Circuit board with temperature equalization function

Abstract

This utility model discloses a circuit board with temperature equalization function, including a circuit board body. Several sets of heat-conducting grooves are horizontally arranged inside the circuit board body, and each set of heat-conducting grooves is filled with heat-conducting filler. Heat dissipation fins are fixedly connected to both sides of the circuit board body. By setting heat-equalizing components at the top of the high-heat and low-heat component areas, heat equalization between different areas of the circuit board is achieved. The design of horizontally opening several sets of heat-conducting grooves inside the circuit board body and filling them with heat-conducting filler increases the internal heat conduction area of ​​the circuit board, allowing the heat generated inside the circuit board to be conducted away more quickly. The heat dissipation fins fixedly connected to both sides of the circuit board body are located at the ends of the heat-conducting grooves, further accelerating heat dissipation, effectively reducing the overall temperature of the circuit board, improving the heat dissipation efficiency of the circuit board, and ensuring the stability of the circuit board under long-term high-load operation.

Description

Technical Field

[0001] This utility model relates to the field of electronic circuit board technology, specifically a circuit board with temperature equalization function. Background Technology

[0002] With the rapid development of electronic devices towards high performance, high integration and miniaturization, the computing power and power density of chips have been significantly improved. As the carrier of core electronic components, the thermal management requirements of circuit boards have become a key bottleneck restricting system reliability.

[0003] In traditional circuit board design, due to the limitations of material thermal conductivity and passive heat dissipation structure, when the device is under high load, the heat generated by high power consumption components is difficult to quickly dissipate to the entire board surface, resulting in a significant temperature gradient in local areas. High temperature environment will directly lead to a decrease in carrier mobility and threshold voltage drift of semiconductor devices, which in turn will cause problems such as increased signal delay and decreased operating frequency. Therefore, we need to propose a circuit board with temperature equalization function. Summary of the Invention

[0004] The purpose of this invention is to provide a circuit board with temperature equalization function. Through various innovative structural designs and material selections, the heat conduction and heat dissipation performance and temperature equalization capability of the circuit board are significantly improved, effectively extending the service life of the circuit board and its electronic components, and improving the stability and reliability of the circuit board under various working environments, thereby solving the problems mentioned in the background art.

[0005] To achieve the above objectives, this utility model provides the following technical solution:

[0006] A circuit board with temperature equalization function includes a circuit board body. The interior of the circuit board body has several sets of heat-conducting grooves arranged horizontally. The interior of each set of heat-conducting grooves is filled with heat-conducting filler. Heat dissipation fins are fixedly connected to both sides of the circuit board body, and the two sets of heat dissipation fins are located at the two ends of the heat-conducting grooves. A high-heat element area is provided on the top of the circuit board body, and a low-heat element area is provided on the side of the high-heat element area on the top of the circuit board body. A heat equalization component is provided on the top of the high-heat element area and the low-heat element area.

[0007] Preferably, the heat dissipation assembly includes a first heat dissipation plate, which is fixedly connected to the top of the high-heat element area. A plurality of heat pipes are connected to the top of the first heat dissipation plate, and a second heat dissipation plate is fixedly connected to one end of each of the heat pipes. The second heat dissipation plate is fixedly connected to the top of the low-heat element area.

[0008] Preferably, the first heat spreader has a cavity inside, and the cavity is filled with a heat-conducting fluid.

[0009] Preferably, the top of the circuit board body has a plurality of vias, and thermal paste is disposed inside the plurality of vias. The thermal paste is a thermally conductive silicone grease containing nano-silver particles.

[0010] Preferably, it also includes an external heat sink, which is fixedly connected to the bottom of the circuit board body.

[0011] Preferably, the external heat sink is a corrugated metal plate with a nano-coating on its surface, the nano-coating being made of aluminum nitride or zinc oxide.

[0012] Preferably, the heat conduction groove has a rectangular cross-sectional shape, and the depth of the heat conduction groove is 1 / 3 to 1 / 2 of the thickness of the circuit board body.

