SMT furnace passing fixture with poor welding prevention function

Abstract

The utility model discloses a SMT passes through the tool with the function of preventing poor welding, and the tool body is formed with several air-avoiding hole grooves and support protrusions, each air-avoiding hole groove extends downwards and penetrates the tool body, and each support protrusion extends upwards and can extend to above the circuit board placed thereon after passing through the circuit board, for supporting the electronic components welded on the circuit board and extending to above the circuit board. The utility model sets up several support protrusions on the tool for passing through the furnace, can support the larger electronic components on the circuit board during the process of passing through the furnace, makes it always adhere to the circuit board under the high temperature environment in the furnace, solves the problem of electronic component deformation displacement and poor welding in SMT production due to the difficulty of stable support of larger electronic components by light and thin plate materials, has the simple structure, the lower manufacturing cost, and provides the further optimization design space for the circuit board design.

Description

Technical Field

[0001] This utility model relates to the field of SMT production technology, and in particular to an SMT reflow fixture with anti-soldering defect function. Background Technology

[0002] PCB warping and lifting is a major problem encountered in SMT reflow production. Currently, there are various solutions and methods to address this issue, such as adjusting the reflow temperature, increasing board thickness, or modifying the PCB structure. With the rapid increase in raw material and labor costs, as well as the development trends of electronic products and intensified market competition, PCB design is almost on the verge of being controlled in terms of thinness and circuit layout. To balance the contradictory requirements of ensuring board thickness and a slim, compact design, many PCBs, while designing lead soldering holes as continuous through-holes, also reduce the contact area between components and the PCB. This is achieved by adding clearance grooves at the edge projection of components on the PCB to reduce weight and avoid lifting caused by thermal stress concentration. However, due to the weakened support of the PCB for components, these components are prone to collapse and deformation during reflow, leading to deformation and poor soldering at the solder joints between component leads and the PCB after reflow. This is especially problematic when the components are plug-in connectors, where even slight positional deviations can affect the insertion operation. Utility Model Content

[0003] To address the problems existing in the prior art, this utility model provides an SMT reflow fixture with anti-soldering defect function, which can solve the problems of electronic component deformation and displacement and poor soldering caused by the difficulty of thin and light boards to stably support large electronic components in SMT reflow production. It has a simple structure, low manufacturing cost, and provides further optimization space for circuit board design.

[0004] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0005] An SMT reflow fixture with anti-soldering defect function includes a fixture body. The upper end of the fixture body is provided with a slot that can accommodate one or more circuit boards. The fixture body has a plurality of clearance slots and support protrusions formed on the bottom end of the slots. Each clearance slot extends downward and penetrates the fixture body. Each support protrusion extends upward and can pass through the circuit board placed thereon and extend above it to support electronic components soldered on the circuit board and extending above it.

[0006] As a further explanation of the above technical solution:

[0007] In the above technical solution, the upper end contour edge of each of the supporting protrusions extends to the outer side of the lower end of the electronic component.

[0008] In the above technical solution, the distance between the upper surface of each support protrusion and the upper surface of the circuit board is between 0.8mm and 1.8mm.

[0009] In the above technical solution, a heat-resistant pad is also provided at the upper end of several of the supporting protrusions.

[0010] In the above technical solution, the fixture body is provided with a foolproof structure and / or a positioning structure.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: by setting several support protrusions on the reflow fixture, larger electronic components on the circuit board can be supported during the reflow process, so that they can always stick to the circuit board in the high temperature environment inside the furnace. This solves the problem of electronic component deformation, displacement and poor soldering caused by the difficulty of thin boards to stably support larger electronic components in SMT reflow production. The structure is simple, the manufacturing cost is low, and it provides further optimization space for circuit board design. Attached Figure Description

[0012] Figure 1 This is a front view structural diagram of this embodiment;

[0013] Figure 2 This is a front view of the structure after the circuit board is installed in this embodiment;

[0014] Figure 3 yes Figure 2 Schematic diagram of the cross-sectional structure of AA;

[0015] Figure 4 yes Figure 3 Enlarged view of section B in the middle.

[0016] In the diagram: 10. Fixture body; 20. Circuit board; 30. Electronic components; 40. Heat-resistant pad; 1. Slot; 2. Clearance hole slot; 3. Support protrusion; 4. Foolproof structure; 5. Positioning structure; 6. Pin. Detailed Implementation

[0017] The present invention will now be described in further detail with reference to the accompanying drawings.

