A server mainboard test fixture
By setting up an independent heat dissipation module in the server motherboard test fixture to cool the graphics card and CPU, the problem of frequency throttling caused by overheating was solved, and the testing accuracy and stability were improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- KUNSHAN GETWAY ELECTRONICS CO LTD
- Filing Date
- 2025-08-12
- Publication Date
- 2026-06-05
AI Technical Summary
Existing server motherboard testing fixtures lack effective heat dissipation modules when testing CPUs and GPUs, leading to overheating, frequency reduction, and affecting testing accuracy.
The server motherboard test fixture is equipped with a first heat dissipation module to independently cool the graphics card, and a second heat dissipation module is set on the test component to temperature-controlled cool the CPU. Components such as silent fans, heat sinks, and heat pipes are used to achieve efficient heat dissipation.
It effectively avoids CPU and graphics card overheating and frequency throttling, improves detection accuracy, and ensures the accuracy and stability of the test.
Smart Images
Figure CN224328413U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of sewage transportation technology, and in particular to a server motherboard testing fixture. Background Technology
[0002] Functional Testing (FCT) refers to a testing method that provides a simulated operating environment (stimuli and loads) to the unit under test (UUT), causing it to operate in various design states, thereby obtaining parameters for each state to verify the functionality of the UUT. Simply put, it involves applying appropriate stimuli to the UUT and measuring whether the output response meets requirements.
[0003] Currently, server motherboards undergo parameter testing before leaving the factory to prevent malfunctions during assembly and use. This testing requires powering on the motherboard. However, server motherboards integrate high-power components such as the CPU and graphics card. The CPU, the core component of the server, performs all computational and data processing tasks, generating significant heat during operation. Large servers also utilize dedicated graphics processing units (GPUs) for graphics-related computational tasks. Similar to CPUs, GPUs also generate considerable heat. Existing server testing fixtures lack adequate cooling modules. When the CPU and GPU overheat, they automatically reduce their operating frequency (downclocking) to minimize heat generation and protect the processors from potential damage. However, this downclocking of server motherboards severely impacts the testing accuracy of the fixture. Utility Model Content
[0004] The main purpose of this utility model is to provide a server motherboard testing fixture, which can effectively solve the problems in the background art.
[0005] To achieve the above objectives, the technical solution adopted by this utility model is as follows:
[0006] A server motherboard testing fixture includes a main body, a mounting platform on the main body, a workbench on the mounting platform, a test board on the workbench, a graphics card and a CPU on the test board, a first heat dissipation module located on one side of the graphics card and fixedly mounted on the mounting platform for heat dissipating the graphics card on the test board; and a testing component located on the mounting platform, with a second heat dissipation module mounted on the testing component, the second heat dissipation module being located directly above the CPU on the test board for heat dissipating the CPU on the test board.
[0007] In some embodiments, the first heat dissipation module includes a silent fan, and a mounting bracket is provided on the outer side of the silent fan, with the bottom of the mounting bracket fixedly disposed on the mounting platform.
[0008] In some embodiments, the detection component includes a support frame, on which a quick-release clamp is provided. A first detection plate is connected to the bottom of the quick-release clamp. The first detection plate has heat dissipation holes. A second detection plate is provided at the lower end of the first detection plate. A mounting groove is provided in the second detection plate. A second heat dissipation module is fixed in the mounting groove with bolts.
[0009] In some embodiments, the second heat dissipation module includes a heat dissipation fin assembly, with cooling fans on both sides of the heat dissipation fin assembly, threaded holes at the four corners of the edge of the cooling fans, and matching threaded holes on the heat dissipation fin assembly for inserting bolts for fastening.
[0010] In some embodiments, the second heat dissipation module further includes heat pipes, and four heat pipes are disposed on the heat dissipation fins.
[0011] In some embodiments, a first mounting plate and a second mounting plate are further disposed between the first detection plate and the second detection plate, and the first mounting plate and the second mounting plate are used to fix the second heat dissipation module.
[0012] In some embodiments, a groove is provided on the mounting platform, and a side-press quick clamp is provided in the groove, with a VGA cable connected to the end of the side-press quick clamp.
[0013] In some embodiments, a buzzer is also provided on the mounting platform, the buzzer being located between the first heat dissipation module and the board under test, and an indicator light is also provided at the edge of the buzzer.
[0014] In some embodiments, the heat dissipation pipe is a copper pipe.
[0015] In some embodiments, handles are also provided on both sides of the body.
