Camera module and electronic device

Abstract

Embodiments of the present application provide a camera module and an electronic device. The camera module comprises a lens assembly, a hard circuit board, a movable circuit board, an image sensor, a first driving assembly and a bottom plate. The lens assembly, the hard circuit board, the movable circuit board and the bottom plate are arranged in sequence along the optical axis direction of the lens assembly. The hard circuit board is provided with a first through hole. The movable circuit board is electrically connected with the hard circuit board, and the movable circuit board is used for connecting an external circuit. The image sensor is electrically connected with the hard circuit board, the image sensor does not contact the movable circuit board, and the image sensor is coaxially arranged with the first through hole. The orthographic projection of the image sensor and the hard circuit board or the movable circuit board on the optical axis at least partially overlaps. The first driving assembly is electrically connected with the hard circuit board, and the first driving assembly is used for driving the hard circuit board and the image sensor to move relative to the lens assembly in a plane perpendicular to the optical axis. The total height of the camera module provided by the embodiments of the present application is relatively low, which is conducive to reducing the thickness of the electronic device.

Description

Technical Field

[0001] This application relates to the field of photography, and more particularly to a camera module and electronic device. Background Technology

[0002] During mobile phone photography, camera module shake can easily occur due to phone movement, leading to blurry images. Therefore, camera modules need image stabilization designs to ensure image quality. While current mainstream image chip-based sensor shift stabilization technology can effectively compensate for shake, its structural design increases the overall height of the camera module, thus increasing the phone's thickness and negatively impacting its aesthetics and user grip. Utility Model Content

[0003] This application provides a camera module and an electronic device that reduces the overall height of the camera module and the thickness of the electronic device, thereby improving the aesthetics of the electronic device and the user experience.

[0004] In a first aspect, embodiments of this application provide a camera module, including a lens assembly, a photosensitive assembly, a first driving assembly, and a base plate. The photosensitive assembly includes a rigid circuit board, a movable circuit board, and an image sensor. The lens assembly, rigid circuit board, movable circuit board, and base plate are arranged sequentially along the optical axis of the lens assembly. The rigid circuit board has a first through hole. The movable circuit board is electrically connected to the rigid circuit board and is used to connect external circuitry. The image sensor is electrically connected to the rigid circuit board, but does not contact the movable circuit board; the image sensor is coaxially arranged with the first through hole. Coaxial arrangement of the image sensor and the first through hole means that the central axis of the image sensor coincides with the central axis of the first through hole, and their central axes may coincide or substantially coincide with the optical axis. The orthogonal projections of the image sensor and the rigid circuit board or the movable circuit board onto the optical axis at least partially overlap. The first driving assembly is electrically connected to the rigid circuit board and is used to drive the rigid circuit board and the image sensor to move relative to the lens assembly in a plane perpendicular to the optical axis.

[0005] In this embodiment, for example, the rigid circuit board can be a printed circuit board (PCB), and the material of the rigid circuit board can be, for example, ceramic, or other materials that meet the product requirements. The movable circuit board is softer than the rigid circuit board, has flexibility, and can undergo elastic deformation. For example, the movable circuit board can be a trace suspension assembly (TSA), and the material of the movable circuit board can be a polymer material or other flexible materials.

[0006] In this embodiment, the total height of the camera module is the total optical length (TTL) of the lens assembly, plus the total height of the image sensor and the component on the side furthest from the lens assembly (hereinafter referred to as the bottom component). Since the total optical length of the lens assembly is a fixed value in the optical design, it is difficult to compress with the same number of pixels. Therefore, the total height of the camera module can be reduced by decreasing the total height of the image sensor and the bottom component. This embodiment achieves at least partial overlap between the orthographic projection of the image sensor on the optical axis and the orthographic projection of the rigid circuit board on the optical axis, making the image sensor flush or substantially flush with the rigid circuit board. This results in the bottom component of the image sensor consisting only of a base plate and a movable circuit board, leading to a smaller overall height of the image sensor and the bottom component. This is beneficial for reducing the overall height of the camera module and the thickness of the electronic device, thus promoting miniaturization of the camera module and electronic device. Alternatively, the orthographic projection of the image sensor on the optical axis can at least partially overlap with the orthographic projection of the movable circuit board on the optical axis, making the image sensor flush or substantially flush with the movable circuit board. This also results in the bottom component of the image sensor consisting only of a base plate, further reducing the overall height of the image sensor and the bottom component. This also promotes miniaturization of the camera module and electronic device.

[0007] In one implementation of the first aspect, the image sensor is located on the side of the rigid circuit board away from the lens assembly. The image sensor is located inside the second through hole, and along the optical axis, the orthographic projection of the first through hole onto the image sensor falls within the boundary of the image sensor.

[0008] In this implementation, the bottom component of the image sensor consists only of a base plate, thereby further reducing the overall height of the image sensor and the bottom component. This, in turn, reduces the overall height of the camera module and the thickness of the electronic device, which is beneficial for miniaturization of the camera module and the electronic device. Furthermore, this configuration allows the length and / or width of the image sensor to be larger than the first through-hole, resulting in a smaller length and / or width of the rigid circuit board. This facilitates the reduction in length and / or width of the camera module, further contributing to the miniaturization of the camera module and the electronic device.

[0009] In one implementation of the first aspect, a first groove is provided on the side of the base plate facing the lens assembly, and the image sensor is located in the first groove.

