A general device for chip assisted alignment for ultrasound scanning
By designing a universal chip-assisted alignment device for ultrasonic scanning, utilizing a rectangular frame and guide rail slider system, the problems of uneven chip alignment and damaged PIN pins were solved, achieving efficient and neat chip alignment and improved imaging quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- BOSCH HUAYU STEERING SYST CO LTD
- Filing Date
- 2025-04-27
- Publication Date
- 2026-06-09
AI Technical Summary
When mass-producing ultrasonic scanning chips, there are problems such as difficulty in removing air bubbles and difficulty in arranging PIN pins, resulting in irregular chip arrangement, easy disruption by water flow, affecting imaging effect and potentially damaging PIN pins.
Design a general-purpose chip-assisted alignment device for ultrasonic scanning. Utilize a rectangular frame structure and a guide rail slider system. Through the cooperation of a slide plate and a push plate, the chips can be slid parallel and aligned neatly. A PIN pin gap is reserved under the slide plate to protect the PIN pins. Air bubbles are removed by rinsing with a water gun.
This achieves efficient and neat arrangement of chips, protects PIN pins, avoids repetitive arrangement, improves work efficiency, and ensures image quality.
Smart Images
Figure CN224341560U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of steering system technology, specifically a general-purpose chip-assisted arrangement device for ultrasonic scanning. Background Technology
[0002] With the development of domestically produced chips, ultrasonic scanning analysis has become a routine method. This technique involves placing the chip in water and using ultrasonic waves to scan and analyze its internal structure. However, with the increasing variety of chip types, some small in size and with numerous pins, the arrangement of components during mass ultrasonic scanning presents the following challenges.
[0003] Removing air bubbles became a major challenge. The chip package surface has an oil film that is not easily soluble in water. When the chip is placed in water, many air bubbles of various sizes appear on the package surface, which is unacceptable for ultrasonic scanning. The air bubbles need to be washed away with a water gun, which will scatter the arranged chips, wasting the previous arrangement work and causing the awkward situation of repeated arrangement.
[0004] The multi-pin structure makes chip arrangement difficult. During arrangement, the pins of adjacent components mesh poorly, resembling gears. This not only results in a chaotic and disordered arrangement of components, affecting image recognition, but also makes the pins prone to twisting and deformation under stress, damaging the components. Summary of the Invention
[0005] To overcome the shortcomings of the prior art, this utility model provides a general-purpose chip-assisting arrangement device for ultrasonic scanning, based on the characteristics of current automotive-grade chip packaging, such as rectangular shape, symmetrical pin distribution, and similar structural shapes. This device can arrange chips while protecting them, thereby improving work efficiency.
[0006] To achieve the above objectives, a general-purpose chip-assisted alignment device for ultrasonic scanning is designed, comprising a base, a sliding plate, a push plate, and a push rod. The base is a frame structure, with several sliding plates arranged side-by-side inside the base. The left and right ends of the sliding plates are slidably connected to the left and right sides of the base via sliders. A push plate is located on the front side of the sliding plates, and the other side of the push plate is connected to a lead screw via a lead screw assembly. Pressure plates are connected above the left and right sides of the base.
[0007] The base is a rectangular frame structure, and the height of the crossbeams on the left and right sides of the base is lower than that of the crossbeams on the front and rear sides of the base; the crossbeams on the left and right sides of the base are guide rail structures.
[0008] The slider has an L-shaped structure, with one end connected to the end of the slide plate, and the right-angle bend of the slider resting on the crossbeams on the left and right sides of the base.
[0009] The push plate is a rectangular panel structure, with grooves on the bottom of the left and right sides of the push plate, which are respectively supported on the crossbeams on the left and right sides of the base.
[0010] The lead screw assembly includes a push block and a lead screw nut. The push block has a U-shaped structure, and the middle part of the push block is provided with a lead screw nut connected to one end of the lead screw. The two forked ends of the push block abut against the push plate.
[0011] One end of the lead screw is located inside the base, and the other end of the lead screw passes through the base and is located on the outside of the base.
[0012] The pressure plate is a rectangular strip structure, with a round hole at one end and a U-shaped groove at the other end.
[0013] Compared with the prior art, this utility model provides a general-purpose chip auxiliary arrangement device for ultrasonic scanning, based on the characteristics of current automotive-grade chip packaging, such as rectangular shape, symmetrical distribution of pins on the chip and similar structural shape. This device can arrange chips while protecting them, thereby improving work efficiency. Attached Figure Description
[0014] Figure 1 This is a three-dimensional view of the structure of this utility model.
