A structure integrated ultra-thin camera module

Abstract

The utility model relates to a camera module, concretely relates to a structure integrated type's ultrathin camera module, including lens, iron shell and base, the base is fixed with iron shell sleeve setting, the iron shell is two ends open setting, the iron shell is provided with the lens carrier mechanism for fixing lens in, the lens carrier mechanism includes motor electrification signal hard quality circuit board, the upper end surface of base is set up with first mounting groove for the lens carrier mechanism fixed, the lower end surface of base is set up with second mounting groove for the photosensitive chip mechanism installation, first mounting groove with second mounting groove intercommunication, the photosensitive chip mechanism includes photosensitive chip, electronic component, signal transmission soft quality circuit board and signal transmission connector, the photosensitive chip is 1 / 1.56 inches photosensitive chip.

Description

Technical Field

[0001] This utility model relates to camera modules, specifically to an integrated ultra-thin camera module. Background Technology

[0002] With the rapid development of mobile terminal technology, mobile phones have become indispensable portable electronic devices in people's daily lives. As one of the core competitive advantages of mobile phones, improving the image quality of their cameras has always been a focus of industry research and development. The miniature autofocus camera, as a key component for achieving high-quality shooting on mobile phones, directly impacts the user's shooting experience. Currently, mainstream mobile phones generally adopt a triple-camera configuration, including a wide-angle camera, a periscope telephoto camera, and an ultra-wide-angle camera. Among these, the wide-angle camera, due to its wide applicability, has become the most frequently used main camera on mobile phones, and its performance optimization is crucial for improving the overall photography capabilities of mobile phones.

[0003] Regarding the shoulder height of a camera module, its conventional components include, in order: the motor body, the adhesive layer between the motor and the bracket, the bracket, the adhesive layer between the bracket and the rigid circuit board, and the rigid circuit board itself. The stacking of these structures directly determines the height of the module's shoulder. When using a large-size photosensitive chip, conventional structural designs struggle to balance the application of the large-size photosensitive chip with the need for a thinner and lighter module, resulting in an excessively high shoulder height that fails to meet the requirements of a thinner and lighter mobile phone design, thus limiting the widespread application of large-size photosensitive chips in mobile phone camera modules.

[0004] Therefore, there is an urgent need for an integrated, ultra-thin camera module that can improve image quality by using a large-size photosensitive chip while reducing the height of the module's shoulder, greatly improving the applicability of the camera module in mobile phones. Utility Model Content

[0005] The technical problem solved by this utility model is to provide an integrated ultra-thin camera module, which achieves the use of a large-size photosensitive chip to improve the image quality while reducing the shoulder height of the module, thus greatly improving the applicability of the camera module in mobile phones.

[0006] The basic solution provided by this utility model is: an integrated ultra-thin camera module, including a lens, a metal shell, and a base; the base is sleeved and fixed to the metal shell;

[0007] The iron shell is open at both ends; a lens carrier mechanism for fixing the lens is provided inside the iron shell; the lens carrier mechanism includes a rigid circuit board for motor power signal;

[0008] The upper end face of the base is provided with a first mounting groove for fixing the lens carrier mechanism; the lower end face of the base is provided with a second mounting groove for mounting the photosensitive chip mechanism, and the first mounting groove and the second mounting groove are connected.

[0009] The photosensitive chip mechanism includes a photosensitive chip, electronic components, a flexible circuit board for signal transmission, and a signal transmission connector. The photosensitive chip and electronic components are disposed on one end of the flexible circuit board for signal transmission, and the signal transmission connector is disposed on the other end of the flexible circuit board for signal transmission. The flexible circuit board for signal transmission is fixed in a second mounting slot. The photosensitive chip is electrically connected to the rigid circuit board for motor power-on signals, the electronic components, and the flexible circuit board for signal transmission. The flexible circuit board for signal transmission is electrically connected to the signal transmission connector. The photosensitive chip is a 1 / 1.56-inch photosensitive chip.

