Display module and display device

Abstract

The application relates to a display module and a display device, wherein a heat dissipation layer located at the back side of a display part comprises a first heat dissipation part and a second heat dissipation part, the elastic modulus of the second heat dissipation part is greater than that of the first heat dissipation part, and the orthographic projection of the second heat dissipation part on the display part at least partially overlaps the orthographic projection of a flexible circuit board on the display part; the second heat dissipation part with a higher elastic modulus is adopted at the position of the heat dissipation layer corresponding to the flexible circuit board, the influence of the pressure of a pressure head on the film layer on the side of the heat dissipation layer far from the flexible circuit board can be reduced, the deformation of the film layer in the binding area can be effectively reduced, and thus the indentation problem caused by the binding process of the flexible circuit board can be improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more particularly to a display module and a display device. Background Technology

[0002] During the bonding process of flexible display modules, a pressure head is usually used to apply pressure to the flexible printed circuit (FPC). However, this pressure can cause stress concentration in the film layers below the bonding area. Since the elastic modulus of film layers such as copper and foam in traditional display module stacks is low, the module in the bonding area is prone to deformation when subjected to pressure, causing deformation of each film layer. This results in differences in light reflection paths, leading to macroscopic imprints. Utility Model Content

[0003] This application provides a display module and display device that can effectively improve the imprint problem caused by the bonding process of flexible circuit boards.

[0004] This application provides a display module, the display module comprising:

[0005] The display panel includes a display section and a mounting section adjacent to the display section, wherein one end of the mounting section away from the display section is bent to the back side of the display section;

[0006] A heat dissipation structure is disposed on the back side of the display unit, the heat dissipation structure including a heat dissipation layer; and

[0007] A flexible circuit board is disposed on the side of the heat dissipation structure away from the display part and is connected to the bonding part;

[0008] The heat dissipation layer includes a first heat dissipation part and a second heat dissipation part adjacent to the first heat dissipation part. The elastic modulus of the second heat dissipation part is greater than that of the first heat dissipation part. The orthographic projection of the second heat dissipation part on the display part at least partially overlaps with the orthographic projection of the flexible circuit board on the display part.

[0009] In some embodiments, the orthographic projection of the flexible circuit board onto the display unit is within the range of the orthographic projection of the second heat dissipation unit onto the display unit.

[0010] In some embodiments, the distance between the edge of the second heat dissipation portion and the edge of the flexible circuit board is greater than or equal to 0.5 mm.

[0011] In some embodiments, the first heat dissipation portion is disposed around the second heat dissipation portion.

[0012] In some embodiments, the distance between the edge of the second heat dissipation portion and the edge of the first heat dissipation portion away from the second heat dissipation portion is greater than or equal to 1 mm.

[0013] In some embodiments, in the thickness direction of the display portion, the thickness of the second heat dissipation portion is equal to the thickness of the first heat dissipation portion.

[0014] In some embodiments, the material of the first heat dissipation part includes copper, and the elastic modulus of the material of the second heat dissipation part is greater than the elastic modulus of copper.

[0015] In some embodiments, the material of the second heat dissipation portion includes stainless steel.

[0016] In some embodiments, the heat dissipation structure further includes:

[0017] The first adhesive layer is disposed on the side of the heat dissipation layer near the display portion;

[0018] A buffer layer is disposed between the heat dissipation layer and the first adhesive layer;

[0019] The display module also includes:

[0020] A backplate is disposed between the display section and the first adhesive layer.

[0021] This application provides a display device, which includes the display module described above.