[0010] In this implementation, "the image sensor is disposed within the first groove" means that at least a portion of the image sensor can be located within the space of the first groove, but not in contact with the bottom wall of the first groove; or, the image sensor can be in direct contact with the bottom wall of the first groove. For example, having at least a portion of the image sensor located within the space of the first groove, but not in contact with the bottom wall of the first groove, effectively prevents friction between the image sensor and the base plate during movement, thereby extending the service life of both the image sensor and the base plate; furthermore, the overall height of the image sensor and the base plate is reduced, which, combined with the above, helps to reduce the overall height of the imaging module. For example, having the image sensor in direct contact with the bottom wall of the first groove further reduces the overall height of the image sensor and the base plate, thus helping to reduce the overall height of the imaging module.

[0011] In one implementation of the first aspect, the image sensor is located within the first through hole. In this implementation, by placing the image sensor within the first through hole of the rigid circuit board, the image sensor is essentially flush with the rigid circuit board. This allows the bottom component of the image sensor to consist only of a movable circuit board and a base plate, without the rigid circuit board, resulting in a lower overall height of the image sensor and the bottom component, thereby helping to reduce the overall height of the camera module.

[0012] In one implementation of the first aspect, the movable circuit board includes a frame, a substrate, and elastic arms. The substrate is located inside the frame, and the elastic arms are distributed around the inner side of the frame. The elastic arms connect the frame and the substrate. The frame is fixedly connected to the base plate, and the substrate is fixedly connected to the rigid circuit board.

[0013] In this implementation, the rigid circuit board moves along with the substrate during the movement of the first driving component, stretching the elastic arm. After the driving action of the first driving component ends, since the frame connected to the elastic arm is fixed to the base plate, the rigid circuit board and the image sensor fixed to the rigid circuit board can be restored to their initial positions, such as the center of the base plate, under the action of the elastic arm. This can be referred to as image sensor reset. The elastic arm can replace the suspension spring of the traditional image stabilization component to reset the image sensor. Compared with the suspension spring, which occupies a large amount of space, the setting of the elastic arm can further reduce the overall height of the camera module.

[0014] In one implementation of the first aspect, the photosensitive component further includes a filter, which is fixedly disposed on the side of the rigid circuit board facing the lens assembly. Along the optical axis, the orthographic projection of the first through hole on the filter falls within the boundary of the filter.

[0015] In this implementation, the filter can be used to filter infrared light passing through the lens, reducing or avoiding infrared light projection onto the image sensor, which is beneficial to improving the imaging quality of the camera module. In one implementation of the first aspect, the first driving component includes a carrier plate, a bracket, a first magnet, and a first coil. The carrier plate is fixed above and electrically connected to the rigid circuit board, and the carrier plate has a third through hole. Along the optical axis, the orthographic projection of the first through hole onto the third through hole is within the range of the third through hole. The bracket surrounds the lens assembly and is connected to the lens assembly, and the bracket is movably connected to the carrier plate. The bracket has a fourth through hole. Along the optical axis, the orthographic projection of the first through hole onto the fourth through hole is within the range of the fourth through hole. The first magnet is fixed to the side of the bracket away from the lens assembly, and the first coil is fixed to and electrically connected to the carrier plate. The first coil generates a magnetic field by being energized and interacts with the first magnet, thereby driving the carrier plate to move in a plane perpendicular to the optical axis.

[0016] In this implementation, when the electronic device shakes during shooting, the first coil receives an electrical signal and generates a corresponding current. The magnetic field generated by the first coil cutting the first magnet produces a Lorentz force, causing the first coil to move relative to the lens assembly in a plane perpendicular to the optical axis. This causes the image sensor and rigid circuit board to move synchronously in a plane perpendicular to the optical axis, thereby compensating for the shaking of the electronic device and ensuring the image clarity of the image sensor.

[0017] In one implementation of the first aspect, the first drive assembly further includes a ball bearing. A second groove is provided on the side of the support plate facing the bracket, and the ball bearing is located in the second groove. The positions and numbers of the ball bearing and the second groove correspond one-to-one, and the ball bearing is in rolling connection with the bracket.

[0018] In this implementation, the ball bearing is located between the support plate and the bracket, which reduces the frictional force on the bracket during the movement of the support plate in a plane perpendicular to the optical axis, thus reducing wear on both the support plate and the bracket. Furthermore, the rolling connection between the support plate and the bracket allows the support plate to move primarily in a plane perpendicular to the optical axis, maintaining a relatively stable position along the optical axis, thereby achieving limiting of the support plate and other moving components along the optical axis.

[0019] In one implementation of the first aspect, the lens assembly includes a housing, a second driving assembly, and a lens. The second driving assembly is used for focusing the lens along the optical axis. The second driving assembly includes a second magnet, a second coil, and a carrier. The lens includes a lens barrel and a lens inside the lens barrel, and the carrier and lens barrel are an integral structure.

[0020] In this implementation, by setting the carrier and lens barrel as an integrated structure, the shaking caused by insufficient connection between the lens barrel and the carrier during autofocus can be avoided, which helps to improve the accuracy of autofocus.

[0021] Secondly, embodiments of this application provide an electronic device, including a main body and any of the aforementioned camera modules, with the camera module disposed on the main body. In this embodiment, by employing any of the aforementioned camera modules, the overall height of the camera module can be reduced, thereby helping to reduce the thickness of the electronic device and thus improving the aesthetics of the electronic device and the user experience. Attached Figure Description

[0022] Figure 1 This is a schematic diagram of the structure of an electronic device in one embodiment;

[0023] Figure 2(A) is Figure 1 A schematic diagram of the 3D structure of the camera module in the image;

[0024] Figure 2(B) is a top view of the camera module in Figure 2(A);

[0025] Figure 3 This is a schematic diagram of the AA cross-sectional structure of the camera module in Figure 2(B);

[0026] Figure 4 yes Figure 3 A schematic diagram of the lens assembly in the diagram;

[0027] Figure 5 yes Figure 3 An enlarged view of point B;

[0028] Figure 6 This is a schematic diagram of the exploded structure of the camera module in Figure 2(A);