[0018] The embodiments described with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application. In the description of this application, it should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," and "counterclockwise," etc., indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings, are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as limiting this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "several" or "more than" means two or more, unless otherwise explicitly specified. In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances. In this application, unless otherwise expressly specified and limited, "above" or "below" a second feature can include direct contact between the first and second features, or it can include contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of a second feature includes the first feature directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" of a second feature includes the first feature directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0019] like Figure 1-2As shown, an SMT reflow fixture with anti-soldering defect function includes a fixture body 10. The upper end of the fixture body 10 is provided with a slot 1 that can accommodate one or more circuit boards 20. Several clearance slots 2 and support protrusions 3 are formed on the bottom end of the slots 1 on the fixture body 10. Each clearance slot 2 extends downward and penetrates the fixture body 10, and each support protrusion 3 extends upward and can pass through the circuit board 20 placed on it and extend above it to support electronic components 30 soldered on the circuit board 20 and extending above it. In application, depending on the actual structure of the circuit board 20 and the fixture body 10, a foolproof structure 4 and / or a positioning structure 5 can be provided on the fixture body 10.

[0020] like Figure 2-4 As shown, in order to effectively support the electronic component 30, the upper end contour edge of each support protrusion 3 extends to the outer side of the lower end of the electronic component 30; the distance between the upper end face of each support protrusion 3 and the upper end face of its upper circuit board 20 is between 0.8mm and 1.8mm.

[0021] In this embodiment, the slot 1 can accommodate a larger circuit board assembled from several small circuit boards 20. Each small circuit board 20 has at least one electronic component 30 that needs to be supported. The upper end of each support protrusion 3 passes through the weight reduction slot on the circuit board 20 and extends to the outside of the circuit board 20, and its end is 1.0 mm away from the upper end of the circuit board 20. In order to avoid dimensional deviations caused by the accumulation of tolerances during the production process, a heat-resistant pad 40 is also provided at the upper end of several support protrusions 3 to ensure that one end of the electronic component 30 is well supported, so that the end with the pin 6 can always be attached to the circuit board 20 in the high temperature environment of the SMT soldering oven. This avoids the problem of the pin 6 and the circuit board 20 becoming loose due to the heat displacement of the electronic component 30 (i.e., the overhead end drooping and the pin 6 lifting). This ensures the stability of the soldering of the larger electronic component 30 with insufficient support on the circuit board 20.

[0022] This invention, by setting several supporting protrusions 3 on the reflow fixture, can support larger electronic components 30 on the circuit board 20 during the reflow process, ensuring that they remain attached to the circuit board 20 under the high temperature environment inside the oven. This solves the problem of deformation, displacement, and poor soldering of electronic components 30 caused by the difficulty of supporting larger electronic components 30 with thin sheet metal in SMT reflow production. The structure is simple, the manufacturing cost is low, and it provides further optimization space for circuit board design.

[0023] The above does not limit the technical scope of this utility model. Any modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this utility model shall still fall within the scope of the technical solution of this utility model.

Claims

1. An SMT reflow fixture with anti-soldering defect function, comprising a fixture body, wherein the upper end of the fixture body is provided with a slot capable of accommodating one or more circuit boards; characterized in that, The fixture body has a plurality of clearance slots and support protrusions formed at the bottom end of the slot. Each clearance slot extends downward and through the fixture body, and each support protrusion extends upward and can pass through the circuit board placed thereon and extend above it, so as to support electronic components soldered on the circuit board and extending above it.

2. The SMT reflow fixture with anti-soldering defect function according to claim 1, characterized in that, The upper edge of each of the support protrusions extends to the outer side of the lower end of the electronic component.

3. The SMT reflow fixture with anti-soldering defect function according to claim 1, characterized in that, The distance between the upper surface of each of the support protrusions and the upper surface of the circuit board is between 0.8 mm and 1.8 mm.

4. The SMT reflow fixture with anti-soldering defect function according to any one of claims 1-3, characterized in that, The upper end of several of the support protrusions is also provided with a heat-resistant pad.

5. The SMT reflow fixture with anti-soldering defect function according to claim 4, characterized in that, The fixture body is provided with a foolproof structure and / or a positioning structure.

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