A PCB antenna structure compatible with multiple package types and electronic device

Abstract

The utility model relates to a kind of PCB antenna structure compatible with multiple packaging types, including PCB board, at least two different packaging types of antenna elements being set on the PCB board, and with the chip being connected to the antenna element;The signal pin of the antenna element is connected to the same function pin of the chip in parallel, and the packaging layout of the two antenna elements on the PCB board is pin overlapping arrangement;Wherein, the pin pad of the antenna element adopts overlapping design in PCB layout, and pad size, spacing is consistent, so that only one antenna element is welded when actual patch.

Description

Technical Field

[0001] This utility model relates to the field of wireless communication, and in particular to a PCB antenna structure and electronic device compatible with multiple packaging types. Background Technology

[0002] For PCB boards of electromechanical boxes, meeting the needs of enterprise development through compatible design within limited space, such as reducing costs and maximizing profits, has become an important strategy for enterprise development. Currently, if an antenna needs to be replaced due to objective requirements, it takes at least 8 days from PCB design and quick-build to surface mount technology for simple circuit boards, and at least two weeks for complex high-density PCB boards, wasting a lot of time and money. Utility Model Content

[0003] The purpose of this utility model is to provide a PCB antenna structure compatible with multiple packaging types, mainly used to save the design cost of the PCB board of the set-top box, shorten the design cycle, and thus improve the market competitiveness of the set-top box.

[0004] To achieve the above objectives, the present invention adopts the following technical solution:

[0005] A PCB antenna structure compatible with multiple package types includes a PCB board, at least two antenna elements of different package types disposed on the PCB board, and a chip connected to the antenna elements;

[0006] The signal pins of the antenna element are connected in parallel to the same functional pin of the chip, and the two antenna elements are arranged in a pin-overlapping layout on the PCB board.

[0007] The antenna element's pin pads are designed to overlap in the PCB layout, and the pads are the same size and spacing, so that only one antenna element is soldered during actual surface mounting.

[0008] Optionally, the antenna element is a WIFI antenna element, a Bluetooth antenna element, or a 5G antenna.

[0009] Optionally, the antenna element includes at least two of the following package types: surface mount device (SMD), dual in-line package (DIP), and PCB antenna.

[0010] Optionally, the chip is U18, and the two antenna elements are connected in parallel to pin 2 of chip U18.

[0011] Optionally, the chip U18 is an MT7663 series WIFI module or a BCM43362 series Bluetooth module.

[0012] Optionally, the signal pins of the antenna element are connected to the chip function pins through the same electrical node, and the ground pins are connected to the ground plane of the PCB board through independent lines.

[0013] Optionally, the overlapping pads satisfy the following conditions:

[0014] The SMD package pads are rectangular, measuring 1.2mm × 1.0mm, with a spacing of 0.8mm;

[0015] The DIP package pads are circular through holes with a diameter of 0.6mm, an outer diameter of 1.0mm, and a spacing of 0.8mm.

[0016] The two types of pads completely overlap in vertical projection.

[0017] Optionally, the PCB board has a double-layer structure, with the top layer being a signal trace layer and the bottom layer being a ground layer. The signal pins are connected to the chip through the top layer traces, and the ground pins are connected to the bottom ground layer through vias.

[0018] Optionally, the length of the signal traces in the PCB layout does not exceed 15mm, and the parallel spacing between the signal traces and the ground traces is greater than 0.5mm.

[0019] On the other hand, the present invention also provides an electronic device, including a PCB antenna structure compatible with multiple package types as described in any of the foregoing embodiments;

[0020] The electronic device is a set-top box, router, IoT terminal device or mobile communication device, and the antenna structure is used to receive and transmit wireless signals and supports at least one of WIFI, Bluetooth or 5G communication protocols.

[0021] The technical solutions provided in this application embodiment may include the following beneficial effects:

[0022] The antenna structure provided by this utility model adopts a repeatable design, which can effectively reduce time and material costs.

[0023] The antenna structure provided by this utility model can effectively improve space utilization: the overlapping layout saves 15%-25% of PCB area, and is especially suitable for high-density circuit boards.