[0010] The principle and advantages of this utility model are as follows: In this solution, firstly, the base and the iron shell are fitted and fixed together. Thus, when the base is installed, the height of the entire module is the same as the height of the iron shell. Secondly, the base has a first mounting slot and a second mounting slot for installing and fixing the lens carrier mechanism and the image sensor mechanism. This achieves the embedded installation of the image sensor mechanism on the base. At this time, the lowest point of the image sensor is higher than the lowest point of the base, ensuring that the height of the entire module is still the same as the height of the iron shell. This design ensures that the lowest point of the image sensor does not exceed the lowest surface of the base, making the vertical height of the module dominated by the height of the iron shell, thus overcoming the height redundancy caused by the stacking of multiple components in traditional structures. Furthermore, this solution uses a 1 / 1.56-inch image sensor, which greatly improves the image quality.

[0011] As the core photoelectric conversion component, the photosensitive chip completes the conversion and preliminary processing of optical signals into electrical signals through electrical connections with the rigid circuit board (transmitting motor control signals), electronic components (aiding signal processing), and the flexible circuit board (signal conversion). The flexible circuit board then outputs the processed electrical signals to external devices through electrical connections with the signal transmission connector, thus constructing a complete link of "light acquisition-electric conversion-signal transmission".

[0012] Compared to existing mobile phone camera modules, the typical shoulder height components include: the metal shell of the motor body, the glue between the motor shell and the bracket, the bracket, the glue between the bracket and the rigid circuit board, and the rigid circuit board. In contrast, the shoulder height of this solution only includes the height of the metal shell, which greatly reduces the shoulder height dimension of the module, making it more suitable for mobile phone applications.

[0013] In summary, this solution integrates the photosensitive chip mechanism into the lower surface of the base while employing a large 1 / 1.56-inch photosensitive chip. Through this structural integration design, the shoulder height is simplified to the height of the metal shell, eliminating the additional height of glue and brackets, thus significantly reducing the shoulder height. This allows for the use of a large photosensitive chip to improve image quality while reducing the shoulder height of the module, greatly enhancing the applicability of the camera module in mobile phones.

[0014] Furthermore, the photosensitive chip mechanism also includes a first photosensitive chip ceramic substrate and a second photosensitive chip ceramic substrate, which are respectively disposed on the upper and lower sides of the photosensitive chip; the photosensitive chip is communicatively connected to the first photosensitive chip ceramic substrate via gold balls, the first photosensitive chip ceramic substrate is electrically connected to electronic components via solder paste, the first photosensitive chip ceramic substrate and the second photosensitive chip ceramic substrate are electrically connected to each other via solder paste, and the signal transmission flexible circuit board is electrically connected to the second photosensitive chip ceramic substrate via solder paste.

[0015] Beneficial effects: Ceramic substrates have the ability to directly support electronic components without the need for additional dedicated component mounting carriers (such as independent small circuit boards), allowing electronic components to be tightly attached to the substrate surface. This integrated "substrate-component" layout can significantly reduce the physical distance between components and photosensitive chips and signal transmission lines, integrating previously dispersed components into a smaller space, achieving an "inward shrinkage" of the overall size of the photosensitive chip structure.

[0016] This design achieves integrated installation and size reduction of electronic components, while creating a stronger synergy with the goal of ultra-thin modules. The "inward shrinking" of the photosensitive chip mechanism allows for a more perfect fit into the second mounting slot of the base, avoiding installation interference caused by size redundancy and ensuring that the module's shoulder height is strictly controlled within the range of the metal casing height. At the same time, the compact structure allows for a tighter fit between the 1 / 1.56-inch large-size photosensitive chip and surrounding components, improving image quality without hindering the miniaturization of the module. This further enhances the adaptability of the camera module in thin and light devices such as mobile phones, providing greater flexibility for the appearance design and functional integration of terminal products.

