Circuit board pin welding tool
By setting multi-depth insertion slots on the circuit board pin soldering fixture, the problem of difficulty in positioning pins with various cantilever heights during manual operation is solved, achieving precise height control and efficient production.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- NORTHWEST ELECTROMECHANICAL ENG RES INST
- Filing Date
- 2025-06-18
- Publication Date
- 2026-06-05
AI Technical Summary
In existing circuit board pin soldering processes, manual operation makes it difficult to accurately position pins with various overhang heights, resulting in post-soldering heights that are out of tolerance or too high or too low, affecting electrical reliability and production efficiency.
Design a circuit board pin soldering fixture. By setting multi-depth insertion slots on the clamping assembly, the pins are inserted and their ends abut against the bottom of the slots. Physical limiting replaces manual visual inspection and fine-tuning, realizing automatic positioning of pins with different functions.
It achieves precise limiting of various cantilever height pins, controlled within ±0.2mm, improving the quality and efficiency of mass production, and reducing the difficulty and cost of operation.
Smart Images
Figure CN224322485U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of circuit board soldering technology, and more specifically, to a circuit board pin soldering fixture. Background Technology
[0002] As electronic devices become increasingly functional and circuit board sizes become more miniaturized, the types and functions of pins also become more diverse. The accuracy of the height position of different functional pins on the board directly affects the subsequent assembly of components and the stability of the overall system performance.
[0003] In existing pin soldering processes, it is generally required that the pins pass vertically through the solder holes on the circuit board and maintain a predetermined soldering height relative to the board surface. Different pins, depending on their application, have strict requirements regarding the height they can protrude from the board surface after soldering, and the error must be controlled within ±0.2mm to ensure good fit and electrical reliability of subsequent connectors. However, current pin soldering methods often rely on manual operation. Operators must insert the pins and adjust their height using experience under a microscope or visual aids. On the one hand, even slight hand tremors or parallax during soldering can cause the pins to not be precisely positioned; on the other hand, the heat-affected zone of high-temperature solder waves or manual soldering pens is difficult to control precisely, easily leading to excessive or insufficient solder height, resulting in pin heights that are out of tolerance or too high or too low after soldering.
[0004] To address the aforementioned issues, patent application number 2019210448737 proposes a circuit board pin soldering fixture. This fixture uses a positioning block on the side of the base to physically limit the pins, and adjusts the relative position between the positioning block and the base to ensure the height distance between the pins and the circuit board. However, this solution can only limit pins of the same height at a time, and cannot simultaneously accommodate pins with multiple overhang heights. When encountering circuit boards with mixed heights, the position of the positioning block must be repeatedly adjusted, significantly reducing production efficiency and increasing debugging costs, making it difficult to meet the demands of modern electronic products for high quality, low cost, and mass production. Utility Model Content
[0005] The purpose of this application is to provide a circuit board pin soldering fixture to address the shortcomings of the above-mentioned technology.
[0006] To achieve the above objectives, the technical solution adopted in this application is as follows:
[0007] This application provides a circuit board pin soldering fixture, including a clamping assembly for placing the circuit board. The clamping assembly has several insertion slots of different depths. Several pins pass parallel through the circuit board and are inserted into the insertion slots, with their ends abutting against the bottom wall of the insertion slots of different depths.
[0008] Furthermore, a groove for placing a circuit board is provided in the center of the clamping assembly, and several insertion slots of different depths are provided on the bottom wall of the groove.
[0009] Furthermore, the size of the groove is smaller than the size of the circuit board, and the circuit board covers the periphery of the groove.
[0010] Furthermore, the clamping assembly is provided with a number of bosses, which are arranged at intervals along the circumference to clamp the circuit board onto the surface of the clamping assembly.
[0011] Furthermore, the clamping assembly includes a clamping plate for placing the circuit board and a base connected to the clamping plate. The bottom surface of the clamping plate and the top surface of the base are complementary stepped surfaces, and the bottom surface of the base is a horizontal surface.
[0012] Furthermore, several through slots of different depths are opened on the mounting plate, and the top surface of the base closes the through slots to form a plug slot. Several pins pass through the circuit board and the through slots in sequence, and their ends abut against the top surface of the base.
