A power supply voltage conversion circuit and system

Abstract

The present disclosure relates to a power supply voltage conversion circuit and system, the power supply voltage conversion circuit comprising: a first power supply module and a second power supply module. The first power supply module comprises a power management chip; the first power supply module and the power management chip are used to supply power for the second power supply module, and the second power supply module is used to supply power for an electric load; the second power supply module comprises a control module and a plurality of load switches; the power management chip is used to control the power-on timing of the control module; the control module is used to control the turn-on and turn-off of the load switches according to the power-on timing; the second power supply module is used to supply power for the electric load through the turned-on load switches; and the power management chip is provided with a plurality of power management functions. The power supply voltage conversion circuit provided by the present disclosure does not need to additionally design a peripheral circuit for each power management function, and a load switch with lower cost is used to realize the power-on timing control, so that the manufacturing cost of the power supply voltage conversion circuit can be reduced.

Description

Technical Field

[0001] This disclosure relates to the field of power supply technology, and in particular to a power supply voltage conversion circuit and system. Background Technology

[0002] Power supply design for high-performance computing chips is a complex engineering challenge, requiring comprehensive consideration of factors such as electrical performance, thermal management, cost-effectiveness, and reliability. High-performance computing chips typically require a large amount of current to support their high-performance operations, necessitating that the power supply voltage conversion circuits provide sufficient current while maintaining voltage stability. Different topologies exist for these voltage conversion circuits, such as Boost, Buck, and Buck-Boost topologies. All of these topologies face the challenge of a large overall size and high manufacturing cost due to the numerous internal functional circuits and large component dimensions. Therefore, reducing the size and manufacturing cost of power supply voltage conversion circuits has become a pressing technical problem for those skilled in the art. Utility Model Content

[0003] To solve the above-mentioned technical problems, or at least partially solve them, this disclosure provides a power supply voltage conversion circuit and system. The power supply voltage conversion circuit provided by this disclosure does not require additional design of peripheral circuits for each power management function, and uses a low-cost load switch to realize power-on timing control, thus reducing the manufacturing cost of the power supply voltage conversion circuit.

[0004] This disclosure provides a power supply voltage conversion circuit, comprising: a first power supply module and a second power supply module. The first power supply module includes a power management chip, the input terminal of which and a first terminal of the first power supply module are both connected to an external power source. Both the first power supply module and the power management chip are used to receive power signals provided by the external power source. The second power supply module includes a control module and multiple load switches. The second power supply module is connected to the output terminals of the first power supply module and the power management chip. Both the first power supply module and the power management chip are used to supply power to the second power supply module. The control module is connected to the control terminals of the load switches. The power management chip is used to control the power-on sequence of the control module. The control module is used to control the on and off of the load switches according to the power-on sequence. The second power supply module is used to supply power to the electrical load through the on-state load switches. The power management chip has multiple power management functions.

[0005] Optionally, the second power module further includes: at least one first buck chip; multiple load switches including at least one first load switch; both the first buck chip and the first load switch are connected to the power management chip, the first buck chip is used to step down and convert the power supply signal output by the power management chip to provide it to the electrical load, and the first load switch is used to output the first power supply signal provided by the power management chip to the electrical load when it is turned on; the control terminal of the first load switch is connected to the control module, and the control module is used to control the turning on and off of the first load switch according to the power-on sequence.

[0006] Optionally, the second power module further includes: at least one first boost chip; multiple load switches including at least one second load switch; both the first boost chip and the second load switch are connected to the power management chip, the first boost chip is used to boost and convert the power supply signal output by the power management chip to provide it to the electrical load, and the second load switch is used to provide the first power supply signal output by the power management chip to the electrical load; the control terminal of the second load switch is connected to the control module, and the control module is used to control the conduction and cutoff of the second load switch according to the power-on sequence.

[0007] Optionally, the first power module further includes: a second buck chip and a second boost chip; the input terminal of the second buck chip is connected to an external power supply, the input terminal of the second boost chip is connected to the output terminal of the second buck chip, and the output terminal of the second boost chip is connected to the second power module; the second buck chip is used to convert the power signal by step-down and then provide it to the second boost chip; the second boost chip is used to convert the second power supply signal provided by the second buck chip by step-up and then provide it to the second power module.