[0015] Figure 2 This is an exploded view of the structure of this utility model.
[0016] Figure 3 This is a front view of the chip mounting section of this utility model.
[0017] Figure 4 This is a top view of the chip being installed in this utility model. Detailed Implementation
[0018] The present invention will be further described below with reference to the accompanying drawings.
[0019] like Figure 1 , Figure 2 As shown, the base 1 is a frame structure, and several sliding plates 2 are arranged side by side inside the base 1. The left and right ends of the sliding plates 2 are slidably connected to the left and right sides of the base 1 through sliders 3. A push plate 4 is provided on the front side of the sliding plates 2, and the other side of the push plate 4 is connected to the screw 6 through a screw assembly. Pressure plates 7 are connected to the top of the left and right sides of the base 1 respectively.
[0020] The base 1 is a rectangular frame structure. The height of the crossbeams on the left and right sides of the base 1 is lower than that of the crossbeams on the front and back sides of the base 1. The crossbeams on the left and right sides of the base 1 are guide rail structures.
[0021] The slider 3 has an L-shaped structure. One end of the slider 3 is connected to the end of the slide plate 2, and the right-angle bend of the slider 3 is supported on the crossbeams on the left and right sides of the base 1.
[0022] The push plate 4 has a rectangular panel structure. The bottom of the left and right sides of the push plate 4 is provided with grooves, and the grooves on the left and right sides of the push plate 4 are respectively supported on the crossbeams on the left and right sides of the base 1.
[0023] The lead screw assembly includes a push block and a lead screw nut. The push block 5 has a U-shaped structure. The middle part of the push block 5 is provided with a lead screw nut that is connected to one end of the lead screw 6. The two forked ends of the push block 5 abut against the push plate 4.
[0024] One end of the lead screw 6 is located inside the base 1, and the other end of the lead screw 6 passes through the base 1 and is located on the outside of the base 1.
[0025] The pressure plate 7 has a rectangular strip structure, with a round hole at one end and a U-shaped groove at the other end.
[0026] The device is designed based on the characteristics of current automotive-grade chip packages, which are rectangular in shape and have symmetrically distributed and similarly shaped pins. Since the chip is placed on a glass panel and completely immersed in water during ultrasonic scanning, the movement of the chip on the glass panel will not damage the chip surface, which also meets the design requirements of the device.
[0027] Taking advantage of the fact that most automotive-grade chips are packaged in rectangular shapes, the sliding plate 2 of the device is designed in the shape of a ruler. The guide rail structure on both sides of the base 1 allows the slider 3 to slide parallel, effectively pushing the chips in each row to ensure neat alignment. The gap between the slider 3 and the guide rail is increased to 1mm to prevent slight unevenness that could cause jamming when moving the slider 3.
[0028] Currently, the design structure of PIN pins for automotive-grade chips is not significantly different; they all feature outward-extending PIN pins with a symmetrical design on both sides. By simply leaving a gap at the bottom of the device to accommodate the PIN pins, collisions between the slide plate 2 and the PIN pins can be effectively avoided. Therefore, this device is designed so that after the slider 3 is placed on the guide rail structure, a gap is left at the bottom of the base of the slide plate 2 and the guide rail structure to accommodate the PIN pins. Figure 3 The 0.5mm gap is shown in the diagram. This gap allows the PIN pins to be positioned precisely below slide 2, and the side of slide 2 to contact the package. When slide 2 pushes the chip horizontally, the side does not touch the PIN pins, thus protecting them. If the chip size is small, this function can be achieved simply by changing the design value of this bottom gap. This dimension can be designed according to the actual PIN pin height parameters of different chips.
[0029] Based on the current pin width dimensions of most automotive-grade chips, the width of the slide plate 2 is designed to be 2.6mm. Figure 4 The markings shown can effectively prevent the pins of each row of chips from colliding with each other after the chip is flattened, thus protecting the pins.
[0030] With the chips arranged by the device, the PIN pins are confined under the slide plate 2. When the air bubbles on the surface of the chips are rinsed off with a water gun, the chips will not be washed away by the water flow, avoiding the ineffective work of repeated arrangement and improving work efficiency.
[0031] The pressure plate 7 utilizes a U-shaped groove design to facilitate the replacement of the slide plate 2 and the slider 3. Furthermore, the gap between the slide plate 2 and the pressure plate 7 is designed to be 0.05mm, which not only does not affect the sliding of the slide plate 2, but also effectively prevents the slide plate 2 from flipping over when the chip is moved or washed by water.
