Circuit board structure, heat dissipation assembly, power module and vehicle

Abstract

The application provides a circuit board structure, a heat dissipation assembly, a power module and a vehicle, and belongs to the technical field of heat dissipation. The circuit board structure comprises a circuit board, a heat spreading plate and a connecting component. One side of the circuit board is provided with a heating device. The heat spreading plate is arranged on the side of the heating device away from the circuit board. The connecting component is connected with the circuit board, and is used for elastically abutting against the side of the heat spreading plate away from the circuit board, so that the heat spreading plate is pressed on the heating device. The circuit board structure provided in the application can realize good adhesion between the heat spreading plate and the heating device, and guarantee the heat dissipation effect of the heating device.

Description

Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to a circuit board structure, heat dissipation component, power module, and vehicle. Background Technology

[0002] As the functional requirements of intelligent driving domain control products continue to increase, the computing power requirements for automotive heat-generating devices are also increasing, leading to higher heat dissipation during operation and thus placing higher demands on heat dissipation.

[0003] In related technologies, the heat dissipation structure typically involves first pressing the heat dissipation module and liquid cooling component together, and then assembling it with the PCBA (Printed Circuit Board Assembly) to ensure a tight fit between the heat dissipation structure and the heat-generating device. However, this method can easily cause deformation of the liquid cooling component, which affects the flatness of the heat dissipation surface of the heat dissipation structure used to fit the heat-generating device, resulting in poor adhesion and consequently reduced heat dissipation performance. Utility Model Content

[0004] This application provides a circuit board structure, a heat dissipation component, a power module, and a vehicle. The circuit board structure enables good adhesion between the heat dissipation plate and the heat-generating device, ensuring the heat dissipation effect of the heat-generating device.

[0005] To achieve the above objectives, according to a first aspect of this application, a circuit board structure is provided, comprising:

[0006] A circuit board with a heating element on one side;

[0007] A heat spreader is located on the side of the heat-generating device away from the circuit board.

[0008] The connecting component is connected to the circuit board. The connecting component is used to elastically abut against the side of the heat spreader away from the circuit board to press the heat spreader onto the heating device.

[0009] Optionally, the heat spreader has a protrusion on the side facing the circuit board, and the protrusion abuts against the heating device.

[0010] Optionally, a heat-equalizing cavity is formed at the protrusion, which is used to contain the heat-equalizing medium.

[0011] Optionally, the connecting components include interconnected elastic elements and fasteners;

[0012] The elastic element is disposed on the side of the heat spreader away from the circuit board, and the elastic element elastically abuts against the side of the heat spreader away from the circuit board.

[0013] Fasteners are connected to the circuit board.

[0014] Optionally, the circuit board structure may also include a limiting structure;

[0015] The limiting structure is located on the side of the heat exchange plate away from the elastic element. The limiting structure is connected to the fastener to limit the displacement of the fastener in the thickness direction of the heat exchange plate.

[0016] Optionally, the circuit board structure also includes a first fixing member, and the limiting structure includes a snap-fit ​​member;

[0017] The first fastener is located on the side of the heat spreader away from the elastic member, and the first fastener is provided with a first through hole for fasteners to pass through.

[0018] The snap-fit ​​component is located on the side of the first fixing member away from the heat spreader plate. The snap-fit ​​component snaps the fastener to the first fixing member and is used to limit the displacement of the fastener in the thickness direction of the heat spreader plate.

[0019] Optionally, the circuit board structure also includes a second fastener, and the limiting structure includes a first threaded segment formed on the fastener;

[0020] The second fastener is located on the side of the heat spreader away from the elastic member, and the second fastener is provided with a screw hole that matches the first threaded section. The first threaded section is adapted to pass through the screw hole to limit the displacement of the fastener in the thickness direction of the heat spreader.

[0021] Optionally, the circuit board structure also includes a third fixing member, and the limiting structure includes a first fastening bolt;

[0022] The third fastener is located on the side of the heat spreader away from the elastic element, and the third fastener is provided with a second through hole for fasteners to pass through.

[0023] The first fastening bolt is located on the side of the third fixing member away from the heat spreader plate. The first fastening bolt is connected to the fastener to limit the displacement of the fastener in the thickness direction of the heat spreader plate.

[0024] Optionally, the circuit board structure also includes a fourth fastener;

[0025] The fourth fixing component is located on the side of the circuit board away from the heat spreader, and the fourth fixing component is connected to the connecting component.

