Heat dissipation device and electronic device

Abstract

The application discloses a heat dissipation device and an electronic device. The heat dissipation device is used for the electronic device and comprises a heat dissipation shell, a wind channel arranged in the heat dissipation shell, a first air inlet and a first air outlet of the wind channel, an installation area and a transition area of the wind channel, a first air inlet, a first air outlet, an installation area and a transition area, a first air inlet, a first air outlet, an installation area and a transition area, a first air inlet, a first air outlet, an installation area and a transition area, a first air inlet, a first air outlet, an installation area and a transition area, a first air inlet, a first air outlet, an installation area and a transition area, a first air inlet, a first air outlet, an installation area and a transition area, a first air inlet, a first air outlet, an installation area and a transition area, a first air inlet, a first air outlet, an installation area and a transition area, a first air inlet, a first air outlet, an installation area and a transition area, a first air inlet, a first air outlet, an installation area and a transition area, a first air inlet, a first air outlet, an installation area and a transition area, a first air inlet, a first air outlet, an installation area and a transition

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, specifically relating to a heat dissipation device and an electronic device. Background Technology

[0002] Currently, active cooling is commonly used to improve the heat dissipation performance of electronic devices. For example, Figure 1 , Figure 2 and Figure 3 As shown, the active cooling device in the related technology includes an air duct 1' and a fan 2' disposed within the air duct 1'. The air duct 1' has an air inlet 3' and an air outlet 4'. After the air enters the air duct 1' through the air inlet 3', it flows out through the air outlet 4'. Through the airflow, the heat of the electronic equipment is carried away, thereby achieving the purpose of heat dissipation. However, the noise generated by the fan 2' during operation is directly dissipated to the air outlet 4', resulting in relatively high noise during the operation of the cooling device. Utility Model Content

[0003] This application aims to provide a heat dissipation device and electronic device, at least to solve the problem of excessive operating noise in heat dissipation devices in the related art.

[0004] To solve the above-mentioned technical problems, this application is implemented as follows:

[0005] In a first aspect, embodiments of this application propose a heat dissipation device for electronic devices. The heat dissipation device includes: a heat dissipation shell, an air duct inside the heat dissipation shell, a first air inlet and a first air outlet in the air duct, the air duct including a connected mounting area and a transition area, the first air inlet being connected to the first air outlet through the mounting area and the transition area, the first air outlet being located on one side of the transition area along a first direction, the mounting area being located on one side of the transition area along a second direction, the first direction and the second direction being intersected; and a fan located in the mounting area for supplying air to the transition area.

[0006] Secondly, embodiments of this application provide an electronic device, including: a housing, the housing having a second air inlet and a second air outlet; and a heat dissipation device as claimed in any of the first aspects, the heat dissipation device being disposed inside the housing, the first air inlet being connected to the second air inlet, and the first air outlet being connected to the second air outlet.

[0007] In the embodiments of this application, the heat dissipation device includes a heat sink and a fan. The heat sink has an air duct, which includes an installation area and a transition area. The fan is located in the installation area and can blow air into the transition area. Under the action of the fan, the airflow outside the electronic device can enter the air duct through the first air inlet, then flow through the fan to the transition area, and finally flow out of the electronic device through the first air outlet, thereby carrying away the heat of the electronic device and achieving heat dissipation. The first air outlet is located on one side of the transition area along a first direction, and the installation area is located on one side of the transition area along a second direction. The first and second directions intersect, meaning the fan's airflow direction is offset from the location of the first air outlet. The airflow blown by the fan turns within the transition area and then flows out through the first air outlet. On the one hand, the transition area separates the fan from the first air outlet, allowing some of the noise generated by the fan during operation to be absorbed. On the other hand, the airflow changes direction within the transition area after being blown out by the fan before flowing out through the first air outlet, slowing down the airflow speed and thus reducing the noise of the heat dissipation device during operation.

[0008] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0009] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which:

[0010] Figure 1 This is one of the structural schematic diagrams of heat dissipation devices in related technologies;

[0011] Figure 2 This is the second schematic diagram of a heat dissipation device in related technologies;

[0012] Figure 3 This is the third schematic diagram of a heat dissipation device in related technologies.

[0013] Figure label:

[0014] 1' Air duct, 2' Fan, 3' Air inlet, 4' Air outlet.