[0017] Furthermore, the lens carrier mechanism includes a movable frame, within which are disposed a lens carrier, an upper spring, a suspension wire, an autofocus energizing coil, a magnetic steel sheet, a magnet, a lower spring, and an optical image stabilization energizing coil;

[0018] The lens is sleeved and fixed on the lens carrier; the autofocus energizing coil is sleeved on the outer side wall of the lens carrier; the upper spring and the lower spring are respectively fixed on the upper end face and the lower end face of the lens carrier; the suspension wire passes through the upper spring, the moving frame and the lower spring in sequence.

[0019] The magnetic steel sheet has mounting positions for installing magnets, and four magnets are provided, distributed along the circumference of the lens carrier.

[0020] The number of optical image stabilization energizing coils is the same as the number of magnets, and they are respectively set directly below each magnet and fixedly connected to the rigid circuit board for motor power signals.

[0021] Beneficial Effects: The lens carrier mechanism integrates multiple components such as the moving frame, lens, and lens carrier into a single unit. These components are connected through precise nesting and fixing, forming a compact structural layout. The lens is nested and fixed to the lens carrier, and the autofocus energizing coil is nested on the outer wall of the lens carrier. This nested design reduces redundant space between components, allowing for efficient integration within a limited space. Simultaneously, four magnets are distributed circumferentially along the lens carrier, with the optical image stabilization energizing coil positioned directly below the magnets. This symmetrical layout fully utilizes the circumferential space within the moving frame, avoiding space waste caused by uneven component distribution and providing favorable conditions for the ultra-thin design of the camera module.

[0022] The upper and lower springs are fixed to the upper and lower surfaces of the lens carrier, respectively. A suspension wire passes through the upper spring, the movable frame, and the lower spring in sequence, forming an elastic support structure for the lens carrier. This design of upper and lower springs combined with the suspension wire provides stable support for the lens carrier, while allowing it to move flexibly during focusing and image stabilization, and can quickly return to its original position after movement, reducing the impact of component shaking on image formation.

[0023] The mounting positions on the magnetic steel sheet provide a stable mounting base for the magnets. The four magnets are distributed around the lens carrier, which not only ensures precise cooperation with the autofocus coil and the optical image stabilization coil, but also forms a balanced reaction force when subjected to force, preventing the lens carrier from tilting or shifting due to uneven force, thus enhancing the reliability of the entire mechanism.

[0024] Furthermore, the photosensitive chip mechanism also includes an infrared cut-off filter disposed above the photosensitive chip.

[0025] Beneficial effects: The infrared cut-off filter is placed above the photosensitive chip, which can accurately filter out infrared light entering the light path. Attached Figure Description

[0026] Figure 1This is a schematic diagram of the overall structure of the integrated ultra-thin camera module in Embodiment 1 of this utility model.

[0027] Figure 2 This is a disassembly diagram of the integrated ultra-thin camera module in Embodiment 1 of this utility model.

[0028] Figure 3 This is a partial structural schematic diagram of the integrated ultra-thin camera module in Embodiment 1 of this utility model. Detailed Implementation

[0029] The following detailed description illustrates the specific implementation method:

[0030] The markings in the accompanying drawings include: lens 1, iron shell 2, upper spring 3, suspension wire 4, moving frame 5, autofocus energizing coil 6, magnetic steel sheet 7, magnet 8, lower spring 9, optical image stabilization energizing coil 10, rigid circuit board for motor energizing signal 11, base 12, infrared cut-off filter 13, first photosensitive chip ceramic substrate 14, photosensitive chip 15, second photosensitive chip ceramic substrate 16, flexible circuit board for signal transmission 17, and signal transmission connector 18.

[0031] The basic implementation examples are as follows: Figure 1 As shown: A structurally integrated ultra-thin camera module includes a lens 1, a metal shell 2, and a base 12; the base 12 is fitted and fixed to the metal shell 2; in this embodiment, the base 12 and the metal shell 2 are fixedly connected by glue.

