Plastic plate extrusion die

Abstract

The utility model relates to the technical field of plastics processing, concretely relates to a plastic plate extrusion die, including box and cooling assembly, cooling assembly includes extrusion component, feed slot, discharge slot, discharge die, semiconductor condensing plate and heat dissipation component, through feed slot, the raw material that needs extrusion forming is added in the box, then the raw material in the box is extruded through extrusion component, the raw material that is extruded enters the discharge die in the discharge slot, and the surface solidification efficiency of raw material forming is accelerated through the shaping of discharge die, the low temperature that semiconductor condensing plate generates can be quickly transferred to the metal peeling design of discharge die, and the heat dissipation component is the heat dissipation of semiconductor condensing plate radiating surface, and the heat dissipation of semiconductor condensing plate is accelerated, and the condensing effect is improved.

Description

Technical Field

[0001] This utility model relates to the field of plastic processing technology, and in particular to a plastic sheet extrusion die. Background Technology

[0002] Extrusion molding dies are a type of mold used to shape and produce continuous plastic products. They are widely used in the processing of plastic pipes, sheets, etc. Extrusion molding dies are usually used in conjunction with plastic extruders. Solid plastic is heated and melted by the plastic extruder and then passed through a die of a specific shape to form continuous plastic products with the same cross-section as the die.

[0003] A plastic sheet extrusion mold is provided, including a lower mold plate, an upper mold plate above the lower mold plate, a feeding mechanism on one side of the upper mold plate, and an extrusion mechanism located between the upper and lower mold plates. Beneficial effects: The extrusion assembly extrudes the injection-molded plastic sheet, and the scraping assembly effectively cleans the residual waste material on the inner wall of the mold after extrusion, preventing waste residue from affecting subsequent use and the quality of the produced plastic sheet. Through its use in conjunction with control components, the device achieves automated linkage, improving its flexibility and practicality, and ultimately enhancing the quality of the produced plastic sheet.

[0004] However, in the above-mentioned utility model, the extruded product cannot be cooled and shaped quickly during the processing, which may cause the extruded product to be deformed by external factors such as conveyor vibration, thus affecting the product quality. Utility Model Content

[0005] The purpose of this invention is to provide a plastic sheet extrusion mold, which aims to solve the problem that the extruded product cannot be cooled and shaped quickly during the processing of existing devices, which may cause the extruded product to be deformed by external factors such as conveyor vibration, thus affecting product quality.

[0006] To achieve the above objectives, this utility model provides a plastic sheet extrusion mold, including a housing and a cooling component, wherein the cooling component includes an extrusion member, a feed trough, a discharge trough, a discharge mold, a semiconductor condenser plate, and a heat dissipation member;

[0007] The feed chute is connected to the housing and located on one side of the housing. The discharge chute is connected to the housing and located at the end of the housing away from the feed chute. The extrusion member is connected to the housing and located at the top of the housing. The discharge mold is connected to the housing and located on one side of the discharge chute. The semiconductor condenser plate is fixedly connected to the discharge mold and located outside the discharge mold. The heat dissipation member is connected to the semiconductor condenser plate and connected to the housing, and located outside the semiconductor condenser plate.

[0008] The heat dissipation component includes heat dissipation fins and a fan. The heat dissipation fins are fixedly connected to the semiconductor condenser plate and located on top of the semiconductor condenser plate. The fan is connected to the housing and located on one side of the housing.

[0009] The extrusion component includes a cylinder and a pressure plate. The cylinder is fixedly connected to the housing and located at the top of the housing. The pressure plate is fixedly connected to the output end of the cylinder and located inside the housing.

[0010] The cooling component further includes a heating plate and a heat insulation shell. The heat insulation shell is fixedly connected to the box body and located at the bottom of the box body. The heating plate is fixedly connected to the box body and located inside the heat insulation shell.

[0011] The cooling assembly also includes a support cylinder and a conveyor. The conveyor is located at the bottom of the discharge mold, and the output end of the support cylinder is rotatably connected to the conveyor and located at the bottom of the conveyor.