[0022] This application provides a display module and a display device. The display module of this application has a heat dissipation layer on the side of the display section near the flexible circuit board. The heat dissipation layer includes a first heat dissipation section and a second heat dissipation section adjacent to the first heat dissipation section. The elastic modulus of the second heat dissipation section is greater than that of the first heat dissipation section, and the orthographic projection of the second heat dissipation section at least partially overlaps with the orthographic projection of the flexible circuit board. This application uses the second heat dissipation section to replace part of the first heat dissipation section that originally corresponded to the flexible circuit board. Since the second heat dissipation section has a higher elastic modulus, higher strength, and is less prone to deformation, aligning the second heat dissipation section with the flexible circuit board can reduce the impact of the pressure of the pressure head on the film layer on the side of the flexible circuit board away from the pressure head, effectively reducing the deformation of the film layer in the bonding area, thereby improving the imprint problem caused by the bonding process of the flexible circuit board. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0024] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0025] Figure 1 This is a cross-sectional schematic diagram of a display module provided by existing technology;

[0026] Figure 2 This is a cross-sectional schematic diagram of a display module provided in an embodiment of this application;

[0027] Figure 3 This is a top view schematic diagram of a heat dissipation layer and flexible circuit board of a display module provided in an embodiment of this application.

[0028] Explanation of reference numerals in the attached figures:

[0029] 10-Display module; 101-Pressure head; 100-Display panel; 110-Display section; 120-Bonding section; 200-Heat dissipation structure; 210-Heat dissipation layer; 211-First heat dissipation section; 212-Second heat dissipation section; 220-Buffer layer; 230-First adhesive layer; 300-Flexible circuit board; 310-Components; 410-Second adhesive layer; 420-Third adhesive layer; 430-Fourth adhesive layer; 500-Back plate; 600-Polarizing film; 700-Cover plate. Detailed Implementation

[0030] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0031] Please refer to Figure 1 , Figure 1This is a cross-sectional schematic diagram of a display module provided by the prior art. The display module includes a display panel 100, a heat dissipation structure 200, a flexible circuit board 300, and a backplate 500, among other film layers. The heat dissipation structure 200 is located on the side of the backplate 500 away from the display panel 100 and includes a heat dissipation layer 210, a buffer layer 220, and a first adhesive layer 230 stacked together. The flexible circuit board 300 is bonded to the side of the heat dissipation structure 200 away from the backplate 500. The heat dissipation layer 210 is typically made of copper, and the buffer layer 220 is typically made of foam. The copper layer covers the entire side of the foam layer away from the first adhesive layer 230. During the bonding process of the flexible circuit board 300, a pressure head 101 is required to apply pressure to the flexible circuit board 300 to ensure a stable connection between the flexible circuit board 300 and the module. However, due to the low elastic modulus of materials such as copper and foam, the heat dissipation layer 210, buffer layer 220, first adhesive layer 230, and back plate 500 located below the flexible circuit board 300 are prone to deformation (e.g., ...) during the application of pressure by the pressure head 101. Figure 1 (The area within the dashed line in A) The deformation of these films can cause differences in the light reflection path, which in turn leads to macroscopic imprinting problems.

[0032] To address the aforementioned problems, this application provides a display module 10, please refer to... Figure 2 , Figure 2 This is a cross-sectional schematic diagram of a display module 10 provided in an embodiment of this application.

[0033] Please refer to Figure 2 The display module 10 includes a display panel 100, a heat dissipation structure 200, and a flexible circuit board 300. The display panel 100 includes a display portion 110 and a bonding portion 120 adjacent to the display portion 110. One end of the bonding portion 120 away from the display portion 110 is bent to the back side of the display portion 110. The heat dissipation structure 200 is disposed on the back side of the display portion 110 and includes a heat dissipation layer 210. The flexible circuit board 300 is disposed on the side of the heat dissipation structure 200 away from the display portion 110 and is connected to the bonding portion 120. The heat dissipation layer 210 includes a first heat dissipation portion 211 and a second heat dissipation portion 212 adjacent to the first heat dissipation portion 211. The elastic modulus of the second heat dissipation portion 212 is greater than that of the first heat dissipation portion 211. The orthographic projection of the second heat dissipation portion 212 onto the display portion 110 at least partially overlaps with the orthographic projection of the flexible circuit board 300 onto the display portion 110.

[0034] In this application, the display panel 100 can be a flexible display panel to meet the bendability requirement of the display module 10. The display panel 100 can be, for example, an organic light-emitting diode (OLED) display panel, but is not limited thereto. The display panel 100 includes a display portion 110 and a bonding portion 120. The bonding portion 120 is located on at least one side of the display portion 110, and the display portion 110 and the bonding portion 120 can be an integral structure. The display portion 110 has a light-emitting side for displaying images; the end of the bonding portion 120 away from the display portion 110 is bent to the side of the heat dissipation layer 210 away from the display portion 110 for bonding the flexible circuit board 300. The bonding portion 120 can be fixed to the heat dissipation layer 210 by a second adhesive layer 410.