[0013] Compared with the prior art, the beneficial effects of this utility model are:

[0014] This invention achieves heat balance between different areas of the circuit board by setting heat dissipation components on top of the high-heat and low-heat component areas. By horizontally opening several sets of heat-conducting grooves inside the circuit board body and filling the grooves with heat-conducting filler, this design greatly increases the heat conduction area inside the circuit board, allowing the heat generated inside the circuit board to be conducted away more quickly. At the same time, the heat dissipation fins fixedly connected to both sides of the circuit board body are located at both ends of the heat-conducting grooves, further accelerating heat dissipation, effectively reducing the overall temperature of the circuit board, improving the heat dissipation efficiency of the circuit board, and ensuring the stability of the circuit board under long-term high-load operation. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the structure of this utility model;

[0016] Figure 2 This is a schematic diagram of the axial side structure of this utility model;

[0017] Figure 3 This is a schematic diagram of the structure of the first heat spreader, cavity and heat pipe of this utility model;

[0018] Figure 4 This is a schematic diagram of the circuit board body, heat conduction groove and via of this utility model.

[0019] In the figure: 1. Circuit board body; 2. Heat conduction groove; 3. Heat conduction filler; 4. Heat dissipation fins; 5. High heat element area; 6. Low heat element area; 7. Heat dissipation assembly; 701. First heat dissipation plate; 702. Heat pipe; 703. Second heat dissipation plate; 8. Cavity; 9. Through hole; 10. External heat dissipation plate; 11. Nano coating. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0021] Please see Figure 1-4 This utility model provides a technical solution:

[0022] A circuit board with temperature equalization function includes a circuit board body 1, which is the core basic structure of the entire circuit board. Its material is usually selected from materials with good insulation and certain mechanical strength, such as FR-4 epoxy glass cloth laminate. Several sets of heat conduction grooves 2 are horizontally opened inside the circuit board body 1. These heat conduction grooves 2 are evenly distributed inside the circuit board body 1, which can effectively collect and conduct heat generated at different locations inside the circuit board body 1. The heat conduction grooves 2 are filled with heat conduction fillers 3. The heat conduction fillers 3 are usually made of materials with high thermal conductivity, such as graphite powder and alumina particles. They are tightly filled in the heat conduction grooves 2, which increases the heat conduction area and improves the heat conduction efficiency, so that the heat inside the circuit board body 1 can be transferred out more quickly, reducing the overall temperature of the circuit board body 1 and ensuring the stability of the circuit board body 1 during long-term operation.

[0023] Heat dissipation fins 4 are fixedly connected to both sides of the circuit board body 1, and the two sets of heat dissipation fins 4 are located at both ends of the heat conduction groove 2. This layout allows the heat conducted from the heat conduction groove 2 to be directly transferred to the heat dissipation fins 4. The heat dissipation fins 4 are made of high thermal conductivity metal material, such as copper or aluminum, and their surfaces are usually specially treated, such as wire drawing or oxidation, to increase the heat dissipation area and heat dissipation efficiency. When the circuit board body 1 is working, the heat dissipation fins 4 can quickly dissipate heat to the surrounding environment, effectively reduce the temperature of the circuit board, and avoid the circuit board performance degradation or damage due to excessive temperature.

[0024] The top of the circuit board body 1 is provided with a high-heat component area 5, which is the area where electronic components with large heat generation are installed, such as high-power chips and power transistors. On the top of the circuit board body 1, on one side of the high-heat component area 5, there is a low-heat component area 6, which is where electronic components with relatively small heat generation are installed, such as resistors and capacitors. The top of the high-heat component area 5 and the low-heat component area 6 are provided with a heat dissipation component 7, which plays a key role in balancing the temperature of the two areas.

