An SMT component precision welding workstation

Abstract

The utility model relates to surface mount technology (SMT) welding equipment technical field, concretely relates to a kind of SMT element precision welding workstation, comprising: workbench, workbench surface is equipped with antistatic coating;Six-axis collaborative robot arm, its end is integrated with miniature soldering iron head and vacuum suction nozzle;Dynamic temperature control module is connected with the miniature soldering iron head, for real-time adjustment welding temperature;Machine vision positioning system, including camera and image processing unit, for identifying the coordinate deviation of component and pad.The utility model overcomes the deficiency of prior art, through the six-axis collaborative robot arm of high degree of freedom movement, realize complex angle and accurate welding in small space, solve the problem of insufficient flexibility of traditional mechanical arm, through high-frequency induction heating coil heating and closed-loop control combination, significantly reduce temperature fluctuation, avoid false welding or component damage due to temperature out of control, improve component alignment accuracy through camera, reduce the demand of manual intervention.

Description

Technical Field

[0001] This utility model relates to the field of surface mount technology (SMT) soldering equipment technology, specifically to a precision soldering workstation for SMT components. Background Technology

[0002] In the electronics manufacturing industry, SMT (Surface Mount Technology) component soldering is one of the key processes, and its soldering quality directly affects the performance and reliability of electronic products.

[0003] Existing SMT component soldering workstations have some shortcomings in practical applications. For example, the soldering precision is not high enough, making it difficult to meet the soldering requirements of high-density, miniaturized electronic components; the temperature control during the soldering process is not precise enough, which can easily lead to poor soldering.

[0004] At the same time, the workstation has poor operational flexibility, and the adjustment and adaptation process for SMT components of different specifications and types is cumbersome, which affects production efficiency.

[0005] To address the aforementioned technical issues, a precision soldering workstation for SMT components is proposed. Summary of the Invention

[0006] In view of the shortcomings of the prior art, this utility model provides a precision soldering workstation for SMT components, which overcomes the shortcomings of the prior art and solves the problems mentioned in the background art.

[0007] To achieve the above objectives, this utility model provides the following technical solution: a precision SMT component soldering workstation, comprising:

[0008] The workbench has an anti-static coating on its surface.

[0009] A six-axis collaborative robotic arm with a miniature soldering tip and a vacuum nozzle integrated at its end;

[0010] A dynamic temperature control module, connected to the miniature soldering iron tip, is used to adjust the soldering temperature in real time.

[0011] A machine vision positioning system, including a camera and an image processing unit, is used to identify the coordinate deviation between components and pads;

[0012] Vacuum adsorption fixture, equipped with a miniature vacuum nozzle array, is used to fix PCB boards and tiny components;

[0013] The modular feeding system, consisting of a vibrating feed tray, supports rapid switching between various packaged components.

[0014] A six-axis collaborative robotic arm with high degrees of freedom of motion enables precise welding in complex angles and tiny spaces, solving the problem of insufficient flexibility of traditional robotic arms. By combining high-frequency induction heating coil heating with closed-loop control, temperature fluctuations are significantly reduced, avoiding poor soldering or component damage caused by temperature runaway. Cameras improve component alignment accuracy and reduce the need for manual intervention. The micro vacuum nozzle array design ensures stable fixation of PCB boards and tiny components, adapting to high density. The vibrating feeder can shorten production line changeover time and improve the efficiency of multi-variety, small-batch production.

[0015] As a preferred embodiment of this utility model, the end of the six-axis collaborative robotic arm is also integrated with a pressure sensor, the pressure sensor having a range of 0.1N to 1N and an accuracy of ±0.05N; the micro soldering tip has a diameter of 0.2-0.3mm and a repeatability of ±5μm.

[0016] By monitoring the soldering pressure and ultra-fine soldering tip in real time, excessive pressure can be avoided, which may cause components to break or insufficient solder.

[0017] As a preferred embodiment of this utility model, the dynamic temperature control module includes:

[0018] A high-frequency induction heating coil, coupled with a miniature soldering iron tip, provides a heating rate of ≥50℃ / second, shortening soldering preparation time and improving production efficiency.

[0019] Infrared thermal imager to collect solder joint temperature data in real time;

[0020] The PID controller adjusts the soldering tip temperature in a closed loop based on the preset temperature curve and feedback data from the infrared thermal imager, with a temperature fluctuation range of ≤±1℃.

[0021] Infrared thermal imagers provide real-time feedback on solder joint temperature, while PID closed-loop control limits temperature fluctuations to ±1℃, ensuring consistent solder joint wettability and reducing the risk of cold soldering.

[0022] As a preferred embodiment of this invention, the camera of the machine vision positioning system has a resolution of 5μm / pixel and is used to identify component package type, pad position and angular offset.

[0023] As a preferred technical solution of this utility model, the suction port diameter of the micro vacuum nozzle array of the vacuum adsorption fixture is 0.1-0.3mm, which supports the adsorption of SMT components with a size of 0.2mm×0.4mm to 2mm×2mm.

