrated circuits on an entire wafer scale, breaking the area limitations imposed by photolithography apertures in traditional chip design. Since both sides of the chip need to be processed during fabrication, corresponding flipping devices are required for this purpose.

[0003] A patent for a chip manufacturing flipping device, with publication number CN218114145U, has been disclosed. Specifically, the patent discloses a technical solution where: "First, the circuit of the electromagnet is disconnected, causing the electromagnet to lose its magnetic force due to de-energization. This loosens the connection between the electromagnet and the adjusting rod, pulling the adjusting rod and causing it to slide inside the adjusting sleeve. The adjusting rod then drives the chip fixing mechanism to move horizontally, facilitating adjustment of the chip fixing mechanism's position according to the chip's size. After the chip fixing mechanism's position is adjusted, the electromagnet's circuit is reconnected, causing the electromagnet to generate magnetic force due to energization. This magnetic attraction between the electromagnet and the adjusting rod facilitates fixing the chip fixing mechanism." This solution achieves the technical effect that "by setting up an adjusting sleeve, adjusting rod, rubber block, and electromagnet, the position of the chip fixing mechanism can be easily adjusted according to the chip's size (i.e., length) during the use of the flipping device, thus facilitating subsequent chip fixing. Simultaneously, the flipping device can be applied to chips of different sizes, thereby improving its practicality."

[0004] While existing technologies can flip chips using components such as adjustment rods, they require clamping and fixing during actual use. Since the chip itself is relatively fragile, clamping it from both sides may cause irreversible damage, resulting in waste. Utility Model Content

[0005] The purpose of this invention is to provide a wafer-level packaged chip extraction, flipping, and positioning device to solve the problems mentioned in the background section and overcome its technical defects.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows: it includes a worktable, a sliding seat is slidably connected to the top of the worktable, and a fixing block is fixedly installed on the top of the sliding seat, and an adjustment mechanism is provided inside the fixing block;

[0007] The adjusting mechanism includes a sleeve, which is fixedly installed on the axial outer wall of the sliding seat, and a through rod extends through the inside of the sleeve. A flip motor is fixedly installed at one end of the through rod, and a first air suction cylinder is fixedly installed at the power output end of the flip motor. An air suction head is fixedly installed at the bottom end of the first air suction cylinder, and a rubber ring is fixedly installed at the bottom end of the air suction head.

[0008] As a further improvement of this utility model: a drive motor is fixedly installed on the top of the fixing block, and a threaded rod is fixedly installed on the power output end of the drive motor.

[0009] As a further embodiment of this utility model: a sliding block is slidably connected to the outer wall of the threaded rod, and a second air extraction cylinder is fixedly installed at one axial end of the sliding block that protrudes from the fixed block.

[0010] As a further improvement of this utility model: a coil is fixedly installed on one side of the inside of the sleeve, and an iron core is embedded in the inner wall of the coil.

[0011] As a further improvement of this utility model: the first suction cylinder is connected to the suction head, and the suction head is bonded to the rubber ring.

[0012] As a further improvement of this utility model: a mounting shell is fixedly installed on one side of the outer wall of the workbench, and a drive mechanism is provided inside the mounting shell.

[0013] As a further embodiment of this utility model: the driving mechanism includes a rotating block, which is rotatably connected to one end of the mounting shell, and a rotating rod is fixedly installed at one end of the rotating block.

[0014] As a further improvement of this utility model: a support block is slidably connected to one end of the rotating rod that passes through the mounting shell, and a slot is provided on the other side of the outer wall of the workbench.

[0015] Compared with the prior art, the beneficial effects of this utility model include:

[0016] 1. This utility model, through the cooperation of a flipping motor, a first suction cylinder, a drive motor, a threaded rod, a sliding block, and a second suction cylinder, can automatically extract, flip, and position the chip. At the same time, it fixes the chip by drawing air through a micro vacuum pump to form a negative pressure, avoiding damage to the outer wall of the chip caused by clamp fixation, thus avoiding waste. In addition, with the help of a coil and an iron core, the displacement of the first suction cylinder can reserve space for the stroke of the second suction cylinder.