[0035] In this application, the flexible circuit board 300 is connected to the bonding portion 120 to achieve signal transmission with the display panel 100. The flexible circuit board 300 can be fixed to the side of the heat dissipation layer 210 away from the display portion 110 via a third adhesive layer 420. Furthermore, other components 310, such as integrated circuit (IC) chips, are also bonded to the side of the flexible circuit board 300 away from the heat dissipation layer 210, but are not limited to these.

[0036] In this application, the heat dissipation structure 200 is located on the back side of the display unit 110, which is the side of the display unit 110 away from the light-emitting side. The heat dissipation structure 200 is used to dissipate heat from the display panel 100. The heat dissipation structure 200 includes at least the heat dissipation layer 210, which is the main structure in the heat dissipation structure 200 that plays a major role in heat dissipation. The heat dissipation layer 210 includes a first heat dissipation part 211 and a second heat dissipation part 212. At least a portion of the second heat dissipation part 212 is located within the orthographic projection range of the flexible circuit board 300. For example, the second heat dissipation part 212 at least covers the area of ​​the pressure head applied to the flexible circuit board 300. Because the second heat dissipation part 212 has a higher elastic modulus, its strength is higher than that of the first heat dissipation part 211. Compared to the first heat dissipation part 211, the second heat dissipation part 212 is less prone to deformation. Therefore, by providing the second heat dissipation part 212 in the area where the pressure head is applied to the flexible circuit board 300, the pressure of the pressure head on the deformation of the second heat dissipation part 212 can be reduced. At the same time, since the second heat dissipation part 212 has high strength, it can further protect the film layer on the side of the second heat dissipation part 212 away from the flexible circuit board 300, so as to avoid deformation of the film layer on the side of the second heat dissipation part 212 away from the flexible circuit board 300, thereby improving the imprint problem caused by the bonding process of the flexible circuit board 300.

[0037] The first heat dissipation part 211 can be made of copper, while the second heat dissipation part 212 has a higher elastic modulus than copper. The second heat dissipation part 212 can be made of, for example, stainless steel (SUS), but is not limited to this. Copper has good heat dissipation performance and can be used as the main heat dissipation material of the heat dissipation layer 210. Stainless steel has a higher elastic modulus than copper and is less prone to deformation. It is used as a partial component of the heat dissipation layer 210 at a location corresponding to the flexible circuit board 300 to resist the pressure of the pressure head. In this application, the first heat dissipation part 211 and the second heat dissipation part 212 are combined to form the heat dissipation layer 210, which avoids the problem of imprints while ensuring the overall heat dissipation effect of the heat dissipation layer 210.

[0038] In some embodiments, please refer to Figure 2 The heat dissipation structure 200 further includes a first adhesive layer 230, which is disposed on the side of the heat dissipation layer 210 near the display unit 110. The first adhesive layer 230 serves to bond the upper and lower film layers. The material of the first adhesive layer 230 can be an adhesive mesh (Embo), but is not limited to it. The adhesive mesh can improve heat transfer while providing adhesion.

[0039] In some embodiments, please refer to Figure 2 The heat dissipation structure 200 further includes a buffer layer 220, which is disposed between the heat dissipation layer 210 and the first adhesive layer 230, serving as a buffer and protection layer while also conducting heat. The material of the buffer layer 220 can be foam, but is not limited to it.

[0040] In this application, the heat dissipation structure 200 can be a heat dissipation and buffer composite layer (Super Clean Foam, SCF) composed of the heat dissipation layer 210, the buffer layer 220, and the first adhesive layer 230. The heat dissipation layer 210 includes a first heat dissipation portion 211 and a second heat dissipation portion 212. The first heat dissipation portion 211 is made of copper, and the second heat dissipation portion 212 is made of stainless steel. The buffer layer 220 is made of foam, and the first adhesive layer 230 is made of mesh adhesive. The heat dissipation and buffer composite layer can effectively improve the overall heat dissipation, support, and buffering effect of the heat dissipation structure 200.