[0025] The heat spreader assembly 7 includes a first heat spreader plate 701, which is fixedly connected to the top of the high-heat element area 5 by welding or bonding. The first heat spreader plate 701 is made of a high thermal conductivity metal, and its internal structure is designed to quickly absorb the heat generated by the high-heat element area 5. Several sets of heat pipes 702 are connected to the top of the first heat spreader plate 701. The heat pipes 702 are heat transfer elements with extremely high thermal conductivity, and their interiors are filled with a working medium. They achieve rapid heat transfer through the phase change heat transfer principle. The heat pipes 702 can heat the first heat spreader plate... The heat absorbed by 701 is efficiently conducted away. One end of several heat pipes 702 is fixedly connected to a second heat spreader 703. The second heat spreader 703 is also made of a high thermal conductivity metal. The second heat spreader 703 is fixedly connected to the top of the low-heat element area 6. The heat pipes 702 transfer heat from the first heat spreader 701 to the second heat spreader 703, which raises the temperature of the low-heat element area 6, thereby achieving heat balance between the high-heat element area 5 and the low-heat element area 6, avoiding local overheating, and improving the overall performance and reliability of the circuit board.

[0026] The first heat spreader 701 has a cavity 8 inside. The structural design of the cavity 8 can increase the space for heat storage and conduction. The cavity 8 is filled with a heat-conducting fluid, which is usually a liquid with high thermal conductivity and good fluidity, such as deionized water, ethanol, or some special heat-conducting working fluid. When the first heat spreader 701 absorbs heat, the heat-conducting fluid in the cavity 8 undergoes a phase change. Through the phase change process, it quickly absorbs a large amount of heat and transfers the heat to the area where the heat pipe 702 is located. The presence of the heat-conducting fluid greatly improves the thermal conductivity of the first heat spreader 701, so that the heat can be conducted away more quickly, further enhancing the temperature equalization capability of the heat spreader 7.

[0027] The top of the circuit board body 1 has several sets of vias 9, and thermal paste is placed inside each set of vias 9. The thermal paste is a thermal grease containing nano-silver particles. Nano-silver particles have extremely high thermal conductivity. Adding them to the thermal grease can significantly improve the thermal conductivity of the thermal grease. The thermal paste fills the vias 9 and can closely adhere to the inner wall of the vias 9 and the surrounding electronic component pins or circuits, reducing thermal resistance and enabling more efficient heat transfer between different layers of the circuit board. In this way, when the circuit board is working, the heat generated by each layer can be quickly conducted to the surface of the circuit board or other heat dissipation structures through the vias 9 and the thermal paste, improving the overall heat dissipation efficiency of the circuit board.

[0028] It also includes an external heat sink 10, which is fixedly connected to the bottom of the circuit board body 1.

[0029] The external heat sink 10 is a corrugated metal plate. The corrugated design increases the contact area between the heat sink and the air. When the air flows over the surface of the heat sink, more turbulence is formed, thereby enhancing the heat dissipation effect. Its surface is covered with a nano-coating 11. The nano-coating 11 is made of aluminum nitride or zinc oxide. Both aluminum nitride and zinc oxide have high thermal conductivity and good chemical stability. The nano-coating 11 can further improve the heat dissipation performance of the heat sink and quickly dissipate the heat transferred from the circuit board body 1 to the surrounding environment. In addition, the nano-coating 11 can also effectively prevent the surface of the external heat sink 10 from being corroded and extend the service life of the external heat sink 10.

[0030] The heat conduction groove 2 has a rectangular cross-sectional shape, which facilitates processing and filling with heat-conducting filler 3. At the same time, it ensures that the heat conduction groove 2 has a certain structural strength. The depth of the heat conduction groove 2 is 1 / 3 to 1 / 2 of the thickness of the circuit board body 1. This reasonable depth setting ensures that the heat conduction groove 2 has enough space to fill with heat-conducting filler 3 to achieve a good heat conduction effect, while not excessively weakening the structural strength of the circuit board body 1. This ensures that the circuit board will not be damaged due to structural problems during normal use, thus balancing thermal conductivity and mechanical properties.

