Camera module and electronic device

Abstract

The present disclosure relates to a camera module and an electronic device, the camera module comprising a lens assembly, an imaging assembly and a package, the imaging assembly comprising a circuit board and an image sensor electrically connected to the circuit board through a connecting line; the circuit board is provided with a receiving groove and a notch opened along a direction perpendicular to an optical axis of the lens assembly, the notch is communicated with the receiving groove, and the notch is close to an edge of the electronic device; the image sensor is arranged in the receiving groove and extends into the notch; the package is formed on the circuit board and the image sensor and covers the notch; and the package is provided with a light passing hole corresponding to the receiving groove. In the camera module of the present application, the receiving groove and the notch are arranged to be communicated with each other on the circuit board, and the circuit board is arranged outside part of the edge of the image sensor, so that the normal arrangement of the electronic components on the circuit board is ensured, the size of the camera module as a whole can be reduced, the required mounting space of the camera module is smaller, and the electronic device is more convenient to realize multifunction and miniaturization.

Description

Technical Field

[0001] This application relates to the field of imaging technology, and more particularly to a camera module and electronic device. Background Technology

[0002] With the continuous development of technology, electronic devices with cameras, such as smartphones, smartwatches, and laptops, are gradually evolving towards greater multifunctionality and miniaturization. To fulfill image acquisition capabilities, electronic devices typically include cameras. However, camera modules in these technologies are usually quite large, occupying considerable installation space. This not only hinders the assembly of the camera module itself but also reduces the installation space for other electronic components, thus impeding the multifunctionality and miniaturization of electronic devices. Utility Model Content

[0003] The purpose of this disclosure is to provide a camera module and an electronic device to solve the problem that the large size of camera modules in the related art is not conducive to the development of electronic devices towards multi-functionality and miniaturization.

[0004] To achieve the above objectives, this disclosure provides a camera module, comprising:

[0005] Lens assembly;

[0006] An imaging assembly includes a circuit board and an image sensor, the circuit board and the image sensor being electrically connected via a connecting wire; the circuit board has a receiving groove and a notch opened along a direction perpendicular to the optical axis of the lens assembly, the notch communicating with the receiving groove and being close to the edge of the electronic device; the image sensor is disposed in the receiving groove and extends into the notch; and,

[0007] The package is formed on the circuit board and the image sensor and covers the notch. The package has a light-transmitting hole corresponding to the receiving groove.

[0008] As an optional implementation, the edge of the image sensor is flush with or nearly flush with the outer edge of the notch. This reduces the extra space occupied by the circuit board in the direction of the notch's outer edge, resulting in a more compact circuit board size and a more compact overall camera module in that direction. This facilitates the installation of the camera module and makes it easier for electronic devices to achieve multi-functionality and miniaturization.

[0009] As an optional implementation, the width of the notch and the width of the receiving groove in the direction of the notch width are the same. This arrangement, where the receiving groove and the notch are of equal width, has two advantages: firstly, there is no obvious dividing line between the receiving groove and the notch, making it easier to assemble the image sensor onto the circuit board; secondly, the shape of the receiving groove is roughly rectangular, allowing the image sensor to also be a rectangular structure, resulting in a more regular shape for the image sensor.

[0010] As an optional implementation, both the receiving groove and the notch extend through the opposite sides of the circuit board along the optical axis; the bottom surface of the image sensor and the side of the circuit board facing away from the lens assembly are flush. This design allows the space occupied by the image sensor in the optical axis direction to overlap with the circuit board, reducing the space occupied by the entire camera module in the optical axis direction. This design also makes the lower surface of the camera module neater, facilitating its installation.

[0011] As an optional implementation, the connecting line is located on the periphery of the receiving groove, excluding the notch. This eliminates the need for connecting lines and corresponding pads on the notch side when electrically connecting the image sensor and the circuit board, thus reducing the space occupied by the circuit board in the notch direction.