[0029] Figure 7 yes Figure 6 A schematic diagram of the assembly structure of the photosensitive component in the image;

[0030] Figure 8 This is a schematic diagram of the structure of the active circuit board in one embodiment;

[0031] Figure 9 This is a schematic diagram of the structure of the base plate in one embodiment;

[0032] Figure 10 The diagram illustrates the positional relationship between the image sensor and the base plate;

[0033] Figure 11(A) is a schematic diagram of the structure of the first driving component in one embodiment;

[0034] Figure 11(B) is a top view of the first drive assembly in Figure 11(A);

[0035] Figure 12 This is a CC cross-sectional view of the first drive component in Figure 11(B);

[0036] Figure 13 This is a schematic diagram of the assembly of the bearing plate and the ball bearings in Figure 11(A);

[0037] Figure 14 This is a cross-sectional view of the camera module in another embodiment.

[0038] Explanation of reference numerals in the attached figures:

[0039] 1-Electronic devices;

[0040] 10 - Camera module; 20 - Housing;

[0041] 11-Lens assembly, 12-Image stabilization assembly;

[0042] 111-Lens, 112-Second driving assembly, 113-Housing shell, 121-First driving assembly, 122-Photosensitive assembly, 123-Base plate, 124-Conductive block, 125-Support component, 126-Wire; 201-First housing, 202-Second housing;

[0043] 111a-lens, 111b-lens; 112a-carrier, 112b-second coil, 112c-second magnet, 121a-support, 121b-first magnet, 121c-first coil, 121d-carrier plate, 121e-ball bearing; 122a-filter, 122b-image sensor, 122c-rigid circuit board, 122d-movable circuit board, 1231-first groove;

[0044] 1211a - Fourth through hole, 1211d - Third through hole, 1212d - Second groove, 1213d - Protrusion, 1221c - First through hole, 1221d - Second through hole, 1222d - Frame, 1223d - Annular gap, 1224d - Elastic arm, 1225d - Substrate, 1231a - Bottom wall. Detailed Implementation

[0045] This application provides an electronic device, including but not limited to mobile phones, tablets, laptops, in-vehicle devices, wearable devices, augmented reality (AR) glasses, AR helmets, virtual reality (VR) glasses, VR helmets, laptop computers, personal digital assistants (PDAs), or cameras and other devices with camera functions.

[0046] Figure 1 This is a schematic diagram of the structure of an electronic device 1 in one embodiment. For example... Figure 1As shown, for ease of description, the thickness direction of electronic device 1 can be defined as the Z-axis, the length direction as the X-axis, and the width direction as the Y-axis. It is understood that the coordinate system of electronic device 1 can be flexibly set according to specific practical needs and is not limited to what is described above.

[0047] like Figure 1 As shown, the electronic device 1 may include a camera module 10, a housing 20, and a display screen (not shown). It is understood that the accompanying drawings in this embodiment only schematically illustrate some components of the electronic device 1, and the actual structure, size, position, and quantity of these components are not limited by the figures shown. In this embodiment, the portion of the electronic device 1 other than the camera module 10 can be referred to as the main body. It is readily understood that the main body includes the housing 20 and the display screen, and the camera module 10 is mounted within the main body.

[0048] like Figure 1 As shown, for example, the housing 20 may include a first housing 201 and a second housing 202. The first housing 201 may be, for example, a rear housing (hereinafter referred to as rear housing 201), and the second housing 202 may be, for example, a mid-frame (hereinafter referred to as mid-frame 202). The rear housing 201 and the display screen may be respectively connected to the two sides of the mid-frame 202. The rear housing 201 and the mid-frame 202 may enclose the internal space of the electronic device 1. Various devices may be arranged inside the electronic device 1, such as batteries, receivers, microphones, etc.

[0049] Figure 1 The image shows one camera module 10 of the electronic device 1. This is merely an illustrative example and is not intended to limit the number of camera modules 10. The electronic device 1 may also have multiple camera modules 10 as needed.

[0050] In this embodiment, the camera module 10 can be a rear camera module that collects light from one side of the rear cover 201. Alternatively, the camera module 10 can be a front camera module that collects light from one side of the display screen.

[0051] In this embodiment, the optical axis direction of the camera module 10 can be the Z-axis direction.

[0052] Figure 2(A) is Figure 1A three-dimensional structural diagram of the camera module 10 is shown in Figure 2(A). The camera module 10 may include a lens assembly 11 and an image stabilization assembly 12. The lens assembly 11 and the image stabilization assembly 12 may be arranged sequentially along the optical axis. The lens assembly 11 may be fixedly connected to the image stabilization assembly 12. For example, the lens assembly 11 may be assembled onto the image stabilization assembly 12 using an Active Alignment (AA) process, which ensures precise alignment between the lens assembly 11 and the image stabilization assembly 12, guaranteeing high-precision operation of the camera module 10. In another embodiment, the connection method between the lens assembly 11 and the image stabilization assembly is not limited.

[0053] Combination Figure 1 As shown in Figure 2(A), the lens assembly 11 can face outwards from the housing 20 to receive and process ambient light. The image stabilization assembly 12 can face inwards from the housing 20. The image stabilization assembly 12 may include a second drive assembly and an image sensor, etc. The second drive assembly is connected to the image sensor and is used for optical image stabilization of the image sensor. The image sensor is located on the image side of the optical lens. Ambient light passing through the lens assembly 11 can be projected onto the image sensor to form an image, as will be explained below.

[0054] The schematic structure of lens assembly 11 is described below.

[0055] Figure 2(B) is a top view of the camera module 10 in Figure 2(A). Figure 3 This is a schematic diagram of the AA cross-sectional structure of the camera module 10 in Figure 2(B). Figure 4 for Figure 3 A schematic diagram of the lens assembly 11.

