A terminal drop layer riveting thin film potentiometer
By using a terminal drop-down riveting structure and an all-square conductive adhesive layer connection, the problem of insufficient contact area between metal terminals and circuit layers in thin-film potentiometers is solved, resulting in better conductivity and stability, and improved product quality.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- FAVOR ELECTRONICS (DONGGUAN) CO LTD
- Filing Date
- 2025-06-13
- Publication Date
- 2026-06-09
AI Technical Summary
In existing thin-film potentiometers, the contact area between the metal terminals and the circuit layer is too small, resulting in poor conductivity and a tendency for intermittent connections, which affects product quality.
The terminal drop-down riveting structure is adopted to make the metal terminals in full contact with the circuit surface. The wires of the upper and lower circuits are connected by an all-square conductive adhesive layer, which increases the contact area and improves stability.
It enhances conductivity and stability, reduces intermittent connections, and improves product quality.
Smart Images
Figure CN224342121U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of thin-film potentiometer technology, and specifically to a thin-film potentiometer with terminal delamination and riveting. Background Technology
[0002] In existing technologies, such as Figure 1 and Figure 2 As shown, the thin-film potentiometer includes an upper substrate 10, an upper circuit 11 printed on the upper substrate 10, a lower substrate 14, and a lower circuit 13 printed on the lower substrate 14. An insulating layer 12 separates the upper substrate 10 and the lower substrate 14, creating a gap between them. Metal terminals 15 are riveted to the ends of the upper substrate 10 and the lower substrate 14 away from the insulating layer 12. Since both the upper circuit 11 and the lower circuit 13 are located in the inner layer, the metal terminals 15 can only be connected to the side edges of the upper circuit 11 and the lower circuit 13. That is, the metal terminals 15 are only connected to the area of the circuit layer thickness. If the thickness is too thin, it can easily lead to poor contact with the metal terminals, resulting in an open circuit, directly affecting product quality. Therefore, this situation urgently needs improvement. Utility Model Content
[0003] To address the above problems, this utility model provides a thin-film potentiometer with terminal drop-down riveting. The terminals are in contact with the circuit surface, which increases the contact area, improves conductivity, and enhances stability, making it less prone to virtual circuits.
[0004] To achieve the above objectives, a thin-film potentiometer with terminal drop-down riveting is provided, comprising an upper substrate, an upper circuit, a lower substrate, a lower circuit, a separator layer, an all-square conductive adhesive layer, and metal terminals. The upper circuit is printed on the inner surface of the upper substrate, and the lower circuit is printed on the upper surface of the lower substrate. The separator layer is coated between the upper and lower circuits to form a space. The lead-out terminal of the upper circuit is formed within the space. The lower circuit has a wire corresponding to the upper circuit. The lead-out terminal of the upper circuit is connected to the wire through the all-square conductive adhesive layer. The other end of the wire extends to a position corresponding to the lead-out terminal of the lower circuit. The metal terminals are riveted to the lead-out terminal of the lower circuit.
[0005] Preferably, the upper layer circuit and the lower layer circuit have the same thickness, both set to 5-20μm.
[0006] Preferably, the thickness of the separator layer and the all-square conductive adhesive layer is the same, both set to 50-200μm.
[0007] The beneficial effects of this utility model are as follows: the lower circuit is provided with a wire corresponding to the upper circuit. The output end of the upper circuit is connected to the wire through an all-square conductive adhesive layer. The other end of the wire extends to the position corresponding to the output end of the lower circuit. The metal terminal is riveted to the output end of the lower circuit in a descending manner. This structural arrangement allows the metal terminal to make overall contact with the circuit surface, which is much larger than the contact area with the thickness surface of the circuit in conventional structures. This increases the contact area, improves conductivity, and enhances stability, making it less prone to virtual circuits and greatly improving product quality. Attached Figure Description
[0008] Figure 1 This is a side sectional view of the prior art.
[0009] Figure 2 This is a schematic diagram of the upper and lower layer circuits in the prior art.
[0010] Figure 3 This is a side sectional view of the present invention.
[0011] Figure 4 This is a schematic diagram of the upper and lower circuits of this utility model.
[0012] The attached figures are labeled as follows: upper substrate 10, upper circuit 11, lower substrate 14, lower circuit 13, insulating layer 12, all-square conductive adhesive layer 16, metal terminal 15, and wire 17. Detailed Implementation
[0013] The present invention will be further described in detail below with reference to the embodiments and accompanying drawings, but the implementation of the present invention is not limited thereto.
[0014] Reference Figure 3-4The image shows a thin-film potentiometer with terminal drop-down riveting, comprising an upper substrate 10, an upper circuit 11, a lower substrate 14, a lower circuit 13, a separator layer 12, an all-square conductive adhesive layer 16, and metal terminals 15. In this embodiment, the upper circuit 11 and the lower circuit 13 have the same thickness, both set to 5-20 μm. The separator layer 12 and the all-square conductive adhesive layer 16 have the same thickness, both set to 50-200 μm. The upper circuit 11 is printed on the inner side of the upper substrate 10, and the lower circuit 13 is printed on the upper surface of the lower substrate 14. The insulating layer 12 is coated and formed between the upper circuit 11 and the lower circuit 13 to create a space. The output terminal of the upper circuit 11 is formed in the space. The lower circuit 13 is provided with a wire 17 corresponding to the upper circuit 11. The output terminal of the upper circuit 11 is connected to the wire 17 through an all-square conductive adhesive layer 16. The other end of the wire 17 extends to the position corresponding to the output terminal of the lower circuit 13. The metal terminal 15 is riveted to the output terminal of the lower circuit 13. This structure allows the metal terminal to make overall contact with the circuit surface, increasing the contact area, improving conductivity, and enhancing stability. It also makes it less prone to virtual circuits, greatly improving product quality.
[0015] The above embodiments illustrate only one implementation of this utility model, and while the description is relatively specific and detailed, it should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.
Claims
1. A thin-film potentiometer with terminal delamination and riveting, characterized in that: The system includes an upper substrate (10), an upper circuit (11), a lower substrate (14), a lower circuit (13), a separator layer (12), an all-square conductive adhesive layer (16), and metal terminals (15). The upper circuit (11) is printed on the inner surface of the upper substrate (10), the lower circuit (13) is printed on the upper surface of the lower substrate (14), and the separator layer (12) is coated and formed between the upper circuit (11) and the lower circuit (13). The upper circuit (11) has its output terminal formed within the space. The lower circuit (13) is provided with a wire (17) corresponding to the upper circuit (11). The output terminal of the upper circuit (11) is connected to the wire (17) through an all-square conductive adhesive layer (16). The other end of the wire (17) extends to a position corresponding to the output terminal of the lower circuit (13). The metal terminal (15) is riveted to the output terminal of the lower circuit (13).
2. A thin-film potentiometer with terminal delamination riveting according to claim 1, characterized in that: The upper circuit (11) and the lower circuit (13) have the same thickness, both set to 5-20 μm.
3. A thin-film potentiometer with terminal delamination riveting according to claim 1, characterized in that: The thickness of the insulating layer (12) and the all-square conductive adhesive layer (16) is the same, both set to 50-200μm.