[0013] Furthermore, the base includes several base plates, the top surfaces of which are sequentially spliced together to form a stepped surface that complements and connects with the bottom surface of the mounting plate, and the bottom surfaces of the base plates are flush.
[0014] Furthermore, there is a gap between two adjacent base plates.
[0015] Furthermore, the mounting plate and the base are detachably connected.
[0016] Furthermore, the clamping assembly is made of spring steel.
[0017] The beneficial effects of this application include:
[0018] This application provides a circuit board pin soldering fixture. The device includes a clamping assembly for securely holding the circuit board to be soldered. The clamping assembly has several insertion slots on its surface, and the position and depth of each slot can be pre-processed to different dimensions according to the solder hole position of the circuit board and the height requirements of different pins. After each pin passes vertically through the solder hole of the circuit board, it is inserted into the corresponding depth of the insertion slot, and its end accurately abuts against the bottom wall of the slot. The physical limiting effect of the multi-depth insertion slots replaces the traditional method of manual visual inspection and fine-tuning, allowing different functional pins to be automatically positioned at their predetermined heights in the same soldering process. This solves the inefficiency and high cost problem caused by the frequent adjustment of the relative positions of the components of the fixture due to the single depth limitation of traditional fixtures. Compared with existing technologies that can only accommodate pins of the same height, this application does not require interrupting the production cycle to switch or adjust the tooling. Even if pins of various overhang heights are mixed on the circuit board, precise positioning can be completed in one go, achieving a height control accuracy within ±0.2mm. This significantly improves the quality and efficiency of mass production and multi-variety production, meeting the needs of modern electronic products for efficient, low-cost, and large-volume assembly. Attached Figure Description
[0019] To more clearly illustrate the technical solutions of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.
[0020] Figure 1 This is one of the structural schematic diagrams of a circuit board pin soldering fixture provided in this application;
[0021] Figure 2 This is the second schematic diagram of a circuit board pin soldering fixture provided in this application;
[0022] Figure 3 One of the structural schematic diagrams of a clamping plate for a circuit board pin soldering fixture provided in this application;
[0023] Figure 4 A second schematic diagram of the structure of a clamping plate for a circuit board pin soldering fixture provided in this application;
[0024] Figure 5 A schematic diagram of the structure of a square base plate for a circuit board pin soldering fixture provided in this application;
[0025] Figure 6 A schematic diagram of the structure of an L-shaped base plate for a circuit board pin soldering fixture provided in this application;
[0026] Icons: 1-Clamping component; 2-Clamping plate; 3-Base; 4-Square base plate; 5-L-shaped base plate; 6-Interlocking slot; 7-Groove; 8-Boss; 9-Through slot. Detailed Implementation
[0027] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.
[0028] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. It should be noted that, unless otherwise specified, the various features in the embodiments of this application can be combined with each other, and the combined embodiments are still within the protection scope of this application.
[0029] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.
[0030] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of this application is in use. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on this application. In addition, the terms "first," "second," and "third," etc., are only used to distinguish descriptions and should not be construed as indicating or implying relative importance.
[0031] Furthermore, terms such as "horizontal" and "vertical" do not imply that components must be absolutely horizontal or suspended, but rather that they can be slightly tilted. For example, "horizontal" simply means that its direction is more horizontal than "vertical," and does not mean that the structure must be completely horizontal, but can be slightly tilted.
[0032] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "set up," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0033] The technical solution of this application will be described in detail below with reference to specific embodiments.