[0008] Optionally, the second power module includes a high-side driver chip, which is connected to the output of the second boost chip. The high-side driver chip is used to supply power to the electrical load.

[0009] Optionally, the first power module also includes a third step-down chip; the input terminal of the third step-down chip is connected to an external power supply, and the output terminal of the third step-down chip is connected to the second power module; the third step-down chip is used to step down the power signal and then provide it to the second power module.

[0010] Optionally, the multiple load switches include a third load switch; the control module is connected to the first power module; the third load switch is connected to the output terminal of the third step-down chip, and the third load switch is used to provide the third power supply signal output by the third step-down chip to the electrical load; the control terminal of the third load switch is connected to the control module, and the control module is used to control the conduction and cutoff of the third load switch according to the power-on sequence.

[0011] Optionally, the second power module includes a fourth step-down chip; the fourth step-down chip is connected to the output terminal of the third step-down chip, and the fourth step-down chip is used to step down and convert the third power supply signal output by the third step-down chip to provide it to the power load.

[0012] Optionally, the power supply voltage conversion circuit is located on the mother circuit board; the first power module also includes a buck-boost chip; the input terminal of the buck-boost chip is connected to an external power supply, the output terminal of the buck-boost chip is connected to the sub-circuit board, and the output terminal of the third buck chip is connected to the sub-circuit board; wherein, the buck-boost chip is used to provide the sub-circuit board with the power signal after boosting or bucking, and the third buck chip is used to provide the sub-circuit board with the power signal after bucking.

[0013] This disclosure also provides a power supply voltage conversion system, including any power supply voltage conversion circuit as described.

[0014] This disclosure provides a power supply voltage conversion circuit and system. The power supply voltage conversion circuit includes a first power module and a second power module. The first power module includes a power management chip. The input terminal of the power management chip and a first terminal of the first power module are connected to an external power source, which provides power signals to the power management chip and the first power module. The second power module is connected to the output terminals of the first power module and the power management chip, and is powered by the first power module and the power management chip. The first power module and the power management chip can boost or buck the power signal provided by the external power source according to the power demand of the second power module. The second power module can boost or buck the power signal provided by the first power module and the power management chip according to the power load demand, thereby enabling power supply to loads with different power demands. The second power module includes a control module and multiple load switches. The power management chip controls the power-on sequence of the control module to control the on / off state of the load switches, thereby controlling the timing of power supply to the electrical load. The power management chip also has a variety of power management functions. Therefore, when designing the power voltage conversion circuit, there is no need to design additional peripheral circuits for different power functions. Multiple functions can be achieved simply by using the power management chip. Furthermore, using low-cost load switches to control the power supply to the electrical load can reduce the manufacturing cost of the power voltage conversion circuit. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments of this application will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of a power supply voltage conversion circuit provided in an embodiment of the present disclosure;

[0017] Figure 2 A schematic diagram of another power supply voltage conversion circuit provided in this embodiment of the present disclosure;

[0018] Figure 3 A schematic diagram of another power supply voltage conversion circuit provided in this embodiment of the present disclosure;

[0019] Figure 4 A schematic diagram of another power supply voltage conversion circuit provided in this embodiment of the present disclosure;

[0020] Figure 5 This is a schematic diagram of the hierarchical structure of a power supply voltage conversion circuit provided in an embodiment of this disclosure.

[0021] 100. First power supply module; 110. Power management chip; 120. Second buck chip; 130. Second boost chip; 140. Third buck chip; 200. Second power supply module; 20. Load switch; 201. First buck chip; 202. First load switch; 203. First boost chip; 204. Second load switch; 205. High-side driver chip; 206. Third load switch; 207. Fourth buck chip; 210. Control module; 220. Ethernet module; 230. SerDes module; 240. CAN module; 250. CAM module; 260. USS module; 270. USB module; 280. M.2 interface module; 300. External power supply; 400. Electrical load; 510. Mother circuit board; 520. Daughter circuit board. Detailed Implementation

[0022] The features and exemplary embodiments of various aspects of this application will now be described in detail. Numerous specific details are set forth in the following detailed description in order to provide a comprehensive understanding of this application. However, it will be apparent to those skilled in the art that this application can be implemented without some of these specific details. The following description of embodiments is merely intended to provide a better understanding of this application by illustrating examples thereof.

