High-temperature-resistant heat-conducting rubber base

Abstract

The utility model provides a kind of heat-conducting rubber base of high temperature resistance, it is related to heat-conducting rubber base technical field to solve the problem that the heat-conducting performance of heat-conducting rubber base is difficult to realize uniform conduction due to uneven internal heat source distribution of electronic equipment in actual application scene, especially in local high temperature area, heat cannot be effectively and quickly conducted out, leading to the problem of significantly reduced heat dissipation efficiency, including base layer. By equidistantly opening air-permeable groove in the inside of base layer, the air-permeable groove penetrates the side end of base layer, while facilitating heat dissipation of base layer itself, it can promote uniform conduction of heat in the base layer, effectively solve the problem of poor heat dissipation in local high temperature area of electronic equipment, improve overall heat dissipation efficiency, the heat dissipation grooves staggered on the top layer greatly increase the contact area with air, form more heat dissipation channels, further accelerate heat dissipation, ensure that heat can be quickly conducted out from high temperature area, realize more efficient and uniform heat dissipation effect.

Description

Technical Field

[0001] This utility model belongs to the field of thermal conductive adhesive base technology, and more specifically, it relates to a high-temperature resistant thermal conductive adhesive base. Background Technology

[0002] With the continuous development of electronic technology, electronic devices are becoming increasingly integrated, generating more and more heat during operation. Excessive temperature can seriously affect the performance, stability, and lifespan of electronic devices. For example, mobile phones will experience significant heat generation when playing games or running multiple large programs for extended periods, leading to problems such as lag and frame drops. When a computer's CPU is performing complex calculations or graphics processing, poor heat dissipation will not only slow down the processing speed but may also cause hardware failures. Currently, common heat dissipation methods for electronic devices on the market include air cooling, liquid cooling, and the use of heat dissipation materials. Among these, the use of heat dissipation materials is a relatively common and effective method, and silicon-based heat dissipation bases, as a commonly used heat dissipation material, play an important role in the heat dissipation of electronic devices.

[0003] Based on existing technology, it has been found that existing thermal conductive adhesive bases have some shortcomings:

[0004] Firstly, in practical applications, due to the uneven distribution of heat sources inside electronic devices, the thermal conductivity of thermal conductive pads is difficult to achieve uniform conduction. Especially in local high-temperature areas, heat cannot be effectively and quickly dissipated, resulting in a significant reduction in heat dissipation efficiency. Secondly, the mechanical properties of existing thermal conductive pads are insufficient, with poor tear resistance. Under the action of external forces during assembly or vibration and impact during equipment operation, they are prone to tearing and damage, causing the heat conduction path to be interrupted, which seriously affects the reliability and service life of the heat dissipation system. Utility Model Content

[0005] To address the aforementioned technical problems, this utility model relates to a high-temperature resistant thermally conductive adhesive base. This solves the problem that in practical applications, due to the uneven distribution of heat sources inside electronic devices, the thermal conductivity of the adhesive base is difficult to achieve uniform conduction, especially in locally high-temperature areas where heat cannot be effectively and quickly dissipated, resulting in a significant reduction in heat dissipation efficiency. Furthermore, existing thermally conductive adhesive bases have insufficient mechanical properties, exhibiting poor tear resistance. Under external forces during assembly or vibrations and impacts during equipment operation, they are prone to tearing and damage, interrupting the heat conduction path and severely affecting the reliability and service life of the heat dissipation system.

[0006] In a first aspect, this disclosure provides a high-temperature resistant thermally conductive adhesive base, achieved through the following specific technical means:

[0007] A high-temperature resistant thermally conductive adhesive base, comprising:

[0008] A base layer; the base layer is composed of silicone composite material; the upper end of the base layer is provided with a top layer, the lower end of the base layer is provided with a wrapping layer, and the wrapping layer and the top layer are both provided with an adhesive layer.

[0009] According to some solutions of this utility model, ventilation grooves are provided at equal intervals on the inner side of the base layer, and the ventilation grooves penetrate the side end of the base layer.

[0010] According to some solutions of this utility model, the bottom of the top layer is attached to the upper surface of the base layer, and the top of the top layer is provided with staggered heat dissipation grooves.

