Shock resistant seamless tube for semiconductors
By setting spiral reinforcing ribs and carbon fiber reinforcing layers on the outer surface of the seamless tube body, and covering them with a rubber buffer layer, a multi-layer protective structure is formed, which solves the problem of damage to the seamless tube under impact and improves its impact resistance and service life.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- XINXIN SEMICONDUCTOR MATERIALS (JIANGSU) CO LTD
- Filing Date
- 2025-06-23
- Publication Date
- 2026-06-05
AI Technical Summary
Existing seamless tubes for semiconductors lack impact-resistant structures, making them susceptible to damage when subjected to impacts, reducing their lifespan, and potentially causing bending or breakage, affecting fluid transport and wafer yield.
Spiral reinforcing ribs are set on the outer surface of the seamless tube body, and a carbon fiber reinforcement layer and a rubber buffer layer are covered on it. Spiral grooves and protrusions are formed inside and outside the carbon fiber reinforcement layer, and a steel wire reinforcement mesh is provided in the rubber buffer layer and coated with a wear-resistant layer, forming a multi-layer protective structure.
It improves the impact resistance of seamless tubes, prevents bending and cracking, extends service life, and ensures fluid delivery stability and wafer yield.
Smart Images

Figure CN224326811U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of seamless tube technology, specifically to an impact-resistant seamless tube for semiconductors. Background Technology
[0002] Seamless tubes for semiconductors are special tubing developed to meet the high purity, high precision, and high reliability requirements of semiconductor manufacturing. They are typically made of ultra-pure stainless steel (such as 316L and 304L) or nickel-based alloys, and undergo processes such as vacuum refining and electroslag remelting to ensure low impurity content (carbon ≤ 0.03%, total impurity content ≤ 50ppm). Through cold drawing and electrolytic polishing, the inner wall roughness Ra ≤ 0.2μm is achieved. They also possess excellent corrosion resistance and cleanliness, effectively preventing contamination and media leakage during semiconductor manufacturing. They are widely used in gas and liquid transport systems in key processes such as wafer cleaning, photolithography, and etching.
[0003] Existing seamless tubes for semiconductors do not have impact-resistant structures, which makes the surface of the seamless tubes easily damaged when subjected to impact, reducing their service life. In severe cases, the seamless tubes may bend or break, affecting the transport of fluids inside the tubes. They may even reduce the yield of wafers due to particulate contamination or media leakage. To address this, we propose an impact-resistant seamless tube for semiconductors. Utility Model Content
[0004] The purpose of this invention is to provide an impact-resistant seamless tube for semiconductors. This tube has the advantages of improving its impact resistance, preventing it from bending and breaking due to impact, avoiding surface wear, and extending its service life. It solves the problem that existing seamless tubes for semiconductors do not have an impact-resistant structure, which makes the surface of the tube easily damaged when it is impacted, reducing its service life. In severe cases, it may cause the tube to bend or break, affecting the transport of fluid inside the tube, and may even lead to a decrease in wafer yield due to particulate contamination or media leakage.
[0005] To achieve the above objectives, the present invention provides the following technical solution: an impact-resistant seamless tube for semiconductors, comprising a seamless tube body, a carbon fiber reinforcement layer and a rubber buffer layer, wherein a spiral reinforcing rib is provided on the outer surface of the seamless tube body, a carbon fiber reinforcement layer is provided on the outer surface of the seamless tube body, and the spiral reinforcing rib is located between the carbon fiber reinforcement layer and the seamless tube body, and a rubber buffer layer is provided on the outer surface of the carbon fiber reinforcement layer.
[0006] Preferably, the inner wall of the carbon fiber reinforcement layer forms a first spiral groove at the location of the spiral reinforcing rib, and the spiral reinforcing rib is located inside the first spiral groove.
[0007] Preferably, a spiral protrusion is formed on the outer surface of the carbon fiber reinforcement layer at the location of the first spiral groove, and the formation of the spiral protrusion can improve the strength of the carbon fiber reinforcement layer.
[0008] Preferably, the inner wall of the rubber buffer layer is provided with a second spiral groove, and the spiral protrusion is located inside the second spiral groove. The number of second spiral grooves is greater than the number of spiral protrusions. The provision of the second spiral groove facilitates the installation and fixation of the rubber buffer layer. At the same time, the excess second spiral groove can also reduce the weight of the rubber buffer layer and form a buffer chamber between the carbon fiber reinforcement layer and the rubber buffer layer.