[0041] In some embodiments, please refer to Figure 2 In the first direction Z, the thickness of the second heat dissipation part 212 can be equal to the thickness of the first heat dissipation part 211 to ensure the overall surface flatness of the heat dissipation layer 210, which is beneficial to the subsequent film bonding process. Here, the first direction Z is the thickness direction of the display part 110.

[0042] In some embodiments, please refer to Figures 2-3 The orthographic projection of the flexible circuit board 300 on the display unit 110 is within the range of the orthographic projection of the second heat dissipation part 212 on the display unit 110. That is, the second heat dissipation part 212 at least covers the entire flexible circuit board 300, so that the pressure applied to the flexible circuit board 300 by the pressure head will not affect the first heat dissipation part 211. The second heat dissipation part 212 bears the overall pressure of the flexible circuit board 300, further reducing the impact of the pressure applied by the pressure head on the film layer of the second heat dissipation part 212 away from the flexible circuit board 300.

[0043] For further details, please refer to Figures 2-3 The orthographic projection of the second heat dissipation part 212 on the display part 110 can be greater than the orthographic projection of the flexible circuit board 300 on the display part 110. Considering the influence of the bonding tolerance of the flexible display panel 100, the distance d1 between the edge of the second heat dissipation part 212 and the edge of the flexible circuit board 300 is greater than or equal to 0.5mm, so that when the flexible circuit board 300 is misaligned, the side of the flexible display panel 100 close to the display part 110 is always supported by the second heat dissipation part 212.

[0044] In some embodiments, please refer to Figures 2-3 The first heat dissipation part 211 is arranged around the second heat dissipation part 212. Because the second heat dissipation part 212 has a high elastic modulus and high hardness, it is difficult to punch, and is prone to die-cutting defects and edge-gripping problems. For example, stainless steel is difficult to punch during cutting, and burrs, folds, or tears are likely to occur at the edges, leading to difficulties in edge-gripping and poor bonding during film lamination. The first heat dissipation part 211, on the other hand, has a low elastic modulus and is relatively easy to cut with high cutting quality. For example, copper films are usually cut with high quality and are less prone to the problems encountered during stainless steel cutting. Therefore, this application positions the second heat dissipation part 212 in the middle of the first heat dissipation part 211, so that the first heat dissipation part 211 surrounds the second heat dissipation part 212, to avoid the impact of poor edge cutting of the second heat dissipation part 212 on the edge bonding of the film in the display module 10.

[0045] Specifically, the first heat dissipation layer 210 can be formed on the entire surface of the buffer layer 220 firstly. The material of the first heat dissipation layer 210 is metallic copper to ensure the edge bonding quality of the film layer. Then, in the area corresponding to the flexible circuit board 300, part of the copper film is removed, and the second heat dissipation layer 210 is then bonded at the removed position. The material of the second heat dissipation layer 210 is stainless steel, thus forming a heat dissipation layer structure in which the first heat dissipation part 211 surrounds the second heat dissipation part 212. In this way, the stainless steel edge of the second heat dissipation layer 210 will not affect the edge bonding quality when the heat dissipation layer 210 is bonded to other film layers.

[0046] In some embodiments, please refer to Figures 2-3 The distance d2 between the edge of the second heat dissipation part 212 and the edge of the first heat dissipation part 211 away from the second heat dissipation part 212 is greater than or equal to 1 mm. By keeping the edge of the second heat dissipation part 212 at the above distance from the overall outer edge of the heat dissipation layer 210, the influence of the cut edge of the second heat dissipation layer 210 on the edge bonding quality when the heat dissipation layer 210 is bonded to other film layers can be further reduced.

[0047] In some embodiments, please refer to Figure 2 The display module 10 further includes at least one of a back plate 500, a polarizer 600, and a cover plate 700.