[0026] Optionally, the connecting component has a second threaded section at one end near the fourth fixing member, and the fourth fixing member is connected to the second threaded section on the connecting component by a second fastening bolt.

[0027] Optionally, the connecting component has a cavity structure, and the inner wall of the cavity structure has threads. The fourth fastener is adapted to be connected to the fourth fastener by a fastening stud.

[0028] Optionally, the elastic element includes a wave spring or a compression spring.

[0029] Optionally, the side of the heat spreader away from the circuit board is used for thermal contact with the liquid cooling components.

[0030] Optionally, the liquid cooling assembly and connecting parts are integrally molded.

[0031] According to a second aspect of this application, a heat dissipation assembly is also provided, including a liquid cooling assembly and at least one circuit board structure as described above, wherein the liquid cooling assembly is disposed on the side of the heat spreader away from the circuit board.

[0032] Optionally, it includes a liquid cooling assembly and two circuit board structures;

[0033] The two circuit board structures are respectively located on opposite sides of the liquid cooling assembly.

[0034] Optionally, it includes a liquid cooling assembly and a circuit board structure;

[0035] The circuit board structure is located on one side of the liquid cooling assembly.

[0036] Alternatively, the fasteners in the circuit board structure are integrally formed with the liquid cooling components.

[0037] According to a third aspect of this application, a power module is also provided, including the circuit board structure as described above, and / or the heat dissipation components as described above.

[0038] According to a fourth aspect of this application, a vehicle is also provided, including the power module described above.

[0039] The circuit board structure provided in this application includes a circuit board, a heat spreader, and a connecting component. A heating element is located on one side of the circuit board. The heat spreader is positioned on the side of the heating element away from the circuit board. The connecting component is connected to the circuit board and elastically abuts against the side of the heat spreader away from the circuit board to press the heat spreader onto the heating element. By first assembling the heat spreader to the circuit board via the connecting component, and ensuring the connecting component allows the heat spreader to press onto the heating element, flexible assembly of the heat spreader and circuit board can be achieved, ensuring good contact between the heat spreader and the heating element and reducing damage to the heating element caused by uneven pressure during assembly. Pre-assembling the heat spreader and circuit board improves the rigidity of the overall assembly structure. During subsequent assembly with liquid cooling components and other structures, the compression of the elastic component reduces the pressure impact during assembly, minimizing deformation of the liquid cooling components and the heating element. This ensures good contact between the heating element and the heat spreader, allowing the heat generated by the heating element to be further transferred to the liquid cooling component structure through the heat spreader, ensuring good heat dissipation.

[0040] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0041] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0042] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0043] Figure 1 This is a cross-sectional schematic diagram of the first circuit board structure provided in the embodiments of this application;

[0044] Figure 2 yes Figure 1 Enlarged view of point A in the middle;

[0045] Figure 3 This is a schematic diagram of the assembly structure of the heat dissipation plate and the first fixing member in the first type of circuit board structure provided in the embodiments of this application;

[0046] Figure 4 This is an exploded structural diagram of the first circuit board structure provided in the embodiments of this application;

[0047] Figure 5 This is a cross-sectional schematic diagram of the second circuit board structure provided in the embodiments of this application;

[0048] Figure 6 yes Figure 5 Enlarged view of point B in the middle;

[0049] Figure 7 This is a cross-sectional schematic diagram of the third circuit board structure provided in the embodiments of this application;

[0050] Figure 8 yes Figure 7 Enlarged view of point C in the middle;

[0051] Figure 9 This is a cross-sectional schematic diagram of the fourth circuit board structure provided in the embodiments of this application;

[0052] Figure 10 yes Figure 9 Enlarged view of point D;

[0053] Figure 11 This is a schematic diagram of the heat dissipation component provided in the embodiments of this application.

[0054] Explanation of reference numerals in the attached figures:

[0055] 100. Circuit board structure; 1. Circuit board; 11. Heating element; 111. Thermal conductive gel; 2. Heat spreader; 21. Protrusion; 22. Heat spreader cavity; 3. Connecting component; 31. Fastener; 311. First threaded section; 312. Second threaded section; 32. Elastic component; 41. First fixing component; 411. Positioning hole; 42. Second fixing component; 43. Third fixing component; 5. Limiting structure; 51. Snap-fit ​​component; 52. First fastening bolt; 6. Fourth fixing component; 61. Second fastening bolt; 62. Fastening screw; 63. Positioning post; 200. Liquid cooling assembly. Detailed Implementation

[0056] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the protection scope of this application.

