Coated carrier and coating apparatus
By designing a structure with a first conductor and a second conductor on the coating substrate, the charge is collected and discharged using the tip effect, which solves the problem of abnormal discharge caused by charge accumulation on the substrate during the coating process, ensuring the safety of the solar cells and the coating quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- TONGWEI SOLAR ENERGY (CHENGDU) CO LID
- Filing Date
- 2025-05-27
- Publication Date
- 2026-06-05
Smart Images

Figure CN224325406U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of coating equipment technology, and in particular to a coating carrier plate and coating equipment. Background Technology
[0002] During the production of solar cells, a coating deposition process is required. During the coating process, the carrier plate will continuously accumulate charge, which may lead to abnormal discharge and damage to the solar cells.
[0003] The information disclosed in this background section is intended only to enhance the understanding of the overall background of this utility model and should not be construed as an admission or in any way implying that the information constitutes prior art known to those skilled in the art. Utility Model Content
[0004] Therefore, it is necessary to provide a coating carrier and coating equipment to address the problem that the carrier plate will continuously accumulate charge during the coating process, which will lead to abnormal discharge and damage to the battery cells.
[0005] In a first aspect, a coated substrate includes:
[0006] Carrier plate body; and
[0007] A conductive structure comprising a first conductor and a second conductor, wherein the first conductor protrudes from the carrier plate body along a first direction, the second conductor is electrically connected to the first conductor, and the second conductor extends along at least one direction intersecting the first direction.
[0008] In one embodiment, the carrier plate body includes a frame and a plurality of carrier portions spaced apart on the frame. The carrier portions are used to hold battery cells. The first conductor protrudes from the frame along the first direction, and both the first conductor and the second conductor are located on the outer periphery of the carrier portions.
[0009] In one embodiment, the frame includes a top surface and a bottom surface disposed opposite each other along its own thickness direction, and the first conductor and the second conductor are disposed on the top surface and / or the bottom surface.
[0010] In one embodiment, the first direction is configured as the thickness direction of the frame, and the second conductor includes interleaved transverse and longitudinal conductors, both of which are connected to the first conductor and are located on the outer periphery of the substrate portion. The transverse conductor extends along a second direction, and the longitudinal conductor extends along a third direction. The first direction, the second direction, and the third direction intersect each other and are not coplanar.
[0011] In one embodiment, a plurality of the substrate portions are arranged in a matrix along the second direction and the third direction. Each substrate portion is surrounded by four first conductors. Two first conductors located on either side of the substrate portion along the second direction are spaced apart along the third direction and connected by the transverse conductor. Two first conductors located on either side of the substrate portion along the third direction are spaced apart along the second direction and connected by the longitudinal conductor.
[0012] In one embodiment, the first conductor is provided with a connecting hole through at least one direction intersecting the first direction, and the second conductor is connected to the connecting hole through the connecting hole.
[0013] In one embodiment, the second conductor includes interleaved transverse conductors and longitudinal conductors, the transverse conductors extending along a second direction and the longitudinal conductors extending along a third direction, the first direction, the second direction and the third direction intersecting each other and not being coplanar;
[0014] The connection hole includes a first connection hole and a second connection hole spaced apart along the first direction. The first conductor passes through the first connection hole along the second direction, and the first conductor passes through the second connection hole along the third direction. The transverse conductor passes through and is connected to the first connection hole, and the longitudinal conductor passes through and is connected to the second connection hole.
[0015] In one embodiment, the first conductor includes a cylindrical portion and a spherical portion connected together, the cylindrical portion protruding from the carrier plate body along the first direction, the spherical portion being disposed at the top of the cylindrical portion away from the carrier plate body, and the second conductor being connected to the cylindrical portion.
[0016] In one embodiment, the diameter D of the spherical portion is greater than the cross-sectional diameter d of the maximum cross-section of the cylindrical portion.
[0017] In a second aspect, a coating apparatus comprising a coating carrier plate as described in the first aspect.
