A circuit connection structure of a matching micro-pump module

Abstract

The utility model discloses a kind of circuit connection structure matched with micro pump module, it is related to driving circuit technical field;It includes support structure, micro pump circuit board and piezoelectric ceramic and adapter plate fixedly connected on support structure, there is adapter plate's first solder pad, second solder pad, third solder pad and fourth solder pad on adapter plate, the first solder pad of adapter plate is connected with the third solder pad of adapter plate through the wire laid on adapter plate, the second solder pad of adapter plate is connected with the fourth solder pad of adapter plate through the wire laid on adapter plate;The first solder pad of micro pump circuit board is adjacent with the first solder pad on adapter plate and welded together, the second solder pad of micro pump circuit board is adjacent with the second solder pad on adapter plate and welded together, the first solder pad of piezoelectric ceramic is adjacent with the third solder pad on adapter plate and welded together, the second solder pad of piezoelectric ceramic is adjacent with the fourth solder pad on adapter plate and welded together;Direct solder pad is welded together to solder pad, and the convenience and reliability of welding are improved.

Description

Technical Field

[0001] This utility model relates to the field of drive circuit technology, and in particular to a circuit connection structure for matching a micropump module. Background Technology

[0002] Currently, micro-pump modules are widely used.

[0003] like Figure 4 As shown, the micropump module includes a support structure 1, a micropump circuit board 2, a piezoelectric ceramic 3, a first wiring harness 6, and a second wiring harness 7. The first pad 2-1 of the micropump circuit board is connected to the first pad 3-1 of the piezoelectric ceramic via the second wiring harness 7. The second pad 2-2 of the micropump circuit board is connected to the second pad 3-2 of the piezoelectric ceramic via the first wiring harness 6. The micropump circuit board 2 and the piezoelectric ceramic 3 are connected by welding the two wiring harnesses together.

[0004] Difficulties in producing and welding wire harnesses: During production, it is inconvenient to weld wire harnesses that are suspended in the air, and there is a risk that the wire harnesses may fall off.

[0005] The micropump module has a low level of integration: the micropump circuit board 2 and piezoelectric ceramic 3 are not integrated together, resulting in inconvenient wiring.

[0006] Therefore, the difficulty in connecting the micropump circuit board and piezoelectric ceramic in the micropump module has become a technical problem that urgently needs to be solved. Utility Model Content

[0007] This invention provides a circuit connection structure for matching micropump modules, solving the technical problem of difficult connection between the micropump circuit board and piezoelectric ceramics in micropump modules.

[0008] To solve the above-mentioned technical problems, the technical solution adopted by this utility model is as follows:

[0009] A circuit connection structure for a matching micropump module includes a support structure, a micropump circuit board and a piezoelectric ceramic fixedly connected to the support structure, and an adapter board. The micropump circuit board has a first pad and a second pad, the piezoelectric ceramic has a first pad and a second pad, and the adapter board has a first pad, a second pad, a third pad, and a fourth pad. The first pad of the adapter board is connected to the third pad of the adapter board via a wire laid on the adapter board, and the second pad of the adapter board is connected to the fourth pad of the adapter board via a wire laid on the adapter board. The first pad of the micropump circuit board is adjacent to and soldered together with the first pad of the adapter board, the second pad of the micropump circuit board is adjacent to and soldered together with the second pad of the adapter board, the first pad of the piezoelectric ceramic is adjacent to and soldered together with the third pad of the adapter board, and the second pad of the piezoelectric ceramic is adjacent to and soldered together with the fourth pad of the adapter board.

[0010] A further technical solution is that the adapter board is a hard adapter board, and the hard adapter board has a first pad, a second pad, a third pad and a fourth pad.

[0011] A further technical solution is that the hard adapter board is a PCB adapter board.

[0012] A further technical solution is that the adapter plate is a flexible adapter plate.

[0013] A further technical solution is that the flexible adapter board is an FPC adapter board.