[0017] 2. This utility model, through the cooperation of the mounting shell, rotating block, rotating rod, support block and slot, can adjust the position of the sliding seat and limit and fix it, so as to avoid the situation of loosening that would cause the chip to shift during chip reset, and to ensure that the first suction cylinder can correspond to the position of the chip when the chip is extracted. Attached Figure Description

[0018] The disclosure of this utility model is illustrated with reference to the accompanying drawings. It should be understood that the drawings are for illustrative purposes only and are not intended to limit the scope of protection of this utility model. In the drawings, the same reference numerals are used to refer to the same parts. Wherein:

[0019] Figure 1 The schematic diagram shows an overall structural schematic diagram according to one embodiment of the present invention;

[0020] Figure 2 The schematic diagram shows a structural schematic of a sleeve according to one embodiment of the present invention;

[0021] Figure 3 The schematic diagram shows a structural schematic of a sliding block according to one embodiment of the present invention;

[0022] Figure 4 The schematic diagram shows a structural schematic of a support block according to one embodiment of the present invention.

[0023] Labels in the diagram: 1. Workbench; 2. Sliding seat; 3. Fixing block; 4. Adjustment mechanism; 401. Sleeve; 402. Through rod; 403. Tilting motor; 404. First suction cylinder; 405. Suction head; 406. Rubber ring; 407. Drive motor; 408. Threaded rod; 409. Sliding block; 410. Second suction cylinder; 411. Coil; 412. Iron core; 5. Mounting shell; 6. Drive mechanism; 601. Rotating block; 602. Rotating rod; 603. Support block; 604. Slot. Detailed Implementation

[0024] It is readily understood that, based on the technical solution of this utility model, those skilled in the art can propose various interchangeable structural methods and implementations without altering the essential spirit of this utility model. Therefore, the following detailed embodiments and accompanying drawings are merely illustrative descriptions of the technical solution of this utility model and should not be considered as the entirety of this utility model or as limitations or restrictions on the technical solution of this utility model.

[0025] An embodiment of the present invention is shown in conjunction with the accompanying drawings.

[0026] Please see Figures 1 to 3A wafer-level packaged chip extraction, flipping, and positioning device includes a worktable 1, a sliding seat 2 slidably connected to the top of the worktable 1, a fixing block 3 fixedly installed on the top of the sliding seat 2, and an adjustment mechanism 4 provided inside the fixing block 3.

[0027] The adjusting mechanism 4 includes a sleeve 401, which is fixedly installed on the axial outer wall of the sliding seat 2. A through rod 402 extends from the inside of the sleeve 401. A flip motor 403 is fixedly installed at one end of the through rod 402. A first suction cylinder 404 is fixedly installed at the power output end of the flip motor 403. A suction head 405 is fixedly installed at the bottom end of the first suction cylinder 404. A rubber ring 406 is fixedly installed at the bottom end of the suction head 405. A drive is fixedly installed at the top end of the fixing block 3. The drive motor 407 has a threaded rod 408 fixedly installed at its power output end. A sliding block 409 is slidably connected to the outer wall of the threaded rod 408. A second suction cylinder 410 is fixedly installed at one axial end of the sliding block 409 that protrudes from the fixed block 3. A coil 411 is fixedly installed on one side of the inner side of the sleeve 401. An iron core 412 is embedded in the inner wall of the coil 411. The first suction cylinder 404 is connected to the suction head 405. The suction head 405 is bonded to the rubber ring 406.

[0028] By adopting the above technical solution, the micro vacuum pump inside the first suction cylinder 404 first works, generating negative pressure through the suction head 405 to adsorb the chip. The rubber ring 406 provides a certain protective effect. Then, under the rotation of the flipping motor 403, the first suction cylinder 404 moves the chip to face the suction head 405 of the second suction cylinder 410. By controlling the micro vacuum pumps of the first suction cylinder 404 and the second suction cylinder 410, the second suction cylinder 410 can adsorb the chip. Then, with the help of the drive motor 407 and the threaded rod 408, the sliding block 409 drives the second suction cylinder 410 to slide along the fixed block 3 to close the micro vacuum pump and return the chip to its position. This achieves the effects of extraction, flipping and positioning, avoiding manual intervention and preventing damage to the chip that may be caused by the clamping and flipping of the fixture. By controlling the current direction of the coil 411, it can work with the iron core 412 to adsorb and repel the permanent magnet material protruding rod 402. It can also reserve space when the second suction cylinder 410 is displaced to avoid mutual limitation.

[0029] Specifically, such as Figure 1 and Figure 4 As shown, a mounting shell 5 is fixedly installed on one side of the outer wall of the workbench 1. A drive mechanism 6 is provided inside the mounting shell 5. The drive mechanism 6 includes a rotating block 601, which is rotatably connected to one end of the mounting shell 5. A rotating rod 602 is fixedly installed on one end of the rotating block 601. A support block 603 is slidably connected to one end of the rotating rod 602 that passes through the mounting shell 5. A slot 604 is provided on the other side of the outer wall of the workbench 1.

