An automatic stacking mechanism for integrated circuit package finished products

Abstract

The utility model belongs to the technical field of semiconductor packaging, disclose a kind of integrated circuit packaging finished product automatic stacking mechanism, including automatic stacking machine body, conveying equipment and drive assembly, automatic stacking machine body, mobile plate conveying equipment are set to, connect in the automatic stacking machine body, for conveying the drive assembly of circuit chip completed packaging, including linkage piece one, linkage piece two, linkage piece three, connecting column and gyro wheel, the gyro wheel is connected in the position above linkage piece three by connecting column, linkage piece one is connected in the conveying equipment, linkage piece two is driven under linkage piece one, linkage piece three is rotated, circuit chip is limited by gyro wheel, avoid the direct contact of circuit chip in moving process with mobile plate, and then make circuit chip more smooth when moving, to avoid the problem of wear and tear when circuit chip moves.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor packaging technology, and in particular relates to an automatic stacking mechanism for finished integrated circuit packages. Background Technology

[0002] In the semiconductor packaging industry, the handling and transportation of integrated circuit packaged products is a tedious and high-precision task. Traditional manual handling methods are not only time-consuming and labor-intensive, but also prone to product damage and quality control problems. In recent years, with the development of automation technology, automatic stacking mechanisms have been widely used in the handling of integrated circuit packaged products. These mechanisms can automatically complete the transfer and stacking of integrated circuit packaged products, and can effectively improve production efficiency and product quality while ensuring high precision.

[0003] Existing automated stacking mechanisms for finished integrated circuit packages require conveying equipment to transport packaged circuit chips. However, during the transport of these packaged circuit chips, they need to be restricted by moving plates on both sides. At this time, the circuit chips will rub against the moving plates, which will cause scratches on the surface of the circuit chips and affect the overall performance of the circuit chips.

[0004] In other words, when traditional automated stacking mechanisms for finished integrated circuit packages transport circuit chips, they may scratch the surface of the circuit chips, thereby affecting the overall performance of the circuit chips. Utility Model Content

[0005] This invention addresses the problem that traditional automated stacking mechanisms for finished integrated circuit packages scratch the surface of circuit chips during transport, thus affecting the overall performance of the circuit chips. The following technical solution is proposed:

[0006] An automated stacking mechanism for finished integrated circuit packages includes:

[0007] The automatic stacking machine body is equipped with a movable plate;

[0008] A conveying device, connected to the automatic stacking machine body, is used to convey packaged circuit chips;

[0009] The drive assembly includes a first linkage component, a second linkage component, a third linkage component, a connecting column, and a roller. The roller is connected to the third linkage component above the connecting column. The first linkage component is connected to the conveying device. The second linkage component drives the third linkage component to rotate under the drive of the first linkage component.

[0010] As a preferred embodiment of the above technical solution, a mobile component is also included:

[0011] The movable component includes a connecting plate, an elastic element, a connecting rod, and a housing. The housing and the connecting plate are both connected to the movable plate. The connecting column and the connecting rod are both inserted inside the connecting plate. The linkage element is connected to the connecting plate. The housing is connected to the connecting plate through the elastic element.

[0012] As a preferred embodiment of the above technical solution, the rollers are provided in a plurality of positions, and the plurality of rollers are distributed in an equidistant array from one end of the conveying device to the other end. The first linkage component, the second linkage component, the third linkage component, and the connecting column correspond one-to-one with the rollers.

[0013] As a preferred embodiment of the above technical solution, the conveying equipment is provided with two baffles, which are respectively located at both ends of the conveying equipment.

[0014] As a preferred embodiment of the above technical solution, the outer shell is fitted onto the connecting plate, and the outer surface of the connecting plate is in contact with the inner wall of the outer shell.

[0015] As a preferred embodiment of the above technical solution, the connecting rod is rectangular, and the outer casing has a rectangular groove with the same shape as the connecting rod, and the connecting rod slides inside the rectangular groove.

[0016] The beneficial effects of this utility model are as follows:

[0017] (1) By using rollers to restrict the circuit chip, the circuit chip is prevented from directly contacting the moving board during the movement process, which makes the movement of the circuit chip smoother and avoids the problem of wear and tear when the circuit chip moves.