[0023] It should be noted that, unless otherwise specified, the embodiments and features described in this application can be combined with each other. The embodiments will now be described in detail with reference to the accompanying drawings.

[0024] Figure 1 This is a schematic diagram of a power supply voltage conversion circuit provided in an embodiment of the present disclosure, as shown below. Figure 1As shown, the power supply voltage conversion circuit includes: a first power supply module 100 and a second power supply module 200.

[0025] The first power module 100 includes a power management chip 110. The input terminal of the power management chip 110 and the first terminal of the first power module are connected to an external power supply 300. Both the first power module 100 and the power management chip 110 are used to receive power signals provided by the external power supply 300. The second power module 200 includes a control module 210 and multiple load switches 20. The second power module 200 is connected to the output terminals of the first power module 100 and the power management chip 110. Both the first power module 100 and the power management chip 110 are used to supply power to the second power module 200. The control module 210 is connected to the control terminal of the load switches 20. The power management chip 110 is connected to the control module 210. The power management chip 110 is used to control the power-on sequence of the control module 210. The control module 210 is used to control the on and off of the load switches 20 according to the power-on sequence. The second power module 200 is used to supply power to the electrical load 400 through the on load switches 20. The power management chip 110 is equipped with multiple power management functions.

[0026] Specifically, the power management chip 110 has a voltage conversion function. An external power supply 300 provides a power signal to the first power module 100 and the power management chip 110. The first power module 100 and the power management chip 110 can boost or buck the power signal provided by the external power supply 300 according to the power demand of the second power module 200, thereby meeting the power demand of the second power module 200. The second power module 200 can boost or buck the power signal provided by the first power module 100 and the power management chip 110 according to the power demand of the electrical load 400, or directly output the power signal provided by the first power module 100 and the power management chip 110 to the electrical load 400, thus enabling power supply to the electrical load 400 with different power demands.

[0027] The power management chip 110 has voltage conversion and control functions. Therefore, the external power supply 300 can convert the power signal into the supply voltage required by the control module 210 through the power management chip 110, thereby ensuring the normal operation of the control module 210. Simultaneously, the control module 210 can be controlled through the control function of the power management chip 110. The power management chip 110 can pre-program the power-on sequence of all power-consuming modules in the second power module 200, including the control module 210, thereby controlling the power-on sequence of the control module 210. This, in turn, enables control of the on / off state of the load switch 20, thus controlling the power supply sequence to each electrical load 400. Compared to the external power supply 300 directly supplying power to the control module 210 through the voltage conversion module, this disclosure is more advantageous for the control module 210 in controlling the power-on sequence. Furthermore, using the lower-cost load switch 20 to control the power supply to the electrical loads 400 reduces the manufacturing cost of the power voltage conversion circuit.

[0028] Furthermore, both the first power module 100 and the second power module 200 include a power chip with a built-in semiconductor switch. The first power module 100 and the second power module 200 use the power chip to perform voltage signal boosting or buck conversion. When designing the power voltage conversion circuit, since both the first power module 100 and the second power module 200 use power signals with built-in semiconductor switches, there is no need to design additional peripheral circuitry for the semiconductor switches. Moreover, the power management chip 110 has multiple power management functions. Therefore, when designing the power voltage conversion circuit, there is no need to design additional peripheral circuitry for different power functions. Multiple functions can be achieved solely through the power management chip 110. This reduces the size of the power voltage conversion circuit by eliminating the need for external circuitry to implement multiple power functions, as well as the size of the semiconductor switches and their peripheral circuitry. This results in a smaller overall size of the power voltage conversion circuit, and the elimination of the need for such external circuitry also reduces the manufacturing cost of the power voltage conversion circuit.

[0029] Preferably, the power management chip 110 can be a power management chip with a watchdog timer, which can make the entire power supply voltage conversion circuit more reliable.

[0030] For example, the external power supply 300 provides a voltage of 12V, and provides 1.25V and 1.2V voltages to the control module 210.

