A solder paste stirring device capable of feeding back viscosity

Abstract

This utility model discloses a solder paste mixing device with viscosity feedback capability, relating to the field of solder paste mixing devices. It includes a body, with a stepper motor fixedly connected to the bottom inner side of the body. The stepper motor is fixedly connected to a rotating rod via a coupling. One end of the rotating rod is fixedly connected to a turntable, and a mixing chamber is fixedly connected to the top of the turntable. A drive motor is fixedly connected to the bottom inner side of the mixing chamber, and the drive motor is fixedly connected to a rotating rod via a coupling. This utility model, through the arrangement of a stepper motor, rotating rod, turntable, mixing chamber, drive motor, rotating rod, and fixed chamber, enables the solder paste container in the fixed chamber to rotate by starting the drive motor, forming a self-rotation. Then, starting the stepper motor drives the mixing chamber on the turntable to rotate, forming a revolution. The superposition of these two motions (self-rotation and revolution) breaks through the mixing dead zones of single rotation, such as the edges and corners of the container, resulting in a more thorough and uniform mixing.

Description

Technical Field

[0001] This utility model relates to the field of solder paste mixing devices, specifically a solder paste mixing device with viscosity feedback capability. Background Technology

[0002] During storage or transportation, metal particles and flux in solder paste may separate or settle, affecting uniformity and soldering quality. Furthermore, solder paste stored for a long time may dry and harden, affecting printability. Stirring can ensure uniform mixing of components, prevent soldering defects such as cold solder joints and solder balls, and ensure the consistency and reliability of soldering. It can also adjust its viscosity to restore good printability. Therefore, a solder paste stirring device that can provide viscosity feedback is needed.

[0003] Existing viscosity-feedback solder paste mixing devices can thoroughly and evenly mix solder paste during operation, but they are not convenient for quickly fixing solder paste containers of different radii, resulting in long loading and unloading times. Therefore, there is an urgent need for a viscosity-feedback solder paste mixing device. Utility Model Content

[0004] Therefore, the purpose of this utility model is to provide a solder paste mixing device with feedback viscosity, so as to solve the problem that the existing solder paste mixing devices with feedback viscosity do not mix the solder paste thoroughly and evenly, and are not convenient for quickly fixing solder paste containers of different radius sizes, resulting in long loading and unloading times.

[0005] To achieve the above objectives, this utility model provides the following technical solution: a solder paste mixing device with viscosity feedback capability, comprising a body, a stepper motor fixedly connected to the bottom inner side of the body, a rotating rod fixedly connected to the stepper motor via a coupling, a turntable fixedly connected to one end of the rotating rod, a mixing chamber fixedly connected to the top of the turntable, a drive motor fixedly connected to the bottom inner side of the mixing chamber, a rotating rod fixedly connected to the drive motor via a coupling, and a fixed chamber fixedly connected to one end of the rotating rod.

[0006] An anti-slip plate is fixedly connected to the bottom inner side of the fixed chamber, a telescopic rod is fixedly connected to the side wall of the fixed chamber, a return spring is installed on the outer wall of the telescopic rod, a clamping plate is fixedly connected to one end of the telescopic rod, an anti-slip pad is installed on the side wall of the clamping plate, and an optical sensor is fixedly connected to the side wall of the fixed chamber.

[0007] Preferably, the turntable forms a rotating structure with the machine body via a rotating rod, and the rotating rod is movably connected to the machine body.

[0008] Preferably, the mixing chambers are arranged in a circular array around the central axis of the turntable, and the inner wall of the mixing chambers is perforated.

[0009] Preferably, the fixed chamber forms a rotating structure with the mixing chamber via a rotating rod, and the rotating rod is movably connected to the mixing chamber.

[0010] Preferably, the clamping plate forms a telescopic structure with the fixed chamber via a telescopic rod, and the clamping plate is bonded to the anti-slip pad.

[0011] Preferably, the telescopic rod is sleeved with the return spring, and the telescopic rod is arranged in a circular array around the central axis of the fixed compartment.