[0032] By utilizing the precise fit between the push plate 4 and the base 1, the gap size is controlled within 0.05mm. The push plate 4 is pushed horizontally by manually rotating the screw 6. After being pushed to the ideal position, the screw 6 and the threaded hole of the base 1 are designed to fix the position of the push plate 4, preventing the slider from being washed away by the water flow.
[0033] This is a universal device that utilizes precise dimensional design and a simple structural design to adapt to multiple chip sizes. It is compatible with the vast majority of automotive-grade chips currently available.
[0034] Specific usage method of this utility model:
[0035] 1. Replace the appropriate slide plate according to the chip size, and tighten the pressure plate 7 with the nut. Place the base 1 flat on the glass panel in the water tank of the ultrasonic equipment, and position the lead screw 6 facing the inside of the water tank (generally, the space on the outside is limited and inconvenient to operate), and move all the slide plates 2 to one side of the push plate 4.
[0036] 2. Place the chips in their assigned positions along the direction of slide 2, according to their numerical order (e.g., ...). Figure 3 , Figure 4 Then, align the direction of the chip PIN pins with the sliding direction of slide plate 2. Gently push both sides of slide plate 2 horizontally along the guide rail structure; the pushing force should be less than 1N after encountering resistance. Complete the chip placement process according to this requirement.
[0037] 3. Install lead screw 6 until push plate 4 is slightly obstructed. The torque of lead screw 6 should be less than 1 Nm to prevent damage to the chip package during the process.
[0038] 4. Rinse the chip surface with a water bottle to remove air bubbles.
[0039] 5. Rotate the lead screw counterclockwise by 45° to loosen the clamping force of the push plate 4 on the slide plate 2, allowing the chip to move freely in the direction of the slider.
[0040] 6. Move base 1 horizontally to gather all the chips to one side, at which point all the chips are neatly arranged.
[0041] 7. First lift the base 1 from the side of the lead screw 6, then remove the base 1 to complete all the arrangement work.
Claims
1. A universal device for chip-assisted alignment using ultrasonic scanning, comprising a base, a sliding plate, a push plate, and a push rod, characterized in that: The base (1) is a frame structure. Several slide plates (2) are arranged side by side inside the base (1). The left and right ends of the slide plates (2) are slidably connected to the left and right sides of the base (1) through sliders (3). A push plate (4) is provided on the front side of the slide plates (2). The other side of the push plate (4) is connected to the screw rod (6) through the screw rod assembly. Pressure plates (7) are connected above the left and right sides of the base (1).
2. The universal chip-assisted alignment device for ultrasonic scanning according to claim 1, characterized in that: The base (1) is a rectangular frame structure. The height of the crossbeams on the left and right sides of the base (1) is lower than that of the crossbeams on the front and rear sides of the base (1). The crossbeams on the left and right sides of the base (1) are guide rail structures.
3. The universal chip-assisted alignment device for ultrasonic scanning according to claim 1, characterized in that: The slider (3) is an L-shaped structure. One end of the slider (3) is connected to the end of the slide plate (2). The right-angle bend of the slider (3) is supported on the crossbeams on the left and right sides of the base (1).
4. A universal chip-assisted alignment device for ultrasonic scanning according to claim 1, characterized in that: The push plate (4) is a rectangular panel structure. The bottom of the left and right sides of the push plate (4) is provided with grooves respectively. The grooves on the left and right sides of the push plate (4) are respectively mounted on the crossbeams on the left and right sides of the base (1).
5. A universal chip-assisted alignment device for ultrasonic scanning according to claim 1, characterized in that: The lead screw assembly includes a push block and a lead screw nut. The push block (5) has a U-shaped structure. The middle part of the push block (5) is provided with a lead screw nut connected to one end of the lead screw (6). The two forked ends of the push block (5) abut against the push plate (4).
6. A universal chip-assisted alignment device for ultrasonic scanning according to claim 1, characterized in that: One end of the lead screw (6) is located inside the base (1), and the other end of the lead screw (6) passes through the base (1) and is located on the outside of the base (1).
7. A universal chip-assisted alignment device for ultrasonic scanning according to claim 1, characterized in that: The pressure plate (7) is a rectangular strip structure. One end of the pressure plate (7) is provided with a round hole, and the other end of the pressure plate (7) is provided with a U-shaped groove.