[0031] In some embodiments, the second power module further includes: at least one first step-down chip and at least one first load switch; both the first step-down chip and the first load switch are connected to the power management chip, the first step-down chip is used to step down the power supply signal output by the power management chip and provide it to the electrical load, and the first load switch is used to provide the electrical load with the first power supply signal output by the power management chip; the control terminal of the first load switch is connected to the control module, and the control module is used to control the conduction and cutoff of the first load switch according to the power-on sequence.

[0032] For example, Figure 2 A schematic diagram of another power supply voltage conversion circuit provided in this disclosure embodiment is shown below. Figure 2 As shown, the second power module 200 can be, for example, an Ethernet module 220 and a SerDes module 230 (deserializer and serializer module).

[0033] The Ethernet module 220 includes a first step-down chip 201 and two first load switches 202. Both the first step-down chip 201 and the first load switches 202 are connected to the power management chip 110. The first step-down chip 201 in the Ethernet module 220 converts the power supply signal output from the power management chip 110 into a step-down value before providing it to the electrical load 400 in the Ethernet module 220. The first load switches 202 provide the first power supply signal output by the power management chip 110 to the electrical load 400 in the Ethernet module 220. The control terminal of the first load switch 202 is connected to the control module 210. The control module 210 stores the power-on sequence of each module and controls the first load switch 202 to turn on and off according to the power-on sequence, thereby controlling the power-on of the electrical load 400 in the Ethernet module 220.

[0034] The SerDes module 230 includes three first step-down chips 201 and one first load switch 202. Both the first step-down chips 201 and the first load switch 202 are connected to the power management chip 110. The first step-down chips 201 in the SerDes module 230 convert the power supply signal output from the power management chip 110 into a step-down value before providing it to the electrical load 400 in the SerDes module 230. The first load switch 202 provides the electrical load 400 in the SerDes module 230 with the first power supply signal output from the power management chip 110. The control terminal of the first load switch 202 is connected to the control module 210. The control module 210 controls the on / off state of the first load switch 202 according to the power-on sequence, thereby controlling the power-on of the electrical load 400 in the SerDes module 230.

[0035] When the power demand of the electrical load 400 differs from the power supply signal output by the power management chip 110, this disclosure uses a first step-down chip 201 to convert the power supply signal output by the power management chip 110 to a lower voltage. Conversely, when the power demand of the electrical load 400 is the same as the power supply signal output by the power management chip 110, this disclosure uses a first load switch 202 to output the power supply signal to the electrical load 400, thereby meeting the power demands of different electrical loads 400. Furthermore, since the first load switch 202 does not change the input power supply signal, power loss can be reduced.

[0036] For example, the external power supply 300 provides a voltage of 12V, the power management chip 110 provides a voltage of 3.3V, the first buck chip 201 provides a voltage of 0.9V, and the first load switch 202 provides a voltage of 3.3V.

[0037] The first step-down chip 201 can be a step-down chip with mode switching function, thereby reducing output current ripple.

[0038] It should be noted that the second power module 200 is either an Ethernet module 220 or a SerDes module 230, and the number of the first step-down chip 201 and the first load switch 202 are only examples and are not specifically limited here.

[0039] In some embodiments, the second power module further includes: at least one first boost chip and at least one second load switch; both the first boost chip and the second load switch are connected to the power management chip, the first boost chip is used to boost and convert the power supply signal output by the power management chip to provide it to the electrical load, and the second load switch is used to provide the electrical load with the first power supply signal output by the power management chip; the control terminal of the second load switch is connected to the control module, and the control module is used to control the conduction and cutoff of the second load switch according to the power-on sequence.

[0040] For example, see [link to previous article] Figure 2The second power module 200 can be, for example, a Controller Area Network (CAN) module 240. The CAN module 240 includes a first boost converter chip 203 and a second load switch 204, both of which are connected to the power management chip 110. The first boost converter chip 203 boosts and converts the power supply signal output from the power management chip 110 to provide it to the electrical load 400 in the CAN module 240. The second load switch 204 provides the first power supply signal output by the power management chip 110 to the electrical load 400 in the CAN module 240. The control terminal of the second load switch 204 is connected to a control module 210, which stores the power-on sequence of each module. The control module 210 controls the on and off of the second load switch 204 according to the power-on sequence, thereby controlling the power-on of the electrical load 400 in the CAN module 240.