[0031] When the circuit board body 1 is working, the electronic components in the high-heat component area 5 generate a large amount of heat. This heat is first absorbed by the first heat spreader 701. The heat-conducting fluid inside the first heat spreader 701 undergoes a phase change when heated, quickly absorbs heat and transfers the heat to the area where the heat pipe 702 is located. The heat pipe 702 uses its internal phase change heat transfer principle to efficiently conduct the heat to the second heat spreader 703. The second heat spreader 703 transfers the heat to the low-heat component area 6, causing the temperature of the low-heat component area 6 to rise, thereby achieving heat balance between the high-heat component area 5 and the low-heat component area 6.

[0032] Meanwhile, the heat generated inside the circuit board body 1 is conducted to both sides of the circuit board body 1 through the thermally conductive filler 3 in the thermally conductive groove 2, and then transferred to the heat dissipation fins 4. The heat dissipation fins 4 dissipate the heat into the surrounding air, reducing the overall temperature of the circuit board body 1. In addition, the heat between different layers of the circuit board body 1 is transferred through the vias 9 and the internal thermal paste, so that the heat of each layer can be evenly distributed and dissipated.

[0033] The external heat sink 10 at the bottom of the circuit board body 1 further increases the heat dissipation area. Its corrugated structure and surface nano-coating 11 improve heat dissipation efficiency, quickly dissipating the heat transferred from the circuit board body 1 to the surrounding environment. Through the synergistic effect of the above multiple heat dissipation and temperature equalization mechanisms, the circuit board with temperature equalization function can effectively control the temperature of each area of ​​the circuit board body 1, avoid local overheating, improve the working performance, stability and reliability of the circuit board body 1, and extend the service life of electronic components.

[0034] Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the present invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A circuit board with temperature equalization function, comprising a circuit board body (1), characterized in that: The circuit board body (1) has several sets of heat-conducting grooves (2) arranged horizontally inside. The heat-conducting grooves (2) are filled with heat-conducting fillers (3). Heat dissipation fins (4) are fixedly connected to both sides of the circuit board body (1), and the two sets of heat dissipation fins (4) are located at both ends of the heat-conducting grooves (2). A high-heat element area (5) is provided on the top of the circuit board body (1). A low-heat element area (6) is provided on the side of the high-heat element area (5) on the top of the circuit board body (1). A heat-spreading component (7) is provided on the top of the high-heat element area (5) and the low-heat element area (6).

2. A circuit board with temperature equalization function according to claim 1, characterized in that: The heat spreader assembly (7) includes a first heat spreader plate (701), which is fixedly connected to the top of the high heat element area (5). A plurality of heat pipes (702) are connected to the top of the first heat spreader plate (701), and a second heat spreader plate (703) is fixedly connected to one end of the plurality of heat pipes (702). The second heat spreader plate (703) is fixedly connected to the top of the low heat element area (6).

3. A circuit board with temperature equalization function according to claim 2, characterized in that: The first heat spreader (701) has a cavity (8) inside, and the cavity (8) is filled with a heat-conducting fluid.

4. A circuit board with temperature equalization function according to claim 1, characterized in that: The top of the circuit board body (1) is provided with several sets of vias (9), and thermal paste is provided inside each of the several sets of vias (9). The thermal paste is thermal grease containing nano-silver particles.

5. A circuit board with temperature equalization function according to claim 1, characterized in that: It also includes an external heat sink (10), which is fixedly connected to the bottom of the circuit board body (1).

6. A circuit board with temperature equalization function according to claim 5, characterized in that: The external heat sink (10) is a corrugated metal plate with a nano-coating (11) on its surface. The nano-coating (11) is made of aluminum nitride or zinc oxide.

7. A circuit board with temperature equalization function according to claim 1, characterized in that: The heat conduction groove (2) has a rectangular cross-sectional shape, and the depth of the heat conduction groove (2) is 1 / 3 to 1 / 2 of the thickness of the circuit board body (1).

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