[0034] This application provides a circuit board pin soldering fixture that is simple in structure, easy to operate, and reliable in precision. Its core feature lies in limiting the overhang height of the pins after soldering by using a pre-settable insertion slot depth, thereby achieving precise height control for pins with different functions. For example... Figure 1 and Figure 2 As shown, the device includes a clamping assembly 1, which is used to stably place the circuit board to be soldered. The clamping assembly 1 has several insertion slots 6 on its surface, and the position and depth of each insertion slot 6 can be pre-processed to different sizes according to the solder hole position of the circuit board and the height requirements of different pins. Specifically, for various types such as power pins, signal pins, and ground pins, corresponding shallow, medium, and deep slots (or more) are designed. This allows each pin to be inserted into the corresponding depth of the insertion slot 6 after vertically passing through the solder hole of the circuit board, with its end accurately abutting the bottom wall of the insertion slot 6. The physical limiting effect of the multi-depth insertion slots replaces the traditional method of manual visual inspection and fine-tuning, enabling different functional pins to be automatically positioned at their predetermined heights during the same soldering process. This solves the inefficiency and high cost problem caused by the frequent adjustments to the relative positions of components in traditional fixtures due to the single depth limitation.
[0035] It should be understood that the pin, solder hole, and insertion slot 6 are coaxial and collinear—the pin first passes through the solder hole and then inserts into the insertion slot 6 at the corresponding depth until its end is tightly fitted with the bottom of the slot, thus automatically maintaining a predetermined height during the solder melting stage. Furthermore, tiny positioning guide grooves or arc transition surfaces can be provided on both sides or the bottom of the insertion slot 6 to further eliminate lateral movement caused by the difference between the pin diameter and the solder hole diameter, improving insertion guidance and stability.
[0036] Compared to existing technologies that can only accommodate pins of the same height, this application eliminates the need to interrupt production cycles to switch or adjust tooling. Even with a mix of pins of various overhang heights on the circuit board, precise positioning can be achieved in one go, realizing height control accuracy within ±0.2mm. This significantly improves the flexibility and efficiency of mass production and multi-variety manufacturing, greatly reducing operational difficulty and rework rates. Simultaneously, through a batch-based, modular clamping design, the same type of circuit boards can be processed continuously, significantly increasing production line cycle time and automation. Furthermore, by designing multiple clamping components 1 with different structural parameters, rapid soldering can be performed on various circuit board products, offering strong adaptability and simple maintenance. This significantly reduces manual labor, production cycle, and manufacturing costs, meeting the demands of modern electronic products for efficient, low-cost, and high-volume assembly.
[0037] Furthermore, the clamping assembly 1 is made of highly elastic spring steel. Its core advantage lies in the material's inherent elasticity and strength. Through the yield point and tensile strength characteristics of spring steel, the clamping assembly 1 maintains its original elastic constant and shape accuracy during repeated loading and unloading, exhibiting stable deformation recovery capability. This avoids clamping force attenuation or assembly deformation due to material fatigue after long-term use, ensuring the reproducibility of the welding height for each batch of pins. This material, under pre-load conditions, applies a uniform and controllable clamping force to the circuit board and pins, effectively fixing the circuit board and preventing minor displacement during welding, while ensuring that the pin ends in the limiting insertion slot 6 remain firmly against the bottom of the slot, achieving precise height positioning.
[0038] During assembly, clamping component 1 is first formed into a blank through CNC cutting or stamping. Then, it undergoes a rigorous heat treatment process (including uniform heating, oil quenching or gas quenching, and multi-stage tempering) to transform its internal structure into tempered martensite, achieving the predetermined hardness and impact toughness requirements. Subsequently, the surface of clamping component 1 is phosphated or galvanized to enhance corrosion resistance and reduce the coefficient of friction, ensuring smooth and stable clamping and release actions. Finally, dimensional inspection and spring force testing ensure that the spring constant and clamping stroke of clamping component 1 meet the design tolerances.
[0039] Furthermore, such as Figure 1 As shown, a groove 7, precisely matching the shape and size of the circuit board, is provided at the center of the clamping assembly 1 for accurately placing the circuit board to be soldered. In designing this groove 7, it is necessary to ensure a stable fit against the board surface, preventing tilting or lateral movement from affecting the verticality of the pins, while also providing sufficient space for operators or automated equipment to smoothly insert the pins into the solder holes from above the groove 7. Small positioning shoulders or guide chamfers may be provided around the groove 7 to facilitate rapid positioning and self-alignment during clamping, improving positioning efficiency.