[0041] When the power demand of the electrical load 400 differs from the power supply signal output by the power management chip 110, this disclosure uses a first boost chip 203 to boost and convert the power supply signal output by the power management chip 110. Conversely, when the power demand of the electrical load 400 is the same as the power supply signal output by the power management chip 110, this disclosure uses a second load switch 204 to output the power supply signal to the electrical load 400, thereby meeting the power demands of different electrical loads 400. Furthermore, since the second load switch 204 does not change the input power supply signal, power loss can be reduced.

[0042] For example, the external power supply 300 provides a voltage of 12V, the power management chip 110 provides a voltage of 3.3V, the first boost chip 203 provides a voltage of 5V, and the second load switch 204 provides a voltage of 3.3V.

[0043] The first boost chip 203 can be filtered using a π-type LC filter circuit to reduce noise caused by current discontinuity.

[0044] It should be noted that the second power module 200 is the CAN module 240, and the number of the first boost chip 203 and the second load switch 204 are only examples and are not specifically limited here.

[0045] In some embodiments, Figure 3 A schematic diagram of another power supply voltage conversion circuit provided in this disclosure embodiment is shown below. Figure 3 As shown, the first power module includes a second buck chip 120 and a second boost chip 130.

[0046] The input terminal of the second buck chip 120 is connected to the external power supply 300, the input terminal of the second boost chip 130 is connected to the output terminal of the second buck chip 120, and the output terminal of the second boost chip 130 is connected to the second power module 200.

[0047] The second buck chip 120 is used to convert the power signal into a step-down signal and then provide it to the second boost chip 130; the second boost chip 130 is used to convert the second power supply signal provided by the second buck chip 120 into a step-up signal and then provide it to the second power module 200.

[0048] Specifically, for a power load 400 whose power demand is the same as the signal provided by the external power supply 300 and which has certain requirements for power-on time, the second step-down chip 120 and the second step-up chip 130 can be used to step down the voltage first and then boost the voltage. While ensuring the power demand of the power load 400, the power-on time of the power load 400 is delayed, which facilitates the timing control of the power load 400.

[0049] For example, the external power supply 300 provides a voltage of 12V, the second buck chip 120 provides a voltage of 7V, and the second boost chip 130 provides a voltage of 12V.

[0050] The second step-down chip 120 can be a step-down chip with mode switching function, which can reduce the output current ripple.

[0051] In some embodiments, see continue to see Figure 3 The second power module 200 includes a high-side driver chip 205, which is connected to the output terminal of the second boost chip 130. The high-side driver chip 205 is used to supply power to the electrical load 400.

[0052] For example, the second power module 200 may be, for example, a content-addressable memory (CAM) module 250, and / or a universal serial interface (USS) module 260.

[0053] CAM module 250 includes a high-side driver chip 205, which is connected to the output of the second boost chip 130. The high-side driver chip 205 is used to supply power to the electrical load 400 in CAM module 250. And / or, USS module 260 includes a high-side driver chip 205, which is connected to the output of the second boost chip 130. The high-side driver chip 205 is used to supply power to the electrical load 400 in USS module 260, thereby enabling power supply to the electrical load 400 with different power requirements.

[0054] The second boost chip 130 can be filtered using a π-type LC filter circuit to reduce noise caused by current discontinuity.

[0055] It should be noted that the second power module 200 being the CAM module 250 or the USS module 260 is merely an example and is not specifically limited here.

[0056] In some embodiments, Figure 4 A schematic diagram of another power supply voltage conversion circuit provided in this disclosure embodiment is shown below. Figure 4 As shown, the first power module 100 includes a third step-down chip 140; the input terminal of the third step-down chip 140 is connected to the external power supply 300, and the output terminal of the third step-down chip 140 is connected to the second power module 200; the third step-down chip 140 is used to step down and convert the power signal and then provide it to the second power module 200.

[0057] Specifically, when the power demand is such that the voltage is lower than that provided by the external power supply 300, the power signal can be stepped down and converted by the third step-down chip 140 and then provided to the second power module 200. The second power module 200 then supplies power to the electrical load 400, thereby meeting the power demand of the electrical load 400.

[0058] For example, the external power supply 300 provides a voltage of 12V, and the third step-down chip 140 provides a voltage of 5V.

[0059] The third step-down chip 140 can be a step-down chip with mode switching function, which can reduce output current ripple.