[0012] This utility model discloses a plastic sheet extrusion mold. The raw material to be extruded is added to the housing through the feeding groove. Then, the extrusion member extrudes the raw material inside the housing. The extruded material enters the extrusion mold through the discharge groove and is shaped by the extrusion mold. During the discharge process, a semiconductor condenser plate cools the extrusion mold, accelerating the surface curing efficiency of the raw material. The extrusion mold adopts a metal peeling design, allowing the low temperature generated by the semiconductor condenser plate to be quickly transferred. The heat dissipation member dissipates heat from the heat-dissipating surface of the semiconductor condenser plate, accelerating heat dissipation and improving the condensation effect. This solves the problem that the extruded product cannot cool and solidify quickly during processing, leading to deformation due to external factors such as conveyor vibration, which affects product quality. Attached Figure Description

[0013] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the accompanying drawings used in the description of the embodiments or the prior art will be briefly introduced below.

[0014] Figure 1 This is a structural diagram of a plastic sheet extrusion mold according to the present invention.

[0015] Figure 2 This is a cross-sectional schematic diagram of a plastic sheet extrusion mold according to the present invention.

[0016] 101-Box body, 102-Cooling component, 103-Extrusion component, 104-Feeding chute, 105-Discharge chute, 106-Discharge mold, 107-Semiconductor condenser plate, 108-Heat dissipation component, 109-Heat dissipation fins, 110-Fan, 111-Cylinder, 112-Pressure plate, 113-Heating plate, 114-Insulation shell, 115-Support cylinder, 116-Conveyor. Detailed Implementation

[0017] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0018] Please see Figures 1-2 , Figure 1 This is a structural diagram of a plastic sheet extrusion mold according to the present invention. Figure 2 This is a cross-sectional schematic diagram of a plastic sheet extrusion mold according to the present invention.

[0019] This utility model provides a plastic sheet extrusion mold, comprising a housing 101 and a cooling component 102. The cooling component 102 includes an extrusion member 103, a feed trough 104, a discharge trough 105, a discharge mold 106, a semiconductor condenser plate 107, a heat dissipation member 108, heat dissipation fins 109, a fan 110, a cylinder 111, a pressure plate 112, a heating plate 113, a heat insulation shell 114, a support cylinder 115, and a conveyor 116. This solution solves the problem that the extruded product cannot be quickly cooled and molded during processing, leading to deformation due to external factors such as conveyor vibration, thus affecting product quality.

[0020] In this embodiment, the feed chute 104 communicates with the housing 101 and is located on one side of the housing 101; the discharge chute 105 communicates with the housing 101 and is located at the end of the housing 101 away from the feed chute 104; the extrusion member 103 is connected to the housing 101 and is located at the top of the housing 101; the discharge mold 106 is connected to the housing 101 and is located on one side of the discharge chute 105; the semiconductor condenser plate 107 is fixedly connected to the discharge mold 106 and is located outside the discharge mold 106; the heat dissipation member 108 is connected to the semiconductor condenser plate 107 and connected to the housing 101, and is located outside the semiconductor condenser plate 107. The raw material to be extruded is added to the housing 101 through the feed chute 104. In step 1, the raw material inside the box 101 is then extruded by the extrusion member 103. The extruded raw material enters the discharge mold 106 through the discharge chute 105 and is shaped by the discharge mold 106. During the discharge process, the semiconductor condenser plate 107 cools the discharge mold 106, accelerating the surface curing efficiency of the raw material. The discharge mold 106 adopts a thin-walled metal design, which allows the low temperature generated by the semiconductor condenser plate 107 to be quickly transferred. The heat dissipation member 108 dissipates heat from the heat-dissipating surface of the semiconductor condenser plate 107, accelerating the heat dissipation of the semiconductor condenser plate 107 and improving the condensation effect. This solves the problem that the extruded product cannot be cooled and shaped quickly during the processing, which may cause the extruded product to deform due to external factors such as conveyor vibration, affecting product quality.

[0021] The heat dissipation component 108 includes heat dissipation fins 109 and a fan 110. The heat dissipation fins 109 are fixedly connected to the semiconductor condenser plate 107 and located on top of the semiconductor condenser plate 107. The fan 110 is connected to the housing 101 and located on one side of the housing 101. The heat dissipation fins 109 are installed on the heat dissipation surface of the semiconductor condenser plate 107 to increase the efficiency of heat dissipation. The fan 110 provides air cooling to the heat dissipation fins 109 to accelerate the heat diffusion efficiency of the heat dissipation fins 109.

