Semiconductor refrigeration automobile cooling water tank

Abstract

The utility model provides a kind of automobile cooling water tank of semiconductor refrigeration, comprising: heat dissipation component, water tank component is installed in the heat dissipation component, the heat dissipation component includes the shell for protecting water tank component, the water tank component includes the water tank body for storing automobile cooling water, the water tank body middle is provided with air hole, the inner wall left side, right side, upside and downside of the air hole are respectively equipped with multiple refrigeration modules for cooling water refrigeration, compared with prior art, the utility model has the beneficial effects as follows: the setting of air hole effectively avoids heat accumulation, at the same time, it can make multiple refrigeration modules be installed in the water tank body inside, avoid expanding the volume of entire water tank body, by setting refrigeration module, multiple heat-conducting sheets together lower temperature itself cool the liquid inside water tank body, in turn make the temperature of cooling liquid reduce.

Description

Technical Field

[0001] This utility model belongs to the field of automotive coolant tank technology, and specifically relates to a semiconductor-cooled automotive coolant tank. Background Technology

[0002] Current automotive coolant systems primarily rely on air cooling for heat dissipation. However, in hot weather, their cooling effect is often insufficient, presenting significant drawbacks. First, the increased air temperature in high-temperature environments reduces heat dissipation efficiency, making it difficult to dissipate the heat generated by the engine during operation. This can lead to overheating, affecting engine performance and even causing damage. Second, the effectiveness of air-cooling systems is highly dependent on vehicle speed and external environmental conditions. Cooling efficiency decreases significantly when stationary or driving at low speeds, further exacerbating thermal management issues.

[0003] Conventional solutions include adding auxiliary fans to improve heat dissipation when stationary or introducing liquid cooling technology to enhance overall heat exchange efficiency. However, these methods have certain drawbacks: while auxiliary fans can improve cooling performance to some extent when stationary, they increase energy consumption and generate additional noise; and while liquid cooling systems offer higher heat dissipation capacity, they require additional space for piping and water pumps, increasing system complexity and manufacturing costs. Therefore, we aim to design a novel automotive coolant tank to address this problem. Utility Model Content

[0004] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a semiconductor-cooled automotive coolant tank to solve the problems mentioned in the background art.

[0005] This utility model is achieved through the following technical solution: a semiconductor-cooled automotive coolant tank, comprising: a heat dissipation assembly, wherein a water tank assembly is installed inside the heat dissipation assembly, the heat dissipation assembly includes a shell for protecting the water tank assembly, a grille is provided on the front side of the shell, and a fan for dissipating heat from the water tank assembly is installed inside the rear side of the shell.

[0006] The water tank assembly includes a water tank body for storing automotive coolant. The water tank body has an air vent in the middle, and multiple refrigeration modules for cooling the coolant are installed on the left, right, upper, and lower sides of the inner wall of the air vent.

[0007] In a preferred embodiment, the fan is positioned directly behind the air vent, the upper part of the outer casing is designed as an opening, and the water tank body is fixed inside the outer casing by screws. By setting an air vent in the middle of the water tank body, the complete water tank body is transformed into a hollow structure in the middle, which facilitates air to pass through the water tank body and can remove the heat generated by the cooling module during cooling.

[0008] In a preferred embodiment, the air vent has a rectangular structure and extends through the water tank body in the front-to-back direction. The upper side of the water tank body is provided with a connecting pipe for connecting to the vehicle's cooling water pipe, and the lower end of the water tank body is provided with a drain outlet and sealed with a nut.

[0009] In a preferred embodiment, the refrigeration module includes a mounting plate. The side of the mounting plate away from the water tank body is recessed towards the side closer to the water tank body to form a rectangular groove. The side of the rectangular groove closer to the water tank body extends inward to form a mounting cavity. In actual use, the mounting plate can be made of aerogel to prevent the hot surface of the refrigeration element from transferring heat to the water tank body through the mounting plate.

[0010] In a preferred embodiment, a cooling chip for cooling is installed inside the mounting cavity. The cooling chip is a semiconductor cooling chip, and multiple cooling chips in the mounting plate are connected in series via wires.

[0011] In a preferred embodiment, the cooling surface of the cooling chip faces the inside of the mounting cavity, and the heating surface of the cooling chip faces the outside of the mounting plate. A sealing plate is installed on the side of the mounting plate near the water tank body by screws. The water tank body has multiple rectangular cavities on the inner wall of the air vent. The side of the sealing plate near the water tank body is sealed and fixedly connected to the edge of the rectangular cavity of the water tank body by a sealing gasket.

[0012] In a preferred embodiment, the portion of the sealing plate located inside the water tank body is provided with a plurality of equally spaced heat-conducting sheets. The outer side of the sealing plate abuts against the cold surface of the cooling sheet, and a layer of thermally conductive silicone grease is applied between the outer side of the sealing plate and the cold surface of the cooling sheet.