[0018] The aforementioned coating substrate can achieve both charge accumulation guidance and charge discharge. A first conductor protrudes from the substrate body along a first direction. Due to the tip effect, during the coating process, the charge accumulated on the substrate will preferentially accumulate towards the tip of the protruding first conductor. The electric field strength at the tip is higher, enabling more efficient capture of the scattered charges, changing the disordered accumulation state of the charges, and preventing the random accumulation of charges over a large area of the substrate, thereby reducing the risk of abnormal discharge. A second conductor, electrically connected to the first conductor, extends along at least one direction intersecting the first direction. When charges accumulate at the tip of the first conductor, the second conductor provides a discharge path for the accumulated charges, allowing the accumulated negative charges to be guided away along the second conductor, preventing the accumulation of charges from causing abnormal discharge, thus reducing the possibility of damage to the solar cell due to abnormal discharge, and ensuring the safety and stability of the solar cell during the coating deposition process. Attached Figure Description
[0019] To more clearly illustrate the technical solutions in the embodiments of this application or the conventional technology, the drawings used in the description of the embodiments or the conventional technology will be briefly introduced below. Obviously, the drawings described below are only embodiments of this application. For those skilled in the art, other drawings can be obtained based on the disclosed drawings without creative effort.
[0020] Figure 1 This is a three-dimensional structural diagram of a coating carrier plate provided in an embodiment of this application.
[0021] Figure 2 This is a top view of a coating carrier plate provided in an embodiment of this application.
[0022] Figure 3 This is a cross-sectional view of a coating carrier plate provided in an embodiment of this application.
[0023] Explanation of reference numerals in the attached drawings: 100, coating carrier plate; 1, carrier plate body; 11, frame; 12, carrier plate part; 2, conductive structure; 21, first conductor; 211, connecting hole; 2111, first connecting hole; 2112, second connecting hole; 212, column part; 213, sphere part; 22, second conductor; 221, longitudinal conductor; 222, transverse conductor. Detailed Implementation
[0024] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.
[0025] During the production of solar cells, a coating deposition process is required. During this process, the carrier plate continuously accumulates charges, leading to abnormal discharges and potential damage to the cells. Specifically, in the fabrication of heterojunction solar cells, a transparent conductive layer needs to be deposited on a silicon substrate using physical vapor deposition (PVD) equipment. During deposition, negative charges accumulate on the surface and edges of the carrier plate, causing abnormal discharges.
[0026] In an optional implementation, the first direction is Figure 2 and Figure 3 The Z-direction shown has two directions: the first is the thickness direction of the carrier plate body 1; the second is... Figure 2 and Figure 3 The X direction is shown, the second direction is the length direction of the carrier plate body 1. The third direction is... Figure 2 and Figure 3 The Y direction is shown, and the third direction is the width direction of the carrier plate body 1.
[0027] Based on the above issues, please refer to Figure 1 This application provides a coating carrier 100, including a carrier body 1 and a conductive structure 2. Please refer to... Figure 2 The conductive structure 2 includes a first conductor 21 and a second conductor 22, the first conductor 21 being along a first direction (e.g., Figure 2 The second conductor 22 (as shown in the Z direction) protrudes from the carrier plate body 1, and is electrically connected to the first conductor 21. The second conductor 22 is along at least one direction intersecting the first direction (e.g., Figure 2 Extending in the X and Y directions (as shown). The aforementioned coating carrier 100 can achieve the functions of charge accumulation guidance and charge discharge. The first conductor 21 protrudes from the carrier body 1 along the first direction. Due to the tip effect, during the coating process, the charge accumulated on the coating carrier 100 will preferentially accumulate towards the tip of the protruding first conductor 21. The electric field strength at the tip is higher, which can more efficiently capture the charges distributed in all directions, change the state of disordered charge accumulation, and avoid the random accumulation of charges over a large area of the coating carrier 100, thereby reducing the risk of abnormal discharge. The second conductor 22, which is electrically connected to the first conductor 21, extends along at least one direction intersecting the first direction. When the charge accumulates at the tip of the first conductor 21, the second conductor 22 can provide a conductive path for the accumulated charge, allowing the accumulated negative charge to be discharged along the second conductor 22, preventing the charge from accumulating and causing abnormal discharge, thereby reducing the possibility of damage to the battery cell due to abnormal discharge, and ensuring the safety and stability of the battery cell during the coating deposition process.
[0028] The second conductor 22 may extend along the length direction of the carrier motherboard 1, or along the width direction of the carrier body 1, or simultaneously along both the length and width directions of the carrier body 1.
[0029] In an optional embodiment, the first conductor 21 is made of a conductive material such as iron or copper. The second conductor 22 is made of a conductive material such as steel, copper, or aluminum.