[0057] Firstly, please refer to Figure 1 and Figure 2 This application provides a circuit board structure 100, including a circuit board 1, a heat spreader 2, and a connecting component 3. A heating element 11 is disposed on one side of the circuit board 1. The heat spreader 2 is located on the side of the heating element 11 facing away from the circuit board 1. The connecting component 3 is connected to the circuit board 1 and is used to elastically abut against the side of the heat spreader 2 facing away from the circuit board 1, thereby pressing the heat spreader 2 onto the heating element 11. By first assembling the heat spreader 2 to the circuit board 1 via the connecting component 3, and by ensuring that the connecting component 3 can press the heat spreader 2 onto the heating element 11, flexible assembly of the heat spreader 2 and the circuit board 1 can be achieved, ensuring good contact between the heat spreader 2 and the heating element 11 and reducing damage to the heating element 11 caused by uneven pressure during assembly. After the heat spreader 2 and the circuit board 1 are pre-assembled, the rigidity of the overall assembly structure can be improved. When it is assembled with the liquid cooling component 200 and other structures in the future, the pressure influence during the assembly process can be reduced by the compression of the elastic element 32, thereby reducing the deformation of the liquid cooling component 200 and the heat-generating device 11. This ensures that the heat-generating device 11 can form a good fit with the heat spreader 2, and the heat generated by the heat-generating device 11 can be further transferred to the liquid cooling component 200 structure through the heat spreader 2, ensuring a good heat dissipation effect.

[0058] For example, in the embodiments of this application, the heat-generating device 11 refers to a device that can generate heat during operation and needs to be dissipated, such as a SOC chip, an MCU chip, and other IGBT devices.

[0059] In some embodiments, please refer to Figure 4The heat spreader 2 and the heating element 11 are provided with thermally conductive gel 111. The thermally conductive gel 111 can improve the thermal conductivity, heat spread and heat dissipation effect.

[0060] In some embodiments, please refer to Figure 3 The heat spreader 2 has a protrusion 21 on the side facing the circuit board 1, and the protrusion 21 abuts against the heating element 11. The protrusion 21 on the side of the heat spreader 2 facing the circuit board 1 ensures the fit between the heat spreader 2 and the heating element 11, thereby improving heat transfer efficiency and ensuring heat dissipation performance.

[0061] In some embodiments, please refer to Figure 1 A heat-spreading cavity 22 is formed at the protrusion 21, which is used to contain the heat-spreading medium. By containing the heat-spreading medium in the heat-spreading cavity 22 at the protrusion 21, the heat generated by the heating device 11 can be evenly distributed on the heat-spreading plate 2, thereby improving the heat-spreading effect and ensuring heat dissipation performance.

[0062] In some embodiments, please refer to Figure 1 , Figure 2 , Figures 5-10 The connecting component 3 includes an elastic element 32 and a fastener 31 that are connected to each other. The elastic element 32 is disposed on the side of the heat spreader 2 away from the circuit board 1, and the elastic element 32 elastically abuts against the side of the heat spreader 2 away from the circuit board 1. The fastener 31 is connected to the circuit board 1.

[0063] The elastic element 32 is disposed on the side of the heat spreader 2 facing away from the circuit board 1, and elastically abuts against the side of the heat spreader 2 facing away from the circuit board 1. It can provide downward pressure on the heat spreader 2 towards the circuit board 1, so that the heat spreader 2 can fit more tightly with the heat-generating device 11. In addition, when the circuit board structure 100 is assembled with the liquid cooling assembly 200, the elastic element 32 can also provide a cushioning effect, reducing the risk of deformation of the liquid cooling plate during assembly and ensuring heat dissipation effect. The fastener 31 can connect the heat spreader 2 and the circuit board 1 into a whole, ensuring the stability of the structure and improving the rigidity of the overall structure.

[0064] In some embodiments, please refer to Figure 2 , Figure 6 , Figure 8 and Figure 10 The circuit board structure 100 also includes a limiting structure 5. The limiting structure 5 is disposed on the side of the heat spreader 2 away from the elastic member 32. The limiting structure 5 is connected to the fastener 31 to limit the displacement of the fastener 31 in the thickness direction of the heat spreader 2. The limiting structure 5 can prevent the fastener 31 from dislodging from the heating plate and ensure the stability of the structure.