[0015] Figure 4 This is one of the structural schematic diagrams of an electronic device according to an embodiment of this application;

[0016] Figure 5 This is one of the structural schematic diagrams of a heat dissipation device according to an embodiment of this application;

[0017] Figure 6 This is an exploded structural diagram of a heat dissipation device according to an embodiment of this application;

[0018] Figure 7This is a second schematic diagram of the heat dissipation device according to an embodiment of this application;

[0019] Figure 8 It shows Figure 7 A sectional view of the heat dissipation device in the embodiment shown from direction AA;

[0020] Figure 9 It shows Figure 7 A sectional view of the heat dissipation device in the embodiment shown from the BB direction;

[0021] Figure 10 This is the third schematic diagram of the heat dissipation device according to an embodiment of this application;

[0022] Figure 11 It shows Figure 10 A cross-sectional view of the heat dissipation device in the embodiment shown in the figure along the CC direction;

[0023] Figure 12 It shows Figure 11 A partial structural schematic diagram of the heat dissipation device in the illustrated embodiment.

[0024] Figure 13 It shows Figure 10 A DD-direction sectional view of the heat dissipation device of the embodiment shown;

[0025] Figure 14 It shows Figure 13 A partial structural schematic diagram of the heat dissipation device in the illustrated embodiment.

[0026] Figure label:

[0027] 1. Heat sink, 10. Air duct, 11. First air inlet, 12. First air outlet, 13. Mounting area, 130. Second bottom wall, 132. Recess, 14. Transition area, 140. First bottom wall, 1400. First transition surface, 1402. Second transition surface, 141. First side wall, 142. Second side wall, 143. Third side wall, 144. Arc surface, 15. Air inlet area, 16. First heat sink, 17. Second heat sink, 170. Double-sided adhesive, 18. Connector, 19. Circuit board, 2. Fan, 3. Housing, 32. Second air outlet, 4. One-way valve body. Detailed Implementation

[0028] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0029] The terms "first" and "second" in the specification and claims of this application may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise stated, "a plurality of" means two or more. Furthermore, "and / or" in the specification and claims indicates at least one of the connected objects.

[0030] In the description of this application, it should be understood that the terms "thickness", "upper", "lower", "top", "bottom", "inner", "outer", "circumferential", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0031] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0032] The following is combined with Figures 4-14 This application describes a heat dissipation device and an electronic device according to embodiments thereof.

[0033] like Figure 4 , Figure 5 , Figure 6 , Figure 7 , Figure 8 and Figure 9 As shown, a heat dissipation device according to some embodiments of this application is used in electronic devices. The heat dissipation device includes: a heat dissipation shell 1, an air duct 10 provided inside the heat dissipation shell 1, the air duct 10 having a first air inlet 11 and a first air outlet 12, the air duct 10 including a connected mounting area 13 and a transition area 14, the first air inlet 11 being connected to the first air outlet 12 through the mounting area 13 and the transition area 14, the first air outlet 12 being located on one side of the transition area 14 along a first direction, the mounting area 13 being located on one side of the transition area 14 along a second direction, the first direction and the second direction being intersected; and a fan 2, located in the mounting area 13, for supplying air to the transition area 14.

[0034] In the embodiments of this application, the heat dissipation device includes a heat dissipation shell 1 and a fan 2. The heat dissipation shell 1 is provided with an air duct 10, which includes an installation area 13 and a transition area 14. The fan 2 is located in the installation area 13 and can deliver air to the transition area 14. Under the action of the fan 2, the airflow outside the electronic device can enter the air duct 10 through the first air inlet 11, then flow through the fan 2 to the transition area 14, and then flow out of the electronic device through the first air outlet 12, so as to remove the heat of the electronic device and realize the heat dissipation of the electronic device. The first air outlet 12 is located on one side of the transition zone 14 along the first direction, and the mounting area 13 is located on one side of the transition zone 14 along the second direction. The first direction and the second direction are intersecting, that is, the air outlet direction of the fan 2 is offset from the location of the first air outlet 12. As a result, the airflow blown by the fan 2 turns in the transition zone 14 and flows out through the first air outlet 12, which changes the direction of airflow. On the one hand, the fan 2 and the first air outlet 12 are separated by the transition zone 14, so that the noise generated by the fan 2 during operation can be partially absorbed by the transition zone 14. On the other hand, the airflow blown by the fan 2 changes direction in the transition zone 14 and flows out through the first air outlet 12, which slows down the airflow speed and reduces the noise of the heat dissipation device during operation.

