A heat dissipation mechanism for a case

Abstract

The utility model discloses a kind of heat dissipation mechanisms for cabinet, it includes, heat dissipation plate and cover in heat dissipation plate on shell, heat dissipation plate includes heated end and heat dissipation end, heated end is equipped with several adaptive parts, heat dissipation end is equipped with several assembly parts, at least one adaptive part is communicated with assembly part, cover is completely covered in adaptive part, the utility model is different from traditional heat dissipation plate, this kind of heat dissipation plate includes heated end and heat dissipation end, heated end has adaptive part, it is convenient to assemble and position with mainboard, heat dissipation end has assembly part, for with cabinet assembly, at least one assembly part and adaptive part are communicated, it is convenient for mainboard wire harness to pass through, cover adaptive part of heated end, realize mainboard dustproof seal, heat dissipation end is equipped with fin outside assembly part, high -efficient heat dissipation, this mode combines heat dissipation and dustproof, it is convenient for equipment installation.

Description

Technical Field

[0001] This utility model relates to the field of electrical heat dissipation technology, and in particular to a heat dissipation mechanism for a chassis. Background Technology

[0002] Electrical components inside communication chassis typically utilize finned heatsinks. The conventional approach is to place heat-generating components such as the CPU and graphics card in contact with the fin surface for heat conduction. However, other components remain separated from the fins. To improve heat dissipation, the chassis usually incorporates ventilation designs. Furthermore, some devices are installed outdoors, leading to dust accumulation inside the chassis. Dust easily adheres to the surfaces of critical components like the CPU and graphics card, increasing the risk of equipment failure and shortening their lifespan. Utility Model Content

[0003] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.

[0004] To address the aforementioned problems, this utility model provides the following technical solution:

[0005] A heat dissipation mechanism for a chassis includes a heat sink and a cover covering the heat sink;

[0006] The heat sink includes a heat receiving end and a heat dissipation end. The heat receiving end is provided with a plurality of adapter parts, and the heat dissipation end is provided with a plurality of assembly parts. At least one of the adapter parts is connected to the assembly part, and the cover completely covers the adapter part.

[0007] Based on the above technical solution, the present invention can be further improved as follows.

[0008] As a preferred embodiment of the heat dissipation mechanism for the chassis described in this utility model, an annular groove is provided on the heated end, and the annular groove is completely enclosed in the assembly part.

[0009] As a preferred embodiment of the heat dissipation mechanism for the chassis described in this utility model, the adapter part includes a first adapter part, a second adapter part and a third adapter part, and the assembly part includes a first assembly part and a second assembly part.

[0010] As a preferred embodiment of the heat dissipation mechanism for the chassis described in this utility model, the second adapter includes a first recess and a third opening, the first recess is recessed at the heat-receiving end, and the second adapter has a third opening that passes through the first assembly part.

[0011] As a preferred embodiment of the heat dissipation mechanism for the chassis described in this utility model, the first adapter includes a first protrusion, a first opening, a second protrusion, a screw groove, and a housing, wherein the first protrusion, the first opening, the second protrusion, and the screw groove are all disposed within the receiving cavity of the housing.

[0012] As a preferred embodiment of the heat dissipation mechanism for the chassis described in this utility model, the first protrusion and the second protrusion are staggered on the heated end, and the screw groove is connected to the casing.

[0013] As a preferred embodiment of the heat dissipation mechanism for the chassis described in this utility model, the first protrusion protrudes from the heated end, and the first protrusion has a first opening that passes through the second assembly part.

[0014] As a preferred embodiment of the heat dissipation mechanism for the chassis described in this utility model, the third adapter includes a second protrusion and a second opening, the second protrusion protrudes from the heated end, and the second protrusion has a second opening that passes through the second assembly part.

[0015] The beneficial effects of this utility model are as follows: Unlike traditional heat sinks, this heat sink includes a heat receiving end and a heat dissipation end. The heat receiving end is provided with several adapter parts for easy assembly and positioning with the motherboard. The heat dissipation end is provided with an assembly part for assembly with the chassis. At least one assembly part and the adapter part are connected to facilitate the passage of the motherboard wiring harness. The cover completely covers the adapter part of the heat receiving end to achieve dustproof sealing of the motherboard. All surfaces of the heat dissipation end except for the assembly part are provided with fins to efficiently dissipate the heat-generating parts of the motherboard. This method better integrates the heat dissipation fins and the connection between the motherboard and the chassis, which not only facilitates equipment installation but also has the effects of heat dissipation and dust prevention. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:

[0017] Figure 1 This is a perspective view of the entire embodiment.