[0030] By adopting the above technical solution, the rotating block 601 is adjusted to drive the threaded rotating rod 602 to rotate, and under the limit of the mounting shell 5, the support block 603 can drive the sliding seat 2 to adjust its position so as to correspond to the chip placement position. The slot 604 opened in the worktable 1 and the mounting shell 5 further improves the stability of the sliding seat 2 displacement process.

[0031] Working principle: The worktable 1 is the working plane for chip processing, equipped with a series of processing mechanisms such as photolithography. The first vacuum pump 404 and the second vacuum pump 410 are of the same type, with a miniature vacuum pump embedded inside. The vacuum pump head 405 creates negative pressure to suck up the chip, and the rubber ring 406 prevents the chip from being damaged by bumps. When flipping is required, the rotating block 601 is adjusted to make the threaded rotating rod 602 push the support block 603 to move the sliding seat 2 so that the first vacuum pump 404 can be aligned with the chip. The worktable 1 and the mounting shell 5 have slots 604 at the positions corresponding to the sliding seat 2 to improve the stability of the movement process. The flipping motor 403, fixed by the through rod 402 inside the sleeve 401, can rotate 180 degrees after the first suction cylinder 404 picks up the chip. Then, the vacuum pump is closed by the control terminal, and the vacuum pump of the second suction cylinder 410 is started to adsorb. Then, the current direction of the coil 411 is controlled so that the iron core 412 adsorbs the space reserved by the through rod 402 of the permanent magnet material. This facilitates the cooperation of the drive motor 407 and the threaded rod 408, so that the sliding block 409 drives the second suction cylinder 410 to slide along the fixed block 3, so that the flipped chip is placed in its original position, thereby achieving the effect of picking up, flipping and placing.

[0032] The technical scope of this utility model is not limited to the content described above. Those skilled in the art can make various modifications and variations to the above embodiments without departing from the technical concept of this utility model, and all such modifications and variations should fall within the protection scope of this utility model.

Claims

1. A wafer level package chip extraction flip bit device, comprising: Includes a workbench (1), the top of the workbench (1) is slidably connected to a sliding seat (2), and a fixing block (3) is fixedly installed on the top of the sliding seat (2), and an adjustment mechanism (4) is provided inside the fixing block (3). The adjusting mechanism (4) includes a sleeve (401), which is fixedly installed on the axial outer wall of the sliding seat (2). A through rod (402) extends through the inside of the sleeve (401). A flip motor (403) is fixedly installed at one end of the through rod (402). A first air pump (404) is fixedly installed at the power output end of the flip motor (403). An air pump head (405) is fixedly installed at the bottom end of the first air pump head (404), and a rubber ring (406) is fixedly installed at the bottom end of the air pump head (405).

2. The wafer level package chip extraction flip-chip device of claim 1, wherein, The top of the fixed block (3) is fixedly mounted with a drive motor (407), and the power output end of the drive motor (407) is fixedly mounted with a threaded rod (408).

3. The wafer level package chip extraction flip-chip device of claim 2, wherein, The outer wall of the threaded rod (408) is slidably connected to a sliding block (409), and a second air pump (410) is fixedly installed on one axial end of the sliding block (409) that protrudes from the fixed block (3).

4. The wafer level package in a chip extraction flip-chip device of claim 1, wherein, A coil (411) is fixedly installed on one side of the inside of the sleeve (401), and an iron core (412) is embedded in the inner wall of the coil (411).

5. The wafer-level packaged chip extraction, flipping, and positioning device according to claim 1, characterized in that, The first suction cylinder (404) is connected to the suction head (405), and the suction head (405) is bonded to the rubber ring (406).

6. The wafer-level packaged chip extraction, flipping, and positioning device according to claim 1, characterized in that, A mounting shell (5) is fixedly installed on one side of the outer wall of the workbench (1), and a drive mechanism (6) is provided inside the mounting shell (5).

7. The wafer-level packaged chip extraction, flipping, and positioning device according to claim 6, characterized in that, The drive mechanism (6) includes a rotating block (601), which is rotatably connected to one end of the mounting shell (5), and a rotating rod (602) is fixedly installed at one end of the rotating block (601).

8. The wafer-level packaged chip extraction, flipping, and positioning device according to claim 7, characterized in that, The rotating rod (602) is slidably connected to a support block (603) at one end of the mounting shell (5), and a slot (604) is provided on the other side of the outer wall of the workbench (1).

Images