[0014] The beneficial effects of adopting the above technical solution are as follows:

[0015] A circuit connection structure for a matching micropump module includes a support structure, a micropump circuit board and a piezoelectric ceramic fixedly connected to the support structure, and an adapter board. The micropump circuit board has a first pad and a second pad, the piezoelectric ceramic has a first pad and a second pad, and the adapter board has a first pad, a second pad, a third pad, and a fourth pad. The first pad of the adapter board is connected to the third pad of the adapter board via a wire laid on the adapter board, and the second pad of the adapter board is connected to the fourth pad of the adapter board via a wire laid on the adapter board. The first pad of the micropump circuit board is adjacent to and soldered together with the first pad of the adapter board, the second pad of the micropump circuit board is adjacent to and soldered together with the second pad of the adapter board, the first pad of the piezoelectric ceramic is adjacent to and soldered together with the third pad of the adapter board, and the second pad of the piezoelectric ceramic is adjacent to and soldered together with the fourth pad of the adapter board. The micropump circuit board is connected to the piezoelectric ceramic via an adapter plate, and the soldering is completed directly from pad to pad, which improves the convenience and reliability of soldering, makes it easy to fix and not easy to fall off. Attached Figure Description

[0016] Figure 1 This is a structural diagram of Embodiment 1 of the present invention;

[0017] Figure 2 This is a state diagram of Embodiment 1 of this utility model;

[0018] Figure 3 This is a structural diagram of Embodiment 2 of the present invention;

[0019] Figure 4 This is a structural diagram of the existing technical solution.

[0020] The components are: 1. Support structure, 2. Micropump circuit board, 2-1. First pad of micropump circuit board, 2-2. Second pad of micropump circuit board, 3. Piezoelectric ceramic, 3-1. First pad of piezoelectric ceramic, 3-2. Second pad of piezoelectric ceramic, 4. Hard adapter board, 4-1. First pad of hard adapter board, 4-2. Second pad of hard adapter board, 4-3. Third pad of hard adapter board, 4-4. Fourth pad of hard adapter board, 5. Flexible adapter board, 6. First wire harness, 7. Second wire harness. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit this application or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0022] Many specific details are set forth in the following description in order to provide a full understanding of this application. However, this application may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0023] Example 1:

[0024] like Figure 1 and Figure 2 As shown, this utility model discloses a circuit connection structure for matching a micropump module, including a support structure 1, a micropump circuit board 2 and a piezoelectric ceramic 3 fixedly connected to the support structure 1, and a hard adapter board 4. The micropump circuit board 2 has a first pad 2-1 and a second pad 2-2 of the micropump circuit board. The piezoelectric ceramic 3 has a first pad 3-1 and a second pad 3-2 of the piezoelectric ceramic. The hard adapter board 4 has a first pad 4-1, a second pad 4-2, a third pad 4-3, and a fourth pad 4-4 of the hard adapter board. The first pad 4-1 of the hard adapter board is connected to the third pad 4-3 of the hard adapter board via a wire laid on the hard adapter board. The second pad 4-2 of the hard adapter board is connected to the fourth pad 4-4 of the hard adapter board via a wire laid on the hard adapter board.

[0025] The hard adapter board 4 is a PCB adapter board.

[0026] like Figure 2As shown, during assembly, the first pad 2-1 of the micropump circuit board on the micropump circuit board 2 is adjacent to the first pad 4-1 of the hard adapter board on the hard adapter board 4, and the second pad 2-2 of the micropump circuit board on the micropump circuit board 2 is adjacent to the second pad 4-2 of the hard adapter board on the hard adapter board 4.

[0027] like Figure 1 As shown, the first pad 3-1 of the piezoelectric ceramic on the piezoelectric ceramic 3 is adjacent to the third pad 4-3 of the hard adapter plate on the hard adapter plate 4, and the second pad 3-2 of the piezoelectric ceramic on the piezoelectric ceramic 3 is adjacent to the fourth pad 4-4 of the hard adapter plate on the hard adapter plate 4.