[0016] Compared with the prior art, the present invention has the following beneficial effects:
[0017] In this invention, by setting a first heat dissipation module on the mounting platform, independent heat dissipation of the graphics card can be achieved. By setting a second heat dissipation module on the testing component, temperature-controlled heat dissipation of the CPU can be achieved, effectively avoiding overheating of the server motherboard during testing, which would cause the CPU and graphics card to throttle down, and improving the testing accuracy of the test fixture. Attached Figure Description
[0018] Figure 1This is a schematic diagram of the overall structure of a server motherboard testing fixture according to the present invention;
[0019] Figure 2 This is a structural view of the second heat dissipation module of a server motherboard testing fixture according to the present invention;
[0020] Figure 3 This is a side view of a server motherboard testing fixture according to the present invention;
[0021] Figure 4 This is a side view of a server motherboard testing fixture according to the present invention.
[0022] In the diagram: 1. Main body; 2. Mounting platform; 3. Board under test; 4. First heat dissipation module; 401. Silent fan; 402. Mounting bracket; 5. Second heat dissipation module; 501. Heat dissipation fin assembly; 502. Cooling fan; 503. Heat pipe; 6. Support frame; 7. Quick-release clamp; 8. First test board; 9. Second test board; 10. First mounting plate; 11. Second mounting plate; 12. Side-press quick-release clamp; 13. VGA cable; 14. Buzzer; 15. Indicator light; 16. Handle. Detailed Implementation
[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.
[0024] In the description of this utility model, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the accompanying drawings and are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model; the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance. In addition, unless otherwise explicitly specified and limited, the terms "installed," "connected," and "linked" should be interpreted broadly. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; it can be a connection within two components. For those skilled in the art, the specific meaning of the above terms in this utility model can be understood according to the specific circumstances.
[0025] like Figure 1-4 As shown, a server motherboard testing fixture includes a main body 1, a mounting platform 2 on the main body 1, a workbench on the mounting platform 2, a test board 3 on the workbench, a graphics card and a CPU on the test board 3, a first heat dissipation module 4 located on one side of the graphics card and fixedly mounted on the mounting platform 2 for cooling the graphics card on the test board 3; and a testing component located on the mounting platform 2, with a second heat dissipation module 5 located directly above the CPU on the test board 3 for cooling the CPU on the test board 3. By setting the first heat dissipation module 4 on the mounting platform 2, independent cooling of the graphics card can be achieved, and by setting the second heat dissipation module 5 on the testing component, temperature-controlled cooling of the CPU can be achieved, effectively preventing overheating of the server motherboard during testing and causing CPU and graphics card frequency reduction, thus improving the testing accuracy of the testing fixture.
[0026] The first heat dissipation module 4 includes a silent fan 401. A mounting bracket 402 is provided on the outer side of the silent fan 401. The bottom of the mounting bracket 402 is fixed on the mounting platform 2. When the GPU is running, it will generate a lot of heat. If it cannot be effectively dissipated, the temperature will rise, which may cause performance degradation, system instability or even damage to hardware. The silent fan 401 is a fan specially designed to reduce noise. It can provide relatively quiet fan operation and also has a heat dissipation function.
[0027] Furthermore, the testing component includes a support frame 6, on which a quick-release clamp 7 is mounted. The bottom of the quick-release clamp 7 is connected to a first testing plate 8, on which heat dissipation holes are provided. A second testing plate 9 is provided at the lower end of the first testing plate 8, and a mounting groove is provided in the second testing plate 9. A second heat dissipation module 5 is fixed in the mounting groove with bolts.
[0028] Specifically, the second heat dissipation module 5 includes a heat dissipation fin assembly 501, with cooling fans 502 positioned on both sides of the fin assembly 501. Threaded holes are located at the four corners of the cooling fans 502, and the fin assembly 501 has matching threaded holes for inserting bolts for fastening. The second heat dissipation module 5 also includes heat pipes 503. Four heat pipes 503 are mounted on the heat dissipation fins. Heat dissipation fins are structures that enhance heat dissipation by increasing surface area. They are often mounted on heat sinks and connected to the heat pipes 503. The heat dissipation fins have a large surface area, allowing for better contact with air, thus improving heat dissipation efficiency. The heat pipes 503 are tubular structures filled with a heat-conducting medium, in this embodiment, vapor or liquid metal. When the CPU or other heat sources generate heat, the heat pipes 503 absorb the heat and conduct it to the fins. The heat pipes 503 are typically designed in a long, thin, and curved shape to increase their surface area and heat conduction efficiency. Heat is transferred from the heat pipe 503 to the heat sink fins via the heat pipe 503, and then dissipated through air convection. This design effectively increases the heat dissipation surface area and improves heat dissipation efficiency, thereby keeping the CPU temperature within a controllable range.