[0024] The antenna structure provided by this utility model has stronger market adaptability and has been verified to be applicable to multiple communication protocols such as WIFI, Bluetooth, and 5G. It is also flexible for customer customization, and the same PCB design can be adapted to different packaging requirements, improving customer order response speed by 60%. Attached Figure Description

[0025] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0026] Figure 1 This is a schematic diagram of the present invention.

[0027] Figure 2 This is the PCB layout diagram of this utility model. Detailed Implementation

[0028] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0029] like Figure 1 As shown, the antenna-compatible design scheme of this utility model includes: Chip U18: the core control chip, responsible for signal processing and antenna function control. Antenna element J201: an antenna module in SMD (surface mount) package, containing 2 pins (Pin1, Pin2). Antenna element U1402: an antenna module in DIP (dual in-line package), containing 2 pins (Pin1, Pin2).

[0030] Electrical connection path:

[0031] Pin 1 of J201 and Pin 1 of U1402 are connected in parallel and then connected to pin 2 (functional pin) of chip U18. To avoid signal interference, Pin 2 of J201 and U1402 are connected to the ground plane of the PCB board through independent lines to form independent loops.

[0032] Two antenna elements, J201 and U1402, are connected in parallel to pin 2 of chip U18 to implement the WIFI antenna function. These two antenna elements use different packages, but their parallel connection achieves a compatible design, providing a basis for subsequent selection and debugging of components with different packages on the PCB board.

[0033] Parallel antenna elements J201 and U1402 are functionally compatible through the same electrical connection path (pin 2 of chip U18). J201 and U1402 are antenna elements in different packages (such as surface mount and through-hole), but their pin definitions and electrical characteristics are consistent to ensure functional equivalence.

[0034] like Figure 2The diagram shows the overlapping PCB layout of the antenna components, including the PCB board: a double-layer FR4 material circuit board, with the top layer being the signal layer and the bottom layer being the ground layer. J201 pad: an SMD package pad containing two rectangular solder points (Pad1, Pad2), each measuring 1.2mm × 1.0mm with a spacing of 0.8mm. U1402 pad: a DIP package pad containing two circular through-hole pads (Pad1, Pad2), with a hole diameter of 0.6mm, an outer diameter of 1.0mm, and a spacing of 0.8mm. Overlapping area: The pads J201 and U1402 completely overlap in the PCB layout, with Pad1 and Pad2 corresponding one-to-one.

[0035] Pad1 of J201 and Pad1 of U1402 completely overlap in vertical projection, and Pad2 of J201 and Pad2 of U1402 completely overlap in vertical projection. Pad1 is connected to Pin2 (signal path) of chip U18 through a top layer trace. Pad2 is connected to the bottom ground plane (independent ground path) through a via.

[0036] To avoid physical conflicts, the overlapping layout of the two pads ensures that only one component needs to be soldered during surface mount technology (SMT).

[0037] On the PCB board, the pins of packages J201 and U1402 are arranged in an overlapping layout. This layout design allows for functional debugging using only one type of package during actual testing, ultimately selecting the most suitable package for mass production. For example, if the J201 packaged antenna element is found to perform better during testing, only the J201 component can be mounted on the PCB board for mass production; conversely, if the U1402 packaged antenna element is more suitable for project requirements, then the U1402 component is selected. The antenna design structure provided in this application meets the needs of multiple antenna package selections. Whether it is two or more WIFI antennas with different PCB packages, BT antennas with different packages, or other types of antennas, the same design scheme can be flexibly selected according to customer needs, thereby achieving the goal of saving product design costs.

[0038] Without this compatibility design, when the antenna needs to be replaced due to objective requirements, it is necessary to redesign the PCB, fabricate the board, and perform surface mount technology (SMT) work. For a simple circuit board, this process takes at least 8 days, while for a complex high-density PCB board, it takes at least two weeks, which will inevitably waste a lot of time and money.

[0039] Furthermore, meticulous optimization was also performed on the PCB layout to further enhance performance. For example... Figure 2As shown, each component in the schematic has a clearly defined positional relationship on the PCB. This correspondence ensures the electrical performance and signal transmission stability of the circuit. Simultaneously, to guarantee the reliability of the compatible design, it is essential to ensure that the pin pad sizes and pin spacing of the J201 and U1402 PCB packages are consistent. Only in this way can they achieve an overlapping layout on the PCB without interfering with each other, thus ensuring the normal operation of the entire circuit.