[0035] Optionally, the first direction is perpendicular to the second direction. It is understood that the first direction and the second direction may not be perpendicular.

[0036] like Figure 5 As shown, according to some embodiments of this application, optionally, the transition zone 14 includes: a first bottom wall 140; a first side wall 141, a second side wall 142 and a third side wall 143, which surround the first bottom wall 140, and the second side wall 142 is connected between the first side wall 141 and the third side wall 143; the second side wall 142 is disposed opposite to the fan 2 along a second direction, the first side wall 141 and the third side wall 143 are disposed opposite to each other along a first direction, and the first air outlet 12 is disposed on the third side wall 143.

[0037] In this embodiment, the transition zone 14 includes a first bottom wall 140 and a first side wall 141, a second side wall 142, and a third side wall 143 surrounding the first bottom wall 140. The second side wall 142 is disposed opposite to the fan 2 along a second direction, and the first side wall 141 and the third side wall 143 are disposed opposite to each other along a first direction. The first air outlet 12 is disposed on the third side wall 143. In this way, the airflow blown out by the fan 2 flows to the first air outlet 12 on the third side wall 143 after being guided by the first side wall 141 and the second side wall 142, thereby realizing the change of the airflow direction and slowing down the airflow speed to reduce noise.

[0038] Optionally, the transition zone 14 is open at one end near the fan 2 along the second direction.

[0039] like Figure 5 As shown, according to some embodiments of this application, optionally, an arc-shaped surface 144 is provided between the first sidewall 141 and the second sidewall 142. The arc-shaped surface 144 is recessed in the direction away from the transition area 14, and the first sidewall 141 and the second sidewall 142 are connected by the arc-shaped surface 144.

[0040] In this embodiment, the first sidewall 141 and the second sidewall 142 are connected by an arc-shaped surface 144, which allows the airflow to smoothly change its flow direction under the guidance of the first sidewall 141 and the arc-shaped surface 144, thereby avoiding noise problems caused by the change of airflow direction.

[0041] Optionally, the arc-shaped surface 144 is a rounded corner structure between the first sidewall 141 and the second sidewall 142.

[0042] like Figure 5 , Figure 10 , Figure 11 , Figure 12 , Figure 13 and Figure 14 As shown, according to some embodiments of this application, optionally, the installation area 13 includes a second bottom wall 130, the fan 2 is disposed on the second bottom wall 130, the first bottom wall 140 includes a first transition surface 1400, the first transition surface 1400 is connected to the second bottom wall 130, and along the second direction, the first transition surface 1400 is inclined towards the air duct 10 from one end near the installation area 13 to one end away from the installation area 13; and / or the first bottom wall 140 includes a second transition surface 1402, one end of the second transition surface 1402 is connected to the third side wall 143, and along the first direction, the second transition surface 1402 is inclined towards the first air outlet 12 from one end away from the first air outlet 12 to one end near the first air outlet 12.

[0043] In this embodiment, the first bottom wall 140 includes a first transition surface 1400, which is connected to the second bottom wall 130 of the mounting area 13. The first transition surface 1400 is inclined towards the air duct 10 from one end near the mounting area 13 to the end away from the mounting area 13, so that the second bottom wall 130 and the first bottom wall 140 are smoothly connected, allowing the airflow to flow gently towards the transition area 14, reducing the resistance of the airflow from the fan 2 to the transition area 14, and thus reducing the noise of the airflow. Optionally, the first bottom wall 140 also includes a second transition surface 1402, one end of which is connected to the third side wall 143. The second transition surface 1402 is inclined towards the first air outlet 12 from one end away from the first air outlet 12 to the end near the first air outlet 12, so that the airflow in the transition area 14 flows gently towards the first air outlet 12, thereby reducing the noise of the airflow flowing from the transition area 14 to the first air outlet 12.

[0044] like Figure 4 and Figure 5 As shown, according to some embodiments of this application, optionally, the installation area 13 is provided with a groove 132, the groove 132 is recessed along the outer side of the third-direction air duct 10, and the fan 2 is disposed in the groove 132.

[0045] In this embodiment, a groove 132 recessed along the third direction of the air duct 10 is provided in the installation area 13, and the fan 2 is installed in the groove 132 to ensure the stability of the fan 2 installation.