[0048] The back plate 500 is disposed between the display portion 110 and the first adhesive layer 230, serving to support the display panel 100. The material of the back plate 500 can be a flexible material, such as polyimide, polyethylene terephthalate, etc., but is not limited to these.

[0049] The polarizer 600 is disposed on the side of the display unit 110 away from the first adhesive layer 230, that is, on the light-emitting side of the display panel 100. The polarizer 600 is used to optimize display performance, improve image quality and enhance contrast.

[0050] The cover plate 700 is disposed on the side of the polarizer 600 away from the display section 110 to protect the polarizer 600, the display panel 100, and other film structures. The cover plate 700 can be made of a rigid material, such as glass, but is not limited thereto. The cover plate 700 can be connected and fixed to the polarizer 600 via a fourth adhesive layer 430. The material of the fourth adhesive layer 430 can be optically clear adhesive (OCA), but is not limited thereto.

[0051] This application also provides a display device, which includes the display module 10 as described above. The display device may be a mobile phone, tablet, computer, television, or other display products, but is not limited thereto.

[0052] This application provides a display module and a display device. The display module of this application has a heat dissipation layer on the side of the display section near the flexible circuit board. The heat dissipation layer includes a first heat dissipation section and a second heat dissipation section adjacent to the first heat dissipation section. The elastic modulus of the second heat dissipation section is greater than that of the first heat dissipation section, and the orthographic projection of the second heat dissipation section at least partially overlaps with the orthographic projection of the flexible circuit board. This application uses the second heat dissipation section to replace part of the first heat dissipation section that originally corresponded to the flexible circuit board. Since the second heat dissipation section has a higher elastic modulus, higher strength, and is less prone to deformation, aligning the second heat dissipation section with the flexible circuit board can reduce the impact of the pressure of the pressure head on the film layer on the side of the flexible circuit board away from the pressure head, effectively reducing the deformation of the film layer in the bonding area, thereby improving the imprint problem caused by the bonding process of the flexible circuit board.

[0053] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0054] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0055] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0056] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A display module, characterized in that, include: The display panel includes a display section and a mounting section adjacent to the display section, wherein one end of the mounting section away from the display section is bent to the back side of the display section; A heat dissipation structure is disposed on the back side of the display unit, the heat dissipation structure including a heat dissipation layer; and A flexible circuit board is disposed on the side of the heat dissipation structure away from the display part and is connected to the bonding part; The heat dissipation layer includes a first heat dissipation part and a second heat dissipation part adjacent to the first heat dissipation part. The elastic modulus of the second heat dissipation part is greater than that of the first heat dissipation part. The orthographic projection of the second heat dissipation part on the display part at least partially overlaps with the orthographic projection of the flexible circuit board on the display part.

2. The display module according to claim 1, characterized in that, The orthographic projection of the flexible circuit board onto the display unit is within the range of the orthographic projection of the second heat dissipation unit onto the display unit.

3. The display module according to claim 2, characterized in that, The distance between the edge of the second heat dissipation part and the edge of the flexible circuit board is greater than or equal to 0.5 mm.

4. The display module according to claim 2, characterized in that, The first heat dissipation part is arranged around the second heat dissipation part.

5. The display module according to claim 4, characterized in that, The distance between the edge of the second heat dissipation part and the edge of the first heat dissipation part away from the second heat dissipation part is greater than or equal to 1 mm.

6. The display module according to claim 2, characterized in that, In the thickness direction of the display portion, the thickness of the second heat dissipation portion is equal to the thickness of the first heat dissipation portion.

7. The display module according to any one of claims 1 to 6, characterized in that, The material of the first heat dissipation part includes copper, and the elastic modulus of the material of the second heat dissipation part is greater than that of copper.

8. The display module according to claim 7, characterized in that, The material of the second heat dissipation part includes stainless steel.

9. The display module according to claim 8, characterized in that, The heat dissipation structure also includes: The first adhesive layer is disposed on the side of the heat dissipation layer near the display portion; A buffer layer is disposed between the heat dissipation layer and the first adhesive layer; The display module also includes: A backplate is disposed between the display section and the first adhesive layer.

10. A display device, characterized in that, Includes the display module as described in any one of claims 1 to 9.

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