Display module and electronic device

Abstract

The application provides a display module and an electronic device, and relates to the technical field of display. The display module comprises a cover plate, a display panel, a protective film and an ink layer. The display panel has a non-display area. The display panel and the protective film are located on two sides of the cover plate along the thickness direction of the display module. The protective film comprises a base layer and a first adhesive layer arranged along the thickness direction of the display module. The base layer is located on the side of the first adhesive layer away from the cover plate. The projection of the ink layer along the thickness direction of the display module is located in the non-display area. The ink layer is arranged between the first adhesive layer and the cover plate along the thickness direction of the display module. The ink layer is connected with the cover plate and the first adhesive layer. The base layer is fixed to the surface of the cover plate through the first adhesive layer. The first adhesive layer of the protective film can eliminate the height difference caused by the ink layer by using its own thickness, thereby achieving the thickness reduction and weight reduction of the display module, and further facilitating the thin and light design of the electronic device and improving the experience of the user.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display module and electronic device. Background Technology

[0002] Electronic devices include display modules, which are used to display image or video information for users to view. Currently, display modules suffer from excessive thickness and weight, hindering the design of thinner and lighter electronic devices and thus impacting the user experience. Utility Model Content

[0003] The purpose of this application is to provide a display module and electronic device to solve the problems of excessive thickness and weight of display modules in the prior art.

[0004] In a first aspect, embodiments of this application provide a display module, including a cover plate, a display panel, a protective film, and an ink layer. The display panel has a non-display area. Along the thickness direction of the display module, the display panel and the protective film are located on opposite sides of the cover plate. The protective film includes a base layer arranged along the thickness direction of the display module and a first adhesive layer. The base layer is located on the side of the first adhesive layer away from the cover plate. The projection of the ink layer along the thickness direction of the display module is located in the non-display area. The ink layer is disposed between the first adhesive layer and the cover plate along the thickness direction of the display module. The ink layer is connected to the cover plate and the first adhesive layer. The base layer is fixed to the surface of the cover plate through the first adhesive layer.

[0005] To meet the adhesion requirements of the protective film, the first adhesive layer is typically quite thick. This allows the first adhesive layer to directly fill the height difference caused by the ink layer using its own thickness. In other words, the first adhesive layer does not need to be thickened further to eliminate the height difference caused by the ink layer. The display panel and the cover plate can be connected through the second adhesive layer. In this embodiment, the first adhesive layer of the protective film is used to eliminate the height difference caused by the ink layer. This eliminates the need for the second adhesive layer, which is used to connect to the display module, to increase its own thickness to eliminate the height difference caused by the ink layer. This achieves a reduction in the thickness and weight of the second adhesive layer, thereby achieving a reduction in the thickness and weight of the display module. This, in turn, facilitates the thinner and lighter design of electronic devices and improves the user experience.

[0006] In one possible implementation, the display module further includes a first hardened coating. Along the thickness direction of the display module, the first hardened coating is located between the first adhesive layer and the cover plate, and the first hardened coating is connected to the first adhesive layer and the cover plate. Along the thickness direction of the display module, the ink layer is located between the cover plate and the first hardened coating, and the ink layer is connected to the first hardened coating and the cover plate.

[0007] Applying a first hardened coating increases the surface hardness of the cover plate, giving it excellent wear resistance and mechanical properties. It also reduces the likelihood of scratches or abrasions, thus extending the lifespan of the display module. The first hardened coating has a larger water droplet angle, giving it good hydrophobicity. This improves the cover plate's resistance to dirt and reduces the likelihood of fingerprints, water stains, oil, and other contaminants adhering to its surface, thereby enhancing user experience.

[0008] In one possible implementation, the ink layer protrudes from the surface of the cover plate, the first hardened coating has a first portion and a second portion, the first portion covering the ink layer and the second portion covering the cover plate, the first adhesive layer includes a third portion and a fourth portion, the third portion covering the first portion and the fourth portion covering the second portion, and the surface of the first adhesive layer opposite to the first hardened coating is planar.

[0009] The first hardened coating simultaneously covers both the ink layer and the cover plate, effectively improving the surface hardness of the cover plate to extend the service life of the display module. The surface of the first adhesive layer opposite to the first hardened coating is flat, providing a smooth contact interface for the base layer of the protective film, improving the mechanical and optical properties of the protective film, thereby enhancing the reliability of the display module.

[0010] In one possible implementation, the first portion has the same thickness as the second portion, and the fourth portion has a greater thickness than the third portion.

[0011] The fact that the first and second parts have the same thickness ensures that the first hardened coating is a film layer of uniform thickness, thereby improving the reliability of the first hardened coating and facilitating the production and fabrication of the display module. The fourth part has a greater thickness than the third part, allowing the first adhesive layer to eliminate the height difference between the first and second parts, thus ensuring the mechanical properties and display effect of the display module.

[0012] In one possible implementation, the thickness D2 of the first hardened coating satisfies: 5um ≤ D2 ≤ 10um.

[0013] By limiting the thickness of the first hardened coating, it is beneficial to reduce the possibility of warping of the first hardened coating while achieving a thinner and lighter design for electronic devices, thereby improving the reliability of the first hardened coating and extending the service life of the display module.

[0014] In one possible implementation, the display module includes a first hardened coating located between the first adhesive layer and the cover plate along the thickness direction of the display module. The first hardened coating is connected to the cover plate and the first adhesive layer. The ink layer surrounds the first hardened coating, and the inner peripheral wall of the ink layer is connected to the outer peripheral wall of the first hardened coating.

[0015] A portion of the first adhesive layer is connected to the cover plate via the first hardened coating, while another portion is connected to the cover plate via the ink layer. The roughness of the ink layer is greater than that of the first hardened coating, resulting in a stronger bond between the ink layer and the first adhesive layer. This means that the connection between the ink layer and the first adhesive layer is more stable and reliable, thereby improving the stability and reliability of the connection between the protective film and the cover plate. This reduces the possibility of the protective film partially or completely detaching from the cover plate after repeated bending of the display module, thus improving the reliability of the display module and facilitating the normal use of electronic devices.