[0012] As an optional implementation, the package has a boss extending along the contour of the image sensor, the boss surrounding the image sensor and embedded between the circuit board and the image sensor. The boss protects the edges of the image sensor, preventing damage during camera module assembly. Furthermore, the boss embedded between the circuit board and the image sensor also prevents collisions between the package and the image sensor.

[0013] As an optional implementation, the distance between the boss facing the wall of the image sensor and the boss away from the wall of the image sensor is less than or equal to 0.1 mm.

[0014] As an optional implementation, the camera module further includes a motor assembly disposed in the package, and the motor assembly has an electrical connection structure on the side near the package. The electrical connection structure extends from the bottom surface of the motor assembly to the circuit board and is electrically connected to the circuit board.

[0015] As an optional implementation, the camera module further includes a connector and a flexible circuit board, the flexible circuit board being connected between the connector and the circuit board, and the connector being used for electrical connection with the electronic device. This allows the camera module to easily establish electrical connection and signal transmission with the main body of the electronic device.

[0016] On the other hand, this application also discloses an electronic device including a camera module as described in any one of the above statements.

[0017] Compared with the prior art, the beneficial effects of this application are:

[0018] The camera module of this application, by setting receiving slots and notches on the circuit board, allows the image sensor to be housed within these slots and notches. As with related technologies, the circuit board no longer needs to support the image sensor. Correspondingly, the circuit board no longer needs to be larger than the image sensor in all directions perpendicular to the optical axis to form a portion for mounting electronic components. In this application, the circuit board houses the image sensor through a receiving slot and notch structure. This ensures that the circuit board can be electrically connected to the image sensor and that electronic components can be properly mounted on the circuit board. Simultaneously, it reduces the overall height of the camera module along the optical axis and avoids wasting space on the circuit board, thereby reducing the size of the circuit board and consequently the size of the imaging components. This results in a smaller overall size of the camera module and requires less installation space. When the camera module of this application is applied to electronic devices, it facilitates the realization of multifunctionality and miniaturization of electronic devices. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a cross-sectional view of a camera module in the prior art;

[0021] Figure 2 This is a schematic diagram of the structure of a circuit board and an image sensor in the prior art;

[0022] Figure 3 This is a schematic diagram of the camera module structure disclosed in the embodiments of this application;

[0023] Figure 4 This is a schematic diagram of the imaging component disclosed in the embodiments of this application under a first implementation.

[0024] Figure 5 yes Figure 4 A schematic diagram of the circuit board structure in the imaging component;

[0025] Figure 6 yes Figure 5 A plan view of the circuit board in the diagram;

[0026] Figure 7 This is a schematic diagram showing the position of the camera module in the electronic device according to the embodiments of this application;

[0027] Figure 8 This is a schematic diagram of the imaging component disclosed in the embodiments of this application under a second implementation;

[0028] Figure 9 yes Figure 8 A schematic diagram of the circuit board structure;

[0029] Figure 10 yes Figure 9 A plan view of the circuit board in the diagram;

[0030] Figure 11 This is a cross-sectional view of the imaging component disclosed in the embodiments of this application in the y-direction;

[0031] Figure 12 This is a cross-sectional view of the imaging component disclosed in the embodiments of this application in the x-direction;

[0032] Figure 13 This is a schematic diagram showing the connection between the image sensor and the circuit board in the imaging assembly disclosed in this application embodiment;

[0033] Figure 14 This is a schematic diagram of the structure of the camera module disclosed in the embodiments of this application when it has a flexible circuit board and a connecting plate;

[0034] Figure 15 This is a schematic diagram of the structure of the camera module disclosed in the embodiments of this application when it has a motor assembly.