[0009] Preferably, the rubber buffer layer is provided with a steel wire reinforcement mesh, which can improve the tensile and tear resistance of the rubber buffer layer.
[0010] Preferably, the outer surface of the rubber buffer layer is provided with a wear-resistant coating, which can improve the wear resistance of the rubber buffer layer surface, effectively prevent the rubber buffer layer surface from wearing, extend its service life, and at the same time, the wear-resistant coating can also isolate oxygen, effectively prevent the rubber buffer layer from contacting oxygen, and delay the aging of the rubber buffer layer.
[0011] Compared with the prior art, the beneficial effects of this utility model are as follows:
[0012] 1. This utility model, by setting a seamless tube body, spiral reinforcing ribs, carbon fiber reinforcing layer, and rubber buffer layer, achieves the effect of improving the impact resistance of seamless tubes for semiconductors, preventing the seamless tube from bending and breaking due to impact, and also preventing surface wear of the seamless tube, thus improving the service life of the seamless tube. The spiral reinforcing ribs form a support system with the outer surface of the seamless tube body. When the seamless tube body is impacted, the spiral reinforcing ribs undergo plastic deformation first, thereby protecting the seamless tube body. The carbon fiber reinforcing layer can share the impact load of the seamless tube body and absorb the impact energy, further improving the impact resistance. Before the seamless tube body is impacted, the rubber buffer layer on the surface of the carbon fiber reinforcing layer can play an effective buffering role and absorb the impact energy, further reducing the impact on the seamless tube body, thus protecting the seamless tube body.
[0013] 2. By setting a wear-resistant coating, this utility model can improve the wear resistance of the rubber buffer layer surface, effectively prevent the rubber buffer layer surface from wearing, extend its service life, and at the same time, the wear-resistant coating can also isolate oxygen, effectively prevent the rubber buffer layer from contacting oxygen, and delay the aging of the rubber buffer layer.
[0014] 3. By setting up a steel wire reinforcing mesh, this utility model can improve the tensile and tear resistance of the rubber buffer layer. Attached Figure Description
[0015] Figure 1 This is a three-dimensional structural diagram of the present invention;
[0016] Figure 2 This is a partial three-dimensional structural diagram of the seamless tube body of this utility model;
[0017] Figure 3 This is a partial three-dimensional structural diagram of the carbon fiber reinforcement layer of this utility model;
[0018] Figure 4 This is a partial three-dimensional cross-sectional view of the rubber buffer layer of this utility model.
[0019] Reference numerals: 1. Seamless tube body; 2. Carbon fiber reinforcement layer; 3. Rubber buffer layer; 4. Spiral reinforcement rib; 5. First spiral groove; 6. Spiral protrusion; 7. Second spiral groove; 8. Wear-resistant coating; 9. Steel wire reinforcement mesh. Detailed Implementation
[0020] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.
[0021] Example 1
[0022] like Figures 1-4 As shown, this utility model proposes an impact-resistant seamless semiconductor tube, comprising a seamless tube body 1, a carbon fiber reinforcement layer 2, and a rubber buffer layer 3. The outer surface of the seamless tube body 1 is provided with spiral reinforcing ribs 4, which form a support system with the outer surface of the seamless tube body 1. When the seamless tube body 1 is impacted, the spiral reinforcing ribs 4 first undergo plastic deformation, thereby protecting the seamless tube body 1. The outer surface of the seamless tube body 1 is provided with the carbon fiber reinforcement layer 2, and the spiral reinforcing ribs 4 are located between the carbon fiber reinforcement layer 2 and the seamless tube body 1. The carbon fiber reinforcement layer 2 can share the impact load of the seamless tube body 1 and absorb impact energy, further improving the impact resistance. A first spiral groove 5 is formed on the inner wall of the carbon fiber reinforcement layer 2 at the location of the spiral reinforcing ribs 4, and the spiral reinforcing ribs 4 are located inside the first spiral groove 5. A spiral protrusion 6 is formed on the outer surface of the carbon fiber reinforcement layer 2 at the location of the first spiral groove 5. The formation of the spiral protrusion 6 can improve the strength of the carbon fiber reinforcement layer 2. A rubber buffer layer 3 is provided on the outer surface of the carbon fiber reinforcement layer 2.