[0046] Alternatively, the fan 2 is glued to the groove 132 or installed in the groove 132 by means of a snap-fit ​​structure.

[0047] Optionally, the fan 2 is fixed in the groove 132 by double-sided tape 170 or by dotting.

[0048] Optionally, any two of the first direction, the second direction, and the third direction are perpendicular.

[0049] like Figure 4 and Figure 5 As shown, according to some embodiments of this application, optionally, the air duct 10 further includes: an air inlet zone 15, an installation zone 13 disposed between the air inlet zone 15 and the transition zone 14, a first air inlet 11 disposed in the air inlet zone 15, and at least a portion of the air inlet zone 15 is disposed opposite to the fan 2 along a first direction.

[0050] In this embodiment, the air duct 10 further includes an air inlet zone 15, and the mounting zone 13 is located between the air inlet zone 15 and the transition zone 14. A first air inlet 11 is disposed in the air inlet zone 15, so that airflow enters the air inlet zone 15 through the first air inlet 11, then flows through the fan 2 in the mounting zone 13 to the transition zone 14, and then flows to the first air outlet 12. At least a portion of the air inlet zone 15 is arranged opposite to the fan 2 along a first direction, so that at least a portion of the airflow entering through the first air inlet 11 can flow directly to the fan 2, reducing the energy loss of the airflow and thus improving the heat dissipation performance of the heat dissipation device.

[0051] According to some embodiments of this application, optionally, the heat dissipation device further includes: a one-way valve body 4, which is disposed at the first air inlet 11 so that airflow can enter the air duct 10 from the first air inlet 11, or the one-way valve body 4 is disposed at the first air outlet 12 so that airflow can flow out of the air duct 10 from the first air outlet 12.

[0052] In this embodiment, a one-way valve body 4 is provided at the first air inlet 11 or the first air outlet 12 to ensure that the airflow flows in one direction within the air duct 10, thereby ensuring the heat dissipation performance of the heat dissipation device.

[0053] Optionally, the one-way valve body 4 may include a backflow prevention sealing pad or a solenoid valve or similar structure.

[0054] According to some embodiments of this application, optionally, a portion of the heat sink 1 encloses the mounting area 13, and a portion of the heat sink 1 encloses the transition area 14; wherein, the wall thickness of the heat sink 1 enclosing the transition area 14 is greater than the wall thickness of the heat sink 1 enclosing the mounting area 13.

[0055] In this embodiment, the heat sink 1 has an internal air duct 10, which includes an installation area 13 and a transition area 14. That is, a portion of the heat sink 1 surrounds the installation area 13, and a portion surrounds the transition area 14. The thickness of the heat sink 1 surrounding the transition area 14 is greater than the thickness of the heat sink 1 surrounding the installation area 13. On the one hand, the thinner thickness of the heat sink 1 surrounding the installation area 13 provides space for the fan 2 and reduces the overall space occupied by the heat sink 1 on the electronic device, which is beneficial to the miniaturization design of the electronic device. On the other hand, the thicker thickness of the portion of the heat sink 1 surrounding the transition area 14 can improve the absorption capacity of the fan 2 vibration and the absorption capacity of the vibration generated during airflow, thereby reducing the operating noise of the heat dissipation device.

[0056] Of course, the wall thickness of the heat sink 1 that encloses the transition area 14 can also be set to be less than or equal to the wall thickness of the heat sink 1 that encloses the mounting area 13.

[0057] like Figure 5 and Figure 6 As shown, according to some embodiments of this application, optionally, the heat sink 1 includes: a first heat sink 16; a second heat sink 17, which is fastened to the first heat sink 16 and surrounds the air outlet 10 with the first heat sink 16; a fan 2 is connected to at least one of the first heat sink 16 and the second heat sink 17, a first air inlet 11 is provided on the first heat sink 16 or the second heat sink 17, and a first air outlet 12 is provided on the first heat sink 16 or the second heat sink 17.

[0058] In this embodiment, the heat sink 1 includes a first heat sink 16 and a second heat sink 17. The first heat sink 16 and the second heat sink 17 are interlocked to enclose the air duct 10. This arrangement facilitates the installation and maintenance of components such as the fan 2 within the air duct 10. The fan 2 can be installed on the first heat sink 16, the second heat sink 17, or both, thereby fixing both ends of the fan 2 along its axial direction and improving its reliability. The first air inlet 11 can be located on either the first heat sink 16 or the second heat sink 17, and the first air outlet 12 can also be located on either the first heat sink 16 or the second heat sink 17.