[0065] In some embodiments, please refer to Figure 2 and Figure 3The circuit board structure 100 also includes a first fixing member 41, and the limiting structure 5 includes a snap-fit ​​member 51. The first fixing member 41 is disposed on the side of the heat spreader 2 away from the elastic member 32, and the first fixing member 41 is provided with a first through hole for the fastener 31 to pass through. The snap-fit ​​member 51 is disposed on the side of the first fixing member 41 away from the heat spreader 2, and the snap-fit ​​member 51 snaps the fastener 31 to the first fixing member 41, and the snap-fit ​​member 51 is used to limit the displacement of the fastener 31 in the thickness direction of the heat spreader 2.

[0066] In this embodiment, the cooperation between the first fixing member 41 and the snap-fit ​​member 51 restricts the displacement of the fastener 31 in the thickness direction of the heat spreader 2, preventing the fastener 31 from falling off due to the elasticity of the elastic member 32, thus ensuring the stability of the structure. The first fixing member 41 serves as an assembly skeleton for the snap-fit ​​member 51, providing a first through hole for the fastener 31 to pass through. Furthermore, the first fixing member 41 also cooperates with the heat spreader 2 to assist in heat dissipation.

[0067] For example, the locking member 51 is a limiting retaining ring, which is sleeved on the fastener 31 and restricts the relative displacement between the limiting retaining ring and the fastener 31 through the locking portion on the fastener 31. The limiting retaining ring protrudes radially from the fastener 31, thereby restricting the displacement of the fastener 31 in the thickness direction of the heat exchange plate 2, preventing the fastener 31 from falling off the heat exchange plate 2, and improving the stability of the structure. The limiting retaining ring is also provided with a bent portion, which contacts the first fixing member 41 through the bent portion, which can not only play the role of limiting and locking, but also provide a certain amount of elastic space, reducing the probability of the limiting retaining ring being damaged by stress.

[0068] In some embodiments, please refer to Figure 5 and Figure 6 The circuit board structure 100 also includes a second fixing member 42, and the limiting structure 5 includes a first threaded segment 311 formed on the fastener 31. The second fixing member 42 is disposed on the side of the heat spreader 2 away from the elastic member 32, and the second fixing member 42 is provided with a screw hole that matches the first threaded segment 311. The first threaded segment 311 is adapted to pass through the screw hole to limit the displacement of the fastener 31 in the thickness direction of the heat spreader 2.

[0069] In this embodiment, the first threaded segment 311 on the fastener 31 engages with the threaded hole on the second fixing member 42 to restrict the displacement of the fastener 31 in the thickness direction of the heat spreader 2. Specifically, the second fastener 31 has a threaded hole, and the fastener 31 has a first threaded segment 311 that matches the threaded hole. By rotating the fastener 31, the first threaded segment 311 is screwed into the threaded hole until it passes through the hole. Without rotating the fastener 31, the threaded hole can limit the first threaded segment 311 passing through it, thereby preventing the fastener 31 from falling off the heat spreader 2 and ensuring the stability of the structure. The interaction between the first threaded segment 311 and the threaded hole simplifies the assembly process.

[0070] In some embodiments, a protective gasket is provided on the side of the circuit board 1 near the heat spreader 2, and the connecting component 3 is adapted to pass through the protective gasket and connect to the circuit board 1. The protective gasket provided on the circuit board 1 can provide protection for the circuit board 1 and reduce the risk of damage to the circuit board 1 during assembly.

[0071] Understandably, the protective gasket can be made of a flexible material to improve its protective effect. For example, a protective gasket made of PET (polyethylene terephthalate) can be used.

[0072] In some embodiments, please refer to Figures 7-10 The circuit board structure 100 also includes a third fixing member 43, and the limiting structure 5 includes a first fastening bolt 52. The third fixing member 43 is disposed on the side of the heat spreader 2 away from the elastic member 32, and the third fixing member 43 is provided with a second through hole for the fastener 31 to pass through. The first fastening bolt 52 is disposed on the side of the third fixing member 43 away from the heat spreader 2, and the first fastening bolt 52 is connected to the fastener 31 to limit the displacement of the fastener 31 in the thickness direction of the heat spreader 2.