[0018] Figure 2 This is an example. Figure 2 for Figure 1 A partial schematic diagram.

[0019] Figure 3 This is an example. Figure 1 A bottom view.

[0020] Figure 4 This is an example. Figure 1 Side view.

[0021] Figure 5 This is an example. Figure 1 A three-dimensional view of the assembled casing.

[0022] In the diagram; heat sink 100, casing 200;

[0023] Heated end 101, heat dissipation end 102, first assembly part 102a, second assembly part 102b;

[0024] First adapter 103, first protrusion 103a, first opening 103a-1, second protrusion 103b, threaded groove 103c, sleeve 103e, receiving cavity 103e-1;

[0025] Second adapter 104, first recess 104a, third opening 104a-1;

[0026] The third adapter 105, the second protrusion 105a, the second opening 105a-1, and the annular groove 106. Detailed Implementation

[0027] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0028] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0029] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0030] Example

[0031] Reference Figures 1 to 5 This is an embodiment of the present utility model, which provides a heat dissipation mechanism for a chassis, a heat dissipation plate 100 and a cover 200 covering the heat dissipation plate;

[0032] The heat sink 100 includes a heat receiving end 101 and a heat dissipation end 102. The heat receiving end 101 is provided with a plurality of adapter parts, and the heat dissipation end 102 is provided with a plurality of assembly parts. At least one adapter part is connected to the assembly part, and the cover 200 completely covers the adapter part.

[0033] Specifically, unlike the traditional heat sink 100, the heat sink 100 includes a heat receiving end 101 and a heat dissipation end 102. The surface of the heat receiving end 101 is provided with several adapter parts to cooperate with the motherboard of the device for easy assembly and positioning. At the same time, the heat dissipation end 102 is provided with an assembly part to match and assemble with the chassis. At least one assembly part and the adapter part are connected to allow the wire harness on the motherboard to pass through. Then, the cover 200 completely covers all the adapter parts of the heat receiving end 101 to completely seal the motherboard and achieve a dustproof effect. Except for the assembly part, all surfaces of the heat dissipation end 102 are provided with fins to dissipate heat from the heat-generating parts of the motherboard.

[0034] For example, such as Figure 1 , Figure 2 As shown, an annular groove 106 is provided on the heated end 101. The annular groove 106 is completely enclosed in the assembly part. Installing a rubber strip in the annular groove 106 can achieve the effect of sealing and dustproofing at the installation points of the heat sink 100 and the cover 200.

[0035] For example, such as Figures 1-3 As shown, the adapter includes a first adapter 103, a second adapter 104 and a third adapter 105, and the assembly includes a first assembly 102a and a second assembly 102b. The second adapter 104 includes a first recess 104a and a third opening 104a-1. The first recess 104a is recessed in the heated end 101, and the second adapter 104 has a third opening 104a-1 that passes through the first assembly 102a.

[0036] In this embodiment, the adapter and assembly part are composed of a second adapter part 104 and a first assembly part 102a, and the two are connected by a third opening 104a-1 to allow the wire harness to pass through.

[0037] For example, such as Figures 1-3As shown, the adapter includes a first adapter 103, a second adapter 104, and a third adapter 105, and the assembly includes a first assembly 102a and a second assembly 102b. The first adapter 103 includes a first protrusion 103a, a first opening 103a-1, a second protrusion 103b, a threaded groove 103c, and a housing 103e. The first protrusion 103a, the first opening 103a-1, the second protrusion 103b, and the threaded groove 103c are all located in the receiving cavity 103e-1 of the housing 103e. The first protrusion 103a and the second protrusion 103b are staggered on the heated end 101. The threaded groove 103c is connected to the housing 103e. The first protrusion 103a protrudes from the heated end 101, and the first protrusion 103a has a first opening 103a-1 that passes through the second assembly 102b.