[0011] According to some solutions of this utility model, the wrapping layer is divided into upper and lower parts. The upper part of the wrapping layer is attached to the lower surface of the base layer, and a metal mesh is provided between the upper and lower parts. The metal mesh is made of flexible metal wire and can be bent with the base layer.

[0012] According to some embodiments of this utility model, the upper part of the adhesive layer is located on the upper surface of the top layer, and the lower part of the adhesive layer is located on the lower surface of the wrapping layer.

[0013] Compared with the prior art, the present invention has the following beneficial effects:

[0014] 1. In this device, by opening equidistant ventilation slots on the inner side of the base layer, which penetrate through the side of the base layer, it can facilitate the heat dissipation of the base layer itself and promote the uniform conduction of heat within the base layer. This effectively solves the problem of poor heat dissipation in local high-temperature areas inside electronic devices, improves the overall heat dissipation efficiency, and the staggered heat dissipation slots on the top layer greatly increase the contact area with air, forming more heat dissipation channels, further accelerating heat dissipation, ensuring that heat can be quickly discharged from high-temperature areas, and achieving a more efficient and uniform heat dissipation effect.

[0015] 2. In this device, a metal mesh made of flexible metal wire is set between the upper and lower parts of the wrapping layer. The metal mesh can bend with the base layer, providing strong support and reinforcement to the base layer. When subjected to external forces or vibration and impact generated by equipment operation, the metal mesh can effectively disperse stress, prevent the base layer from tearing and being damaged, ensure the integrity of the heat conduction path, significantly improve the mechanical properties and service life of the heat conduction base, and enhance the reliability of the heat dissipation system. Attached Figure Description

[0016] The advantages of this disclosure will be better understood by those skilled in the art through the accompanying drawings. The drawings described herein are for illustrative purposes only and do not represent all possible implementations and are not intended to limit the scope of this disclosure.

[0017] In the attached diagram:

[0018] Figure 1 This is a schematic diagram of the planar structure of this utility model.

[0019] Figure 2 This is a schematic diagram of the disassembled structure of this utility model.

[0020] Figure 3 This is a schematic diagram of the basic layer cross-sectional structure of this utility model.

[0021] Figure 4 This is a schematic diagram of the cross-sectional structure of the wrapping layer of this utility model.

[0022] In the diagram, the correspondence between component names and drawing numbers is as follows:

[0023] 1. Base layer; 101. Ventilation groove; 2. Top layer; 201. Heat dissipation groove; 3. Wrapping layer; 301. Metal mesh; 4. Adhesive layer. Detailed Implementation

[0024] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the described embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0025] Example 1: As shown in the attached document Figure 1 To be continued Figure 4 As shown:

[0026] This utility model provides a high-temperature resistant thermally conductive adhesive base, comprising: a base layer 1; the base layer 1 is composed of silicone composite material; a top layer 2 is provided at the upper end of the base layer 1, a wrapping layer 3 is provided at the lower end of the base layer 1, and an adhesive layer 4 is provided on the outside of both the wrapping layer 3 and the top layer 2.

[0027] As a second embodiment of this application, based on embodiment one, such as Figure 2 and Figure 3 As shown, the inner side of the base layer 1 is provided with equidistant ventilation grooves 101, which penetrate the side end of the base layer 1; the bottom of the top layer 2 is in contact with the upper surface of the base layer 1, and the top of the top layer 2 is provided with staggered heat dissipation grooves 201; the base layer 1 is provided to provide heat dissipation for electronic devices by utilizing the thermal conductivity of silicone; the ventilation grooves 101 facilitate heat dissipation of the base layer 1 and promote a more uniform heat conduction effect; the top layer 2 protects the base layer 1, and the heat dissipation grooves 201 on the top layer 2 increase the contact area between its top and the air, thereby promoting heat dissipation.