[0040] On the bottom wall of the groove 7, several insertion slots 6 with corresponding positions and depths are pre-machined according to the arrangement of the solder holes on the circuit board and the height requirements of different types of pins. The depth of each insertion slot 6 is exactly equal to the overhang length required from the bottom of the pin to the soldering surface. Through this physical limiting method, the pin can be firmly abutted against the bottom of the slot after insertion. The slot depth corresponds one-to-one with the overhang height of the pin after soldering, so that the pin height can always be kept within the accuracy range of ±0.2mm without manual correction during wave soldering or reflow soldering. In addition, the position of each insertion slot 6 should also be aligned with the center of the solder hole, and the slot width should be slightly larger than the pin diameter to ensure smooth insertion, while avoiding excessive gaps that would affect positioning accuracy.
[0041] During soldering, the circuit board is first placed flat in the groove 7 of the clamping assembly 1, ensuring that the electronic component side faces down and the soldering side faces up. Then, the corresponding type of pin is vertically inserted into the solder hole on the circuit board, and further inserted until the pin tip is against the bottom wall of the corresponding depth insertion slot 6. Finally, the entire assembly is placed into the soldering equipment for wave soldering or reflow soldering. After soldering is complete and the solder paste has solidified, the pins are removed from the circuit board, and the solder joints are well-fixed to the pins and at the same height. This fixture solution significantly simplifies the operation process, eliminating the need for complex height measuring tools or manual fine-tuning. It improves production cycle time, ensures consistent batch soldering quality, and greatly reduces rework rates and manufacturing costs.
[0042] Furthermore, the size of the groove 7 is slightly smaller than the size of the circuit board, allowing the circuit board to cover and suspend above the periphery of the groove 7. This design effectively prevents interference or collision between the components mounted on the circuit board and the bottom wall of the groove 7 or the surface of the clamping assembly 1, ensuring the safety protection of the components. At the same time, it keeps the circuit board horizontal and stable during clamping, further improving clamping accuracy and ease of operation.
[0043] In the specific assembly process, pins of various specifications and models can be inserted into pre-machined insertion slots 6 of different depths within the groove 7 of the clamping assembly 1 according to process requirements. In this step, the pins are inserted from top to bottom until one end firmly abuts against the bottom wall of the insertion slot 6, while the other end protrudes from the surface of the clamping assembly 1, forming a stable fixed state. With the clamping force of the spring steel clamping assembly 1, the pin ends will not loosen or tilt in the insertion slot 6, providing reliable guidance and support for the subsequent placement of the circuit board.
[0044] Next, with the soldering side of the circuit board facing up and the electronic component side facing down, insert the protruding pin ends into the solder holes from above until the edges of the circuit board are flush with the perimeter of the groove 7 and suspended in mid-air. At this point, each pin has precisely passed through its corresponding solder hole and automatically stops at the predetermined overhang height due to the physical restraint of the insertion groove 6, achieving a height accuracy of ±0.2mm without manual adjustment. This covered placement also reduces thermal expansion displacement of the board during soldering, ensuring coaxial alignment of the pins and solder holes and improving the consistency of post-soldering quality. Finally, solder the circuit board and pins.
[0045] Furthermore, such as Figure 1 As shown, the clamping assembly 1 is provided with several bosses 8 arranged at intervals along the circumference. The number of bosses 8 can be designed according to requirements (e.g., 4, 6, or 8). The working surface of the bosses 8 is designed as a concave clamping surface, which together form a clamping area that adapts to the outer contour of the circuit board for clamping the circuit board. When the circuit board is circular, the diameter of the groove 7 opened in the center of the clamping assembly 1 is slightly smaller than the outer diameter of the circuit board, so that the circuit board covers the periphery of the groove 7. At this time, the bosses 8 are designed as arc-shaped structures, and the curvature centers of all arc-shaped structures coincide with the center of the circuit board and are distributed on the circumference of the same virtual ring. The diameter of the virtual ring is larger than the diameter of the groove 7, forming a ring-shaped clamping structure for the circuit board. Preferably, four equally spaced arc-shaped bosses 8 are used to clamp the circular circuit board, and the included angle between adjacent bosses 8 is 90° to ensure that the clamping force is evenly distributed in the circumferential direction and avoid local stress concentration. The boss 8 can be fixed to the surface of the clamping assembly 1 by integral molding or mechanical fastening (such as bolts or clips) to form a stable support frame.