[0060] In some embodiments, see continue to see Figure 4 The second power module 200 includes a third load switch 206 and a control module 210. The control module 210 is connected to the power management chip 110 in the first power module. The third load switch 206 is connected to the output terminal of the third step-down chip 140. The third load switch 206 is used to provide the electrical load 400 with the third power supply signal output by the third step-down chip 140. The control terminal of the third load switch 206 is connected to the control module 210. The control module 210 is used to control the conduction and cutoff of the third load switch 206 according to the power-on sequence.

[0061] For example, the second power module 200 may be, for instance, a Universal Serial Bus (USB) module 270. The third load switch 206 provides a third power supply signal output by the third step-down chip 140 to the power-consuming load 400 in the USB module 270. The control terminal of the third load switch 206 is connected to a control module 210, which stores the power-on sequence of each module. The control module 210 controls the on and off of the third load switch 206 according to the power-on sequence, thereby controlling the power-on of the power-consuming load 400 in the USB module 270. When the power demand of the power-consuming load 400 in the USB module 270 is the same as the third power supply signal output by the third step-down chip 140, this disclosure outputs the third power supply signal to the power-consuming load 400 in the USB module 270 via the third load switch 206, thereby meeting the power demand of the power-consuming load 400. Furthermore, since the third load switch 206 does not change the input power supply signal, power loss can be reduced.

[0062] In some embodiments, see continue to see Figure 4 The second power module 200 includes a fourth step-down chip 207; the fourth step-down chip 207 is connected to the output terminal of the third step-down chip 140, and the fourth step-down chip 207 is used to step down and convert the third power supply signal output by the third step-down chip 140 to provide it to the power load 400.

[0063] For example, the second power module 200 may be, for instance, an M.2 interface module 280. The fourth step-down chip 207 is used to step down and convert the third power supply signal output by the third step-down chip 140 before providing it to the power load 400 in the M.2 interface module 280. If the power demand of the power load 400 differs from the third power supply signal output by the third step-down chip 140, this disclosure discloses that the fourth step-down chip 207 steps down and converts the third power supply signal output by the third step-down chip 140 to meet the power demand of the power load 400.

[0064] The third step-down chip 140 can be a step-down chip with mode switching function, which can reduce output current ripple.

[0065] In some embodiments, Figure 5 This is a schematic diagram of the hierarchical structure of a power supply voltage conversion circuit provided in an embodiment of this disclosure. See also: Figure 4 as well as Figure 5The power supply voltage conversion circuit is located on the mother circuit board 510; the first power module also includes a buck-boost chip 150; the input terminal of the buck-boost chip 150 is connected to the external power supply 300, the output terminal of the buck-boost chip 150 is connected to the sub-circuit board 520, and the output terminal of the third buck chip 140 is connected to the sub-circuit board 520; wherein, the buck-boost chip 150 is used to provide the power signal to the sub-circuit board 520 after buck conversion, and the third buck chip 140 is used to provide the power signal to the sub-circuit board 520 after buck conversion.

[0066] Specifically, the sub-circuit board 520 and the mother circuit board 510 are connected via a power-to-boost chip 150 and a third buck chip 140 in a power-to-voltage conversion circuit. Both the boost-to-boost chip 150 and the third buck chip 140 are located on the mother circuit board 510. The sub-circuit board 520 contains electrical loads 400. The power-to-voltage conversion circuit, through the connection between the sub-circuit board 520 and the mother circuit board 510, converts the power signal from the external power supply 300 and supplies power to the electrical loads 400 in the sub-circuit board 520, thereby meeting the power requirements of each electrical load 400.

[0067] The buck-boost chip 150 can be an integrated buck-boost chip to reduce operating losses and improve working efficiency.

[0068] For example, an external power supply provides a voltage of 12V, and a buck-boost chip provides a voltage of 12V.

[0069] This disclosure provides a power supply voltage conversion system, including the power supply voltage conversion circuit provided in any of the above embodiments.

[0070] It is understood that the power supply voltage conversion system provided in this application embodiment can achieve the corresponding beneficial effects of the power supply voltage conversion circuit provided in the above embodiments, which will not be elaborated here.