[0073] In this embodiment, the fastener 31 is connected to the first fastening bolt 52, which can prevent the fastener 31 from falling off the heat spreader 2 and the third fixing member 43, ensuring the stability of the structure and limiting the displacement of the fastener 31 in the thickness direction of the heat spreader 2.

[0074] In some embodiments, please refer to Figure 1 , Figure 2 , Figures 5-10 The circuit board structure 100 also includes a fourth fixing member 6. The fourth fixing member 6 is disposed on the side of the circuit board 1 away from the heat spreader 2, and the fourth fixing member 6 is connected to the connecting member 3.

[0075] By connecting the fourth fixing member 6 to the connecting member 3, the connection and fixation between the heat dissipation plate 2 and the circuit board 1 can be realized. The fourth fixing member 6 helps to improve the overall rigidity of the circuit board structure 100, which can reduce the risk of deformation of the heat-generating device 11 during the assembly of the heat dissipation plate 2 and the circuit board 1, so that the heat-generating device 11 on the circuit board 1 can be tightly attached to the heat dissipation plate 2 to ensure the heat dissipation effect.

[0076] For example, the fourth fastener 6 can be a grid-shaped fastener. The grid-shaped fastener has excellent structural stability, which can ensure the rigidity during the assembly process, reduce the deformation of the heating device 11 during the assembly process, and help to achieve a tight fit between the heat spreader 2 and the heating device 11.

[0077] To improve assembly efficiency, a positioning post 63 can be provided on the fourth fixing member 6, and a corresponding positioning hole 411 can be provided on the first fixing member 41, the second fixing member 42 or the third fixing member 43 that matches it.

[0078] In some embodiments, please refer to Figure 2 , Figure 6 ,and Figure 8 The fastener 31 has a second threaded section 312 at one end near the fourth fixing member 6, and the fourth fixing member 6 is connected to the second threaded section 312 on the fastener 31 by the second fastening bolt 61.

[0079] That is, in this embodiment, the fourth fixing member 6 and the fastener 31 are connected and fixed by the second fastening bolt 61 and the second threaded section 312. The screw connection can ensure the stability of the connection and help to achieve a tight fit between the heat spreader 2 and the heating device 11.

[0080] In some embodiments, please refer to Figure 10 The connecting component 3 has a cavity structure, and the inner wall of the cavity structure is provided with threads. The fourth fixing component 6 is adapted to be connected to the fourth fixing component 6 by means of a fastening stud.

[0081] That is, in this embodiment, the fourth fixing member 6 can be connected by a fastening stud and the internal thread provided in the cavity structure of the fastener 31.

[0082] In some embodiments, the elastic element 32 includes a wave spring or a compression spring. The wave spring has a compact structure and occupies less space. When applied to the heat spreader module mounting structure, it can provide elasticity while reducing space usage, helping to reduce the overall height of the heat spreader module mounting structure. Furthermore, the wave spring has good stability, a long service life, and can provide excellent cushioning. The compression spring is highly adaptable, has a low cost, and can provide good elasticity, meeting the cushioning requirements of the heat spreader module mounting structure.

[0083] In some embodiments, please refer to Figure 11 The side of the heat spreader 2 facing away from the circuit board 1 is used for thermal contact with the liquid cooling assembly 200. Since the side of the heat spreader 2 facing away from the circuit board 1 is provided with a connecting part 3 that elastically abuts against the heat spreader 2, when the heat spreader 2 is assembled with the liquid cooling assembly 200, it can provide a good buffering effect, reduce the risk of deformation of the liquid cooling assembly 200 during the assembly process, and ensure the heat dissipation effect.

[0084] In some embodiments, please refer to Figure 9 and Figure 10 The liquid cooling component 200 and the connecting component 3 are integrally formed. To simplify the overall structure, in this embodiment, the connecting component 3 and the liquid cooling component 200 are integrally formed, making the liquid cooling component 200 and the heat spreader 2 a single unit. The two are then assembled with the circuit board 1. The elastic element 32 provides a cushioning effect, reducing the risk of deformation of the liquid cooling component 200 during assembly. Furthermore, the elastic element 32 provides elasticity, compressing the gaps between the heat spreader 2 and the liquid cooling component 200, and between the heat spreader 2 and the heat-generating device 11, which helps to achieve a good fit between the liquid cooling component 200, the heat spreader 2, and the heat-generating device 11, improving the contact heat dissipation effect.