[0022] Secondly, the extrusion component 103 includes a cylinder 111 and a pressure plate 112. The cylinder 111 is fixedly connected to the housing 101 and located at the top of the housing 101. The pressure plate 112 is fixedly connected to the output end of the cylinder 111 and located inside the housing 101. The cylinder 111 controls the pressure plate 112 to move up and down, and the pressure plate 112 extrudes the raw material in the housing 101, thereby extruding the raw material through the discharge chute 105 into the discharge mold 106 for forming.

[0023] Furthermore, the cooling assembly 102 also includes a heating plate 113 and a heat insulation shell 114. The heat insulation shell 114 is fixedly connected to the housing 101 and located at the bottom of the housing 101. The heating plate 113 is fixedly connected to the housing 101 and located inside the heat insulation shell 114. The heating plate 113 is used to heat the bottom of the housing 101 to prevent the liquefied raw materials entering the housing 101 from solidifying due to temperature reduction. The heat insulation shell 114 is used to protect the heating plate 113 to prevent personnel from being burned by direct contact with the heating plate 113.

[0024] Finally, the cooling assembly 102 also includes a support cylinder 115 and a conveyor 116. The conveyor 116 is located at the bottom of the discharge mold 106. The output end of the support cylinder 115 is rotatably connected to the conveyor 116 and is located at the bottom of the conveyor 116. The conveyor 116 conveys the plastic sheet processed by the discharge mold 106. The support cylinder 115 controls the height of the conveyor 116 to facilitate docking with the discharge mold 106 and subsequent processing steps.

[0025] Using the plastic sheet extrusion mold of this utility model, the raw material to be extruded is added to the box 101 through the feeding groove 104, and then the extrusion member 103 extrudes the raw material in the box 101. The extruded raw material enters the discharge mold 106 through the discharge groove 105 and is shaped by the discharge mold 106. During the discharge process, the semiconductor condenser plate 107 cools the discharge mold 106, accelerating the surface curing efficiency of the raw material. The discharge mold 106 adopts a thin-walled metal design, which allows the low temperature generated by the semiconductor condenser plate 107 to be quickly transferred. The heat dissipation member 108 dissipates heat from the heat-dissipating surface of the semiconductor condenser plate 107, accelerating the heat dissipation of the semiconductor condenser plate 107 and improving the condensation effect. This solves the problem that the extruded product cannot be cooled and shaped quickly during the processing, which may cause the extruded product to deform due to external factors such as conveyor vibration, affecting product quality.

[0026] The above-disclosed embodiments are merely preferred embodiments of the plastic sheet extrusion mold of this utility model, and should not be construed as limiting the scope of this utility model. Those skilled in the art can understand that implementing all or part of the above-described embodiments and making equivalent changes in accordance with the claims of this utility model still fall within the scope of this utility model.

Claims

1. A plastic sheet extrusion mold, comprising a housing, characterized in that: It also includes a cooling component, which includes an extrusion component, a feed trough, a discharge trough, a discharge mold, a semiconductor condenser plate, and a heat dissipation component; The feed chute is connected to the housing and located on one side of the housing. The discharge chute is connected to the housing and located at the end of the housing away from the feed chute. The extrusion member is connected to the housing and located at the top of the housing. The discharge mold is connected to the housing and located on one side of the discharge chute. The semiconductor condenser plate is fixedly connected to the discharge mold and located outside the discharge mold. The heat dissipation member is connected to the semiconductor condenser plate and connected to the housing, and located outside the semiconductor condenser plate.

2. The plastic sheet extrusion die as described in claim 1, characterized in that: The heat dissipation component includes heat dissipation fins and a fan. The heat dissipation fins are fixedly connected to the semiconductor condenser plate and located on top of the semiconductor condenser plate. The fan is connected to the housing and located on one side of the housing.

3. The plastic sheet extrusion die as described in claim 2, characterized in that: The extrusion component includes a cylinder and a pressure plate. The cylinder is fixedly connected to the housing and located at the top of the housing. The pressure plate is fixedly connected to the output end of the cylinder and located inside the housing.

4. The plastic sheet extrusion mold as described in claim 3, characterized in that: The cooling assembly also includes a heating plate and a heat insulation shell. The heat insulation shell is fixedly connected to the box body and located at the bottom of the box body. The heating plate is fixedly connected to the box body and located inside the heat insulation shell.

5. A plastic sheet extrusion die as described in claim 4, characterized in that: The cooling assembly also includes a support cylinder and a conveyor. The conveyor is located at the bottom of the discharge mold. The output end of the support cylinder is rotatably connected to the conveyor and is located at the bottom of the conveyor.

Images