[0013] After adopting the above technical solution, the beneficial effects of this utility model are: 1. By setting air holes inside the water tank assembly and cooperating with heat dissipation components, heat accumulation is effectively avoided. At the same time, it allows multiple cooling modules to be installed inside the water tank body, avoiding the expansion of the entire water tank body volume.

[0014] 2. By setting up a cooling module, multiple cooling chips generate low temperatures, which are then used to cool the sealing plate and its inner heat-conducting chips through a thermally conductive silicone grease layer. The combined low temperatures of the multiple heat-conducting chips cool the liquid inside the water tank, thereby reducing the temperature of the coolant. This solves the problem of reduced heat dissipation efficiency due to increased air temperature in high-temperature environments, and the high temperature of the coolant in the water tank affecting engine performance or even causing damage. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the overall structure of a semiconductor-cooled automotive coolant tank according to the present invention.

[0017] Figure 2 This is a schematic diagram showing the connection between the heat dissipation component and the water tank component of a semiconductor-cooled automotive water tank according to this utility model.

[0018] Figure 3 This is a schematic diagram of the water tank assembly structure of a semiconductor-cooled automotive water tank according to the present invention.

[0019] Figure 4 This is a schematic diagram of the refrigeration module structure of a semiconductor refrigeration automotive coolant tank according to this utility model.

[0020] In the diagram, 100 is the heat dissipation component, 110 is the casing, 120 is the fan, and 130 is the grille.

[0021] 200-Water tank assembly, 210-Water tank body, 211-Air vent, 220-Connecting pipe, 230-Refrigeration module, 231-Mounting plate, 232-Refrigeration element, 233-Sealing plate, 234-Heat conduction element. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0023] As the first embodiment of this utility model:

[0024] Please see Figures 1 to 4 A semiconductor-cooled automotive coolant tank includes: a heat dissipation assembly 100, a water tank assembly 200 installed inside the heat dissipation assembly 100, the heat dissipation assembly 100 including a housing 110 for protecting the water tank assembly 200, a grille 130 provided on the front side of the housing 110, and a fan 120 for dissipating heat from the water tank assembly 200 installed inside the rear side of the housing 110.

[0025] The water tank assembly 200 includes a water tank body 210 for storing automotive coolant. A vent 211 is provided in the middle of the water tank body 210. Multiple cooling modules 230 for cooling the coolant are installed on the left, right, upper and lower sides of the inner wall of the vent 211.

[0026] The fan 120 is located directly behind the air vent 211. The upper part of the outer casing 110 has an open design. The water tank body 210 is fixed inside the outer casing 110 with screws. By setting the air vent 211 in the middle of the water tank body 210, the complete water tank body 210 is transformed into a hollow structure in the middle, which facilitates the air to pass through the water tank body 210 and can remove the heat generated by the cooling module 230 during cooling.

[0027] The air vent 211 has a rectangular structure and extends through the water tank body 210 in the front-to-back direction. A connecting pipe 220 for connecting to the car's cooling water pipe is provided on the upper side of the water tank body 210. A drain outlet is provided at the lower end of the water tank body 210 and sealed with a nut.

[0028] Specifically, by setting vents 211 inside the water tank assembly 200, in conjunction with the heat dissipation assembly 100, when multiple cooling modules 230 in the water tank body 210 work simultaneously in actual use, their hot surfaces will generate a lot of heat. This heat is carried away by the airflow through the vents 211 under the action of the fan 120, thus preventing a large amount of heat from accumulating near the water tank body 210 and causing the temperature to rise. The setting of vents 211 effectively avoids heat accumulation, and at the same time, it allows multiple cooling modules 230 to be installed inside the water tank body 210, avoiding the expansion of the overall volume of the water tank body 210.

[0029] As a second embodiment of this utility model:

[0030] Please see Figures 1 to 4 The cooling module 230 includes a mounting plate 231. The side of the mounting plate 231 away from the water tank body 210 is recessed towards the side closer to the water tank body 210 to form a rectangular groove. The side of the rectangular groove closer to the water tank body 210 extends inward to form a mounting cavity. In actual use, the mounting plate 231 can be made of aerogel to prevent the hot surface of the cooling element 232 from transferring heat to the water tank body 210 through the mounting plate 231.

[0031] The mounting cavity contains a cooling chip 232 for cooling. The cooling chip 232 is a semiconductor cooling chip 232, and the cooling chips 232 in multiple mounting plates 231 are connected in series by wires.

[0032] The cooling surface of the cooling chip 232 faces the inside of the mounting cavity, and the heating surface of the cooling chip 232 faces the outside of the mounting plate 231. A sealing plate 233 is installed on the side of the mounting plate 231 near the water tank body 210 by screws. The water tank body 210 has multiple rectangular cavities on the inner wall of the air vent 211. The side of the sealing plate 233 near the water tank body 210 is sealed and fixedly connected to the edge of the rectangular cavity of the water tank body 210 by a sealing gasket.