[0085] Secondly, please refer to Figure 11 This application embodiment also provides a heat dissipation component, including a liquid cooling component 200 and at least one circuit board structure 100 as described above, wherein the liquid cooling component 200 is disposed on the side of the heat spreader 2 away from the circuit board 1.

[0086] In the heat dissipation module mounting structure, the assembly of the heat dissipation plate 2 and the circuit board 1 ensures a good fit between the heat dissipation plate 2 and the heat-generating device 11, thereby dissipating and evenly dissipating the heat generated by the heat-generating device 11. The liquid cooling component 200, located on the side of the heat dissipation plate 2 away from the circuit board 1, can further dissipate heat through liquid cooling by fitting it to the heat dissipation plate 2, ensuring effective heat dissipation. Because the circuit board structure 100 pre-assembles the heat dissipation plate 2 and the circuit board 1, it ensures a tight fit between the two, reducing the possibility of reduced heat dissipation due to poor fit. In addition, the circuit board structure 100 has good rigidity, and the elastic element 32 in the circuit board structure 100 can provide a buffering effect to reduce the risk of deformation during the assembly of the liquid cooling component 200 and the circuit board structure 100. This achieves a good fit between the liquid cooling component 200 and the heat spreader 2, and a good fit between the heat spreader 2 and the heat-generating device 11. As a result, the heat generated by the heat-generating device 11 can be dissipated in a timely manner through the heat spreader 2 and the liquid cooling component 200, ensuring the heat dissipation effect.

[0087] In some embodiments, please refer to Figure 11The heat dissipation component includes a liquid cooling component 200 and two circuit board structures 100, which are respectively disposed on opposite sides of the liquid cooling component 200.

[0088] The circuit board structure 100 provided in this embodiment is relatively compact, which helps to realize a "sandwich" structure in which two circuit board structures 100 are respectively set on opposite sides of a liquid cooling component 200, improving the overall structural compactness and reducing the use of liquid cooling component 200, thus reducing costs. For example, when the elastic element 32 in the circuit board structure 100 provided in this embodiment is a wave spring, its small space occupation ensures a reasonable overall spatial layout while realizing the "sandwich" structure.

[0089] In some embodiments, the heat dissipation assembly includes a liquid cooling assembly 200 and a circuit board structure 100, the circuit board structure 100 being disposed on one side of the liquid cooling assembly 200.

[0090] By combining a liquid cooling component 200 and a circuit board structure 100, the heat dissipation effect can be improved, the interference and influence of other components can be reduced, and the stability of heat dissipation can be guaranteed.

[0091] In some embodiments, please refer to Figures 9-10 In this embodiment, the connecting component 3 in the circuit board structure 100 is integrally formed with the liquid cooling assembly 200. To simplify the overall structure, the connecting component 3 and the liquid cooling assembly 200 are integrally formed, making the liquid cooling assembly 200 and the heat spreader 2 a single component. The two components are then assembled with the circuit board 1. The elastic element 32 provides a cushioning effect, reducing the risk of deformation of the liquid cooling assembly 200 during assembly. Furthermore, the elastic element 32 provides elasticity, compressing the gaps between the heat spreader 2 and the liquid cooling assembly 200, and between the heat spreader 2 and the heat-generating device 11, which helps to achieve a good fit between the liquid cooling assembly 200, the heat spreader 2, and the heat-generating device 11, improving the contact heat dissipation effect.

[0092] Thirdly, embodiments of this application also provide a power module, including the circuit board structure 100 as described above, and / or, the heat dissipation component as described above.

[0093] The power module provided in this application embodiment has all the beneficial effects of the heat dissipation component described above, which will not be repeated here.

[0094] Fourthly, embodiments of this application also provide a vehicle including the power module described above.

[0095] The vehicle provided in this application embodiment has all the beneficial effects of the heat dissipation component described above, which will not be repeated here.

[0096] In the description of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more features. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0097] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0098] The embodiments, implementation methods, and related technical features of this application can be combined and substituted for each other without conflict.

[0099] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.

Claims

1. A circuit board structure, characterized in that, include: A circuit board, wherein a heating element is provided on one side of the circuit board; A heat spreader is disposed on the side of the heating device away from the circuit board; A connecting component is connected to the circuit board. The connecting component is used to elastically abut against the side of the heat spreader away from the circuit board to press the heat spreader onto the heating device.