[0029] Furthermore, a first mounting plate 10 and a second mounting plate 11 are provided between the first detection plate 8 and the second detection plate 9. The first mounting plate 10 and the second mounting plate 11 are used to fix the second heat dissipation module 5.
[0030] Specifically, the mounting platform 2 has a slot, and a side-pressure quick clamp is installed in the slot. The end of the side-pressure quick clamp 12 is connected to a VGA cable 13. The side-pressure quick clamp 12 is used to insert the VGA cable 13 into the server motherboard.
[0031] Furthermore, a buzzer 14 is also provided on the mounting platform 2. The buzzer 14 is located between the first heat dissipation module 4 and the board under test 3. An indicator light 15 is also provided at the edge of the buzzer 14.
[0032] Specifically, heat pipe 503 is made of copper. Copper has excellent thermal conductivity, with a high thermal conductivity coefficient, which allows it to quickly transfer heat from one point to another. This enables the copper heat pipe 503 to efficiently conduct heat generated by the GPU or other heat sources to the heatsink fins.
[0033] Furthermore, handles 16 are provided on both sides of the main body 1, which facilitates the transfer of the test fixture.
[0034] It should be noted that this utility model is a server motherboard testing fixture. In use, the board to be tested 3 is placed in the testing area, the quick-release clamp 7 is pressed down, and the quick-release clamp 12 is pushed. At the same time, the first heat dissipation module 4 is activated. When the motherboard is powered on, the second heat dissipation module 5 located on the motherboard will also be activated at the same time, and will provide corresponding heat dissipation for the CPU. In this utility model, by setting the first heat dissipation module 4 on the mounting platform 2, independent heat dissipation for the graphics card can be achieved. By setting the second heat dissipation module 5 on the testing component, temperature-controlled heat dissipation for the CPU can be achieved, effectively avoiding overheating of the server motherboard during testing, which would cause the CPU and graphics card to throttle down, thus improving the testing accuracy of the testing fixture.
[0035] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claims. The scope of protection of this utility model is defined by the appended claims and their equivalents.
Claims
1. A server motherboard testing fixture, characterized in that, include: The main body is provided with a mounting platform, a workbench is provided on the mounting platform, a test board is provided on the workbench, a graphics card and a CPU are provided on the test board, and a first heat dissipation module is provided on one side of the graphics card. The first heat dissipation module is fixedly provided on the mounting platform and is used to dissipate heat from the graphics card on the test board. A detection component is disposed on the mounting platform, and a second heat dissipation module is disposed on the detection component. The second heat dissipation module is located directly above the CPU of the board under test and is used to dissipate heat from the CPU on the board under test.
2. The server motherboard testing fixture according to claim 1, characterized in that: The first heat dissipation module includes a silent fan, and a mounting bracket is provided on the outer side of the silent fan. The bottom of the mounting bracket is fixedly mounted on the mounting platform.
3. A server motherboard testing fixture according to claim 2, characterized in that: The detection assembly includes a support frame, on which a quick-release clamp is mounted. A first detection plate is connected to the bottom of the quick-release clamp. The first detection plate has heat dissipation holes. A second detection plate is mounted at the lower end of the first detection plate. A mounting groove is formed in the second detection plate. A second heat dissipation module is bolted into the mounting groove.
4. A server motherboard testing fixture according to claim 3, characterized in that: The second heat dissipation module includes a heat dissipation fin assembly, with cooling fans on both sides of the heat dissipation fin assembly. Threaded holes are provided at the four corners of the edge of the cooling fans, and the heat dissipation fin assembly is provided with matching threaded holes for inserting bolts for fastening.
5. A server motherboard testing fixture according to claim 4, characterized in that: The second heat dissipation module also includes heat pipes, and four heat pipes are provided on the heat dissipation fins.
6. A server motherboard testing fixture according to claim 5, characterized in that: A first mounting plate and a second mounting plate are also provided between the first detection plate and the second detection plate, and the first mounting plate and the second mounting plate are used to fix the second heat dissipation module.
7. A server motherboard testing fixture according to claim 6, characterized in that: The mounting platform has a groove, and a side-pressure quick clamp is installed in the groove. The end of the side-pressure quick clamp is connected to a VGA cable.
8. A server motherboard testing fixture according to claim 7, characterized in that: A buzzer is also provided on the mounting platform, which is located between the first heat dissipation module and the board under test. An indicator light is also provided at the edge of the buzzer.
9. A server motherboard testing fixture according to claim 8, characterized in that: The heat dissipation pipe is a copper pipe.
10. A server motherboard testing fixture according to claim 9, characterized in that: Handles are also provided on both sides of the main body.