[0023] In use, the spiral reinforcing ribs 4 and the outer surface of the seamless tube body 1 form a support system. When the seamless tube body 1 is impacted, the spiral reinforcing ribs 4 first undergo plastic deformation, thereby protecting the seamless tube body 1. The carbon fiber reinforcing layer 2 can share the impact load of the seamless tube body 1 and absorb the impact energy, further improving the impact resistance performance to prevent the seamless tube from bending and breaking due to impact. Furthermore, before the seamless tube body 1 is impacted, the rubber buffer layer 3 on the surface of the carbon fiber reinforcing layer 2 can play an effective buffering role and absorb the impact energy, further reducing the impact on the seamless tube body 1, thereby protecting the seamless tube body 1.
[0024] Example 2
[0025] like Figure 1 , Figure 3 and Figure 4 As shown, the present invention proposes an impact-resistant seamless semiconductor tube. Compared with Embodiment 1, this embodiment further includes a second spiral groove 7 provided on the inner wall of the rubber buffer layer 3, and spiral protrusions 6 located inside the second spiral groove 7. The number of second spiral grooves 7 is greater than the number of spiral protrusions 6. A steel wire reinforcing mesh 9 is provided inside the rubber buffer layer 3. The steel wire reinforcing mesh 9 can improve the tensile and tear resistance of the rubber buffer layer 3. A wear-resistant coating 8 is provided on the outer surface of the rubber buffer layer 3, which can improve the wear resistance of the surface of the rubber buffer layer 3, effectively prevent the surface wear of the rubber buffer layer 3, and extend its service life. At the same time, the wear-resistant coating 8 can also isolate oxygen, effectively prevent the rubber buffer layer 3 from contacting oxygen, and delay the aging of the rubber buffer layer 3.
[0026] In this embodiment, the second spiral groove 7 facilitates the installation and fixation of the rubber buffer layer 3. At the same time, the extra second spiral groove 7 can also reduce the weight of the rubber buffer layer 3 and form a buffer chamber between the carbon fiber reinforced layer 2 and the rubber buffer layer 3.
[0027] The above specific embodiments are merely several preferred embodiments of this utility model. Based on the technical solution of this utility model and the relevant teachings of the above embodiments, those skilled in the art can make various alternative improvements and combinations to the above specific embodiments.
Claims
1. An impact-resistant seamless semiconductor tube, comprising a seamless tube body (1), a carbon fiber reinforcement layer (2), and a rubber buffer layer (3), characterized in that: The outer surface of the seamless tube body (1) is provided with a spiral reinforcing rib (4), the outer surface of the seamless tube body (1) is provided with a carbon fiber reinforcing layer (2), and the spiral reinforcing rib (4) is located between the carbon fiber reinforcing layer (2) and the seamless tube body (1). The outer surface of the carbon fiber reinforcing layer (2) is provided with a rubber buffer layer (3).
2. The impact-resistant seamless semiconductor tube according to claim 1, characterized in that: The inner wall of the carbon fiber reinforcement layer (2) forms a first spiral groove (5) at the position of the spiral reinforcing rib (4), and the spiral reinforcing rib (4) is located inside the first spiral groove (5).
3. The impact-resistant seamless semiconductor tube according to claim 2, characterized in that: The outer surface of the carbon fiber reinforcement layer (2) forms a spiral protrusion (6) at the position of the first spiral groove (5).
4. The impact-resistant seamless semiconductor tube according to claim 3, characterized in that: The inner wall of the rubber buffer layer (3) is provided with a second spiral groove (7), and the spiral protrusion (6) is located inside the second spiral groove (7). The number of the second spiral groove (7) is greater than the number of spiral protrusions (6).
5. The impact-resistant seamless semiconductor tube according to claim 1, characterized in that: The rubber buffer layer (3) is provided with a steel wire reinforcing mesh (9).
6. The impact-resistant seamless semiconductor tube according to claim 1, characterized in that: The outer surface of the rubber buffer layer (3) is provided with a wear-resistant coating (8).