[0059] Optionally, the first heat sink 16 and the second heat sink 17 are bonded together to achieve a seal for the air duct 10.

[0060] Optionally, the first heat sink 16 and the second heat sink 17 are bonded together by double-sided adhesive 170 or by spot adhesive.

[0061] Optionally, the first heat sink 16 and the second heat sink 17 are locked together by a connector 18 to prevent them from separating. The connector 18 is a metal connector that allows the first heat sink 16 and the second heat sink 17 to be connected, thus serving as a grounding element. The connector 18 may include screws or bolts.

[0062] Optionally, the first air inlet 11 can also be formed by the first heat sink 16 and the second heat sink 17, and the first air outlet 12 can also be formed by the first heat sink 16 and the second heat sink 17.

[0063] Optionally, the heat dissipation device also includes a circuit board 19, one end of which is located inside the air duct 10, and the fan 2 is electrically connected to the end of the circuit board 19 that extends into the air duct 10; the other end of the circuit board 19 is located outside the air duct 10, so that the circuit board 19 is electrically connected to the motherboard of the electronic device to realize the control of the heat dissipation device.

[0064] like Figure 4 As shown, according to one embodiment of this application, an electronic device is also proposed, including: a housing 3, the housing 3 having a second air inlet and a second air outlet 32; and a heat dissipation device as proposed in any of the above claims, the heat dissipation device being disposed inside the housing 3, the first air inlet 11 being connected to the second air inlet, and the first air outlet 12 being connected to the second air outlet 32.

[0065] Alternatively, electronic devices include mobile phones, tablets, etc.

[0066] According to one embodiment of this application, noise reduction is achieved by changing the direction of airflow.

[0067] For example, the heat dissipation device proposed in this application hides the fan 2 inside the air duct 10 and sets the transition area 14 between the fan 2 and the first air outlet 12 in a bend. This is to allow some of the noise emitted by the fan 2 to be absorbed by the air duct 10, and to change the air outlet direction and slow down the air outlet speed, thereby reducing noise.

[0068] In addition, at least a portion of the first air inlet 11 is positioned opposite to the fan 2, allowing the intake airflow to flow directly to the fan 2, thus improving heat dissipation performance and compensating for the performance loss caused by the detour of the exhaust airflow. Furthermore, the fan 2 is positioned in the mounting area 13, which offsets the fan 2 from the transition area 14. Consequently, the wall thickness of the heat sink 1 corresponding to the transition area 14 is not limited by the thickness of the fan 2, resulting in better manufacturability.

[0069] Optionally, the heat dissipation device includes screws, a first heat sink 16, double-sided adhesive tape 170, a backflow prevention sealing pad, a circuit board 19 (e.g., a flexible circuit board adapter), a fan 2, and a second heat sink 17.

[0070] Screws: Their function is to lock the first heat sink 16 and the second heat sink 17 together, so as to prevent the first heat sink 16 and the second heat sink 17 from warping and separating, which would lead to airtightness failure; they can also connect the first heat sink 16 and the second heat sink 17 to ground. The first heat sink 16, the second heat sink 17 and the screws are all metal parts.

[0071] First heat sink 16: It is one of the key structural components of air duct 10. Together with second heat sink 17, it forms air duct 10 and plays the role of supporting and protecting fan 2.

[0072] Double-sided adhesive 170: One of the main sealing components, which tightly binds the first heat sink 16 and the second heat sink 17 together.

[0073] One-way valve body 4 (anti-backflow sealing pad): installed at the first air inlet 11 or the first air outlet 12 to prevent backflow and direct airflow in one direction to achieve optimal heat dissipation performance.

[0074] Circuit board 19: It serves to connect the motherboard and fan 2.

[0075] Fan 2: It provides power for active cooling, drives airflow, and removes heat.

[0076] The second heat sink 17 is one of the key structural components of the air duct 10. Together with the first heat sink 16, it forms the air duct 10 and plays the role of supporting and protecting the fan 2.

[0077] The air intake channel (e.g., air intake zone 15) is almost straight with no bends, while the air outlet channel (e.g., transition zone 14) has bends and a large arc transition, forming a noise reduction area. After passing through the noise reduction area, the air flows out from the first air outlet 12.