[0016] In one possible implementation, the thickness of the ink layer is the same as the thickness of the first hardened coating.

[0017] The above design eliminates the height difference between the ink layer and the first hardened coating, thus eliminating the need for the first adhesive layer to fill the step difference. This reduces the thickness of the first adhesive layer, enabling a thinner and lighter display module. Simultaneously, it reduces the possibility of the ink layer flowing upwards onto the first hardened coating during display module manufacturing, thereby preventing either ink layer from covering the first hardened coating or the first hardened coating from flowing upwards onto the ink layer. This ensures a stable and reliable connection between the protective film and the cover plate, while also guaranteeing the display effect of the display module.

[0018] In one possible implementation, the projection of the ink layer along the thickness direction of the display module covers the edges around the cover plate.

[0019] With the ink layer obscuring the view, users can only see the content displayed in the designated display area, thus improving the display effect of the display module and enhancing the user experience. At the same time, the ink layer also acts as a seal at the edges of the cover plate, reducing the possibility of moisture, dust, and other impurities entering the display module, thereby ensuring its normal operation.

[0020] In one possible implementation, the thickness D1 of the ink layer satisfies: 2um ≤ D1 ≤ 5um.

[0021] Limiting the thickness of the ink layer helps to improve the reliability of the ink layer and enhance the display effect of the display module while achieving a thinner and lighter design for electronic devices.

[0022] In one possible implementation, along the thickness direction of the display module, a second adhesive layer is provided on the side of the cover plate away from the protective film. The cover plate is connected to the display panel through the second adhesive layer, and the thickness D3 of the second adhesive layer satisfies: 5um≤D3≤25um.

[0023] By limiting the thickness of the second adhesive layer, the bonding requirements of the second adhesive layer can be guaranteed while achieving a thinner and lighter design for electronic devices, thereby improving the stability and reliability of the connection between the cover plate and the display panel.

[0024] In one possible implementation, the first adhesive layer is an optically transparent adhesive layer, or the first adhesive layer includes an optically transparent adhesive layer and a functional layer.

[0025] The first adhesive layer is an optically transparent adhesive layer, ensuring the display effect of the display module while improving its mechanical properties and reliability. The functional layer can be a silicone layer, which provides cushioning, shock absorption, dust and water resistance, and adhesion. The silicone layer improves the fit between the protective film and the cover plate, thus enhancing the reliability of the protective film. Alternatively, the functional layer can be a thermoplastic polyurethane elastomer layer, which provides cushioning, shock absorption, impact resistance, and support, giving the protective film good bending and impact resistance, further improving its reliability.

[0026] Secondly, embodiments of this application provide a display module, including a cover plate, a display panel, a protective film, an ink layer, and a first hardened coating. The display panel has a non-display area. Along the thickness direction of the display module, the display panel and the protective film are located on opposite sides of the cover plate. The protective film includes a base layer arranged along the thickness direction of the display module and a first adhesive layer. The base layer is located on the side of the first adhesive layer away from the cover plate. The base layer is fixed to the surface of the cover plate by the first adhesive layer. Along the thickness direction of the display module, the first hardened coating is located between the first adhesive layer and the cover plate. The first hardened coating is connected to the cover plate and the first adhesive layer. The projection of the ink layer along the thickness direction of the display module is located in the non-display area. The ink layer surrounds the first hardened coating, and the inner peripheral wall of the ink layer is connected to the outer peripheral wall of the first hardened coating.

[0027] A portion of the first adhesive layer is connected to the cover plate via the first hardened coating, while another portion is connected to the cover plate via the ink layer. The roughness of the ink layer is greater than that of the first hardened coating, resulting in a stronger bond between the ink layer and the first adhesive layer. This means that the connection between the ink layer and the first adhesive layer is more stable and reliable, thereby improving the stability and reliability of the connection between the protective film and the cover plate. This reduces the possibility of the protective film partially or completely detaching from the cover plate after repeated bending of the display module, thus improving the reliability of the display module and facilitating the normal use of electronic devices.

[0028] In one possible implementation, the ink layer is disposed between the first adhesive layer and the cover plate along the thickness direction of the display module, and the ink layer is connected to the cover plate and the first adhesive layer.

[0029] By using the first adhesive layer of the protective film to eliminate the height difference caused by the ink layer, the second adhesive layer used to connect with the display module no longer needs to increase its own thickness to eliminate the height difference caused by the ink layer. This achieves a reduction in the thickness and weight of the second adhesive layer, thereby achieving a reduction in the thickness and weight of the display module. This, in turn, facilitates the thinner and lighter design of electronic devices and improves the user experience.

[0030] In one possible implementation, the projection of the ink layer along the thickness direction of the display module covers the edges around the cover plate.

[0031] With the ink layer obscuring the view, users can only see the content displayed in the designated display area, thus improving the display effect of the display module and enhancing the user experience. At the same time, the ink layer also acts as a seal at the edges of the cover plate, reducing the possibility of moisture, dust, and other impurities entering the display module, thereby ensuring its normal operation.

[0032] In one possible implementation, the thickness of the ink layer is the same as the thickness of the first hardened coating.

[0033] The above design eliminates the height difference between the ink layer and the first hardened coating, thus eliminating the need for the first adhesive layer to fill the step difference. This reduces the thickness of the first adhesive layer, enabling a thinner and lighter display module. Simultaneously, it reduces the possibility of the ink layer flowing upwards onto the first hardened coating during display module manufacturing, thereby preventing either ink layer from covering the first hardened coating or the first hardened coating from flowing upwards onto the ink layer. This ensures a stable and reliable connection between the protective film and the cover plate, while also guaranteeing the display effect of the display module.

[0034] In one possible implementation, along the thickness direction of the display module, a second adhesive layer is provided on the side of the cover plate away from the protective film. The cover plate is connected to the display panel through the second adhesive layer, and the thickness D3 of the second adhesive layer satisfies: 5um≤D3≤25um.