[0056] Combination Figure 3 and Figure 4 As shown, the lens assembly 11 may include a housing 113, a second drive assembly 112, and a lens 111, etc. The lens 111 may include a lens barrel 111a and a lens 111b within the lens barrel 111a.

[0057] like Figure 4 As shown, the second drive component 112 can be an autofocus (AF) motor, such as a lens voice coil motor (VCM). The second drive component 112 may include a second magnet 112c, a second coil 112b, and a carrier 112a, etc.

[0058] like Figure 4As shown, the carrier 112a and the lens barrel 111a can be a single integrated structure, meaning they are connected as one piece. In practice, this can be achieved through injection molding, with no clear boundary between them. By making the carrier 112a and lens barrel 111a a single integrated structure, the lens 111 can avoid shaking during autofocus due to insufficient connection between the lens barrel 111a and the carrier 112a, thus improving autofocus accuracy, as will be explained below. In another embodiment, the carrier 112a and lens barrel 111a can also be separate structures, for example, the lens barrel 111a and carrier 112a can be connected by threads. The choice between a single integrated structure and separate structures depends on the product requirements.

[0059] like Figure 4 As shown, the second coil 112b can be fixedly connected to the outer wall of the carrier 112a, and the second magnet 112c can be fixed inside the outer shell 113. The second coil 112b can generate a magnetic field by being energized and interact with the second magnet 112c, thereby driving the carrier 112a and the lens 111 to move along the optical axis, realizing the automatic focusing of the lens 111, which is beneficial to improving the clarity of the image.

[0060] It is understood that the structure of the second driving component 112 is merely illustrative and not intended to limit the embodiments of this application. For example, in another embodiment, the shape, position, and number of the second coil 112b and the second magnet 112c can be determined as needed and are not limited to... Figure 4 As shown.

[0061] Understandable Figure 3 and Figure 4 The structure of the lens assembly 11 shown and described above is only an illustration and is not intended to limit the embodiments of this application.

[0062] Figure 5 for Figure 3 An enlarged diagram of point B in the diagram. Figure 6 This is an exploded view of the camera module 10 in Figure 2(A). Figures 4-6 As shown, the image stabilization assembly 12 may include a photosensitive assembly 122, a first drive assembly 121, and a base plate 123. The lens assembly 11, the photosensitive assembly 122, and the base plate 123 may be arranged sequentially along the optical axis.

[0063] The detailed structures of the photosensitive component 122, the base plate 123, and the first drive component 121 will be described in turn below.

[0064] Figure 7 for Figure 6 A schematic diagram of the assembly structure of the photosensitive component 122. (See attached diagram.) Figures 5-7As shown, the photosensitive component 122 may include a filter 122a, an image sensor 122b, a rigid circuit board 122c, and a movable circuit board 122d. The rigid circuit board 122c, the movable circuit board 122d, and the base plate 123 may be arranged sequentially along the optical axis.

[0065] like Figures 5-7 As shown, for example, the rigid circuit board 122c can be a printed circuit board (PCB). The material of the rigid circuit board 122c can be, for example, ceramic, or other materials that meet the product requirements. The rigid circuit board 122c may have a first through hole 1221c.

[0066] like Figures 5-7 As shown, the movable circuit board 122d is softer than the rigid circuit board 122c, possessing flexibility and capable of elastic deformation. For example, the movable circuit board 122d can be a trace suspension assembly (TSA), and the material of the movable circuit board 122d can be a polymer material or other flexible material. The movable circuit board 122d facilitates the reset of the image sensor 122b, as will be explained below. The movable circuit board 122d can be used to connect external circuitry and is electrically connected to the rigid circuit board 122c. The connection method between the movable circuit board 122d and the rigid circuit board 122c can be soldering or other connection methods that meet product requirements. The movable circuit board 122d may have a second through-hole 1221d.

[0067] Combination Figure 3 , Figures 5-7 As shown, the first through hole 1221c and the second through hole 1221d are positioned correspondingly in the optical axis direction, so that the light passing through the lens 111 can be smoothly transmitted to the image sensor 122b, which will be described below.

[0068] Combination Figure 3 , Figures 5-7As shown, the filter 122a can be fixedly connected to the side of the rigid circuit board 122c facing the lens assembly 11. For example, the filter 122a can be fixed to the rigid circuit board 122c by dispensing adhesive. The filter 122a can cover the first through-hole 1221c; that is, along the optical axis, the orthographic projection of the first through-hole 1221c onto the filter 122a falls within the boundary of the filter 122a. The filter 122a can be used to filter infrared light transmitted through the lens 111, reducing or preventing infrared light from being projected onto the image sensor 122b, which is beneficial for improving image quality. The material of the filter 122a can be, for example, blue glass (BG), which can effectively block infrared interference and enhance shooting stability under complex lighting conditions. In another embodiment, if necessary, the filter 122a can be any material that meets the product requirements, or the photosensitive assembly 122 may not have a filter.

[0069] Combination Figure 3 , Figures 5-7 As shown, the image sensor 122b can be located on the side of the rigid circuit board 122c away from the lens assembly 11 and is electrically connected to the rigid circuit board 122c. Exemplarily, the image sensor 122b and the rigid circuit board 122c can be connected via a flip-chip packaging process. This process eliminates the need for complex wiring via wire bonding, which improves the reliability of the connection between the image sensor 122b and the rigid circuit board 122c and also helps to reduce the size of the camera module 10, achieving miniaturization of the camera module 10 and the electronic device 1. In another embodiment, the image sensor 122b and the rigid circuit board 122c can also be connected in other ways, such as via wire connection or soldering.