[0030] Please see Figure 2 In some embodiments, the carrier plate body 1 includes a frame 11 and a plurality of wafer portions 12 spaced apart on the frame 11. The wafer portions 12 are used to hold solar cells. A first conductor 21 protrudes from the frame 11 along a first direction, and both the first conductor 21 and the second conductor 22 are located on the outer periphery of the wafer portions 12. By placing the first conductor 21 and the second conductor 22 outside the wafer portions 12, it is possible to avoid the charge distribution of the first conductor 21 and the second conductor 22 themselves and the charge transfer affecting the deposition and coating process of the solar cells, and at the same time, it avoids affecting operations such as loading and unloading of solar cells.
[0031] In an optional embodiment, the carrier plate body 1 includes one, two, three, or a number of frames 11. See also... Figure 2 Multiple slide carriers 12 can be set on a frame 11.
[0032] In an optional embodiment, the carrier portion 12 may be a hollow structure, with the solar cells overlapping the frame 11 and located on the hollow structure. In other optional embodiments, the carrier portion 12 may be an independent tray structure, which overlaps the frame 11, with a recessed center forming a groove in which the solar cells are placed.
[0033] In an optional embodiment, the first conductor 21 and the second conductor 22 may be disposed on at least one of the top surface, bottom surface, and side peripheral surface of the frame 11 along its own thickness direction. The embodiments of this application do not limit the specific placement of the first conductor 21 and the second conductor 22.
[0034] In some embodiments, the frame 11 includes a top surface and a bottom surface disposed opposite each other along its own thickness direction, and the first conductor 21 and the second conductor 22 are disposed on the top surface and / or the bottom surface. The top surface and the bottom surface of the frame 11 can provide more space for the first conductor 21 and the second conductor 22, which can improve charge accumulation efficiency and reduce the probability of abnormal discharge.
[0035] Please see Figure 1 In an optional embodiment, the first conductor 21 and the second conductor 22 may be disposed on the top surface, or on the bottom surface, or simultaneously on both the top and bottom surfaces.
[0036] In optional embodiments, the extended shape of the second conductor 22 may be straight, curved, zigzag, or network-like. The embodiments of this application do not limit the extended shape of the second conductor 22.
[0037] Please see Figure 2In some embodiments, the first direction is configured as the thickness direction of the frame 11. The second conductor 22 includes interleaved transverse conductors 222 and longitudinal conductors 221. Both the transverse conductors 222 and the longitudinal conductors 221 are connected to the first conductor 21 and are located on the outer periphery of the substrate portion 12. The transverse conductors 222 extend along the second direction, and the longitudinal conductors 221 extend along the third direction. The first direction, the second direction, and the third direction intersect each other and are not coplanar. The transverse conductors 222 and the longitudinal conductors 221 can promote the uniform discharge of charge from the substrate, avoid the concentration of charge in a certain area, and ensure the uniformity of the cell coating quality.
[0038] In an optional embodiment, the transverse conductor 222 and the longitudinal conductor 221 may be interleaved, and the charge flowing from the first conductor 21 may conduct to each other along the transverse conductor 222 and the longitudinal conductor 221. Alternatively, in other optional embodiments, the transverse conductor 222 and the longitudinal conductor 221 are interleaved and not connected to each other, and the transverse conductor 222 and the longitudinal conductor 221 may be distributed at intervals along a first direction, and the charge flowing from the first conductor 21 may conduct independently along the transverse conductor 222 and the longitudinal conductor 221.
[0039] In optional embodiments, the first conductor 21 can be located at any position on the outer periphery of the substrate portion 12. The first conductor 21 can be connected to any position of the second conductor 22. The first conductor 21 can be located at an end of the second conductor 22 along its own length direction, or at the middle of the second conductor 22, or simultaneously at both the end and the middle of the second conductor 22. The embodiments of this application do not limit the relative positional relationship between the first conductor 21 and the second conductor 22.
[0040] In optional embodiments, the first conductor 21 and the second conductor 22 may be located outside all the substrate portions 12, or the first conductor 21 and the second conductor 22 may be located in the gap between two adjacent substrate portions 12. The embodiments of this application do not limit the relative positional relationship between the first conductor 21 and the second conductor 22 and the substrate portion 12.
[0041] In an optional embodiment, the slide portions 12 may be randomly distributed on the frame 11. Alternatively, in other optional embodiments, the slide portions 12 may be arranged in a matrix on the frame 11.
[0042] Please see Figure 2In some embodiments, multiple substrate portions 12 are arranged in a matrix along the second direction and the third direction. Each substrate portion 12 is surrounded by four first conductors 21. Two first conductors 21 located on either side of the substrate portion 12 along the second direction are spaced apart along the third direction and connected by a transverse conductor 222. Two first conductors 21 located on either side of the substrate portion 12 along the third direction are also spaced apart along the second direction and connected by a longitudinal conductor 221. Thus, each substrate portion 12 is surrounded by a transverse conductor 222 and a longitudinal conductor 221, which increases the charge conduction range of the second conductor 22 and reduces abnormal discharge.