[0035] Explanation of reference numerals in the attached figures:

[0036] 1. 1a-Camera module; 11-Lens assembly; 111-Lens; 112-Housing; 113-Filter; 114-Filter holder; 12-Imaging assembly; 121, 121a-Circuit board; 1211-Receiving slot; 1212-Notch; 1213-Connecting wire; 122, 122a-Image sensor; 1221-Pad; 13-Package; 131-Boss; 132-Light transmission hole; 14-Flexible circuit board; 15-Connector; 16-Motor assembly; 100-Electronic device. Detailed Implementation

[0037] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application. When the following description refers to the accompanying drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0038] In this application, the terms "upper," "lower," "left," "right," "front," "rear," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. These terms are primarily for the purpose of better describing this application and its embodiments, and are not intended to limit the indicated device, element, or component to having a specific orientation, or to be constructed and operated in a specific orientation.

[0039] Furthermore, in addition to indicating location or positional relationship, some of the aforementioned terms may also have other meanings. For example, the term "above" may also be used in some cases to indicate a certain dependency or connection relationship. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0040] Furthermore, the terms "installation," "setup," "equipped with," "connection," and "linked" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral structure; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium, or an internal connection between two devices, components, or parts. Those skilled in the art can understand the specific meaning of these terms in this application based on the specific circumstances.

[0041] Furthermore, the terms "first," "second," etc., are primarily used to distinguish different devices, elements, or components (which may be the same or different in specific type and construction), and are not intended to indicate or imply the relative importance or quantity of the indicated devices, elements, or components. Unless otherwise stated, "a plurality of" means two or more.

[0042] With the continuous development of technology, electronic devices with cameras, such as smartphones, smartwatches, and laptops, are gradually evolving towards greater functionality and miniaturization. To fulfill image acquisition requirements, electronic devices typically include cameras. However, camera modules in these technologies are usually quite large, occupying significant installation space. This not only hinders the assembly of the camera module itself but also reduces the space available for other electronic components, thus impeding the miniaturization and multifunctionality of the electronic devices. Taking smartphones as an example, smartphones usually require a front-facing camera. When the camera module for the front-facing camera is large, it not only occupies considerable installation space but also affects the smartphone's screen-to-body ratio.

[0043] In related technologies, a camera module 1a typically includes a circuit board 121a and an image sensor 122a. The image sensor 122a processes the received image information and is electrically connected to the circuit board 121a. The image information acquired by the image sensor 122a is transmitted to other electronic components through the circuit board 121a. For details, please refer to... Figure 1 and Figure 2 , Figure 1 This is a cross-sectional view of camera module 1a in the related technology. Figure 2 This is a schematic diagram of the structure of circuit board 121a and image sensor 122a in related technologies. Figure 1 and Figure 2 In the image sensor module 1a, the image sensor 122a needs to be mounted on the surface of the circuit board 121a. This means that the circuit board 121a needs to support the image sensor 122a before mounting other electronic components. This makes the size of the circuit board 121a larger than the size of the image sensor 122a. Correspondingly, when the image sensor 122a is mounted on the circuit board 121a, the circuit board 121a extends beyond the edge of the image sensor 122a to support it, and a portion for mounting electronic components is formed in the peripheral area of ​​the image sensor 122a. However, this design results in a larger size for the circuit board 121a, and some space on the circuit board 121a in the peripheral area of ​​the image sensor 122a may be wasted.

[0044] In view of this, this application designs a camera module and an electronic device. The camera module of this application, by setting receiving slots and notches on a circuit board, allows the circuit board to surround a portion of the image sensor's edge. The circuit board no longer needs to support the image sensor as in related technologies. Correspondingly, the circuit board no longer needs to have dimensions larger than the image sensor in all directions to form a portion capable of housing electronic components. In this application, a circuit board of appropriate size is directly accommodated by the receiving slots and notches to form a structure where the circuit board only surrounds a portion of the image sensor's edge. This ensures that the circuit board can be electrically connected to the image sensor and that electronic components can be properly mounted on the circuit board, while also avoiding wasted space on the circuit board and reducing the space occupied by the entire camera module in the optical axis direction. This allows for a reduction in the size of the circuit board and the imaging component. Thus, the overall size of the camera module can be reduced, and the installation space required for the camera module is smaller. When the camera module of this application is applied to electronic devices, it facilitates the realization of multifunctionality and miniaturization of the electronic device.