[0018] (2) The circuit chips can be moved during the transportation process by rollers, which avoids the problem of cracks on the surface of the circuit chips caused by excessive pressure on both sides of the circuit chips, thereby avoiding damage during transportation of the circuit chips and improving the efficiency of stacking these circuit chips. Attached Figure Description

[0019] Figure 1 The diagram shown is a structural schematic of an automatic stacking mechanism for finished integrated circuit packages in Embodiment 1.

[0020] Figure 2 The diagram shown is a schematic diagram of the back structure of an automatic stacking mechanism for finished integrated circuit packages in Embodiment 1;

[0021] Figure 3 The diagram shown is a structural schematic of the conveying equipment in Embodiment 1;

[0022] Figure 4 The diagram shown is a structural schematic of the outer shell in Embodiment 1;

[0023] Figure 5 The diagram shown is a structural schematic of the elastic element in Embodiment 1.

[0024] In the diagram: 1. Automatic stacking machine body; 2. Moving plate; 3. Conveying equipment; 4. Linkage component one; 5. Linkage component two; 6. Linkage component three; 7. Connecting column; 8. Roller; 9. Connecting plate; 10. Elastic component; 11. Connecting rod; 12. Outer shell; 13. Barrier plate. Detailed Implementation

[0025] To make the objectives, technical solutions, and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments.

[0026] Example 1

[0027] This utility model provides an automatic stacking mechanism for finished integrated circuit packages, such as... Figures 1 to 5 As shown, the system includes: an automatic stacking machine body 1, a conveying device 3, and a drive assembly. The automatic stacking machine body 1 has two movable plates 2, each equipped with a conveying device 3. One of the movable plates 2 has an electric slide rail at its bottom, which is mounted on the surface of the automatic stacking machine body 1. The conveying device 3 is a combination of a toothed belt, a toothed pulley, and a servo motor. A baffle plate 13 is connected to one side of the toothed pulley to prevent the toothed belt from slipping off. The conveying device 3 is connected to the automatic stacking machine body 1 and is used to convey the packaged circuit chips. The drive assembly includes a first linkage 4, a second linkage 5, a third linkage 6, a connecting column 7, and a roller 8. The first linkage 4 is a gear. Linkage 4 meshes with the toothed belt of conveyor 3. Linkage 5 and 6 are bevel gears that mesh with each other. The surface of roller 8 is provided with a silicone sleeve that fits onto the outer surface of roller 8. Roller 8 is connected to the position above linkage 6 via connecting post 7. Linkage 4 is connected to conveyor 3. Linkage 5 drives linkage 6 to rotate under the drive of linkage 4. There are multiple rollers 8, which are distributed in an equidistant array from one end of conveyor 3 to the other end. Linkage 4, linkage 5, linkage 6 and connecting post 7 correspond one-to-one with roller 8. There are two baffle plates 13 on conveyor 3, which are located at both ends of conveyor 3.

[0028] By using rollers 8 to restrict the circuit chip, direct contact between the circuit chip and the moving plate 2 is avoided during the movement process, thus making the movement of the circuit chip smoother and avoiding wear problems during the movement of the circuit chip.

[0029] In operation, the operator first adjusts the position of the moving plate 2 so that the distance between the two moving plates 2 matches the width of the circuit chip. Then, the operator starts the conveying device 3, which drives the first linkage 4 to rotate on its surface. During the rotation of the first linkage 4, the second linkage 5 rotates synchronously, which in turn drives the third linkage 6 to rotate. The third linkage 6 drives the connecting column 7 to rotate, which in turn drives the roller 8 to rotate. As the roller 8 rotates, it moves the circuit chip simultaneously with the conveying device 3. When a single circuit chip comes into contact with the barrier device, the movement stops. Then, the circuit chip is lifted by the lifting device and clamped by the clamping device. The above steps are repeated to stack multiple circuit chips together, thus completing the automatic stacking process. The roller 8 restricts the circuit chip, preventing it from directly contacting the moving plate 2 during movement, thus making the movement of the circuit chip smoother and avoiding wear problems during movement.