[0070] Combination Figure 3 , Figures 5-7 As shown, the image sensor 122b can be located within the second through hole 1221d of the active circuit board 122d and is spaced apart from the active circuit board 122d.

[0071] It is understood that the image sensor 122b being entirely located within the second through-hole 1221d is merely an illustrative example. In practice, in this embodiment, the image sensor 122b may also be partially located within and partially located outside the second through-hole 1221d. The orthographic projection of the image sensor 122b onto the optical axis and the orthographic projection of the movable circuit board 122d onto the optical axis can at least partially overlap. The image sensor 122b and the movable circuit board 122d are aligned or substantially aligned in the optical axis direction. Any plane passing through the optical axis can be defined as the projection plane, and the orthographic projection of the image sensor 122b onto this projection plane and the orthographic projection of the movable circuit board 122d onto this projection plane can at least partially overlap.

[0072] Combination Figure 3 , Figures 5-7 As shown, the image sensor 122b can be coaxially arranged with the first through-hole 1221c. Coaxial arrangement of the image sensor 122b and the first through-hole 1221c means that the central axis of the image sensor 122b coincides with the central axis of the first through-hole 1221c, and their central axes can coincide with or substantially coincide with the optical axis. Along the optical axis, the orthographic projection of the first through-hole 1221c onto the image sensor 122b can fall within the boundary of the image sensor 122b. Defining the length direction of the image sensor 122b as the X-axis and the width direction as the Y-axis, the length and / or width of the image sensor 122b can be larger than the first through-hole 1221c, making the rigid circuit board 122c smaller in length and / or width. This facilitates the reduction in length and / or width of the camera module 10, thereby contributing to the miniaturization of the camera module 10 and the electronic device 1. In another embodiment, the dimensions of the image sensor 122b and the rigid circuit board 122c in length and width are not limited.

[0073] like Figure 3 As shown, the total height of the camera module 10 is the total optical length (TTL) of the lens assembly 11, plus the total height of the image sensor 122b and the component on the side furthest from the lens assembly 11 (hereinafter referred to as the bottom component). Since the total optical length of the lens assembly 11 is a fixed value of the optical design, it is difficult to compress with the same number of pixels. Therefore, the total height of the camera module 10 can be reduced by decreasing the total height of the image sensor 122b and the bottom component.

[0074] like Figure 3 As shown, in this embodiment, by opening a first through hole 1221c in the rigid circuit board 122c and a second through hole 1221d in the movable circuit board 122d, and placing at least a portion of the image sensor 122b in the second through hole 1221d, the image sensor 122b is flush with or substantially flush with the movable circuit board 122d. Through this arrangement, the bottom component of the image sensor 122b consists only of a base plate 123, resulting in a smaller overall height of the image sensor and the bottom component. This reduces the overall height of the camera module 10 and the thickness of the electronic device 1, which is beneficial for miniaturization of the camera module 10 and the electronic device 1.

[0075] like Figure 3As shown, the rigid circuit board 122c and the image sensor 122b can move relative to the lens assembly 11 in a plane perpendicular to the optical axis under the action of the first driving component 121. During this process, the movable circuit board 122d will move and undergo elastic deformation. As a high-precision device, if the image sensor 122b is directly connected to the movable circuit board 122d, repeated bending of the movable circuit board 122d may cause fatigue fracture at the connection point, resulting in an unexpected shift in the position of the image sensor 122b, thus adversely affecting the imaging accuracy of the image sensor 122b. In this embodiment, the image sensor 122b is electrically connected to the rigid circuit board 122c, the rigid circuit board 122c is electrically connected to the movable circuit board 122d, and the movable circuit board 122d is connected to an external circuit, enabling signal transmission between the image sensor 122b and other devices in the electronic device 1. The movable circuit board 122d does not contact the image sensor 122b, that is, there is a gap between the movable circuit board 122d and the image sensor 122b, which can prevent the image sensor 122b from being affected by the bending of the movable circuit board 122d; and by using the rigid circuit board 122c and the base plate 123 as rigid carriers for the image sensor 122b, the mechanical stress on the image sensor 122b from other components can be avoided or reduced, thereby improving the long-term reliability of the image sensor 122b.

[0076] Figure 8 This is a schematic diagram of the structure of the active circuit board 122d in one embodiment. Figure 8 As shown, the movable circuit board 122d may include an elastic arm 1224d, a substrate 1225d, and a frame 1222d, etc.

[0077] like Figure 5 and Figure 8 As shown, substrate 1225d ( Figure 8 (Using dotted shadows to indicate this) can be located in frame 1222d ( Figure 8 The inner side of the substrate 1225d (shown in a diamond-shaped shaded pattern) is fixedly connected to the rigid circuit board 122c, and the connection method can be, for example, soldering. The substrate 1225d and the frame 1222d can be connected by a flexible arm 1224d, and the frame 1222d is fixedly connected to the base plate 123.

[0078] like Figure 8 As shown, there can be multiple elastic arms 1224d, each of which can be a set of suspension wires, and multiple sets of suspension wires are arranged around the substrate 1225d. The elastic arms 1224d can be strip-shaped with a small width, so that only a small material stress needs to be overcome when bending.

[0079] like Figure 8As shown, an annular gap 1223d can be provided between multiple elastic arms 1224d to avoid interference between adjacent elastic arms 1224d, while dispersing mechanical stress and reducing the deformation resistance of elastic arms 1224d.

[0080] refer to Figure 8 As shown, for example, the elastic arm 1224d can be connected to the substrate 1225d via anisotropic conductive film (ACF) process or integral molding process.

[0081] refer to Figure 8 As shown, for example, the elastic arm 1224d can be connected to the frame 1222d via anisotropic conductive adhesive film process or integral molding process.