[0035] By limiting the thickness of the second adhesive layer, the bonding requirements of the second adhesive layer can be guaranteed while achieving a thinner and lighter design for electronic devices, thereby improving the stability and reliability of the connection between the cover plate and the display panel.

[0036] In one possible implementation, the first adhesive layer is an optically transparent adhesive layer, or the first adhesive layer includes an optically transparent adhesive layer and a functional layer.

[0037] The first adhesive layer is an optically transparent adhesive layer, ensuring the display effect of the display module while improving its mechanical properties and reliability. The functional layer can be a silicone layer, which provides cushioning, shock absorption, dust and water resistance, and adhesion. The silicone layer improves the fit between the protective film and the cover plate, thus enhancing the reliability of the protective film. Alternatively, the functional layer can be a thermoplastic polyurethane elastomer layer, which provides cushioning, shock absorption, impact resistance, and support, giving the protective film good bending and impact resistance, further improving its reliability.

[0038] In one possible implementation, the thickness D1 of the ink layer satisfies: 2um ≤ D1 ≤ 5um.

[0039] Limiting the thickness of the ink layer helps to improve the reliability of the ink layer and enhance the display effect of the display module while achieving a thinner and lighter design for electronic devices.

[0040] In one possible implementation, the thickness D2 of the first hardened coating satisfies: 5um ≤ D2 ≤ 10um.

[0041] By limiting the thickness of the first hardened coating, it is beneficial to reduce the possibility of warping of the first hardened coating while achieving a thinner and lighter design for electronic devices, thereby improving the reliability of the first hardened coating and extending the service life of the display module.

[0042] Thirdly, embodiments of this application provide an electronic device, including a housing and a display module, wherein the display module is mounted on the housing, and the display module is the aforementioned display module.

[0043] The display module can achieve the aforementioned technical effects, therefore electronic devices with this display module can also achieve the aforementioned technical effects, which will not be elaborated further here. By setting up the aforementioned display module, it is beneficial to achieve a thinner and lighter design for electronic devices, thereby improving the user experience.

[0044] In one possible implementation, the housing includes a first housing and a second housing rotatably connected to the first housing, the display module being connected to one side of the first housing and the second housing, and the display module being a flexible display module.

[0045] The electronic device can be a foldable electronic device. By setting the above-mentioned display module, the electronic device can be made thinner and lighter, while improving its reliability and reducing the possibility of the protective film of the display module falling off after multiple folds.

[0046] It should be understood that the above general description and the following detailed description are merely exemplary and do not limit this application. Attached Figure Description

[0047] Figure 1 A schematic diagram of an electronic device provided in an embodiment of this application in its unfolded state;

[0048] Figure 2 This is a schematic diagram of an electronic device in a first folded state according to an embodiment of this application;

[0049] Figure 3 This is a schematic diagram of an electronic device in a second folded state according to an embodiment of this application;

[0050] Figure 4 This is a schematic diagram of a display module in one embodiment of this application;

[0051] Figure 5 This is a schematic diagram of a display module in another embodiment of this application;

[0052] Figure 6 This is a schematic diagram of a display module in another embodiment of this application;

[0053] Figure 7 This is a schematic diagram showing the position of the ink layer in the display module according to one embodiment of this application;

[0054] Figure 8 This is a schematic diagram showing the position of the ink layer in the display module according to another embodiment of this application;

[0055] Figure 9 This is a schematic diagram of an embodiment of the present application showing an ink layer disposed on the first surface of a cover plate;

[0056] Figure 10This is a schematic diagram of the ink layer structure in one embodiment of this application;

[0057] Figure 11 This is a schematic diagram of an embodiment of the present application showing an ink layer disposed on the second surface of a cover plate;

[0058] Figure 12 This is a schematic diagram of a display module in another embodiment of this application;

[0059] Figure 13 This is a schematic diagram of a display module in another embodiment of this application;

[0060] Figure 14 This is a schematic diagram of a display module in another embodiment of this application;

[0061] Figure 15 This is a schematic diagram of a display module in another embodiment of this application.

[0062] Figure label:

[0063] 100 - Electronic device; 10 - Display module; 11 - Cover plate; 11a - First surface; 11b - Second surface; 12 - Protective film; 121 - Base layer; 122 - First adhesive layer; 123 - Optical coating; 124 - Second hardened coating; 13 - Ink layer; 13a - Third surface; 13b - Fourth surface; 131 - First ink portion; 132 - Second ink portion; 133 - Second recessed portion; 14 - First hardened coating; 141 - First part; 142 - Second part; 15 - Second adhesive layer; 151 - Third part; 152 - Fourth part; 16 - Display panel; 17 - Display area; 18 - Camera cutout; 191 - First contact surface; 192 - Second contact surface; 193 - First recessed portion; 194 - Third recessed portion; 20 - First housing; 30 - Second housing.

[0064] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. Detailed Implementation

[0065] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0066] In the description of this application, unless otherwise expressly specified and limited, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance; unless otherwise specified or explained, the term "multiple" refers to two or more; the terms "connected," "fixed," etc., should be interpreted broadly. For example, "connected" can be a fixed connection, a detachable connection, an integral connection, or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0067] In the description of this specification, it should be understood that the directional terms such as "upper" and "lower" used in the embodiments of this application are used to describe the angles shown in the accompanying drawings and should not be construed as limiting the embodiments of this application. Furthermore, in the context, it should also be understood that when it is mentioned that an element is connected "upper" or "lower" to another element, it can be directly connected to the other element "upper" or "lower," or indirectly connected to the other element "upper" or "lower" through an intermediate element.

[0068] Currently, display modules in electronic devices are too thick and too heavy, which hinders the design of thinner and lighter electronic devices and thus affects the user experience.

[0069] This application provides a display module and an electronic device. The electronic device includes the display module and includes, but is not limited to, handheld devices, in-vehicle devices, wearable devices, etc. For example, the electronic device can be a smartphone, tablet computer, laptop computer, in-vehicle computer, smart home appliance, and other electronic devices with screen display function.