[0040] The following section will elaborate on this plan in detail with specific implementation steps.

[0041] Step 1: During the schematic design phase, connect compatible antenna components (such as J201 and U1402) in parallel to the same functional pin (pin 2 of chip U18).

[0042] Step 2: When laying out the PCB, ensure that the pin pad size and spacing are completely consistent in the package library of compatible components, and lay them out in an overlapping manner.

[0043] Step 3: After board fabrication, selectively mount antenna components in a specific package according to testing requirements to complete functional verification.

[0044] Step 4: Determine the mass production plan based on the test results, and directly use the existing PCB design without rework.

[0045] The antenna compatibility design scheme of this utility model has been verified through multiple practical applications, proving that it can effectively save project R&D costs and significantly shorten the project R&D cycle. For example, after applying this scheme in the PCB design of set-top boxes, the R&D cycle was shortened by an average of about 30%, and the R&D cost was reduced by about 20%. This makes products using this scheme more competitive in the market, better able to meet the needs of different customers, and bring greater economic benefits to enterprises.

[0046] In summary, the antenna compatibility design scheme of this utility model has significant practical application value, providing an efficient and economical solution to the problems existing in the prior art.

[0047] Other embodiments of this application will readily conceive of by those skilled in the art upon consideration of the specification and practice of the technical solutions disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and embodiments are to be considered exemplary only, and the true scope and spirit of this application are indicated by the following claims.

[0048] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of this application is limited only by the appended claims.

Claims

1. A PCB antenna structure compatible with multiple package types, characterized in that: It includes a PCB board, at least two antenna elements of different package types disposed on the PCB board, and a chip connected to the antenna elements; The signal pins of the antenna element are connected in parallel to the same functional pin of the chip, and the two antenna elements are arranged in a pin-overlapping layout on the PCB board. The antenna element's pin pads are designed to overlap in the PCB layout, and the pads are the same size and spacing, so that only one antenna element is soldered during actual surface mounting.

2. The PCB antenna structure compatible with multiple package types according to claim 1, characterized in that, The antenna element is a WIFI antenna element, a Bluetooth antenna element, or a 5G antenna.

3. The PCB antenna structure compatible with multiple package types according to claim 1, characterized in that, The antenna element includes at least two of the following package types: surface mount device (SMD), dual in-line package (DIP), and PCB antenna.

4. The PCB antenna structure compatible with multiple package types according to claim 1, characterized in that, The chip is U18, and the two antenna elements are connected in parallel to pin 2 of chip U18.

5. The PCB antenna structure compatible with multiple package types according to claim 4, characterized in that, The chip U18 is either an MT7663 series WIFI module or a BCM43362 series Bluetooth module.

6. The PCB antenna structure compatible with multiple package types according to claim 1, characterized in that, The signal pins of the antenna element are connected to the functional pins of the chip through the same electrical node, and the ground pins are connected to the ground plane of the PCB board through independent lines.

7. The PCB antenna structure compatible with multiple package types according to claim 1, characterized in that, The overlapping pad design satisfies the following conditions: The SMD package pads are rectangular, measuring 1.2mm × 1.0mm, with a spacing of 0.8mm; The DIP package pads are circular through holes with a diameter of 0.6mm, an outer diameter of 1.0mm, and a spacing of 0.8mm. The two types of pads completely overlap in vertical projection.

8. The PCB antenna structure compatible with multiple package types according to claim 1, characterized in that, The PCB board has a double-layer structure, with the top layer being the signal trace layer and the bottom layer being the ground layer. The signal pins are connected to the chip through the top layer traces, and the ground pins are connected to the bottom ground layer through vias.

9. The PCB antenna structure compatible with multiple package types according to claim 1, characterized in that, In the PCB layout, the length of the signal traces shall not exceed 15mm, and the parallel spacing between the signal traces and the ground traces shall be greater than 0.5mm.

10. An electronic device, characterized in that, Includes a PCB antenna structure compatible with multiple package types as described in any one of claims 1-9; The electronic device is a set-top box, router, IoT terminal device or mobile communication device, and the antenna structure is used to receive and transmit wireless signals and supports at least one of WIFI, Bluetooth or 5G communication protocols.

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