[0024] As a preferred technical solution of this utility model, it also includes a nitrogen protection device, wherein the nozzle of the nitrogen protection device is arranged around the miniature soldering iron tip, the inert gas flow rate is 5-10L / min, and the oxygen concentration is controlled at ≤100ppm.

[0025] Inert gas covers the soldering area, reducing solder joint oxidation and improving the surface gloss and mechanical strength of the solder, making it especially suitable for high-reliability scenarios using lead-free solder.

[0026] As a preferred technical solution of this utility model, the pressure sensor is connected to the six-axis collaborative robotic arm controller via a CAN bus, providing real-time feedback of contact force data and dynamically adjusting the pressing depth according to a preset pressure-displacement curve, with an adjustment accuracy of ±2μm.

[0027] By combining pressure sensors with dynamic adjustments by a robotic arm, the pressure depth of PCBs or components of different thicknesses can be kept consistent, thus avoiding solder bridging or cold solder joints.

[0028] Compared with the prior art, the beneficial effects of this utility model are:

[0029] A six-axis collaborative robotic arm with high degrees of freedom of motion enables precise welding in complex angles and tiny spaces, solving the problem of insufficient flexibility of traditional robotic arms. By combining high-frequency induction heating coil heating with closed-loop control, temperature fluctuations are significantly reduced, avoiding poor soldering or component damage caused by temperature runaway. Cameras improve component alignment accuracy and reduce the need for manual intervention. The micro vacuum nozzle array design ensures stable fixation of PCB boards and tiny components, adapting to high density. The vibrating feeder can shorten production line changeover time and improve the efficiency of multi-variety, small-batch production. Attached Figure Description

[0030] Figure 1 This is a three-dimensional schematic diagram of the present invention;

[0031] Figure 2 This is a cross-sectional schematic diagram of the miniature soldering iron tip of this utility model;

[0032] Figure 3 For the present utility model Figure 1 A magnified view of a portion of point A in the middle.

[0033] In the diagram: 1. Workbench; 2. Antistatic coating; 3. Six-axis collaborative robotic arm; 4. Miniature soldering tip; 5. Vacuum nozzle; 6. Pressure sensor; 7. High-frequency induction heating coil; 8. PID controller; 9. Infrared thermal imager; 10. Vacuum adsorption fixture; 11. Nozzle; 12. Vibrating feed tray; 13. Camera; 14. Image processing unit; 15. Miniature vacuum nozzle array. Detailed Implementation

[0034] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0035] Please see Figure 1-3 A precision soldering workstation for SMT components includes:

[0036] Workbench 1, the surface of workbench 1 is provided with antistatic coating 2;

[0037] A six-axis collaborative robotic arm 3, with a miniature soldering tip 4 and a vacuum nozzle 5 integrated at its end;

[0038] The dynamic temperature control module, connected to the mini soldering iron tip 4, is used to adjust the soldering temperature in real time.

[0039] A machine vision positioning system, including a camera 13 and an image processing unit 14, is used to identify the coordinate deviation between components and pads;

[0040] The vacuum adsorption fixture 10 is equipped with a miniature vacuum nozzle array 15 for fixing PCB boards and small components.

[0041] The modular feeding system, consisting of a vibrating feeding tray 12, supports rapid switching between various packaged components;

[0042] The six-axis collaborative robotic arm 3, with its high degree of freedom of motion, enables precise welding in complex angles and small spaces, solving the problem of insufficient flexibility of traditional robotic arms. The combination of high-frequency induction heating coil 7 and closed-loop control significantly reduces temperature fluctuations, avoiding poor soldering or component damage caused by temperature runaway. The camera 13 improves component alignment accuracy and reduces the need for manual intervention. The micro vacuum nozzle array 15 design ensures stable fixation of the PCB board and micro components, adapting to high density. The vibrating feeder 12 can shorten production line changeover time and improve the efficiency of multi-variety, small-batch production.

[0043] Specifically, the end of the six-axis collaborative robotic arm 3 is also equipped with a pressure sensor 6, which has a range of 0.1N to 1N and an accuracy of ±0.05N; the micro soldering tip 4 has a diameter of 0.2-0.3mm and a repeatability of ±5μm. By monitoring the soldering pressure and the ultra-fine soldering tip in real time, excessive pressure can be avoided to prevent components from breaking or insufficient solder.

[0044] Specifically, the dynamic temperature control module includes:

[0045] The high-frequency induction heating coil 7 is coupled to the miniature soldering tip 4, with a heating rate ≥50℃ / second, which shortens the soldering preparation time and improves production efficiency.

[0046] Infrared thermal imager 9, real-time acquisition of solder joint temperature data;

[0047] The PID controller 8 adjusts the soldering iron tip temperature in a closed loop based on the preset temperature curve and the feedback data from the infrared thermal imager 9. The temperature fluctuation range is ≤±1℃. The infrared thermal imager 9 provides real-time feedback on the solder joint temperature. The PID closed-loop control limits the temperature fluctuation to ±1℃, ensuring consistent solder joint wettability and reducing the risk of cold soldering.