[0070] The following explanation uses a foldable mobile phone as an example.

[0071] like Figure 1 As shown, Figure 1This is a schematic diagram of an electronic device 100 in an unfolded state according to an embodiment of this application. The electronic device 100 includes a display module 10, a first housing 20, and a second housing 30. The first housing 20 is rotatable relative to the second housing 30 to enable the electronic device 100 to unfold and fold. The display module 10 is located on one side of the first housing 20 and the second housing 30, and is connected to the first housing 20 and the second housing 30 respectively. The display module 10 can be a flexible display module, which can unfold or fold with the rotation of the first housing 20 and the second housing 30. For example, when the electronic device 100 is in the unfolded state, the display module 10 is also in the unfolded state. Specifically, when the electronic device 100 is in the unfolded state, the first housing 20 and the second housing 30 are approximately located in the same plane. At this time, the display module 10 can be roughly unfolded into a plane, thereby giving the display module 10 a larger area to provide users with a clearer picture, and also facilitating users to perform actions such as clicking, swiping, or writing, thereby improving the user experience.

[0072] The first housing 20 and the second housing 30 mentioned above can be the mid-frame structure of the electronic device 100. For example, the first housing 20 can be the main mid-frame of the electronic device 100, and the second housing 30 can be the secondary mid-frame of the electronic device 100. The first housing 20 and the second housing 30 are used to install the display module 10 and components of the electronic device 100 such as batteries, circuit boards, cameras, headphones, earpieces, buttons, and batteries (not shown in the figure).

[0073] The first housing 20 and the second housing 30 can be along a first direction (i.e. Figure 1 Folding is performed in the direction shown (A direction). The first direction can be understood as the direction in which the electronic device 100 is folded inward, so that the electronic device 100 switches from the unfolded state to the first folded state (the first folded state is the state of the electronic device 100 after folding inward).

[0074] like Figure 2 As shown, Figure 2 This is a schematic diagram of an electronic device 100 in a first folded state according to an embodiment of this application. In the first folded state, the display module 10 is located within the space enclosed by the folded first housing 20 and second housing 30. At this time, the display module 10 is not exposed, and the user cannot operate the display module 10. The electronic device 100 in the first folded state is small in size, making it easy to store and carry.

[0075] In some embodiments, the first housing 20 and the second housing 30 may be along a second direction (i.e. Figure 1The first direction (as shown in direction B) is used for folding. The second direction can be understood as the direction in which the electronic device 100 is folded outward, so that the electronic device 100 switches from the unfolded state to the second folded state (the second folded state is the state of the electronic device 100 after being folded outward). The first direction and the second direction are opposite directions.

[0076] like Figure 3 As shown, Figure 3 This is a schematic diagram of the electronic device 100 in a second folded state according to an embodiment of this application. In the second folded state, the display module 10 is exposed on the outside of the first housing 20 and the second housing 30, that is, the display module 10 can be regarded as the outer surface of the electronic device 100, so as to facilitate viewing or operation by the user. The electronic device 100 in the second folded state is smaller in size, making it easier to store and carry.

[0077] The electronic device can be an inward-folding phone, meaning it can switch between an unfolded state and a first folded state; or, it can be an outward-folding phone, meaning it can switch between an unfolded state and a second folded state; or, it can be a phone that has both outward-folding and inward-folding functions, meaning it can switch between an unfolded state, a first folded state, and a second folded state.

[0078] like Figure 4 As shown, Figure 4 This is a schematic diagram of a display module 10 in one embodiment of this application. The display module 10 includes a cover plate 11, a protective film 12, and a display panel 16. The display panel 16 can be, but is not limited to, an organic light-emitting diode (OLED) display, an active-matrix organic light-emitting diode (AMOLED) display, a mini organic light-emitting diode (MLED) display, a micro organic light-emitting diode (MOLED) display, or a micro organic light-emitting diode (MOLED) display, etc.

[0079] Along the thickness direction Z of the display module 10, the cover plate 11 is located on one side of the display panel 16. The cover plate 11 can be connected to the display panel 16 through a second adhesive layer 15, which can be an optically clear adhesive (OCA) layer. The cover plate 11 protects the display panel 16, reducing the possibility of scratches or impacts to the display panel 16, thereby extending the service life of the display panel 16 and ensuring its normal use, thus improving the reliability of the display module 10.

[0080] Along the thickness direction Z of the display module 10, the protective film 12 is located on the side of the cover plate 11 away from the display panel 16, that is, along the thickness direction Z of the display module 10, the protective film 12 is disposed on the upper surface of the cover plate 11. The protective film 12 can protect and support the cover plate 11, and help improve the display effect of the display module 10, thereby improving the reliability of the display module 10.

[0081] The protective film 12 includes a base layer 121 arranged along the thickness direction Z of the display module 10 and a first adhesive layer 122. The base layer 121 is located on the side of the first adhesive layer 122 away from the cover plate 11. The base layer 121 is fixed to the upper surface of the cover plate 11 by the first adhesive layer 122. The first adhesive layer 122 can be a single-layer structure, specifically an optically transparent adhesive layer. The base layer 121 can be a polyethylene terephthalate (PET) layer.

[0082] The first adhesive layer can also be a composite structure, that is, the first adhesive layer has a multi-layer structure, which may include an optically transparent adhesive layer and a functional layer. For example, in some embodiments, the first adhesive layer may include an optically transparent adhesive layer and a silicone layer arranged along the thickness direction of the display module. The silicone layer, as a functional layer, can play the role of buffering and shock absorption, dust and water protection, and adhesion. The silicone layer can improve the adhesion between the protective film and the cover plate, thereby improving the reliability of the protective film.