[0082] Understandable Figure 8 The number and structure of the elastic arms 1224d shown, as well as the connection method between the elastic arms 1224d and the substrate 1225d and the frame 1222d, are only schematic diagrams and are not limited in this embodiment.

[0083] Combination Figure 3 , Figure 5 and Figure 8 As shown, during the movement of the rigid circuit board 122c under the action of the first driving component 121, it can drive the substrate 1225d to move together and stretch the elastic arm 1224d. After the driving action of the first driving component 121 ends, since the frame 1222d connected to the elastic arm 1224d is fixed on the base plate 123, under the action of the elastic arm 1224d, the positions of the rigid circuit board 122c and the image sensor 122b fixed to the rigid circuit board 122c can be restored to their initial positions, such as the middle of the base plate 123, which can be referred to as the reset of the image sensor 122b. The elastic arm 1224d can replace the suspension spring of the traditional image stabilization component 12 to reset the image sensor 122b. Compared with the suspension spring, which occupies a large amount of space, the setting of the elastic arm 1224d can further reduce the overall height of the camera module.

[0084] It is understood that the provision of the elastic arm 1224d is not necessary. In another embodiment, if needed, a suspension spring or other structure can also be used to reset the image sensor 122b.

[0085] Figure 9 This is a schematic diagram of the structure of the base plate 123 in one embodiment. Figure 10 This is a schematic diagram showing the positional relationship between the image sensor 122b and the base plate 123. (Combined with...) Figure 6 , Figure 9 and Figure 10As shown, the base plate 123 may have a first groove 1231 on the side facing the lens assembly 11, and the image sensor 122b is disposed in the first groove 1231. "The image sensor 122b is disposed in the first groove 1231" means that at least a portion of the image sensor 122b may be located within the space of the first groove 1231, but not in contact with the bottom wall 1231a of the first groove 1231; or, the image sensor 122b may be in direct contact with the bottom wall 1231a of the first groove 1231.

[0086] refer to Figure 10 As shown, for example, at least a portion of the image sensor 122b can be located within the space of the first groove 1231, but not in contact with the bottom wall 1231a of the first groove 1231. This effectively prevents the image sensor 122b from rubbing against the base plate 123 during movement, thereby extending the service life of both the image sensor 122b and the base plate 123. Furthermore, the overall height of the image sensor 122b and the base plate 123 is reduced, which, in conjunction with the above description, helps to reduce the overall height of the camera module 10.

[0087] like Figure 10 As shown, for example, the image sensor can directly contact the bottom wall 1231a of the first groove 1231. This arrangement can further reduce the total height of the image sensor 122b and the base plate 123, thereby helping to reduce the total height of the camera module 10.

[0088] It is understood that the first groove 1231 on the side of the base plate 123 facing the lens assembly 11 is only an illustrative example. In another embodiment, the base plate 123 may not have a groove.

[0089] Figure 11(A) is a schematic diagram of the structure of the first driving component 121 in one embodiment, and Figure 11(B) is a top view of the first driving component 121 in Figure 11(A). Figure 12 This is a CC cross-sectional view of the first drive component 121 in Figure 11(B). Figure 13 Figure 11(A) shows a schematic diagram of the assembly of the support plate 121d and the ball bearing 121e.

[0090] Combining Figure 11(A) and Figure 12 As shown, for example, the first drive assembly 121 may include a support plate 121d, a bracket 121a, a first magnet 121b, a first coil 121c, and a ball bearing 121e. The ball bearing 121e can be used to reduce the friction between the support plate 121d and the bracket 121a. In another embodiment, whether or not to provide the ball bearing 121e can be determined according to product requirements.

[0091] Combining Figure 11(A) and Figure 12As shown, the bracket 121a can surround and be fixedly connected to the lens assembly 11. For example, the bracket 121a can be connected to the housing 113 of the lens assembly 11 through an automatic alignment process. The bracket 121a may be provided with a through hole 1211a. For ease of distinction, the through hole 1211d mentioned below can be referred to as the third through hole 1211d, and the through hole 1211a can be referred to as the fourth through hole 1211a.

[0092] Combination Figure 6 Figure 11(A) and Figure 12 As shown, the position of the fourth through hole 1211a in the optical axis direction can correspond to the position of the first through hole 1221c. Along the optical axis direction, the orthographic projection of the first through hole 1221c onto the fourth through hole 1211a can be located within the range of the fourth through hole 1211a, so that the light passing through the lens assembly 11 can all enter the first through hole 1221c after passing through the fourth through hole 1211a and be successfully projected onto the image sensor 122b, reducing light loss.

[0093] Combination Figure 6 Figure 11(A) and Figure 12 As shown, the first magnet 121b can be fixed to the side of the bracket 121a away from the lens assembly 11, and the first coil 121c can be fixed to the carrier plate 121d and electrically connected to the carrier plate 121d. The first coil 121c generates a magnetic field by being energized and interacts with the first magnet 121b, thereby driving the carrier plate 121d to move in a plane perpendicular to the optical axis. The direction of movement of the carrier plate 121d can be, for example, the X direction or the Y direction, or any direction in the XY plane, as will be described below.

[0094] like Figure 3 and Figure 5 As shown, the carrier plate 121d can be fixed above the rigid circuit board 122c and electrically connected to the rigid circuit board 122c. As described above, the first coil 121c is fixedly connected to the carrier plate 121d, the carrier plate 121d is fixedly connected to the rigid circuit board 122c, the filter 122a is fixed to the side of the rigid circuit board 122c facing the lens assembly 11, the image sensor 122b is fixed to the side of the rigid circuit board 122c away from the lens assembly 11, and the substrate 1225d of the movable circuit board 122d is fixedly connected to the rigid circuit board 122c. Therefore, when the first coil 121c interacts with the first magnet 121b and moves in a plane perpendicular to the optical axis, it can drive the carrier plate 121d, the rigid circuit board 122c, the filter 122a, the image sensor 122b, and the substrate 1225d of the movable circuit board 122d, which are directly or indirectly fixed to the first coil 121c, to move synchronously.