[0045] The following will describe the scheme of this application in detail with reference to the accompanying drawings.

[0046] This application discloses a camera module 1, Figure 3 This is a schematic diagram of the structure of the camera module 1 disclosed in the embodiments of this application. Figure 4 This is a schematic diagram of the imaging component disclosed in the embodiments of this application under a first implementation. Please refer to... Figure 3 and Figure 4 The camera module 1 of this application includes a lens assembly 11, an imaging assembly 12, and a package 13. The lens assembly 11 is used to acquire image information. The imaging assembly 12 includes a circuit board 121 and an image sensor 122. The image sensor 122 can process the image information acquired by the lens assembly 11. The circuit board 121 and the image sensor 122 are electrically connected via connecting wires, and the image information acquired by the image sensor 122 can be transmitted to other electronic components through the circuit board 121. For ease of illustration, the relative positions of the image sensor 122 and the circuit board 121, as well as the specific structure of the circuit board 121, are shown below. Figure 4 The connecting lines in the diagram are not shown.

[0047] Please refer to the following for details. Figure 4 , Figure 5 and Figure 6The circuit board 121 has a receiving groove 1211 and a notch 1212 perpendicular to the optical axis of the lens assembly 11. The notch 1212 communicates with the receiving groove 1211 and is located near the edge of the electronic device. The image sensor 122 is disposed in the receiving groove 1211 and extends into the notch 1212. Thus, the circuit board 121 forms a structure surrounding a portion of the edge of the image sensor 122. Since the notch 1212 and the receiving groove 1211 are interconnected, the boundary between the notch 1212 and the receiving groove 1211 is typically determined by the structure of the circuit board 121 itself. Figures 4 to 6 The imaging component structure is illustrated by taking the example of a clear dividing line between the notch 1212 and the receiving groove 1211. Figure 6 In the image, the boundary line between the notch 1212 and the receiving groove 1211 in this structure is shown as a dashed line.

[0048] The package 13 is formed on the circuit board 121 and the image sensor 122, and covers the notch 1212. The package 13 has a light-transmitting hole corresponding to the receiving groove 1211. In this way, the package 13 can be used to fix the imaging component 12 and the lens component 11, and the image sensor can receive light from the lens component 11 through the light-transmitting hole to form an image. The lens component 11 and the imaging component 12 can be respectively arranged on both sides of the package 13 in a first direction, that is, the lens component 11 and the imaging component 12 are arranged along the optical axis. Here, the first direction can be the optical axis direction of the camera module 1, that is, the direction of light propagation in the camera module 1.

[0049] The extension direction of the circuit board 121 can be consistent with the extension direction of the sensing surface of the image sensor 122. In the first direction, the outer contour of the imaging component 12 projected onto the package 13 matches the edge of the package 13.

[0050] The camera module 1 of this application, by providing a receiving groove 1211 and a notch 1212 on the circuit board 121, allows the circuit board 121 to surround a portion of the edge of the image sensor 122. As in related technologies, the circuit board 121 no longer needs to support the image sensor, nor does it need to have dimensions larger than the image sensor 122 in all directions to form a portion capable of housing electronic components. In this application, the appropriately sized circuit board 121 is only positioned around a portion of the edge of the image sensor 122, instead of surrounding the entire circumferential edge of the image sensor 122. This ensures that the circuit board 121 can be electrically connected to the image sensor 122 and that electronic components can be properly housed on the circuit board 121, while also avoiding wasted space on the circuit board 121 and reducing the space occupied by the entire camera module 1 in the optical axis direction, thereby reducing the size of the circuit board 121. Thus, the overall size of the camera module 1 in both the height and circumferential directions of the lens assembly 11 can be reduced, requiring less installation space for the camera module 1. When the camera module 1 of this application is applied to electronic devices, it makes it easier for electronic devices to achieve multi-functionality and miniaturization.