[0012] Compared with the prior art, the beneficial effects of this utility model are:

[0013] This utility model uses a stepper motor, rotating rod, turntable, mixing chamber, drive motor, rotating rod and fixed chamber. The drive motor drives the solder paste container in the fixed chamber to rotate, forming a rotation. Then, the stepper motor drives the mixing chamber on the turntable to rotate, forming a revolution. The superposition of the two movements of rotation and revolution can break the mixing dead corners of the container, such as the edges and corners of the container, so as to make the mixing more thorough and uniform.

[0014] This utility model, through the setting of a fixed compartment, anti-slip plate, telescopic rod, return spring, clamping plate, anti-slip mat, and optical sensor, allows solder paste containers to be quickly fixed by inserting them into the fixed compartment. The return spring's rebound drives the telescopic rod and clamping plate to push the anti-slip mat into contact with the solder paste container, thus saving loading and unloading time. Attached Figure Description

[0015] Figure 1 This is a perspective view of the present utility model;

[0016] Figure 2 This is a schematic diagram of the internal components of the present invention;

[0017] Figure 3 This is a schematic diagram of the internal components of the mixing chamber of this utility model;

[0018] Figure 4 This is a schematic diagram of the internal components of the fixed compartment of this utility model.

[0019] In the diagram: 1. Machine body; 2. Stepper motor; 3. Rotating rod; 4. Turntable; 5. Mixing chamber; 6. Drive motor; 7. Rotating rod; 8. Fixed chamber; 9. Anti-slip plate; 10. Telescopic rod; 11. Return spring; 12. Clamping plate; 13. Anti-slip pad; 14. Optical sensor. Detailed Implementation

[0020] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention.

[0021] The embodiments of this utility model will be described below based on its overall structure.

[0022] Please see Figures 1-4 A solder paste mixing device with viscosity feedback capability includes a body 1. A stepper motor 2 is fixedly connected to the bottom inner side of the body 1. A rotating rod 3 is fixedly connected to the stepper motor 2 via a coupling. A turntable 4 is fixedly connected to one end of the rotating rod 3. A mixing chamber 5 is fixedly connected to the top of the turntable 4. A drive motor 6 is fixedly connected to the bottom inner side of the mixing chamber 5. A rotating rod 7 is fixedly connected to the drive motor 6 via a coupling. A fixed chamber 8 is fixedly connected to one end of the rotating rod 7. The turntable 4 and the body 1 form a rotating structure through the rotating rod 3, and the rotating rod 3 is movably connected to the body 1. The mixing chambers 5 are arranged in a circular array around the central axis of the turntable 4, and the inner wall of the mixing chambers 5 is perforated. The fixed chamber 8 is open. The rotating rod 7 and the mixing chamber 5 form a rotating structure, and the rotating rod 7 and the mixing chamber 5 are movably connected. When using the device, the drive motor 6 is started, and the output shaft of the drive motor 6 drives the rotating rod 7 to rotate, which in turn drives the solder paste container in the fixed chamber 8 to rotate, forming a rotation. Then, the stepper motor 2 is started, and the output shaft of the stepper motor 2 drives the rotating rod 3 to rotate, which in turn drives the mixing chamber 5 on the turntable 4 to rotate, forming a revolution. The rotation produces local shearing and mixing of the solder paste, while the revolution of the base drives the solder paste to form an overall circulation in the container through centrifugal force. The superposition of the two movements can break the dead zones of mixing caused by a single rotation, such as the solder paste at the edge and corner of the container, so that the mixing is more thorough and uniform.