[0038] In this embodiment, the adapter and assembly are composed of a first adapter 103 and a second assembly 102b. The housing 103e, the second protrusion 103b and the screw groove 103c of the first adapter 103 are spliced ​​on the surface of the heated end 101. The first protrusion 103a and the second assembly 102b are processed by stamping grooves on the heat sink 100. In this embodiment, the wire harness passes through the first opening 103a-1 of the first protrusion 103a.

[0039] It is worth mentioning that, such as Figure 4 As shown, the housing 103e and the screw groove 103c or multiple protrusions are attached to the heat-receiving end of the heat sink 100. Therefore, the heat sink 100 can be made from a single sheet of material and then stamped into multiple surfaces with different concave and convex shapes to meet the needs of the corresponding motherboard, heat-generating appliances and chassis. This can reduce the forming process of the heat sink 100.

[0040] For example, such as Figure 1 , Figure 2 As shown, the adapter part includes a first adapter part 103, a second adapter part 104, and a third adapter part 105. The assembly part includes a first assembly part 102a and a second assembly part 102b. The third adapter part 105 includes a second protrusion 105a and a second opening 105a-1. The second protrusion 105a protrudes from the heated end 101. The second protrusion 105a has a second opening 105a-1 that passes through the second assembly part 102b. In this embodiment, the adapter part and the assembly part are composed of the third adapter part 105 and the second assembly part 102b. The second opening 105a-1 of the second protrusion 105a of the third adapter part 105 allows the wire harness to pass through.

[0041] It is worth mentioning that these three embodiments can be arbitrarily combined to form new embodiments, the purpose of which is to match the shape of the corresponding motherboard, heat-generating appliances and chassis, but all adapter parts should be completely covered by the cover 200 to meet the requirements of dust prevention and facilitate the assembly of the motherboard, heat-generating appliances and heat sink 100.

[0042] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape and proportion of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Without departing from the scope of this invention, other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0043] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the present invention as currently considered, or those features that are not relevant to implementing the present invention) may be omitted.

[0044] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A heat dissipation mechanism for a computer chassis, characterized in that: Includes a heat sink (100) and a cover (200) covering the heat sink. The heat sink (100) includes a heat receiving end (101) and a heat dissipation end (102). The heat receiving end (101) is provided with a plurality of adapter parts, and the heat dissipation end (102) is provided with a plurality of assembly parts. At least one of the adapter parts is connected to the assembly parts, and the cover (200) completely covers the adapter parts.

2. The heat dissipation mechanism for a chassis as described in claim 1, characterized in that: An annular groove (106) is provided on the heated end (101), and the annular groove (106) is completely enclosed in the assembly part.

3. The heat dissipation mechanism for a chassis as described in claim 1, characterized in that: The adapter includes a first adapter (103), a second adapter (104) and a third adapter (105), and the assembly includes a first assembly (102a) and a second assembly (102b).

4. The heat dissipation mechanism for a chassis as described in claim 3, characterized in that: The second adapter (104) includes a first recess (104a) and a third opening (104a-1). The first recess (104a) is recessed in the heated end (101), and the second adapter (104) has a third opening (104a-1) that passes through the first assembly part (102a).

5. The heat dissipation mechanism for a chassis as described in claim 3, characterized in that: The first adapter (103) includes a first protrusion (103a), a first opening (103a-1), a second protrusion (103b), a threaded groove (103c), and a housing (103e). The first protrusion (103a), the first opening (103a-1), the second protrusion (103b), and the threaded groove (103c) are all located in the receiving cavity (103e-1) of the housing (103e).

6. The heat dissipation mechanism for a chassis as described in claim 5, characterized in that: The first protrusion (103a) and the second protrusion (103b) are alternately arranged on the heated end (101), and the screw groove (103c) is connected to the casing (103e).

7. The heat dissipation mechanism for a chassis as described in claim 6, characterized in that: The first protrusion (103a) protrudes from the heated end (101), and the first protrusion (103a) has a first opening (103a-1) that passes through the second assembly part (102b).

8. The heat dissipation mechanism for a chassis as described in claim 3, characterized in that: The third adapter (105) includes a second protrusion (105a) and a second opening (105a-1). The second protrusion (105a) protrudes from the heated end (101), and the second protrusion (105a) has a second opening (105a-1) that passes through the second assembly part (102b).

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