[0051] It should be noted that, for example Figure 7 As shown, the camera module 1 is disposed in the electronic device 100, and the notch 1212 of the circuit board 121 is disposed near the edge of the electronic device 100. This is because, in order to avoid affecting components such as the screen, the camera module 1 is generally disposed at the edge of the electronic device 100, for example, at the top edge of the electronic device. Distributing the notch 1212 of the circuit board 121 close to the edge of the electronic device helps to place the image sensor 122 as close as possible to the edge area of ​​the electronic device, reducing the space occupied by the camera module on the screen or other components of the electronic device.

[0052] Typically, the image sensor 122 is constructed as a roughly rectangular plate, with its sensing surface approximately rectangular. In this configuration, the image sensor 122 may have four edges, with two side length directions: length and width. The circuit board 121 may be disposed around three edges of the image sensor 122, while the remaining edge of the image sensor 122 does not have a circuit board 121 structure. Here, the sensing surface refers to the surface of the image sensor 122 used to receive image information.

[0053] For example, with Figures 4 to 6For example, the circuit board 121 can be disposed outside the two opposite edges of the image sensor 122 extending in the width direction, and outside the one edge of the image sensor 122 extending in the length direction. In this case, the structure of the circuit board 121 exists in the width direction of the image sensor 122, while in the length direction of the image sensor 122, the circuit board 121 is disposed outside only one of the two opposite edges of the image sensor 122. In this way, the size of the imaging component 12 in the width direction of the image sensor 122 is reduced.

[0054] In other embodiments, the circuit board 121 may be disposed around the two sides of the image sensor 122 along its length, while only one of the two edges of the image sensor 122 along its width is surrounded by the circuit board 121. In this way, the size of the imaging assembly 12 in the length direction of the image sensor 122 can be reduced.

[0055] It is understandable that when the lengths of all sides of the image sensor 122 are the same or approximately the same, the circuit board 121 can be arranged around the outside of three of the sides, leaving one side without the circuit board 121.

[0056] In this way, since the circuit board 121 is arranged outside three of the four side edges of the image sensor 122, more electronic components can be arranged on the circuit board 121 around the image sensor 122 while ensuring that the size of the circuit board 121 is reduced. The image information acquired by the image sensor 122 can be transmitted to multiple electronic components simultaneously through the circuit board 121, ensuring normal signal transmission between the image sensor 122 and the circuit board 121.

[0057] In some other alternative embodiments, the width of the notch 1212 and the width of the receiving groove 1211 in the width direction of the notch 1212 are the same, such as... Figures 8 to 10 As shown. This arrangement of equal width between the receiving groove 1211 and the notch 1212 has two advantages. First, there is no obvious dividing line between the receiving groove 1211 and the notch 1212, which makes it easy to assemble the image sensor 122 onto the circuit board 121. Second, the shape of the receiving groove 1211 is roughly rectangular, so that the image sensor 122 can also be a rectangular structure, and the shape of the image sensor 122 is relatively regular.

[0058] It should be noted that at this point, the widths of the notch 1212 and the receiving groove 1211 are equal, therefore there is no clear dividing line between the notch 1212 and the receiving groove 1211. In this case, the notch 1212 can be understood as the area of ​​the receiving groove 1211 facing the edge of the circuit board.

[0059] In addition, to facilitate the demonstration of structures such as notch 1212 and receiving groove 1211, Figure 8The connecting lines in the diagram are not shown.

[0060] In some alternative implementations, the edge of the image sensor 122 is flush with or nearly flush with the outer edge of the notch 1212. Specifically, the outer edge of the notch 1212 refers to the outer boundary of the notch 1212, which is the original edge contour of the circuit board 121 before the notch 1212 and the receiving groove 1211 are formed. The edge of the image sensor 122 facing the notch 1212 is flush with or nearly flush with the outer edge of the notch 1212. In this way, the circuit board 121 occupies less extra space in the direction of the outer edge of the notch 1212, the size of the circuit board 121 is more compact, and the size of the entire camera module 1 in this direction is also more compact, which facilitates the installation of the camera module 1 and makes it easier for the electronic device to achieve multifunctionality and miniaturization.