[0095] In this embodiment, the synchronously moving components such as the first coil 121c, the carrier plate 121d, the rigid circuit board 122c, the filter 122a, the image sensor 122b, and the substrate 1225d of the movable circuit board 122d in the image stabilization assembly 12 can be collectively referred to as moving components; the non-movable components in the image stabilization assembly 12 relative to the lens assembly 11, such as the bracket 121a, the first magnet 121b, the frame 1222d of the movable circuit board 122d, and the base plate 123, can be collectively referred to as fixed components.

[0096] like Figure 5 As shown, when the electronic device 1 shakes during shooting, the first coil 121c receives an electrical signal and generates a corresponding current. The first coil 121c cuts the magnetic field generated by the first magnet 121b, generating a Lorentz force, which causes the first coil 121c to move relative to the fixed component in a plane perpendicular to the optical axis, and drives the image sensor 122b and other moving components to move synchronously, thereby compensating for the shaking of the electronic device 1, realizing optical image stabilization of the electronic device 1, and ensuring the imaging clarity of the image sensor 122b.

[0097] Combination Figure 6 Figure 11(A) - Figure 13 As shown, the carrier plate 121d may be provided with a third through hole 1211d. The position of the third through hole 1211d in the optical axis direction may correspond to the first through hole 1221c. The orthographic projection of the first through hole 1221c along the optical axis direction may be located within the range of the third through hole 1211d, so that the light passing through the lens assembly 11 can enter the first through hole 1221c after passing through the fourth through hole 1211a and the third through hole 1211d, and be successfully projected onto the image sensor 122b, thereby reducing light loss.

[0098] Combination Figure 6 Figure 11(A) - Figure 13 As shown, the support plate 121d may have a second groove 1212d on the side facing the bracket 121a, and the ball bearing 121e may be located in the second groove 1212d. The position and number of the ball bearing 121e correspond one-to-one with the second groove 1212d, and the ball bearing 121e is in rolling connection with the bracket 121a. A protrusion 1213d facing the bracket 121a may be provided around the second groove 1212d so that the depth of the second groove 1212d matches the ball bearing 121e. In another embodiment, the support plate 121d may not have the protrusion 1213d. In another embodiment, the shape, position, and number of the ball bearing 121e and the second groove 1212d are not limited to those shown in the figures.

[0099] Combination Figure 6 Figure 11(A) - Figure 13As shown, the ball bearing 121e is located between the support plate 121d and the bracket 121a, which can reduce the frictional force on the bracket 121a during the movement of the support plate 121d in a plane perpendicular to the optical axis, thereby reducing the wear of the support plate 121d and the bracket 121a. Furthermore, the rolling connection between the support plate 121d and the bracket 121a allows the support plate 121d to move primarily in a plane perpendicular to the optical axis, maintaining a relatively stable position in the optical axis direction, thus achieving Z-axis limiting of the support plate 121d and other moving components.

[0100] It is understandable that Figure 11(A)- Figure 13 The structure of the first drive component 121 shown is merely an illustrative example and is not intended to limit the embodiments of this application.

[0101] Figure 14 This is a cross-sectional view of the camera module 10 in another embodiment. For the sake of simplicity, Figure 14 Some structures have been omitted.

[0102] Combination Figure 3 and Figure 14 As shown, in this embodiment, with Figure 3 The illustrated embodiment differs in that the image sensor 122b is located within the first through-hole 1221c of the rigid circuit board 122c. It is understood that the image sensor 122b being entirely within the first through-hole 1221c is merely an illustrative example; in practice, the image sensor 122b may also be partially located within and partially outside the first through-hole 1221c. The orthographic projection of the image sensor 122b onto the optical axis and the orthographic projection of the rigid circuit board 122c onto the optical axis can at least partially overlap. The image sensor 122b and the movable circuit board 122d are aligned or substantially aligned along the optical axis. Any plane passing through the optical axis can be defined as the projection plane, and the orthographic projection of the image sensor 122b onto this projection plane and the orthographic projection of the rigid circuit board 122c onto this projection plane can at least partially overlap.

[0103] like Figure 14 As shown, the movable circuit board 122d can be provided with a second through hole 1221d, which helps to save material for the movable circuit board 122d and reduce costs. It is understandable that... Figure 14 The second through hole 1221d shown on the active circuit board 122d is just an illustration. In fact, the active circuit board 122d in this embodiment may not have the second through hole 1221d.

[0104] like Figure 14As shown, for example, image sensor 122b can be electrically connected to rigid circuit board 122c via wire 126 (e.g., gold wire), and movable circuit board 122d can be electrically connected to rigid circuit board 122c via conductive block 124.

[0105] like Figure 14 As shown, the filter 122a can be fixedly connected to the rigid circuit board 122c. A support member 125 can be provided between the filter 122a and the rigid circuit board 122c to allow the filter 122a to avoid obstructing the wire 126. Alternatively, in another embodiment, if necessary, the support member 125 may not be provided between the filter 122a and the rigid circuit board 122c, and the filter 122a can be directly connected to the rigid circuit board 122c.

[0106] Understandable Figure 14 The connection methods shown and described above between the various components are only illustrative. In reality, a suitable connection method can be selected according to the product requirements, such as welding. This embodiment does not limit this.