[0023] Please see Figures 1-4 A solder paste mixing device with viscosity feedback is disclosed. An anti-slip plate 9 is fixedly connected to the bottom inner side of a fixed chamber 8. A telescopic rod 10 is fixedly connected to the side wall of the fixed chamber 8. A return spring 11 is installed on the outer wall of the telescopic rod 10. A clamping plate 12 is fixedly connected to one end of the telescopic rod 10. An anti-slip pad 13 is installed on the side wall of the clamping plate 12. An optical sensor 14 is fixedly connected to the side wall of the fixed chamber 8. The clamping plate 12 and the fixed chamber 8 form a telescopic structure through the telescopic rod 10, and the clamping plate 12 is bonded to the anti-slip pad 13. The telescopic rod 10 is sleeved with the return spring 11, and the telescopic rod 10 is arranged in a circular array around the central axis of the fixed chamber 8. When using the device, the solder paste container is inserted into the fixed chamber 8 and contacts the anti-slip plate 9. Simultaneously, the telescopic rod 10 retracts, compressing the return spring 11. The return spring 11 then pushes the clamping plate 12, causing the anti-slip pad 13 to contact the solder paste container. This allows for the rapid fixing of solder paste containers of different radii, saving loading and unloading time.

[0024] Working principle: In use, first move the device to a suitable position, then insert the solder paste container between the surrounding clamps 12 and place it on the anti-slip plate 9. The clamps 12 are pressed and drive the telescopic rod 10 to retract, while simultaneously driving the return spring 11 to compress. Then, the elastic rebound of the return spring 11 drives the surrounding clamps 12 to push the anti-slip pad 13 into contact with the surface of the solder paste container, thereby quickly fixing the solder paste container. Then, start the drive motor 6 to drive the rotating rod 7 to rotate, and drive the fixed chamber 8 to rotate in the mixing chamber 5, so that the solder paste container rotates to stir the solder paste. Then, start the stepper motor 2 to drive the rotating rod 3 to rotate, and drive the turntable 4 to rotate in the machine body 1. When the turntable 4 rotates, it drives the multiple mixing chambers 5 to rotate, forming a rotation and revolution, so that the mixing is more thorough and uniform. Then, use the optical sensor 14 to capture the flow pattern of the solder paste during rotation to provide feedback on the viscosity. This completes the use of the device. The contents not described in detail in this specification are existing technologies known to those skilled in the art.

[0025] Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A solder paste mixing device with feedback capability, comprising a body (1), characterized in that: A stepper motor (2) is fixedly connected to the bottom inner side of the machine body (1). The stepper motor (2) is fixedly connected to a rotating rod (3) via a coupling. A turntable (4) is fixedly connected to one end of the rotating rod (3). A mixing chamber (5) is fixedly connected to the top of the turntable (4). A drive motor (6) is fixedly connected to the bottom inner side of the mixing chamber (5). A rotating rod (7) is fixedly connected to the drive motor (6) via a coupling. A fixed chamber (8) is fixedly connected to one end of the rotating rod (7). An anti-slip plate (9) is fixedly connected to the bottom inner side of the fixed chamber (8). A telescopic rod (10) is fixedly connected to the side wall of the fixed chamber (8). A return spring (11) is installed on the outer wall of the telescopic rod (10). A clamping plate (12) is fixedly connected to one end of the telescopic rod (10). An anti-slip pad (13) is installed on the side wall of the clamping plate (12). An optical sensor (14) is fixedly connected to the side wall of the fixed chamber (8).

2. The solder paste mixing device with viscosity feedback according to claim 1, characterized in that: The turntable (4) forms a rotating structure with the body (1) through the rotating rod (3), and the rotating rod (3) is movably connected to the body (1).

3. The solder paste mixing device with viscosity feedback according to claim 1, characterized in that: The mixing chambers (5) are arranged in a circular array around the central axis of the turntable (4), and the inner wall of the mixing chambers (5) is perforated.

4. The solder paste mixing device with viscosity feedback according to claim 1, characterized in that: The fixed chamber (8) forms a rotating structure with the mixing chamber (5) through the rotating rod (7), and the rotating rod (7) is movably connected to the mixing chamber (5).

5. The solder paste mixing device with viscosity feedback according to claim 1, characterized in that: The clamp (12) forms a telescopic structure with the fixed chamber (8) through the telescopic rod (10), and the clamp (12) is bonded to the anti-slip pad (13).

6. The solder paste mixing device with viscosity feedback according to claim 1, characterized in that: The telescopic rod (10) is sleeved with the return spring (11), and the telescopic rod (10) is arranged in a circular array with the central axis of the fixed chamber (8).

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