2. The circuit board structure according to claim 1, characterized in that, The heat spreader has a protrusion on the side facing the circuit board, and the protrusion abuts against the heating device.

3. The circuit board structure according to claim 2, characterized in that, A heat-equalizing cavity is formed at the protrusion, and the heat-equalizing cavity is used to contain the heat-equalizing medium.

4. The circuit board structure according to claim 1, characterized in that, The connecting components include elastic elements and fasteners that are interconnected; The elastic element is disposed on the side of the heat spreader away from the circuit board, and the elastic element elastically abuts against the side of the heat spreader away from the circuit board. The fastener is connected to the circuit board.

5. The circuit board structure according to claim 4, characterized in that, The circuit board structure also includes a limiting structure; The limiting structure is disposed on the side of the heat spreader away from the elastic member, and the limiting structure is connected to the fastener to limit the displacement of the fastener in the thickness direction of the heat spreader.

6. The circuit board structure according to claim 5, characterized in that, The circuit board structure also includes a first fixing member, and the limiting structure includes a snap-fit ​​member; The first fixing member is disposed on the side of the heat spreader away from the elastic member, and the first fixing member is provided with a first through hole for the fastener to pass through; The snap-fit ​​component is disposed on the side of the first fixing member opposite to the heat spreader plate. The snap-fit ​​component snaps the fastener to the first fixing member and is used to limit the displacement of the fastener in the thickness direction of the heat spreader plate.

7. The circuit board structure according to claim 5, characterized in that, The circuit board structure also includes a second fastener, and the limiting structure includes a first threaded segment formed on the fastener; The second fastener is disposed on the side of the heat spreader away from the elastic member, and the second fastener is provided with a screw hole that matches the first threaded section. The first threaded section is adapted to pass through the screw hole to limit the displacement of the fastener in the thickness direction of the heat spreader.

8. The circuit board structure according to claim 5, characterized in that, The circuit board structure also includes a third fixing component, and the limiting structure includes a first fastening bolt; The third fastener is disposed on the side of the heat spreader away from the elastic member, and the third fastener is provided with a second through hole for the fastener to pass through; The first fastening bolt is located on the side of the third fixing member opposite to the heat spreader plate. The first fastening bolt is connected to the fastener to limit the displacement of the fastener in the thickness direction of the heat spreader plate.

9. The circuit board structure according to any one of claims 1-8, characterized in that, The circuit board structure also includes a fourth fixing component; The fourth fixing member is disposed on the side of the circuit board away from the heat spreader, and the fourth fixing member is connected to the connecting component.

10. The circuit board structure according to claim 9, characterized in that, The connecting component has a second threaded section at one end near the fourth fixing member, and the fourth fixing member is connected to the second threaded section on the connecting component by a second fastening bolt.

11. The circuit board structure according to claim 9, characterized in that, The connecting component has a cavity structure, and the inner wall of the cavity structure is provided with threads. The fourth fixing member is adapted to be connected to the fourth fixing member by a fastening stud.

12. The circuit board structure according to any one of claims 4-8, characterized in that, The elastic element includes a wave spring or a compression spring.

13. The circuit board structure according to any one of claims 1-8, characterized in that, The side of the heat spreader away from the circuit board is used for thermal contact with the liquid cooling assembly.

14. The circuit board structure according to claim 13, characterized in that, The liquid cooling component and the connecting component are integrally formed.

15. A heat dissipation component, characterized in that, It includes a liquid cooling assembly and at least one circuit board structure as described in any one of claims 1-14, wherein the liquid cooling assembly is disposed on the side of the heat spreader away from the circuit board.

16. The heat dissipation assembly according to claim 15, characterized in that, It includes one of the liquid cooling components and two of the circuit board structures; The two circuit board structures are respectively disposed on opposite sides of the liquid cooling assembly.

17. The heat dissipation assembly according to claim 15, characterized in that, Includes one of the liquid cooling components and one of the circuit board structures; The circuit board structure is disposed on one side of the liquid cooling assembly.

18. The heat dissipation assembly according to claim 17, characterized in that, The fasteners in the circuit board structure are integrally formed with the liquid cooling component.

19. A power module, characterized in that, Includes the circuit board structure as described in any one of claims 1-14, and / or the heat dissipation component as described in any one of claims 15-18.

20. A vehicle, characterized in that, Includes the power module as described in claim 19.

Images