[0043] In an optional embodiment, each substrate 12 is independently provided with four first conductors 21, a transverse conductor 222, and a longitudinal conductor 221 surrounding its circumference. The transverse conductors 222 and longitudinal conductors 221 on the outer periphery of each substrate 12 are not connected to each other.
[0044] In other alternative embodiments, along the second direction, two adjacent substrate portions 12 share two first conductors 21 and a section of longitudinal conductor 221. Along the third direction, two adjacent substrate portions 12 share two first conductors 21 and a section of transverse conductor 222. This interconnects the transverse conductors 222 around the periphery of the multiple substrate portions 12, and the longitudinal conductors 221 around the periphery of the multiple substrate portions 12. This further increases the current-carrying range of the second conductor 22, enabling rapid and orderly charge conduction and reducing abnormal discharge. With this arrangement, charge can be uniformly discharged, avoiding concentrated charge discharge on one side or at one point, resulting in a more uniform electric field distribution within the substrate portion 12 and throughout the entire coating substrate 100 area. This helps to form a deposited thin film with consistent thickness and uniform electrical properties, thereby improving the coating quality of the solar cell.
[0045] In an optional embodiment, the substrate portion 12 is square, and the four first conductors 21 can be disposed in the middle of the long or short side of the substrate portion 12. The four first conductors 21 can be arranged symmetrically or asymmetrically around the center of the substrate portion 12.
[0046] In other alternative embodiments, four first conductors 21 are respectively disposed at the four corners of the substrate 12. The corners of the substrate 12 are more prone to charge accumulation, and placing the first conductors 21 at the corners of the substrate 12 makes it easier to capture the charge accumulated in the substrate 12.
[0047] In an optional embodiment, the second conductor 22 may be soldered to one side of the first conductor 21. See also other embodiments. Figure 3In some optional embodiments, the first conductor 21 is provided with a connecting hole 211 through at least one direction intersecting the first direction, and the second conductor 22 is connected to the connecting hole 211 through it. By drilling a hole inside the first conductor 21 to allow the second conductor 22 to pass through, the charge transport path can be shortened, allowing the charge inside the first conductor 21 to be better guided out by the second conductor 22.
[0048] Please see Figure 3 In some embodiments, the second conductor 22 includes interleaved transverse conductors 222 and longitudinal conductors 221. The transverse conductors 222 extend along a second direction, and the longitudinal conductors 221 extend along a third direction. The first direction, the second direction, and the third direction intersect each other, and the three directions are not coplanar. The connecting hole 211 includes a first connecting hole 2111 and a second connecting hole 2112 spaced apart along a first direction. The first conductor 21 passes through the first connecting hole 2111 along the second direction, and the first conductor 21 passes through the second connecting hole 2112 along the third direction. The transverse conductor 222 passes through and is connected to the first connecting hole 2111, and the longitudinal conductor 221 passes through and is connected to the second connecting hole 2112. The first connecting hole 2111 and the second connecting hole 2112 are not interconnected, which can reduce mutual interference between the transverse conductor 222 and the longitudinal conductor 221 when conducting charges.
[0049] In other alternative embodiments, when the transverse conductor 222 and the longitudinal conductor 221 are interleaved, the first connecting hole 2111 and the second connecting hole 2112 can be connected.
[0050] In optional embodiments, the shape of the first conductor 21 may be a cylinder, a cone, an irregular body, etc. The embodiments of this application do not limit the specific shape of the first conductor 21.
[0051] In some embodiments, the first conductor 21 includes a cylindrical portion 212 and a spherical portion 213 connected together. The cylindrical portion 212 protrudes from the carrier plate body 1 along a first direction, and the spherical portion 213 is located at the top of the cylindrical portion 212 away from the carrier plate body 1. The second conductor 22 is connected to the cylindrical portion 212. The spherical portion 213 is located at the top of the cylindrical portion 212 away from the carrier plate body 1. The curved surface structure of the sphere makes its surface charge distribution more concentrated. Compared with a simple cylinder or other shapes, the spherical portion 213, under the action of an electric field, can generate a more significant tip effect with a smaller radius of curvature, causing more charge to accumulate towards it, improving the charge accumulation effect, thereby more efficiently capturing the free charge around the carrier plate and avoiding the disorderly accumulation of charge around the solar cell.