[0061] Furthermore, when the edge of the image sensor 122 is flush with the outer edge of the notch 1212, the edge of the image sensor 122 will also match the overall contour of the circuit board 121 on the side of the notch 1212. At this time, it can be understood that the overall shape of the receiving groove 1211 and the notch 1212 is complementary to the edge shape of the image sensor 122.

[0062] In some embodiments, in the first direction, the edge of the package 13 may further conform to the outer contour of the imaging component 12 projected onto the package 13. That is, when the size of the imaging component 12 is reduced, the shape of the package 13 conforms to the imaging component 12, and the size of the package 13 may also be reduced accordingly to conform to the size of the imaging component 12. When both the size of the imaging component 12 and the package 13 are reduced, the size of the lens assembly 11 may also be reduced.

[0063] In this way, the size of the lens assembly 11 can be minimized, avoiding an excessive difference in size between the lens assembly 11 and the package 13 and imaging assembly 12, thus preventing the lens assembly 11 from being too large and affecting the overall size of the camera module 1. At this time, the contour transition of the camera module 1 in the first direction is more uniform and smooth, and the overall size of the camera module 1 can be reduced. When the camera module 1 of this application is applied to electronic devices, it is easier to install the camera module 1, and it is also easier for electronic devices to achieve multi-functionality and miniaturization.

[0064] It is understood that the "matching" mentioned in this application refers to the fact that the two are roughly the same in shape and size. For example, the "matching of contours" mentioned in this application means that the two contours are roughly the same in shape and size. However, in practical applications, assembly errors between multiple components, protrusions formed by the need to install other structures, and gaps 1212 formed to avoid other structures can all cause the projected outer contour of the imaging component 12's package 13 and the edge of the package 13 to be uneven. In this case, the projected outer contour of the imaging component 12's package 13 cannot perfectly match the edge of the package 13. Therefore, to better suit practical applications, a certain degree of error is allowed in the "matching" mentioned in this application.

[0065] For details, please refer to Figure 11 and Figure 12 ,in, Figure 11 This is a cross-sectional view of the imaging module 1 in the y-direction, i.e., the width direction of the image sensor 122, in the first embodiment of the imaging component 12. Figure 12 This is a cross-sectional view of the imaging module 1 in the x-direction, i.e., the length direction of the image sensor 122, in the first embodiment of the imaging component 12. Figure 11 and Figure 12 In the first direction, the outer contour of the lens assembly 11 projected onto the package 13 matches the edge of the package 13.

[0066] Continue to refer to Figure 11 and Figure 12 The image sensor 122 may at least partially overlap with the circuit board 121 in a first direction. As described above, the first direction may be the optical axis direction, so as to... Figure 11 and Figure 12 Using the direction of the drawing as a reference, in Figure 11 and Figure 12 In the diagram, the first direction is represented by the straight line direction z, which is the up-down direction. The image sensor 122 makes reasonable use of the space of the circuit board 121 in the first direction (z-direction), and the size of the image sensor 122 in the first direction can also be reduced. In this way, the imaging component 12 can reduce its size not only in the x-direction and y-direction mentioned above, but also in the first direction. At this time, the receiving groove 1211 and the notch 1212 of the circuit board 121 form a space for accommodating the image sensor 122 in the first direction. The image sensor 122 can be embedded in the space formed by the circuit board 121, so that the image sensor 122 can at least partially overlap with the circuit board 121 in the first direction.

[0067] In some alternative embodiments, the receiving groove 1211 and the notch 1212 both extend through opposite sides of the circuit board 121 along the optical axis; the bottom surface of the image sensor 122 is flush with the side of the circuit board 121 facing away from the lens assembly 11.

[0068] Specifically, both the receiving groove 1211 and the notch 1212 are through-slot structures, thus penetrating both opposite sides of the circuit board 121. In the first direction, the bottom surface of the image sensor 122, that is, the surface of the image sensor 122 away from the package 13, can be flush with the side of the circuit board 121 away from the lens assembly 11, that is, the surface of the circuit board 121 away from the package 13, referring to... Figure 11 and Figure 12 and with Figure 11 and Figure 12 With the plane of the image as a reference, the lower surface of the image sensor 122 is flush with the lower surface of the circuit board 121.