[0083] In other embodiments, the first adhesive layer may include an optically transparent adhesive layer and a thermoplastic polyurethane elastomer (TPU) layer arranged along the thickness direction of the display module. The optically transparent adhesive layer may be located on both sides of the thermoplastic polyurethane elastomer layer to play an adhesive role. The thermoplastic polyurethane elastomer layer, as a functional layer, can play a role in buffering and shock absorption, impact resistance and support, so that the protective film has good bending resistance and impact resistance, and improves the reliability of the protective film.

[0084] like Figure 5 As shown, Figure 5This is a schematic diagram of a display module 10 in another embodiment of this application. The protective film 12 may further include an optical coating 123 and a second hardened coating 124. Along the thickness direction Z of the display module 10, the second hardened coating 124 may be located between the base layer 121 and the optical coating 123. The optical coating 123 may include an anti-reflective coating and / or an anti-glare coating. The optical coating 123 can reduce light reflection and improve the light transmittance of the protective film 12, thereby enhancing the display clarity of the display module 10. The second hardened coating 124 can increase the hardness of the protective film 12 and play a role in preventing scratches and wear, thereby extending the service life of the protective film 12.

[0085] The cover plate described above can be a single-layer structure, for example, a single layer of transparent polyimide (CPI) or a single layer of ultrathin glass (UTG). Alternatively, the cover plate can be a composite structure, for example, the cover plate is composed of a transparent polyimide layer and a polyethylene terephthalate layer, or the cover plate 11 is composed of an ultrathin glass layer and a polyethylene terephthalate layer.

[0086] like Figure 6 As shown, Figure 6 This is a schematic diagram of a display module 10 in another embodiment of this application. The display module 10 further includes an ink layer 13 and a first hardened coating layer 14. Along the thickness direction Z of the display module 10, the first hardened coating layer 14 is located on the side of the cover plate 11 near the protective film 12, and the first hardened coating layer 14 is connected to the cover plate 11 and the first adhesive layer 122. The ink layer 13 may be located on the side of the cover plate 11 away from the protective film 12, and the ink layer 13 is connected to the cover plate 11 and the second adhesive layer 15.

[0087] The first hardened coating 14 enhances the surface hardness of the cover plate 11, giving it good wear resistance, improving its mechanical properties, and reducing the likelihood of scratches or abrasions, thus extending the service life of the display module 10. The water droplet angle is an important indicator for measuring the hydrophobicity of a material surface. The first hardened coating 14 has a large water droplet angle, giving it good hydrophobicity, thereby improving the cover plate 11's resistance to dirt and reducing the possibility of fingerprints, water stains, oil stains, and other contaminants adhering to its surface, thus benefiting user experience.

[0088] The display panel 16 includes a display area and a non-display area. The display area is used to display visual content such as images and text, while the non-display area is the area on the display panel 16 other than the display area. The non-display area can be used to arrange components such as the driving circuit, ribbon cable interface, and chips of the display module 10 (not shown in the figure). The projection of the ink layer 13 along the thickness direction Z of the display module 10 is located in the non-display area, and the projection of the ink layer 13 along the thickness direction Z of the display module 10 covers the edges of the cover plate 11. That is to say, the non-display area can be located at the edges of the display panel 16.

[0089] like Figure 7 As shown, Figure 7 This is a schematic diagram showing the position of the ink layer 13 in the display module 10 according to one embodiment of this application. The ink layer 13 can be disposed at the edges around the display module 10, combined with... Figure 6 As shown, the projection of the ink layer 13 along the thickness direction 10 of the display module 10 covers the edges of the cover plate 11. This means the ink layer 13 can be located at the edges of the cover plate 11, effectively shielding the non-display area located at the edge of the display panel 16. In other words, the ink layer 13 can be positioned around the display area 17 of the display panel 16, forming a black border around the display module 10. Under the shielding effect of the ink layer 13, the user can only see the content displayed in the display area 17, thus improving the display effect of the display module 10 and enhancing the user experience. Simultaneously, the ink layer 13 also acts as a seal at the edges of the cover plate 11, reducing the possibility of moisture, dust, and other impurities entering the display module 10, thereby ensuring the normal operation of the display module 10.

[0090] Besides the edges of the display module, the ink layer can also be applied to other non-display areas. For example... Figure 8 As shown, Figure 8 This is a schematic diagram showing the position of the ink layer 13 in the display module 10 in another embodiment of this application. The ink layer 13 can be disposed in the surrounding area of ​​the camera cutout 18 to reduce light leakage at the camera position and improve the shooting effect of the camera (not shown in the figure).

[0091] The ink layer configuration introduces a height difference (i.e., step difference) issue in the thickness direction of the display module, for example, as... Figure 9 As shown, Figure 9This is a schematic diagram of an embodiment of the present application showing an ink layer 13 disposed on a first surface 11a of a cover plate 11. The cover plate 11 has a first surface 11a, and the ink layer 13 has a third surface 13a. The ink layer 13 can be disposed on the first surface 11a. Because the ink layer 13 has a certain thickness, it protrudes from the first surface 11a of the cover plate 11, thus creating a height difference H1 between the third surface 13a of the ink layer 13 and the first surface 11a of the cover plate 11. The first surface 11a and the third surface 13a together form a layer for bonding with a second adhesive layer 15 (such as...). Figure 6 As shown, the first contact surface 191 is uneven because there is a height difference H1 between the third surface 13a and the first surface 11a. In other words, the first contact surface 191 has a first recess 193 formed by the height difference H1 between the first surface 11a and the third surface 13a.

[0092] When the ink layer forms on the cover plate, there may be height differences between different areas of the ink layer; that is, the ink layer itself may also have height differences (i.e., step differences). For example... Figure 10 As shown, Figure 10 This is a schematic diagram of the partial structure of ink layer 13 in one embodiment of this application. Ink layer 13 includes a first ink portion 131 and a second ink portion 132. Along the thickness direction Z of ink layer 13 (i.e., the height direction of the display module), there is a height difference H2 between the first ink portion 131 and the second ink portion 132, making the third surface 13a of the first ink layer 13 an uneven surface. That is, the third surface 13a has a second recess 133 formed by the height difference H2 between the first ink portion 131 and the second ink portion 132. It can be understood that when the third surface 13a is an uneven surface, the contact surface that contacts the second adhesive layer is also an uneven surface.