[0028] Solder the first pad 2-1 of the micropump circuit board 2 to the first pad 4-1 of the hard adapter board 4 using solder. Solder the second pad 2-2 of the micropump circuit board 2 to the second pad 4-2 of the hard adapter board 4 using solder. Solder the first pad 3-1 of the piezoelectric ceramic 3 to the third pad 4-3 of the hard adapter board 4 using solder. Solder the second pad 3-2 of the piezoelectric ceramic 3 to the fourth pad 4-4 of the hard adapter board 4 using solder.

[0029] Example 2:

[0030] like Figure 3 As shown, this utility model discloses a circuit connection structure for matching a micropump module, including a support structure 1, a micropump circuit board 2 and a piezoelectric ceramic 3 fixedly connected to the support structure 1, and a flexible adapter plate 5. The similarities will not be repeated here.

[0031] Example 2 is an alternative to Example 1. The flexible adapter board 5 is an FPC adapter board, and the micropump circuit board 2 and the piezoelectric ceramic 3 are welded together using the FPC adapter board.

[0032] The pads on one end of the FPC adapter board are aligned and soldered to the pads on the piezoelectric ceramic 3, and the pads on the other end of the FPC adapter board are aligned and soldered to the pads on the micropump circuit board 2.

[0033] To facilitate a clearer understanding of the technical solution of this application, the technical concept is briefly described below.

[0034] The micropump circuit board 2 and the piezoelectric ceramic 3 are directly spot-welded together using an adapter plate. One end of the adapter plate is directly face-to-face with the piezoelectric ceramic 3, with the pads flush and spot-welded together. The other end of the adapter plate is perpendicular to the micropump circuit board 2, with the pads perpendicular and spot-welded together. The micropump circuit board 2, the piezoelectric ceramic 3, the adapter plate, and the support structure 1 form a micropump module.

[0035] The connection method in this application uses an adapter board to directly solder pads to the pads, improving the convenience and reliability of soldering, making it easy to fix and less prone to detachment. This solves the problem of inconvenient wire harness soldering and avoids the risk of wire harnesses easily detaching.

[0036] Improvements: The micropump circuit board 2 and the piezoelectric ceramic 3 are connected by spot welding of the adapter board pads, which is easy to fix and not easy to fall off.

[0037] The above embodiments are only for illustrating the technical concept and features of this utility model. Their purpose is to enable those skilled in the art to understand the content of this utility model and implement it accordingly. They should not be used to limit the protection scope of this utility model. All equivalent changes or modifications made in accordance with the spirit and essence of this utility model should be included within the protection scope of this utility model.

Claims

1. A circuit connection structure for matching a micropump module, characterized in that: The system includes a support structure (1), a micropump circuit board (2) and a piezoelectric ceramic (3) fixedly connected to the support structure (1), and an adapter board. The micropump circuit board (2) has a first pad (2-1) and a second pad (2-2). The piezoelectric ceramic (3) has a first pad (3-1) and a second pad (3-2). The adapter board has a first pad, a second pad, a third pad, and a fourth pad. The first pad of the adapter board is connected to the third pad of the adapter board via a wire laid on the adapter board. The second pad of the adapter board is connected to the fourth pad of the adapter board via a wire laid on the adapter board; the first pad (2-1) of the micropump circuit board is adjacent to and welded together with the first pad on the adapter board, the second pad (2-2) of the micropump circuit board is adjacent to and welded together with the second pad on the adapter board, the first pad (3-1) of the piezoelectric ceramic is adjacent to and welded together with the third pad on the adapter board, and the second pad (3-2) of the piezoelectric ceramic is adjacent to and welded together with the fourth pad on the adapter board.

2. The circuit connection structure for a matching micropump module according to claim 1, characterized in that: The adapter board is a hard adapter board (4), and the hard adapter board (4) has a first pad (4-1), a second pad (4-2), a third pad (4-3) and a fourth pad (4-4).

3. The circuit connection structure for a matching micropump module according to claim 2, characterized in that: The hard adapter board (4) is a PCB adapter board.

4. The circuit connection structure for a matching micropump module according to claim 1, characterized in that: The adapter plate is a flexible adapter plate (5).

5. The circuit connection structure for a matching micropump module according to claim 4, characterized in that: The flexible adapter plate (5) is an FPC adapter plate.

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