[0030] Specifically, there are two mobile plates 2. One is fixedly connected to the surface of the automatic stacker body 1, and the other mobile plate 2 is slidably connected to the top of the automatic stacker body 1. The opposite sides of the two mobile plates 2 are fixedly connected to the conveying device 3. The conveying device 3 is internally connected to the first linkage 4. The surface of the first linkage 4 is fixedly connected to the second linkage 5. The surface of the second linkage 5 is internally connected to the third linkage 6. The top of the third linkage 6 is fixedly connected to the connecting column 7. The top of the connecting column 7 is fixedly connected to the roller 8. The first linkage 4, the second linkage 5, the third linkage 6, the connecting column 7 and the roller 8 are all slidably connected inside the mobile plate 2.

[0031] Existing automated stacking mechanisms for finished integrated circuit packages also include lifting devices, clamping devices, and blocking devices. In use, the blocking devices block the circuit chips during the movement process. Then, the lifting devices lift the circuit chips and the clamping devices hold the circuit chips. The above steps are repeated to stack multiple circuit chips together, thereby completing the automated stacking process. The above are all existing technologies in this field and will not be elaborated further here.

[0032] To reduce the force exerted by roller 8 on the circuit chip in the above example, the following solution is proposed: Figure 2 and Figure 5As shown, it also includes a moving assembly: the moving assembly includes a connecting plate 9, an elastic element 10, a connecting rod 11, and a housing 12. The connecting plate 9 is generally L-shaped. The third linkage 6 rotates inside the connecting plate 9 via the connecting post 7, and the second linkage 5 rotates on its surface. A sliding groove is provided inside the moving plate 2. The first linkage 4, the second linkage 5, the third linkage 6, the connecting post 7, and the roller 8 all slide inside the sliding groove. The elastic element 10 is a spring and is located above the connecting rod 11. The housing 12 and the connecting plate 9 are both connected to the moving plate 2. The connecting post 7 and the roller 8... All connecting rods 11 are inserted inside the connecting plate 9. The second linkage 5 is connected to the connecting plate 9. The outer shell 12 is connected to the connecting plate 9 through the elastic element 10. The outer shell 12 is sleeved on the connecting plate 9. The outer surface of the connecting plate 9 and the inner wall of the outer shell 12 are in close contact with each other. When the roller 8 squeezes the circuit chip, the reaction force generated pushes the connecting plate 9 to move in the opposite direction. The width of the connecting plate 9 can meet the distance of the reverse movement of the connecting plate 9. The connecting rod 11 is rectangular. The outer shell 12 has a rectangular groove with the same shape as the connecting rod 11. The connecting rod 11 slides inside the rectangular groove.

[0033] The circuit chips can be moved during transportation using rollers 8, which avoids the problem of cracks appearing on the surface of the circuit chips due to excessive pressure on both sides, thus preventing damage during transportation and improving the efficiency of stacking these circuit chips.

[0034] In use, the circuit chip is first moved by the rollers 8. As the circuit chip moves, it presses against the rollers 8 on both sides, causing the rollers 8 to move. The rollers 8 then move the connecting plate 9. When the connecting plate 9 moves, it drives the linkage 4, linkage 5, linkage 6, connecting post 7, and connecting rod 11 to move synchronously, pressing against the elastic element 10. This causes the elastic element 10 to be compressed and deformed. The reaction force generated by the deformed elastic element 10 drives the rollers 8 to always be in contact with the side of the circuit chip. When the connecting rod 11 moves, it slides inside the housing 12, and the housing 12 restricts the connecting rod 11, making the movement of the connecting rod 11 more stable. The circuit chip can be moved during the transportation process by the rollers 8, avoiding the problem of cracks appearing on the surface of the circuit chip due to excessive pressure on both sides. This avoids damage during the transportation of the circuit chip and improves the efficiency of stacking these circuit chips.

[0035] Specifically, the same connecting plate 9 is provided on one end face of the second linkage 5 and the first end face of the third linkage 6. The top of the connecting plate 9 is sleeved on the outer surface of the connecting column 7. The second linkage 5 is rotatably connected to one side of the bottom end of the connecting plate 9, and the connecting rod 11 is fixedly connected to the other side of the bottom end of the connecting plate 9. The same outer shell 12 is slidably connected to the outer surface of the connecting plate 9 and the connecting rod 11. The outer shell 12 is fixedly connected to the inside of the moving plate 2. An elastic element 10 is provided above the connecting rod 11. The two ends of the elastic element 10 are fixedly connected to the inner wall of the outer shell 12 and the surface of the connecting plate 9, respectively.