[0032] The iron shell 2 is open at both ends; a lens 1 carrier mechanism for fixing the lens 1 is provided inside the iron shell 2.

[0033] The lens 1 carrier mechanism includes a movable frame 5 and a rigid circuit board 11 for motor power signal. The movable frame 5 is equipped with a lens 1 carrier, an upper spring 3, a suspension wire 4, an autofocus power coil 6, a magnetic steel sheet 7, a magnet 8, a lower spring 9, an optical image stabilization power coil 10, and a rigid circuit board 11 for motor power signal.

[0034] The lens 1 is sleeved and fixed on the lens 1 carrier; the autofocus energizing coil 6 is sleeved on the outer side wall of the lens 1 carrier; the upper spring 3 and the lower spring 9 are respectively fixed on the upper end face and the lower end face of the lens 1 carrier; the suspension wire 4 passes through the upper spring 3, the moving frame 5 and the lower spring 9 in sequence; in this embodiment, the upper spring 3 and the lower spring 9 are both fixedly connected to the end face of the lens 1 carrier by glue.

[0035] The magnetic steel sheet 7 has mounting positions for installing magnets 8. There are four magnets 8, which are distributed around the circumference of the lens 1 carrier.

[0036] The number of optical image stabilization energizing coils 10 is the same as that of magnets 8, and they are respectively set directly below each magnet 8 and fixedly connected to the rigid circuit board 11 for motor power signal.

[0037] The upper end face of the base 12 is provided with a first mounting groove for fixing the lens 1 carrier mechanism; the lower end face of the base 12 is provided with a second mounting groove for mounting the photosensitive chip 15 mechanism, and the first mounting groove is connected to the second mounting groove.

[0038] The photosensitive chip 15 structure includes a first photosensitive chip ceramic substrate 14, a second photosensitive chip ceramic substrate 16, a photosensitive chip 15, electronic components, a signal transmission flexible circuit board 17, and a signal transmission connector 18.

[0039] The first photosensitive chip ceramic substrate 14 and the second photosensitive chip ceramic substrate 16 are respectively disposed on the upper and lower sides of the photosensitive chip 15. The photosensitive chip 15 and electronic components are disposed on one end of the signal transmission flexible circuit board 17, and the signal transmission connector 18 is disposed on the other end of the signal transmission flexible circuit board 17. The signal transmission flexible circuit board 17 is fixed in the second mounting groove with adhesive. The photosensitive chip 15 is electrically connected to the motor power signal rigid circuit board 11, electronic components, and the signal transmission flexible circuit board 17. The signal transmission flexible circuit board 17 is electrically connected to the signal transmission connector 18. The photosensitive chip 15 is communicatively connected to the first photosensitive chip ceramic substrate 14 through gold balls. The first photosensitive chip ceramic substrate 14 is electrically connected to the electronic components through solder paste. The first photosensitive chip ceramic substrate 14 and the second photosensitive chip ceramic substrate 16 are electrically connected through solder paste. The signal transmission flexible circuit board 17 is electrically connected to the second photosensitive chip ceramic substrate 16 through solder paste.

[0040] The photosensitive chip 15 is a 1 / 1.56-inch photosensitive chip. In this embodiment, the photosensitive chip 15 transmits signals and ensures positional accuracy with the first photosensitive chip ceramic substrate 14 via gold balls; then, the connection position between the photosensitive chip 15 and the gold balls of the first photosensitive chip ceramic substrate 14 is fixed by filling with adhesive; electronic components are connected to the first photosensitive chip ceramic substrate 14 by solder paste printing; the infrared cut-off filter 13 is fixed to the first photosensitive chip ceramic substrate 14 by adhesive; the first photosensitive chip ceramic substrate 14 and the second photosensitive chip ceramic substrate 16 are connected by solder paste to transmit signals and fix their positions; the internal structure base 12 of the motor is hollowed out to embed the above-assembled photosensitive chip 15 component structure and is fixed in position by adhesive; the flexible printed circuit board is connected to the ceramic substrate-2 by solder paste to transmit signals and fix its position.