[0078] The second heat sink 17 has a groove 132. The fan 2 is fixed to the groove 132 by double-sided tape 170 or by dotting. The transition area 14 directly opposite the fan 2 has a first transition surface 1400.

[0079] Optionally, the transition zone 14 is provided with two transition surfaces. The first transition surface 1400 is located at the air outlet of the fan 2. When air comes out of the fan 2, there is no obstruction at the air outlet of the fan 2, and the airflow passes smoothly through the first transition surface 1400, achieving the purpose of quiet operation. The second transition surface 1402 is located at the first air outlet 12. When air comes out of the transition zone 14 and reaches the first air outlet 12, there is no obstruction at the first air outlet 12, and the airflow passes smoothly through the second transition surface 1402, further achieving the purpose of quiet operation.

[0080] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0081] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. A heat dissipation device for electronic equipment, characterized in that, The heat dissipation device includes: A heat dissipation shell is provided inside the heat dissipation shell. The air duct has a first air inlet and a first air outlet. The air duct includes a connected installation area and a transition area. The first air inlet is connected to the first air outlet through the installation area and the transition area. The first air outlet is located on one side of the transition area along a first direction. The installation area is located on one side of the transition area along a second direction. The first direction and the second direction are intersecting. A fan, located in the installation area, is used to supply air to the transition area.

2. The heat dissipation device according to claim 1, characterized in that, The transition region includes: First bottom wall; A first sidewall, a second sidewall, and a third sidewall are arranged around the first bottom wall, and the second sidewall is connected between the first sidewall and the third sidewall. The second sidewall is disposed opposite to the fan along the second direction, the first sidewall and the third sidewall are disposed opposite to each other along the first direction, and the first air outlet is disposed on the third sidewall.

3. The heat dissipation device according to claim 2, characterized in that, An arc-shaped surface is provided between the first sidewall and the second sidewall. The arc-shaped surface is recessed in the direction away from the transition area, and the first sidewall and the second sidewall are connected by the arc-shaped surface.

4. The heat dissipation device according to claim 2, characterized in that, The mounting area includes a second bottom wall, the fan is disposed on the second bottom wall, the first bottom wall includes a first transition surface, the first transition surface is connected to the second bottom wall, and along the second direction, the first transition surface is inclined towards the air duct from one end near the mounting area to one end away from the mounting area; and / or The first bottom wall includes a second transition surface, one end of which is connected to the third side wall. Along the first direction, the second transition surface is inclined towards the first air outlet from the end away from the first air outlet to the end close to the first air outlet.

5. The heat dissipation device according to any one of claims 1 to 4, characterized in that, The installation area is provided with a groove, which is recessed outward along a third direction towards the outside of the air duct, and the fan is located in the groove.

6. The heat dissipation device according to any one of claims 1 to 4, characterized in that, The air duct also includes: The air intake area is located between the air intake area and the transition area. The first air inlet is located in the air intake area, and at least a portion of the air intake area is arranged opposite to the fan along the first direction.

7. The heat dissipation device according to any one of claims 1 to 4, characterized in that, Also includes: A one-way valve body is provided at the first air inlet so that airflow can enter the air duct from the first air inlet, or the one-way valve body is provided at the first air outlet so that airflow can flow out of the air duct from the first air outlet.

8. The heat dissipation device according to any one of claims 1 to 4, characterized in that, A portion of the heat dissipation shell encloses the mounting area, and a portion of the heat dissipation shell encloses the transition area; The wall thickness of the heat dissipation shell that encloses the transition area is greater than the wall thickness of the heat dissipation shell that encloses the installation area.

9. The heat dissipation device according to any one of claims 1 to 4, characterized in that, The heat sink includes: First heat dissipation shell; The second heat dissipation shell is fastened to the first heat dissipation shell and together with the first heat dissipation shell to form the air duct; The fan is connected to at least one of the first heat sink and the second heat sink, the first air inlet is located on the first heat sink or the second heat sink, and the first air outlet is located on the first heat sink or the second heat sink.

10. An electronic device, characterized in that, include: The housing is provided with a second air inlet and a second air outlet; and The heat dissipation device as described in any one of claims 1 to 9 is disposed inside the housing, the first air inlet is connected to the second air inlet, and the first air outlet is connected to the second air outlet.

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