[0052] Please see Figure 3In some embodiments, the diameter D of the spherical portion 213 is larger than the cross-sectional diameter d of the largest cross-section of the cylindrical portion 212. The diameter D of the spherical portion 213 can further increase the tip effect. Based on electrical principles, a larger spherical surface can accommodate more charge, attracting charges from a wider area of the substrate during coating, making charge capture more efficient and comprehensive, reducing the probability of charge escape and residue, and maximizing the orderly accumulation of charges on the substrate.
[0053] Secondly, embodiments of this application also provide a coating apparatus, which includes a coating carrier plate 100 as described in the first aspect. This coating apparatus can be a physical vapor deposition coating apparatus, a chemical vapor deposition coating apparatus, an atomic layer deposition coating apparatus, etc.
[0054] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0055] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.
[0056] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0057] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.
[0058] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.
[0059] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0060] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.
Claims
1. A coating carrier plate (100), characterized in that, include: Carrier plate body (1); as well as The conductive structure (2) includes a first conductor (21) and a second conductor (22). The first conductor (21) protrudes from the carrier plate body (1) along a first direction, and the second conductor (22) is electrically connected to the first conductor (21). The second conductor (22) extends along at least one direction intersecting the first direction.
2. The coating carrier plate (100) according to claim 1, characterized in that, The carrier plate body (1) includes a frame (11) and a plurality of carrier portions (12) spaced apart on the frame (11). The carrier portions (12) are used to hold battery cells. The first conductor (21) protrudes from the frame (11) along the first direction, and the first conductor (21) and the second conductor (22) are both located on the outer periphery of the carrier portion (12).
3. The coating carrier plate (100) according to claim 2, characterized in that, The frame (11) includes a top surface and a bottom surface disposed opposite each other along its own thickness direction, and the first conductor (21) and the second conductor (22) are disposed on the top surface and / or the bottom surface.
4. The coating carrier plate (100) according to claim 2, characterized in that, The first direction is configured as the thickness direction of the frame (11), and the second conductor (22) includes an alternating transverse conductor (222) and a longitudinal conductor (221). The transverse conductor (222) and the longitudinal conductor (221) are both connected to the first conductor (21) and are both located on the outer periphery of the substrate (12). The transverse conductor (222) extends along the second direction, and the longitudinal conductor (221) extends along the third direction. The first direction, the second direction, and the third direction intersect each other and are not coplanar.
5. The coating carrier plate (100) according to claim 4, characterized in that, Multiple substrate portions (12) are arranged in a matrix along the second direction and the third direction. Each substrate portion (12) is surrounded by four first conductors (21). Two first conductors (21) located on either side of the substrate portion (12) along the second direction are spaced apart along the third direction and connected by the transverse conductor (222). Two first conductors (21) located on either side of the substrate portion (12) along the third direction are spaced apart along the second direction and connected by the longitudinal conductor (221).
6. The coating carrier plate (100) according to claim 1, characterized in that, The first conductor (21) has a connecting hole (211) through it along at least one direction intersecting the first direction, and the second conductor (22) passes through and is connected to the connecting hole (211).
7. The coating carrier plate (100) according to claim 6, characterized in that, The second conductor (22) includes interleaved transverse conductors (222) and longitudinal conductors (221), the transverse conductors (222) extending along a second direction, and the longitudinal conductors (221) extending along a third direction. The first direction, the second direction, and the third direction intersect each other, and the three are not coplanar. The connecting hole (211) includes a first connecting hole (2111) and a second connecting hole (2112) spaced apart along the first direction. The first conductor (21) passes through the first connecting hole (2111) along the second direction. The first conductor (21) passes through the second connecting hole (2112) along the third direction. The transverse conductor (222) passes through and is connected to the first connecting hole (2111). The longitudinal conductor (221) passes through and is connected to the second connecting hole (2112).
8. The coating carrier plate (100) according to any one of claims 1 to 7, characterized in that, The first conductor (21) includes a column portion (212) and a sphere portion (213) connected together. The column portion (212) protrudes from the carrier plate body (1) along the first direction. The sphere portion (213) is located at the top of the column portion (212) away from the carrier plate body (1). The second conductor (22) is connected to the column portion (212).
9. The coating carrier plate (100) according to claim 8, characterized in that, The diameter D of the spherical part (213) is greater than the diameter d of the maximum cross section of the cylindrical part (212).
10. A coating apparatus, characterized in that, The coating apparatus includes a coating carrier plate (100) as described in any one of claims 1 to 9.