[0093] Please continue to refer to this. Figure 6 ,exist Figure 6 In the illustrated embodiment, the ink layer 13 is located on the side of the cover plate 11 near the second adhesive layer 15, and is combined with... Figure 9 As shown, the second adhesive layer 15 contacts the first contact surface 191. Due to the certain fluidity of the second adhesive layer 15, it can fill the first recess 193. That is, the second adhesive layer 15 simultaneously contacts the first surface 11a of the cover plate 11 and the third surface 13a of the ink layer 13, thereby eliminating the height difference between the ink layer 13 and the cover plate 11. Furthermore, the surfaces of the second adhesive layer 15 that are away from the cover plate 11 and the ink layer 13 (such as...) Figure 6As shown, the cover plate 11 is a flat surface, thus providing a flat contact interface for the display panel (not shown in the figure). When the cover plate 11 is bonded to the display panel through the second adhesive layer 15, the flat contact surface provided by the second adhesive layer 15 makes the cover plate 11 and the display panel fit together stably, improving the mechanical and optical performance of the display module 10.

[0094] The principle by which the second adhesive layer eliminates the height difference within the ink layer itself is the same as the principle by which the second adhesive layer eliminates the height difference between the ink layer and the cover plate. Specifically, as... Figure 10 As shown, the second adhesive layer 15 can fill the second recess 133 of the ink layer 13. That is, the second adhesive layer 15 simultaneously contacts the end of the first ink layer 131 and the end of the second ink layer 132 of the ink layer 13. Thus, the second adhesive layer 15 eliminates the height difference between the first ink layer 131 and the second ink layer 132 in the ink layer 13, thereby providing a flat contact interface for the display panel.

[0095] In summary, the second adhesive layer can eliminate the height difference between the ink layer and the cover plate and / or the height difference of the ink layer itself, thus solving the height difference problem in the thickness direction of the display module caused by the ink layer. However, the second adhesive layer fills the aforementioned recessed area with its own thickness, which requires additional thickness, resulting in an increase in the thickness of the second adhesive layer and thus an increase in the overall thickness of the display module. At the same time, as the amount of the second adhesive layer increases, the weight of the display module increases, making it difficult to achieve a thinner and lighter design for electronic devices.

[0096] This application embodiment changes the position of the ink layer in the thickness direction of the display module, placing it on the side of the cover plate closer to the protective film. This eliminates the need for the second adhesive layer to increase its own thickness in order to eliminate the step difference caused by the ink layer, thereby reducing the thickness of the display module and the weight of the display module.

[0097] like Figure 11 As shown, Figure 11 This is a schematic diagram showing an ink layer 13 disposed on the second surface 11b of a cover plate 11 in one embodiment of this application. The position of the ink layer 13 on the cover plate 11 can be located at the edge of the cover plate 11, or it can be located in other non-display areas of the cover plate 11. The following description takes the ink layer 13 located at the edge of the cover plate 11 as an example. The cover plate 11 has a second surface 11b, which is the surface of the cover plate 11 that is opposite to the first surface 11a (e.g., ...). Figure 9The surface of the cover plate 11 is shown. The ink layer 13 has a fourth surface 13b, which can be disposed on the second surface 11b. The ink layer 13 protrudes from the second surface 11b of the cover plate 11, thereby forming a height difference H3 between the fourth surface 13b of the ink layer 13 and the second surface 11b of the cover plate 11. The second surface 11b and the fourth surface 13b together form a second contact surface 192 for contacting the first adhesive layer (not shown) of the protective film. Due to the height difference H3 between the fourth surface 13b and the second surface 11b, the second contact surface 192 is an uneven surface. That is, the second contact surface 192 has a third recess 194 formed by the height difference H3 between the ink layer 13 and the cover plate 11.

[0098] like Figure 12 As shown, Figure 12 This is a schematic diagram of the display module 10 in another embodiment of this application. Along the thickness direction of the display module 10, the display panel 16 and the protective film 12 are located on opposite sides of the cover plate 11. The base layer 121 of the protective film 12 is connected to the cover plate 11 via a first adhesive layer 122. The ink layer 13 is disposed on the side of the cover plate 11 near the base layer 121, that is, the ink layer 13 is disposed along the thickness direction Z of the display module 10 between the first adhesive layer 122 and the cover plate 11. The ink layer 13 is connected to the cover plate 11 and the first adhesive layer 122. The projection of the ink layer 13 along the thickness direction Z of the display module is located in the non-display area of ​​the display panel 16. Please also refer to... Figure 11 Because the first adhesive layer 122 has a certain fluidity, it fills into the third recess 194. The first adhesive layer 122 is simultaneously connected to the fourth surface 13b of the ink layer 13 and the second surface 11b of the cover plate 11. That is, the first adhesive layer 122 can be used to eliminate the height difference between the ink layer 13 and the cover plate 11. At the same time, the surface of the first adhesive layer 122 facing away from the cover plate 11 and the ink layer 13 is flat, so as to provide a flat contact interface for the base layer 121, improve the mechanical and optical properties of the protective film 12, and thus improve the reliability of the display module 10.

[0099] As mentioned above, when the ink layer is formed on the cover plate, there may be a height difference between the ink layers in different areas. In other words, the ink layer itself will also have a height difference. The first adhesive layer can also eliminate the height difference of the ink layer itself. The principle of the first adhesive layer eliminating the height difference of the ink layer itself is the same as the principle of the first adhesive layer eliminating the height difference between the ink layer and the cover plate, which will not be repeated here.