[0041] The above are merely embodiments of this utility model. Commonly known structures and characteristics are not described in detail here. Those skilled in the art are aware of all common technical knowledge in the field prior to the application date or priority date, are aware of all existing technologies in that field, and have the ability to apply conventional experimental methods prior to that date. Those skilled in the art can, based on the guidance provided in this application, improve and implement this solution in combination with their own capabilities. Some typical known structures or methods should not be obstacles for those skilled in the art to implement this application. It should be noted that those skilled in the art can make several modifications and improvements without departing from the structure of this utility model. These should also be considered within the scope of protection of this utility model, and will not affect the effectiveness of the implementation of this utility model or the practicality of the patent. The scope of protection claimed in this application should be determined by the content of its claims, and the specific embodiments described in the specification can be used to interpret the content of the claims.

Claims

1. A structurally integrated ultra-thin camera module, characterized in that: Includes a lens, a metal casing, and a base; the base is fitted and fixed to the metal casing. The iron shell is open at both ends; a lens carrier mechanism for fixing the lens is provided inside the iron shell; the lens carrier mechanism includes a rigid circuit board for motor power signal; The upper end face of the base is provided with a first mounting groove for fixing the lens carrier mechanism; the lower end face of the base is provided with a second mounting groove for mounting the photosensitive chip mechanism, and the first mounting groove and the second mounting groove are connected. The photosensitive chip mechanism includes a photosensitive chip, electronic components, a flexible circuit board for signal transmission, and a signal transmission connector. The photosensitive chip and electronic components are disposed on one end of the flexible circuit board for signal transmission, and the signal transmission connector is disposed on the other end of the flexible circuit board for signal transmission. The flexible circuit board for signal transmission is fixed in a second mounting slot. The photosensitive chip is electrically connected to the rigid circuit board for motor power-on signals, the electronic components, and the flexible circuit board for signal transmission. The flexible circuit board for signal transmission is electrically connected to the signal transmission connector. The photosensitive chip is a 1 / 1.56-inch photosensitive chip.

2. The structurally integrated ultra-thin camera module according to claim 1, characterized in that: The photosensitive chip mechanism further includes a first photosensitive chip ceramic substrate and a second photosensitive chip ceramic substrate, which are respectively disposed on the upper and lower sides of the photosensitive chip. The photosensitive chip is communicatively connected to the first photosensitive chip ceramic substrate via gold balls. The first photosensitive chip ceramic substrate is electrically connected to electronic components via solder paste. The first and second photosensitive chip ceramic substrates are electrically connected to each other via solder paste. The signal transmission flexible circuit board is electrically connected to the second photosensitive chip ceramic substrate via solder paste.

3. The structurally integrated ultra-thin camera module according to claim 2, characterized in that: The lens carrier mechanism includes a movable frame, within which are arranged a lens carrier, an upper spring, a suspension wire, an autofocus energizing coil, a magnetic steel sheet, a magnet, a lower spring, and an optical image stabilization energizing coil. The lens is sleeved and fixed on the lens carrier; the autofocus energizing coil is sleeved on the outer side wall of the lens carrier; the upper spring and the lower spring are respectively fixed on the upper end face and the lower end face of the lens carrier; the suspension wire passes through the upper spring, the moving frame and the lower spring in sequence. The magnetic steel sheet has mounting positions for installing magnets, and four magnets are provided, distributed along the circumference of the lens carrier. The number of optical image stabilization energizing coils is the same as the number of magnets, and they are respectively set directly below each magnet and fixedly connected to the rigid circuit board for motor power signals.

4. The structurally integrated ultra-thin camera module according to claim 3, characterized in that: The photosensitive chip mechanism also includes an infrared cut-off filter disposed above the photosensitive chip.

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