[0071] It should be noted that, in this document, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0072] The above are merely specific embodiments of this disclosure, enabling those skilled in the art to understand or implement this disclosure. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this disclosure. Therefore, this disclosure is not to be limited to these embodiments, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A power supply voltage conversion circuit, characterized in that, include: The first power module includes a power management chip. The input terminal of the power management chip and the first terminal of the first power module are both connected to an external power source. The first power module and the power management chip are both used to receive power signals provided by the external power source. The second power module includes a control module and multiple load switches. The second power module is connected to the output terminals of the first power module and the power management chip. The first power module and the power management chip are both used to supply power to the second power module. The control module is connected to the control terminal of the load switches. The power management chip is used to control the power-on sequence of the control module. The control module is used to control the on and off of the load switches according to the power-on sequence. The second power module is used to supply power to the electrical load through the on load switches. The power management chip is equipped with a variety of power management functions.

2. The power supply voltage conversion circuit according to claim 1, characterized in that, The second power module further includes: at least one first buck converter chip; the plurality of load switches include at least one first load switch; Both the first step-down chip and the first load switch are connected to the power management chip. The first step-down chip is used to step down the power supply signal output by the power management chip and then provide it to the electrical load. The first load switch is used to output the first power supply signal provided by the power management chip to the electrical load when it is turned on. The control terminal of the first load switch is connected to the control module, and the control module is used to control the first load switch to turn on and off according to the power-on sequence.

3. The power supply voltage conversion circuit according to claim 1, characterized in that, The second power module further includes: at least one first boost chip; the plurality of load switches include at least one second load switch; Both the first boost chip and the second load switch are connected to the power management chip. The first boost chip is used to boost the power supply signal output by the power management chip and then provide it to the electrical load. The second load switch is used to provide the electrical load with the first power supply signal output by the power management chip. The control terminal of the second load switch is connected to the control module, which is used to control the second load switch to turn on and off according to the power-on sequence.

4. The power supply voltage conversion circuit according to claim 1, characterized in that, The first power module further includes: a second buck chip and a second boost chip; The input terminal of the second buck chip is connected to the external power supply, the input terminal of the second boost chip is connected to the output terminal of the second buck chip, and the output terminal of the second boost chip is connected to the second power module. The second buck chip is used to convert the power signal into a step-down signal and then provide it to the second boost chip; the second boost chip is used to convert the second power supply signal provided by the second buck chip into a step-up signal and then provide it to the second power module.

5. The power supply voltage conversion circuit according to claim 4, characterized in that, The second power module includes a high-side driver chip, which is connected to the output terminal of the second boost chip. The high-side driver chip is used to supply power to the electrical load.

6. The power supply voltage conversion circuit according to claim 1, characterized in that, The first power module further includes a third step-down chip; the input terminal of the third step-down chip is connected to the external power supply, and the output terminal of the third step-down chip is connected to the second power module. The third step-down chip is used to step down the power signal and then provide it to the second power module.

7. The power supply voltage conversion circuit according to claim 6, characterized in that, The plurality of load switches includes a third load switch; The control module is connected to the first power module; the third load switch is connected to the output terminal of the third step-down chip, and the third load switch is used to provide the third power supply signal output by the third step-down chip to the electrical load; the control terminal of the third load switch is connected to the control module, and the control module is used to control the conduction and cutoff of the third load switch according to the power-on sequence.

8. The power supply voltage conversion circuit according to claim 6, characterized in that, The second power module includes a fourth buck chip; The fourth step-down chip is connected to the output terminal of the third step-down chip. The fourth step-down chip is used to step down and convert the third power supply signal output by the third step-down chip and then supply it to the power load.

9. The power supply voltage conversion circuit according to claim 6, characterized in that, The power supply voltage conversion circuit is located on the mother circuit board; The first power module also includes a buck-boost chip; The input terminal of the buck-boost chip is connected to the external power supply, the output terminal of the buck-boost chip is connected to the sub-circuit board, and the output terminal of the third buck chip is connected to the sub-circuit board. The step-up / step-down chip is used to boost or buck the power signal and then provide it to the sub-circuit board, and the third step-down chip is used to buck the power signal and then provide it to the sub-circuit board.

10. A power supply voltage conversion system, characterized in that, Includes the power supply voltage conversion circuit as described in any one of claims 1-9.

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