[0069] This design allows the image sensor to overlap with the circuit board as much as possible in the optical axis direction, reducing the space occupied by the entire camera module in the optical axis direction. Even when the thickness of the image sensor 122 is less than the thickness of the circuit board 121, this design can make the image sensor 122 completely overlap with the circuit board 121 in the first direction. At the same time, this design also makes the lower surface of the camera module 1 neater, which is more conducive to the installation of the camera module 1.

[0070] In some embodiments, the package 13 has a boss 131 extending along the contour of the image sensor 122. The boss 131 surrounds the image sensor 122 and is embedded between the circuit board 121 and the image sensor 122. The boss 131 can protect the edge of the image sensor 122, preventing damage to the image sensor 122 during the assembly of the camera module 1. At the same time, the boss 131 embedded between the circuit board 121 and the image sensor 122 can also prevent collisions between the package 13 and the image sensor 122.

[0071] The distance between the wall surface of the boss 131 facing the image sensor 122 and the wall surface of the boss 131 away from the image sensor 122 can be less than or equal to 0.1 mm. Figure 11 In this context, the spacing can be represented by a straight-line distance A. When the spacing is too large, it will increase the size of the boss 131, which in turn will increase the size of the package 13. When the spacing is too small, it will weaken the protective effect of the boss 131 on the image sensor 122, leading to damage to the image sensor 122.

[0072] As an optional implementation, the connecting wire is disposed on the periphery of the receiving groove 1211, excluding the notch 1212. In this way, when realizing the electrical connection between the image sensor 122 and the circuit board 121, the image sensor 122 does not need to be provided with connecting wires and corresponding electrical connectors on the notch 1212 side, which helps to reduce the space occupied by the circuit board 121 in the direction of the notch 1212 side.

[0073] Please see Figure 13 The image sensor 122 has pads 1221 on its periphery, and the placement of these pads affects the arrangement of the connecting lines 1213 and electrical components on the circuit board 121. Therefore, the image sensor 122 can be positioned without pads and corresponding connecting lines on one side (the notch side), while the pads 1221 are placed on other sides of its circumference. In this way, the area on the circuit board 121 corresponding to the image sensor 122 does not need connecting lines or electrical connection structures for connecting to these lines; instead, connections are made via connecting lines 1213 on the other sides where the pads 1221 are located. Therefore, the area on the circuit board 121 without connecting lines 1213 and electrical components can fit into the "U"-shaped structure formed by the receiving groove 1211 and the notch 1212. This results in a smaller space occupation of the circuit board 121 in the notch side direction.

[0074] In some embodiments, the lens assembly 11 may include a lens 111, a housing 112, a filter 113, and a filter holder 114. The housing 112 surrounds the lens 111, providing protection and fixation. The filter holder 114 is disposed between the package 13 and the lens 111, and the filter 113 is mounted on the filter holder 114. The package 13 also has a through-hole 132, allowing image information acquired by the lens assembly 11 to be transmitted to the sensing surface of the image sensor 122 via the through-hole 132. Figure 8 and Figure 9 As shown.

[0075] When the camera module 1 is used in an electronic device, in order to facilitate connection with the electronic device, the camera module 1 may also be provided with a connector 15 and a flexible circuit board 14. Figure 14 This is a schematic diagram of the structure of the camera module 1 disclosed in this application, which has a flexible circuit board 14 and a connector 15. (Refer to...) Figure 14 The flexible circuit board 14 is electrically connected to the circuit board 121 and the connector 15 respectively. The flexible circuit board 14 can be easily arranged and connected in a narrow and irregular space, while the connector 15 is used to achieve electrical connection with electronic devices through various fixed or detachable connection methods, so that the electronic devices can easily transmit signals, data or power to the camera module 1.