[0028] As a third embodiment of this application, based on embodiment one, as follows: Figure 2 and Figure 4 As shown, the wrapping layer 3 is divided into upper and lower parts. The upper part of the wrapping layer 3 is attached to the lower surface of the base layer 1, and a metal mesh 301 is provided between the upper and lower parts. The metal mesh 301 is made of flexible metal wire and can be bent with the base layer 1. The upper part of the adhesive layer 4 is located on the upper surface of the top layer 2, and the lower part of the adhesive layer 4 is located on the lower surface of the wrapping layer 3. The wrapping layer 3 allows the metal mesh 301 to be placed on the inner side of the wrapping layer 3, which can provide better tear resistance to the base layer 1. The adhesive layer 4 can be made of silicone adhesive. The function of the adhesive coating is to firmly attach the silicone base to the heat sink or shell of the electronic device, ensuring that the silicone base will not shift during use and ensuring the stability of heat dissipation. At the same time, the silicone adhesive has good high temperature resistance and can maintain adhesion in high temperature environments.

[0029] The specific usage and function of this embodiment are as follows:

[0030] In this utility model, such as Figure 1-4 As shown, firstly, the lower part of the adhesive layer 4 is attached to the surface of the heat sink or casing of the electronic device. The adhesive properties of the silicone sealant ensure that the wrapping layer 3 is firmly fixed. Then, the heating element is brought into contact with the upper surface of the top layer 2, achieving a tight fit through the upper part of the adhesive layer 4. During the operation of the electronic device, the heat generated by the heating element is rapidly conducted to the top layer 2. The staggered heat dissipation grooves 201 on the top layer 2 increase the contact area with air, assisting in the initial dissipation of heat. At the same time, the remaining heat is quickly transferred to the base layer 1, which is composed of a silicone composite material. The thermal conductivity further conducts heat, while the venting grooves 101 on the inner side of the base layer 1 promote its own heat dissipation and make the heat conduction more uniform, effectively avoiding local high temperature phenomena. The metal mesh 301 inside the wrapping layer 3 provides tear-resistant protection for the base layer 1 when the device is subjected to external force or vibration, maintaining the integrity of the thermal conductive adhesive base structure. Throughout the heat dissipation process, the adhesive layer 4, with the high temperature resistance of the silicone adhesive, always keeps the thermal conductive adhesive base in a stable position, ensuring that heat can be continuously and efficiently conducted from the heat-generating element to the external environment, achieving stable heat dissipation for electronic devices.

[0031] The foregoing disclosure provides illustrations and descriptions, but is not intended to be exhaustive or to limit the embodiments to the precise forms disclosed. Modifications and variations can be made based on the above disclosure, or modifications and variations can be derived from the practice of the embodiments.

[0032] Even though specific combinations of features are recited in the claims or disclosed in the specification, these combinations are not intended to limit the disclosure of various embodiments. In fact, many of these features can be combined in ways not specifically recited in the claims and / or not specifically disclosed in the specification. Although each dependent claim listed below may depend directly on only one claim, the disclosure of various embodiments includes each dependent claim in combination with every other claim in the claim set.

Claims

1. A high-temperature resistant thermally conductive adhesive base, comprising: The base layer (1) is composed of silicone composite material. The base layer (1) is characterized in that the upper end of the base layer (1) is provided with a top layer (2) and the lower end of the base layer (1) is provided with a wrapping layer (3). The wrapping layer (3) is divided into upper and lower parts. The upper half of the wrapping layer (3) is attached to the lower surface of the base layer (1). A metal mesh (301) is provided between the upper and lower parts. The metal mesh (301) is made of flexible metal wire and can be bent with the base layer (1). An adhesive layer (4) is provided on the outside of both the wrapping layer (3) and the top layer (2).

2. The high-temperature resistant thermally conductive adhesive base according to claim 1, characterized in that, The base layer (1) has equidistant ventilation grooves (101) on its inner side, and the ventilation grooves (101) penetrate the side end of the base layer (1).

3. The high-temperature resistant thermally conductive adhesive base according to claim 1, characterized in that, The bottom of the top layer (2) is attached to the upper surface of the base layer (1), and the top of the top layer (2) is provided with staggered heat dissipation grooves (201).

4. The high-temperature resistant thermally conductive adhesive base according to claim 1, characterized in that, The upper part of the adhesive layer (4) is located on the upper surface of the top layer (2), and the lower part of the adhesive layer (4) is located on the lower surface of the wrapping layer (3).

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