[0107] like Figure 14 As shown, in this embodiment, by placing the image sensor 122b inside the first through hole 1221c of the rigid circuit board 122c, the image sensor 122b is flush or substantially flush with the rigid circuit board 122c. This allows the bottom component of the image sensor 122b to consist only of the movable circuit board 122d (the thickness of the movable circuit board 122d can be 0.1 mm or more) and the base plate 123, without the rigid circuit board 122c (the thickness of the rigid circuit board 122c can be 0.3 mm or more). This results in a lower overall height of the image sensor 122b and the bottom component, which helps to reduce the overall height of the camera module 10.

[0108] like Figure 14As shown, the rigid circuit board 122c and the image sensor 122b can move relative to the lens assembly 11 under the action of the first driving component 121, and the movable circuit board 122d will move and elastically deform during this process. As a high-precision device, if the image sensor 122b is directly connected to the movable circuit board 122d, repeated bending of the movable circuit board 122d may cause fatigue fracture at the connection point, resulting in an unexpected displacement of the image sensor 122b's position, thus adversely affecting the imaging accuracy of the image sensor 122b. In this embodiment, the image sensor 122b is electrically connected to the rigid circuit board 122c, the rigid circuit board 122c is electrically connected to the movable circuit board 122d, and the movable circuit board 122d is connected to external circuitry, enabling signal transmission between the image sensor 122b and other devices in the electronic device 1. The movable circuit board 122d and the image sensor 122b do not contact each other, thus avoiding the influence of bending of the movable circuit board 122d on the image sensor 122b.

[0109] In the description of the embodiments in this application, unless otherwise stated, "multiple" means two or more.

[0110] The terms "first," "second," etc., are used for descriptive purposes only and should not be construed as implying or suggesting relative importance or implicitly indicating the number of technical features indicated. Features specified as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0111] The directional terms mentioned in the embodiments of this application, such as "upper," "lower," "front," "rear," "left," "right," "inner," "outer," "side," "top," and "bottom," are only for reference to the directions in the accompanying drawings. These directional terms are used to better and more clearly explain and understand the embodiments of this application, and are not intended to explicitly or implicitly suggest that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, etc., and therefore should not be construed as limiting the embodiments of this application.

[0112] In the description of the embodiments in this application, unless otherwise stated, "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone.

[0113] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A camera module, characterized in that, Includes lens assembly, image sensor assembly, first drive assembly, and base plate; The photosensitive component includes a rigid circuit board, a movable circuit board, and an image sensor; The lens assembly, the rigid circuit board, the movable circuit board, and the base plate are arranged sequentially along the optical axis of the lens assembly; The rigid circuit board is provided with a first through hole; The movable circuit board is electrically connected to the rigid circuit board; The image sensor is electrically connected to the rigid circuit board, the image sensor is not in contact with the movable circuit board, and the image sensor is coaxially arranged with the first through hole; The image sensor and the orthogonal projection of the rigid circuit board or the movable circuit board on the optical axis at least partially overlap; The first driving component is electrically connected to the rigid circuit board, and the first driving component is used to drive the rigid circuit board and the image sensor to move relative to the lens assembly in a plane perpendicular to the optical axis.

2. The camera module according to claim 1, characterized in that, The active circuit board is provided with a second through hole, and the image sensor is located on the side of the rigid circuit board away from the lens assembly. The image sensor is located in the second through hole. Along the optical axis, the orthographic projection of the first through hole onto the image sensor falls within the boundary of the image sensor.

3. The camera module according to claim 1, characterized in that, The base plate has a first groove on the side facing the lens assembly, and the image sensor is disposed in the first groove.

4. The camera module according to claim 1, characterized in that, The image sensor is located inside the first through hole.

5. The camera module according to claim 1, characterized in that, The movable circuit board includes a frame, a substrate, and elastic arms. The substrate is located inside the frame, and the elastic arms are distributed around the inner side of the frame. The elastic arms connect the frame and the substrate. The frame is fixedly connected to the base plate, and the base plate is fixedly connected to the rigid circuit board.

6. The camera module according to claim 1, characterized in that, The photosensitive component also includes a filter, which is fixedly disposed on the side of the rigid circuit board facing the lens assembly. Along the optical axis, the orthographic projection of the first through hole on the filter falls within the boundary of the filter.

7. The camera module according to any one of claims 1-6, characterized in that, The first driving component includes a carrier plate, a bracket, a first magnet, and a first coil; The support plate is fixed above the rigid circuit board and electrically connected to the rigid circuit board. The support plate is provided with a third through hole. Along the optical axis, the orthographic projection of the first through hole on the third through hole is located within the range of the third through hole. The bracket surrounds and is connected to the lens assembly, the bracket is movably connected to the support plate, and the bracket is provided with a fourth through hole; along the optical axis, the orthographic projection of the first through hole onto the fourth through hole is located within the range of the fourth through hole; The first magnet is fixed to the side of the bracket away from the lens assembly, and the first coil is fixed to the carrier plate and electrically connected to the carrier plate. The first coil generates a magnetic field by being energized and interacts with the first magnet, thereby driving the carrier plate to move relative to the lens assembly in a plane perpendicular to the optical axis.

8. The camera module according to claim 7, characterized in that, The first drive assembly also includes a ball bearing. The support plate has a second groove on the side facing the bracket. The ball bearing is located in the second groove. The position and number of the ball bearing and the second groove correspond one-to-one. The ball bearing is tactilely connected to the bracket.

9. The camera module according to claim 1, characterized in that, The lens assembly includes a second drive assembly and a lens, wherein the second drive assembly is used to drive the lens to focus in the optical axis direction; The second driving component includes a second magnet, a second coil, and a carrier. The lens includes a lens barrel and a lens inside the lens barrel. The carrier and the lens barrel are an integral structure.

10. An electronic device, characterized in that, It includes a main body and a camera module as described in any one of claims 1-9, wherein the camera module is disposed on the main body.

Images