[0076] Furthermore, in some optional embodiments, the camera module also includes a motor assembly 16, such as... Figure 15 As shown. Specifically as follows. Figure 15 As shown, after the housing 112 is hidden, the motor assembly 16 can be seen disposed on the package 13. The side of the motor assembly 16 near the package 13 has an electrical connection structure. The electrical connection structure extends from the bottom surface of the motor assembly 16 to the circuit board 121 and is electrically connected to the circuit board 121.

[0077] The motor assembly 16 can be used to drive the lens 111 in the lens assembly 11 to move and focus, or to realize the image stabilization function of the entire camera module 1.

[0078] Since the package 13 itself is mainly composed of insulating material, as an optional feature, the package 13 is provided with a clearance area (not shown in the figure). The clearance area corresponds to the electrical connection structure, so that the electrical connection structure can be directly electrically connected to the circuit board 121. In this way, the main body of the package 13 can still protect the circuit board 121 and other structures of the camera module 1, while not hindering the normal connection between the circuit board 121 and the motor assembly 16, and also facilitating the maintenance and repair of the camera module 1.

[0079] On the other hand, this disclosure also provides an electronic device 100, including the camera module 1 of any of the above embodiments, and having all its beneficial effects, which will not be repeated here. The electronic device 100 here can be a smartphone, or an electronic device such as a smartwatch with camera functionality.

[0080] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A camera module, applied to an electronic device (100), characterized in that, include: Lens assembly (11); An imaging assembly (12) includes a circuit board (121) and an image sensor (122), the circuit board (121) and the image sensor (122) being electrically connected via a connecting wire (1213); the circuit board (121) has a receiving groove (1211) and a notch (1212) opened along a direction perpendicular to the optical axis of the lens assembly (11), the notch (1212) communicating with the receiving groove (1211), and the notch (1212) being close to the edge of the electronic device (100); the image sensor (122) is disposed in the receiving groove (1211) and extends into the notch (1212); and The package (13) is formed on the circuit board (121) and the image sensor (122) and covers the notch (1212). The package (13) is provided with a light-transmitting hole (132) corresponding to the receiving groove (1211).

2. The camera module according to claim 1, characterized in that, The edge of the image sensor (122) is flush with or nearly flush with the outer edge of the notch (1212).

3. The camera module according to claim 1, characterized in that, The width of the notch (1212) and the width of the receiving groove (1211) in the width direction of the notch (1212) are the same.

4. The camera module according to any one of claims 1-3, characterized in that, The receiving groove (1211) and the notch (1212) both penetrate the circuit board (121) on opposite sides along the optical axis; the bottom surface of the image sensor (122) is flush with the side of the circuit board (121) facing away from the lens assembly (11).

5. The camera module according to any one of claims 1-3, characterized in that, The connecting line (1213) is located on the periphery of the receiving groove (1211) at a location other than the notch (1212).

6. The camera module according to any one of claims 1-3, characterized in that, The package (13) has a boss (131) extending along the contour of the image sensor (122), the boss (131) surrounding the image sensor (122) and embedded between the circuit board (121) and the image sensor (122).

7. The camera module according to claim 6, characterized in that, The distance between the wall surface of the boss (131) facing the image sensor (122) and the wall surface of the boss (131) away from the image sensor (122) is less than or equal to 0.1 mm.

8. The camera module according to any one of claims 1-3, characterized in that, The camera module (1) also includes a motor assembly, which is disposed on the package (13). The motor assembly has an electrical connection structure on the side near the package (13). The electrical connection structure extends from the bottom surface of the motor assembly to the circuit board (121) and is electrically connected to the circuit board (121).

9. The camera module according to any one of claims 1-3, characterized in that, It also includes a connector (15) and a flexible circuit board (14), the flexible circuit board (14) being connected between the connector (15) and the circuit board (121), the connector (15) being used for electrical connection with the electronic device (100).

10. An electronic device, characterized in that, Includes the camera module (1) as described in any one of claims 1-9.

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