[0100] To meet the adhesion requirements of the protective film, the first adhesive layer is typically quite thick, around 50µm. This allows the first adhesive layer to directly fill the height difference caused by the ink layer using its own thickness. In other words, the first adhesive layer does not need to be additionally thickened to eliminate the height difference caused by the ink layer. Based on this, this embodiment of the application changes the position of the ink layer in the thickness direction of the display module, thereby utilizing the first adhesive layer of the protective film to eliminate the height difference caused by the ink layer. This eliminates the need for the second adhesive layer to increase its own thickness to eliminate the height difference caused by the ink layer, achieving a reduction in the thickness and weight of the second adhesive layer. Consequently, this results in a reduction in the thickness and weight of the display module, which in turn facilitates the thinner and lighter design of electronic devices and improves the user experience.

[0101] In some embodiments, the thickness D3 of the second adhesive layer 15 satisfies: 5um ≤ D3 ≤ 25um. For example, D3 can be 5um, 6um, 8um, 10um, 12um, 14um, 16um, 18um, 20um, 22um, 24um, or 25um, or other values ​​within the above range. Since the second adhesive layer 15 does not need to increase its own thickness to eliminate the step difference of the ink layer 13, the thickness of the second adhesive layer 15 can reach 5um to 25um. This ensures the bonding requirements of the second adhesive layer 15 while achieving a thinner and lighter design of the electronic device 100, and improves the stability and reliability of the connection between the cover plate 11 and the display panel 16.

[0102] like Figure 13 As shown, Figure 13 This is a schematic diagram of the display module 10 in another embodiment of this application. Along the thickness direction Z of the display module 10, a first hardened coating 14 is located between the first adhesive layer 122 and the cover plate 11, and the first hardened coating 14 is connected to the first adhesive layer 122 and the cover plate 11. An ink layer 13 is located between the cover plate 11 and the first hardened coating 14, and the ink layer 13 is connected to the first hardened coating 14 and the cover plate 11. That is, the first hardened coating 14 covers the ink layer 13 and the cover plate 11. The first adhesive layer 122 is located on the side of the first hardened coating 14 away from the ink layer 13 and is connected to the first hardened coating 14, thereby realizing the connection between the protective film 12 and the cover plate 11. The ink layer 13 protrudes from the surface of the cover plate 11. The first hardened coating 14 has a first portion 141 and a second portion 142. The first portion 141 covers the ink layer 13, and the second portion 142 covers the cover plate 11. The first adhesive layer 122 includes a third portion 151 and a fourth portion 152, the third portion 151 covering the first portion 141, the fourth portion 152 covering the second portion 142, and the surface of the first adhesive layer 122 facing away from the first hardened coating 14 is planar.

[0103] Because the ink layer 13 protrudes from the surface of the cover plate 11, there is a height difference between the ink layer 13 and the cover plate 11 (e.g., Figure 11 As shown, when the first hardened coating 14 covers the ink layer 13 and the cover plate 11, there is a corresponding height difference between the first portion 141 and the second portion 142 of the first hardened coating 14. As mentioned above, the first adhesive layer 122 has a certain fluidity, so the first adhesive layer 122 can eliminate the height difference between the first portion 141 and the second portion 142, while ensuring that the surface of the first adhesive layer 122 facing away from the first hardened coating 14 is flat, so as to ensure the mechanical and optical properties of the protective film 12.

[0104] In some embodiments, the first portion 141 and the second portion 142 of the first hardened coating 14 have the same thickness, and the fourth portion 152 of the first adhesive layer 122 has a greater thickness than the third portion 151. The equal thickness of the first portion 141 and the second portion 142 makes the first hardened coating 14 a film layer of uniform thickness, thereby improving the reliability of the first hardened coating 14 and facilitating the production of the display module 10. The greater thickness of the fourth portion 152 allows the first adhesive layer 122 to eliminate the height difference between the first portion 141 and the second portion 142, ensuring the mechanical properties and display effect of the display module 10.

[0105] In the process of manufacturing the display module 10, the ink layer 13 can be printed on the cover plate 11 first, and then a first hardening coating 14 can be applied to the cover plate 11 with the ink layer 13, so that the first hardening coating 14 covers the ink layer 13 and the cover plate 11. In some embodiments, the ink layer 13 can be formed on the cover plate 11 by a roll-to-roll printing process, and the first hardening coating 14 can be formed on the cover plate 11 by a roll-to-roll coating process.

[0106] exist Figure 6 as well as Figure 13 In the illustrated embodiment, the first adhesive layer 122 is in direct contact with the first hardened coating 14 to achieve the connection between the protective film 12 and the cover plate 11. The roughness of the first hardened coating 14 is small, which makes the connection between the first adhesive layer 122 and the first hardened coating 14 less stable. This causes the protective film 12 to easily fall off the cover plate 11 during the folding and unfolding of the electronic device 100, thereby affecting the normal use of the display module 10 and the entire electronic device 100.

[0107] To address the aforementioned issues, this application embodiment improves the stability of the connection between the protective film and the cover plate by changing the connection method between the first adhesive layer and the cover plate.

[0108] like Figure 14 As shown, Figure 14This is a schematic diagram of the display module 10 in another embodiment of this application. Along the thickness direction Z of the display module 10, the first hardened coating 14 is located between the first adhesive layer 122 and the cover plate 11, and the first hardened coating 14 is connected to the cover plate 11 and the first adhesive layer 122. The ink layer 13 is also located between the first adhesive layer 122 and the cover plate 11, and the ink layer 13 is located outside the first hardened coating 14 and connected to the first hardened coating 14. That is to say, the first hardened coating 14 does not cover the ink layer 13 along the thickness direction Z of the display module 10, but rather the ink layer 13 surrounds the first hardened coating 14 along the first direction X, and the inner peripheral wall of the ink layer 13 is connected to the outer peripheral wall of the first hardened coating 14. The first direction X is perpendicular to the thickness direction Z of the display module 10.