[0036] Working principle: When using this device, the operator first adjusts the position of the moving plate 2 so that the distance between the two moving plates 2 matches the width of the circuit chip. Then, the operator starts the conveying device 3, which drives the first linkage 4 to rotate on its surface. During the rotation of the first linkage 4, the second linkage 5 rotates synchronously. The second linkage 5 drives the third linkage 6 to rotate. The third linkage 6 drives the roller 8 to rotate through the connecting column 7. While the roller 8 rotates, it moves the circuit chip at the same time as the conveying device 3. When a single circuit chip is in contact with the barrier device, it stops moving. Then, the lifting device lifts the circuit chip, and the clamping device clamps the circuit chip. The above steps are repeated to stack multiple circuit chips together, thus completing the automatic stacking process. The roller 8 restricts the circuit chip, preventing the circuit chip from directly contacting the moving plate 2 during the movement, thus making the movement of the circuit chip smoother and avoiding wear problems during the movement of the circuit chip.

[0037] When the rollers 8 move the circuit chip, the movement of the circuit chip simultaneously compresses the rollers 8 on both sides, causing the rollers 8 to move. The rollers 8 then move the connecting plate 9. When the connecting plate 9 moves, it causes the first linkage 4, the second linkage 5, the third linkage 6, the connecting post 7, and the connecting rod 11 to move synchronously, compressing the elastic element 10 and deforming it. The reaction force generated by the deformed elastic element 10 drives the rollers 8 to always be in contact with the side of the circuit chip. When the connecting rod 11 moves, it slides inside the housing 12, and the housing 12 restricts the connecting rod 11, making the movement of the connecting rod 11 more stable. The circuit chip can move during the transportation process via the rollers 8, avoiding the problem of cracks appearing on the surface of the circuit chip due to excessive pressure on both sides, thus avoiding damage during the transportation of the circuit chip and improving the efficiency of stacking these circuit chips.

[0038] The above embodiments are only used to illustrate the technical solution of this utility model, and are not intended to limit it.

Claims

1. An automatic stacking mechanism for finished integrated circuit packages, characterized in that, include: The automatic stacking machine body (1) is equipped with a movable plate (2); The conveying device (3) is connected to the automatic stacking machine body (1) and is used to convey the packaged circuit chips; The drive assembly includes a first linkage (4), a second linkage (5), a third linkage (6), a connecting column (7), and a roller (8). The roller (8) is connected to the third linkage (6) above the connecting column (7). The first linkage (4) is connected to the conveying device (3). The second linkage (5) drives the third linkage (6) to rotate under the drive of the first linkage (4).

2. The automatic stacking mechanism for finished integrated circuit packages according to claim 1, characterized in that, It also includes a moving component, which includes a connecting plate (9), an elastic element (10), a connecting rod (11), and a housing (12). The housing (12) and the connecting plate (9) are both connected to the moving plate (2). The connecting column (7) and the connecting rod (11) are both inserted inside the connecting plate (9). The second linkage element (5) is connected to the connecting plate (9). The housing (12) is connected to the connecting plate (9) through the elastic element (10).

3. The automatic stacking mechanism for finished integrated circuit packages according to claim 1, characterized in that, The rollers (8) are provided in multiples, and the multiple rollers (8) are distributed in an equidistant array from one end of the conveying device (3) to the other end. The first linkage (4), the second linkage (5), the third linkage (6) and the connecting column (7) correspond one-to-one with the rollers (8).

4. The automatic stacking mechanism for finished integrated circuit packages according to claim 1, characterized in that, The conveying device (3) is provided with a baffle plate (13), and there are two baffle plates (13) located at both ends of the conveying device (3).

5. The automatic stacking mechanism for finished integrated circuit packages according to claim 2, characterized in that, The outer shell (12) is fitted onto the connecting plate (9), and the outer surface of the connecting plate (9) is in contact with the inner wall of the outer shell (12).

6. The automatic stacking mechanism for finished integrated circuit packages according to claim 2, characterized in that, The connecting rod (11) is rectangular, and the outer shell (12) has a rectangular groove with the same shape as the connecting rod (11), and the connecting rod (11) slides inside the rectangular groove.

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