[0046] Overall, the concave clamping surface, groove 7, and insertion slot 6 work together to form a multi-axial positioning and limiting system. After the circuit board covers the groove 7, the surrounding bosses 8 use clamping force to keep the board horizontal and prevent it from shifting. At the same time, the pins, pre-inserted into insertion slots 6 at different depths, coaxially align with the solder holes on the circuit board, with their ends abutting the bottom of the slots, achieving vertical height limiting. This organic combination of horizontal and vertical positioning ensures a perfect fit between the pins and the solder holes, improving the stability and reproducibility of the soldering process.
[0047] Furthermore, such as Figures 1 to 4As shown, the clamping assembly 1 consists of two parts: an upper clamping plate 2 and a lower base 3, which are complemented by a stepped surface structure. The clamping plate 2 has grooves 7 that match the shape of the circuit board and several through slots 9, while the top surface of the base 3 is precisely machined according to the stepped contour of the bottom surface of the clamping plate 2. After the two are tightly fitted together, the through slots 9 are closed by the top surface of the base 3, forming insertion slots 6 of different depths. By separating the clamping assembly 1 into the clamping plate 2 and the base 3, the through slots 9 of different depths on the clamping plate 2 can be machined separately, simplifying the construction process. The complementary fit of the stepped heights on the top surface of the base 3 eliminates the need to mill multiple depths on the same board, significantly reducing manufacturing difficulty and cost. Specifically, the stepped bottom surface of the clamping plate 2 is machined by a CNC milling machine according to the position and height requirements of different functional pins on the circuit board; the base 3 undergoes precise heat treatment and grinding to ensure that the fit gap with the stepped surface of the clamping plate 2 is controlled at the micron level, so as to ensure stable contact of the pin ends at the bottom of the slot.
[0048] By utilizing the complementary stepped surface structure of the clamping plate 2 and the base 3, not only is the depth of the insertion slot 6 flexibly configured, but the manufacturing and assembly advantages of the two-piece assembly are also fully utilized, reducing processing difficulty and maintenance costs. Furthermore, the horizontal surface of the base 3 ensures the overall stability of the tooling, while the stepped surface fit ensures the accuracy of the pin height limit.
[0049] Furthermore, such as Figures 1 to 6 As shown, the base 3 is divided into several independent base plates. The thickness of each base plate can be flexibly designed according to the different depths required by the insertion slots 6 to meet the limiting requirements of various pin heights. The top surface of each base plate is precisely machined according to the stepped contour of the bottom surface of the clamping plate 2, and then spliced together to form a complementary and interconnected stepped surface structure. Through this "modular stepped" design, the process complexity caused by machining insertion slots of different depths on the integrated base 3 is avoided, greatly improving the maintainability of the tooling and the flexibility of the production line.
[0050] The base plate can be precisely aligned and securely connected to the corresponding stepped surface of the bottom of the clamping plate 2 using fastening screws or locating pins. After assembly, the bottom surfaces of each base plate remain flush, collectively forming the horizontal support surface of the clamping assembly 1 to ensure stable placement of the assembly in the welding equipment. A design gap is intentionally left between the base plates, eliminating the need for interconnection. This effectively isolates the internal stress transfer between adjacent base plates caused by thermal expansion and contraction or clamping forces, preventing overall deformation or misalignment of the stepped surfaces and ensuring the repeatability accuracy of the pin positioning.
[0051] In this embodiment, the core of the clamping assembly 1 consists of a clamping plate 2 and a segmented base 3. The clamping plate 2 has a central groove 7 that matches the shape of the circuit board. Two sets of through slots 9 of different depths are formed on the bottom wall of the groove 7, each set including two through slots of equal depth. One set is dedicated to power pins, and the other to signal pins. The depths of the two sets of through slots 9 correspond to the required overhang height of the power pins and signal pins after soldering, respectively. This ensures that after the pins pass through the circuit board and are embedded in the through slots 9, their ends can firmly abut against the top surface of the base 3, achieving physical height limitation and precise control. The top surface of the clamping plate 2 remains flat, while the bottom surface is stepped according to the depth of each through slot 9, so as to precisely connect with the segmented stepped surface of the base 3.