[0033] The portion of the sealing plate 233 located inside the water tank body 210 is provided with multiple heat-conducting fins 234 distributed at equal intervals. The outer side of the sealing plate 233 abuts against the cold surface of the cooling fin 232, and a layer of thermally conductive silicone grease is applied between the outer side of the sealing plate 233 and the cold surface of the cooling fin 232.

[0034] Based on the first embodiment described above, further, in actual use, by arranging multiple evenly distributed cooling modules 230 on the inner side of the water tank body 210, since the cooling surface of the cooling element 232 faces the inside of the mounting cavity and the heating surface of the cooling element 232 faces the outside of the mounting plate 231, a sealing plate 233 is installed on the side of the mounting plate 231 near the water tank body 210 by screws, and multiple rectangular cavities are provided on the inner wall of the air vent 211 of the water tank body 210, the side of the sealing plate 233 near the water tank body 210 is sealed and fixedly connected to the edge of the rectangular cavity of the water tank body 210 by a sealing gasket, ensuring that the cooling modules 230 are installed while preventing liquid leakage from the water tank body 210, and further because the sealing plate The portion 233 located inside the water tank body 210 is provided with multiple equally spaced heat-conducting fins 234. The outer side of the sealing plate 233 abuts against the cold surface of the cooling fins 232, and a thermally conductive silicone grease layer is applied between the outer side of the sealing plate 233 and the cold surface of the cooling fins 232. The multiple cooling fins 232 generate low temperatures and cool the sealing plate 233 and the multiple heat-conducting fins 234 inside it through the thermally conductive silicone grease layer. The multiple heat-conducting fins 234 together cool the liquid inside the water tank body 210 at their own low temperatures, thereby reducing the temperature of the coolant. This solves the problem that the high temperature of the coolant in high-temperature environments leads to reduced heat dissipation efficiency due to increased air temperature, which in turn affects engine performance and may even cause damage.

[0035] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A semiconductor-cooled automotive coolant tank, comprising: A heat dissipation assembly (100) is characterized in that a water tank assembly (200) is installed inside the heat dissipation assembly (100), the heat dissipation assembly (100) includes a housing (110) for protecting the water tank assembly (200), a grille (130) is provided on the front side of the housing (110), and a fan (120) for dissipating heat from the water tank assembly (200) is installed inside the rear side of the housing (110). The water tank assembly (200) includes a water tank body (210) for storing automotive coolant. A vent (211) is provided in the middle of the water tank body (210). Multiple cooling modules (230) for cooling the coolant are installed on the left, right, upper and lower sides of the inner wall of the vent (211).

2. The semiconductor-cooled automotive coolant tank as described in claim 1, characterized in that: The fan (120) is located directly behind the air vent (211), the upper part of the outer casing (110) is designed with an opening, and the water tank body (210) is fixed inside the outer casing (110) by screws.

3. The semiconductor-cooled automotive coolant tank as described in claim 1, characterized in that: The air vent (211) has a rectangular structure and the air vent (211) penetrates the water tank body (210) in the front-to-back direction. The upper side of the water tank body (210) is provided with a connecting pipe (220) for connecting to the car's cooling water pipe. The lower end of the water tank body (210) is provided with a drain outlet and is sealed with a nut.

4. The semiconductor-cooled automotive coolant tank as described in claim 1, characterized in that: The refrigeration module (230) includes a mounting plate (231). The mounting plate (231) is recessed from the side away from the water tank body (210) to the side closer to the water tank body (210) to form a rectangular groove. The rectangular groove extends inward from the side closer to the water tank body (210) to form an installation cavity.

5. The semiconductor-cooled automotive coolant tank as described in claim 4, characterized in that: The mounting cavity is equipped with a cooling chip (232) for cooling. The cooling chip (232) is a semiconductor cooling chip (232), and multiple cooling chips (232) in the mounting plate (231) are connected in series by wires.

6. The semiconductor-cooled automotive coolant tank as described in claim 5, characterized in that: The cooling surface of the cooling chip (232) faces the inside of the mounting cavity, and the heating surface of the cooling chip (232) faces the outside of the mounting plate (231). A sealing plate (233) is installed on the side of the mounting plate (231) near the water tank body (210) by screws. The water tank body (210) has multiple rectangular cavities on the inner wall of the air hole (211). The sealing plate (233) is sealed and fixedly connected to the edge of the rectangular cavity of the water tank body (210) near the water tank body (210) by a sealing gasket.

7. A semiconductor-cooled automotive coolant tank as described in claim 6, characterized in that: The portion of the sealing plate (233) located inside the water tank body (210) is provided with multiple heat-conducting plates (234) distributed at equal intervals. The outer side of the sealing plate (233) abuts against the cold surface of the cooling plate (232), and a layer of thermally conductive silicone grease is applied between the outer side of the sealing plate (233) and the cold surface of the cooling plate (232).

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