[0048] Specifically, the camera 13 of the machine vision positioning system has a resolution of 5μm / pixel and is used to identify component package type, pad position and angular offset.

[0049] Specifically, the micro vacuum nozzle array 15 of the vacuum adsorption fixture 10 has a suction port diameter of 0.1-0.3mm, supporting the adsorption of SMT components with a size of 0.2mm×0.4mm to 2mm×2mm.

[0050] Specifically, it also includes a nitrogen protection device. The nozzle 11 of the nitrogen protection device is arranged around the miniature soldering tip 4. The inert gas flow rate is 5-10L / min, and the oxygen concentration is controlled at ≤100ppm. The inert gas covers the soldering area, reducing solder joint oxidation and improving the surface gloss and mechanical strength of the solder. It is especially suitable for high reliability scenarios with lead-free solder.

[0051] Specifically, pressure sensor 6 is connected to the controller of the six-axis collaborative robotic arm 3 via CAN bus, providing real-time feedback of contact force data and dynamically adjusting the pressing depth according to the preset pressure-displacement curve with an adjustment accuracy of ±2μm. The combination of pressure sensor 6 and the robotic arm's dynamic adjustment ensures the consistency of pressing depth for PCBs or components of different thicknesses, avoiding solder bridging or cold solder joints.

[0052] Working principle: First, the PCB board is positioned in the work area. The vision system scans the marked points and corrects the coordinates. The micro vacuum nozzle array 15 ensures that the PCB board and the micro components are fixed and stable. The robotic arm picks up the components from the vibrating feed tray 12 according to the preset path. The vision system detects the adsorption status of the nozzles. Then, the soldering iron tip heats the solder pads according to the preset temperature curve. At the same time, the vacuum nozzle 5 releases the components. The pressure sensor feeds back the contact force. The robotic arm fine-tunes the pressing depth. The infrared thermal imager 9 records the solidification process of the solder joints.

[0053] Finally, it should be noted that in the description of this utility model, the terms "vertical," "upper," "lower," "horizontal," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0054] In the description of this utility model, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0055] The above description is merely a preferred embodiment of the present utility model and is not intended to limit the present utility model. Although the present utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. An SMT component precision soldering station, characterized in that, include: Workbench (1), the surface of workbench (1) is provided with antistatic coating (2); A six-axis collaborative robotic arm (3) has a micro soldering tip (4) and a vacuum nozzle (5) integrated at its end. A dynamic temperature control module is connected to the miniature soldering tip (4) and is used to adjust the soldering temperature in real time; A machine vision positioning system, including a camera (13) and an image processing unit (14), is used to identify the coordinate deviation between the component and the pad; The vacuum adsorption fixture (10) is equipped with a miniature vacuum nozzle array (15) for fixing PCB boards and small components; The modular feeding system consists of a vibrating feeding tray (12) and supports rapid switching of various packaged components.

2. A precise soldering station for SMT components according to claim 1, characterized in that: The end of the six-axis collaborative robotic arm (3) is also integrated with a pressure sensor (6), the pressure sensor (6) has a range of 0.1N to 1N and an accuracy of ±0.05N; the micro soldering tip (4) has a diameter of 0.2-0.3mm and a repeatability of ±5μm.

3. A precise soldering station for SMT components according to claim 1, characterized in that: The dynamic temperature control module includes: A high-frequency induction heating coil (7) is coupled to a miniature soldering tip (4), with a heating rate ≥50℃ / second; Infrared thermal imager (9) to collect solder joint temperature data in real time; The PID controller (8) adjusts the soldering tip temperature in a closed loop according to the preset temperature curve and the feedback data from the infrared thermal imager (9), with a temperature fluctuation range of ≤±1℃.

4. A precise soldering station for SMT components according to claim 1, characterized in that: The camera (13) of the machine vision positioning system has a resolution of 5 μm / pixel and is used to identify component package type, pad position and angle offset.

5. The SMT component precision soldering workstation according to claim 1, characterized in that: The vacuum adsorption fixture (10) has a micro vacuum nozzle array (15) with a nozzle diameter of 0.1-0.3 mm, which supports adsorption of SMT components with a size of 0.2 mm × 0.4 mm to 2 mm × 2 mm.

6. A precise soldering station for SMT components according to claim 1, characterized in that: It also includes a nitrogen protection device, wherein the nozzle (11) of the nitrogen protection device is arranged around the micro soldering iron tip (4), the inert gas flow rate is 5-10L / min, and the oxygen concentration is controlled at ≤100ppm.

7. A precise soldering station for SMT components according to claim 2, characterized in that: The pressure sensor (6) is connected to the controller of the six-axis collaborative robotic arm (3) via the CAN bus, and provides real-time feedback of contact force data. It also dynamically adjusts the pressing depth according to the preset pressure-displacement curve, with an adjustment accuracy of ±2 μm.

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