[0052] Six threaded mounting holes are evenly distributed along the edges and center of the clamping plate 2 for fixed connection with the modules of the base 3. For example... Figure 5 and Figure 6 As shown, the base 3 adopts a modular design, including two units: a square base plate 4 and an L-shaped base plate 5. Their shapes, dimensions, and assembly positions strictly correspond to the stepped area on the bottom surface of the clamping plate 2. The square base plate 4 and the L-shaped base plate 5 have different thicknesses, respectively filling the stepped difference on the bottom surface of the clamping plate 2. The square base plate 4 has two mounting screw holes corresponding to the threaded mounting holes on the clamping plate 2, and the L-shaped base plate 5 has four mounting screw holes corresponding to the threaded holes on the clamping plate 2. Using conventional countersunk screws, the clamping plate 2 can be simultaneously fastened to both the square base plate 4 and the L-shaped base plate 5. After assembly, the bottom surfaces of each base plate are flush, forming a unified horizontal support surface, ensuring the stable placement of the component in subsequent welding equipment.
[0053] The stepped complementary structure of clamping plate 2, square base plate 4, and L-shaped base plate 5 not only enables simultaneous physical positioning of power and signal pins with different depth requirements, but also minimizes the complexity of single-piece processing and manufacturing costs. The modular base 3 design allows for independent inspection or replacement of each unit, simplifying the maintenance process; six-point screw fixing ensures high rigidity and overall flatness. In high-temperature environments such as wave soldering and reflow soldering, this clamping assembly 1 can continuously provide stable and uniform positioning force, significantly improving the consistency, yield, and production efficiency of pin welding, reducing rework and repairs, and meeting the requirements of high-precision, high-reliability electronic assembly.
[0054] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A circuit board pin soldering fixture, characterized in that, The device includes a clamping assembly for placing a circuit board. The clamping assembly has several insertion slots of different depths. Several pins pass parallel through the circuit board and are inserted into the insertion slots, with their ends abutting against the bottom wall of the insertion slots of different depths.
2. The circuit board pin soldering fixture according to claim 1, characterized in that, A groove for placing the circuit board is provided in the center of the clamping assembly, and several insertion slots of different depths are provided on the bottom wall of the groove.
3. The circuit board pin soldering fixture according to claim 2, characterized in that, The size of the groove is smaller than the size of the circuit board, and the circuit board covers the periphery of the groove.
4. The circuit board pin soldering fixture according to any one of claims 1 to 3, characterized in that, The clamping assembly is provided with a plurality of bosses, which are arranged at intervals along the circumference to clamp the circuit board onto the surface of the clamping assembly.
5. The circuit board pin soldering fixture according to any one of claims 1 to 3, characterized in that, The clamping assembly includes a clamping plate for placing the circuit board and a base connected to the clamping plate. The bottom surface of the clamping plate and the top surface of the base are complementary stepped surfaces, and the bottom surface of the base is a horizontal surface.
6. The circuit board pin soldering fixture according to claim 5, characterized in that, A plurality of through slots of different depths are formed in the mounting plate, and the top surface of the base closes the through slots to form the insertion slots. After the plurality of pins pass through the circuit board and the through slots in sequence, their ends abut against the top surface of the base.
7. The circuit board pin soldering fixture according to claim 5, characterized in that, The base includes several base plates, the top surfaces of which are sequentially spliced together to form a stepped surface that complements and connects with the bottom surface of the clamping plate, and the bottom surfaces of the several base plates are flush.
8. The circuit board pin soldering fixture according to claim 7, characterized in that, There is a gap between two adjacent base plates.
9. The circuit board pin soldering fixture according to claim 5, characterized in that, The clamping plate is detachably connected to the base.
10. The circuit board pin soldering fixture according to any one of claims 1 to 3, characterized in that, The clamping assembly is made of spring steel.