[0109] As can be seen from the above, a portion of the first adhesive layer 122 is connected to the cover plate 11 through the first hardened coating 14, and another portion of the first adhesive layer 122 is connected to the cover plate 11 through the ink layer 13. The roughness of the ink layer 13 is greater than that of the first hardened coating 14, resulting in a greater bonding force between the ink layer 13 and the first adhesive layer 122. This means that the stability and reliability of the connection between the ink layer 13 and the first adhesive layer 122 are higher, thereby improving the stability and reliability of the connection between the protective film 12 and the cover plate 11. This reduces the possibility that the protective film 12 may partially or completely detach from the cover plate 11 after multiple bends, thus improving the reliability of the display module 10 and facilitating the normal use of the electronic device 100.

[0110] In the process of preparing the display module 10, the ink layer 13 can be printed on the cover plate 11 first, and then the first hardened coating layer 14 can be applied to the cover plate 11 with the ink layer 13. Alternatively, the first hardened coating layer 14 can be applied to the cover plate 11 first, and then the ink layer 13 can be printed on the cover plate 11 with the first hardened coating layer 14.

[0111] Continue as Figure 14 As shown, in some embodiments, the thickness of the ink layer 13 is the same as the thickness of the first hardened coating 14, so that there is no height difference between the ink layer 13 and the first hardened coating 14. This eliminates the need for the first adhesive layer 122 to fill the height difference, thereby reducing the thickness of the first adhesive layer 122 and achieving a thinner and lighter display module 10. Simultaneously, this reduces the possibility of the ink layer 13 flowing upwards onto the first hardened coating 14 during the manufacturing process of the display module 10, causing the ink layer 13 to cover the first hardened coating 14, or vice versa. This ensures a stable and reliable connection between the protective film 12 and the cover plate 11, while also guaranteeing the display effect of the display module 10.

[0112] like Figure 15As shown, the figure is a schematic diagram of the display module 10 in another embodiment of this application. In some other embodiments, the thickness of the ink layer 13 can be less than the thickness of the first hardened coating 14, so that the ink layer 13 can save space along its own thickness direction Z of the display module 10 while meeting its usage requirements, thereby reducing the thickness of the display module 10, which is conducive to realizing the design of the display module 10 and the electronic device 100 as thinner and lighter.

[0113] In some other embodiments, the thickness of the ink layer may be greater than the thickness of the first hardened coating.

[0114] In some embodiments, the thickness D1 of the ink layer 13 satisfies: 2um ≤ D1 ≤ 5um. For example, D1 can be 2um, 2.5um, 3um, 3.5um, 4um, 4.5um, or 5um, or other values ​​within the above range. By limiting the thickness of the ink layer 13, it is beneficial to achieve a thinner and lighter design for the electronic device 100 while improving the reliability of the ink layer 13 and enhancing the display effect of the display module 10.

[0115] In some embodiments, the thickness D2 of the first hardened coating 14 satisfies: 5µm ≤ D2 ≤ 10µm. For example, D2 can be 5µm, 6µm, 7µm, 8µm, 9µm, or 10µm, or other values ​​within the above range. By limiting the thickness of the first hardened coating 14, it is beneficial to achieve a thinner and lighter design for the electronic device 100 while reducing the possibility of warping of the first hardened coating 14, improving the reliability of the first hardened coating 14, and thus extending the service life of the display module 10.

[0116] In the embodiments of this application, the electronic device described above can also be a candybar phone, and the display module described above can also be a hard screen.

[0117] The above description is merely an optional embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display module, characterized in that, include: Cover plate; A display panel having a non-display area; A protective film is provided along the thickness direction of the display module. The display panel and the protective film are located on both sides of the cover plate. The protective film includes a base layer arranged along the thickness direction of the display module and a first adhesive layer. The base layer is located on the side of the first adhesive layer away from the cover plate. An ink layer, the projection of which along the thickness direction of the display module is located in the non-display area; The ink layer is disposed between the first adhesive layer and the cover plate along the thickness direction of the display module. The ink layer is connected to the cover plate and the first adhesive layer. The base layer is fixed to the surface of the cover plate through the first adhesive layer.

2. The display module according to claim 1, characterized in that, The display module further includes a first hardened coating. Along the thickness direction of the display module, the first hardened coating is located between the first adhesive layer and the cover plate, and the first hardened coating is connected to the first adhesive layer and the cover plate. Along the thickness direction of the display module, the ink layer is located between the cover plate and the first hardened coating, and the ink layer is connected to the first hardened coating and the cover plate.

3. The display module according to claim 2, characterized in that, The ink layer protrudes from the surface of the cover plate, and the first hardened coating has a first portion and a second portion, the first portion covering the ink layer and the second portion covering the cover plate; The first adhesive layer includes a third portion and a fourth portion, the third portion covering the first portion, the fourth portion covering the second portion, and the surface of the first adhesive layer facing away from the first hardened coating is planar.

4. The display module according to claim 3, characterized in that, The first part and the second part have the same thickness, and the fourth part has a greater thickness than the third part.

5. The display module according to claim 1, characterized in that, The display module includes a first hardened coating; Along the thickness direction of the display module, the first hardened coating is located between the first adhesive layer and the cover plate, and the first hardened coating is connected to the cover plate and the first adhesive layer; The ink layer surrounds the first hardened coating, and the inner peripheral wall of the ink layer is connected to the outer peripheral wall of the first hardened coating.

6. The display module according to claim 5, characterized in that, The thickness of the ink layer is the same as the thickness of the first hardened coating.

7. The display module according to any one of claims 1 to 6, characterized in that, The projection of the ink layer along the thickness direction of the display module covers the edges around the cover plate.

8. The display module according to any one of claims 1 to 6, characterized in that, Along the thickness direction of the display module, a second adhesive layer is provided on the side of the cover plate away from the protective film, and the cover plate is connected to the display panel through the second adhesive layer; The thickness D3 of the second adhesive layer satisfies: 5um ≤ D3 ≤ 25um.

9. The display module according to any one of claims 1 to 6, characterized in that, The first adhesive layer is an optically transparent adhesive layer, or; The first adhesive layer includes an optically transparent adhesive layer and a functional layer.

10. An electronic device, characterized in that, include: case; The display module is mounted on the housing, and the display module is the display module according to any one of claims 1 to 9.

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