A CO2-powered heat pipe type chip cooling plate

Abstract

This application provides a CO2-powered heat pipe type chip cold plate, comprising: a plate heat exchanger connected to a refrigerant inlet pipe and a refrigerant outlet pipe; the plate heat exchanger is configured to receive CO2 transmitted through the refrigerant inlet pipe for heat exchange and condense it into CO2 working fluid; at least one chip cold plate connected to the plate heat exchanger via a CO2 heat pipe inlet pipe and a CO2 heat pipe outlet pipe; the CO2 heat pipe inlet pipe is configured to transmit the CO2 working fluid to the chip cold plate, and the CO2 heat pipe outlet pipe is configured to transmit the CO2 working fluid to the plate heat exchanger, thereby solving the problems of insufficient flow control accuracy and lag in dynamic heat load response that still exist in the current integrated application of power heat pipe technology and CO2 cold plates.

Description

Technical Field

[0001] This application relates to the field of refrigeration equipment technology, and in particular to a CO2-powered heat pipe type chip cold plate. Background Technology

[0002] With the rapid development of cloud computing, artificial intelligence, and high-performance computing technologies, the power density of data center chips continues to rise, posing a severe challenge to traditional heat dissipation technologies. Current heat dissipation solutions, particularly air cooling, are limited by the low heat capacity and low thermal conductivity of air, making it difficult to meet the heat dissipation needs of high-power chips and prone to localized overheating, affecting equipment stability and lifespan. While liquid cooling technology can significantly improve heat dissipation efficiency, existing liquid cooling systems mostly rely on synthetic refrigerants (such as Freon), which pose risks of high global warming potential (GWP), ozone layer depletion, and flammability, contradicting the global trend of green and low-carbon development. Furthermore, current cold plate designs have significant shortcomings in terms of structural optimization, pressure resistance, and adaptability: for example, uneven distribution of flow channels in microchannel cold plates can lead to decreased heat dissipation efficiency; metal composite cold plates limit heat transfer performance due to high interfacial thermal resistance; and conventional cold plates are difficult to flexibly adapt to diverse data center heat dissipation scenarios.

[0003] In existing technologies, carbon dioxide (CO2), as a natural working fluid, is considered an ideal choice for environmentally friendly refrigerants due to its zero ozone depletion potential (ODP), extremely low gas volatile organic compound (GWP) (GWP=1), non-flammability, and non-toxicity. However, the high-pressure operation of CO2 during phase change heat transfer places higher demands on system sealing and structural strength, making it difficult for current cold plate designs to balance efficient heat exchange with long-term reliability. Meanwhile, while dynamic heat pipe technology can significantly improve heat transfer efficiency through phase change cycling, its integration with CO2 cold plates still faces problems such as insufficient flow control accuracy and lag in dynamic heat load response, resulting in a low system coefficient of performance (COP) and poor stability. Utility Model Content

[0004] This application provides a CO2-powered heat pipe type chip cold plate to solve the technical problems of insufficient flow control accuracy and lag in dynamic heat load response that still exist in the current integrated application of power heat pipe technology and CO2 cold plates.

[0005] This application provides a CO2-powered heat pipe type chip cold plate, comprising:

[0006] A plate heat exchanger, wherein the plate heat exchanger is connected to a refrigerant inlet pipe and a refrigerant outlet pipe; the plate heat exchanger is configured to receive CO2 transmitted by the refrigerant inlet pipe for heat exchange and condense it into CO2 working fluid;

[0007] At least one chip cold plate is connected to the plate heat exchanger via a carbon dioxide heat pipe inlet pipe and a carbon dioxide heat pipe outlet pipe; the carbon dioxide heat pipe inlet pipe is configured to transfer the CO2 working fluid to the chip cold plate, and the carbon dioxide heat pipe outlet pipe is configured to transfer the CO2 working fluid to the plate heat exchanger.

[0008] In some embodiments, the refrigerant inlet pipe is provided with an electric throttle valve;

[0009] The refrigerant outlet pipe is equipped with a first pressure sensor and a first temperature sensor; the first pressure sensor is configured to acquire the pressure value of the refrigerant; the first temperature sensor is configured to acquire the temperature value of the refrigerant.

[0010] In some embodiments, the carbon dioxide heat pipe inlet pipe is equipped with an electromagnetic pump;

[0011] The carbon dioxide heat pipe outlet pipe is equipped with a second pressure sensor and a second temperature sensor; the second pressure sensor is configured to acquire the pressure value of the CO2 working fluid; the second temperature sensor is configured to acquire the temperature value of the CO2 working fluid.

[0012] In some embodiments, the CO2-powered heat pipe type chip cold plate further includes:

[0013] A control module is connected to the electromagnetic pump, the second pressure sensor, and the second temperature sensor; the control module is configured to:

[0014] Determine the saturation temperature of the CO2 working fluid at the pressure value;

[0015] Calculate the superheat of the CO2 working fluid based on its temperature and saturation temperature.

[0016] Based on the superheat, the switching frequency of the electromagnetic pump is determined so that the superheat of the CO2 working fluid reaches a preset value.

[0017] In some embodiments, the chip cold plate includes:

[0018] The first cold plate diversion channel has a first refrigerant inlet on its side wall.

[0019] The first cold plate manifold has a first refrigerant outlet on its side wall; the first cold plate manifold is parallel to the first cold plate branch flow channel; a plurality of first cold plate branch flow channels are provided between the first cold plate manifold and the first cold plate branch flow channel; the first cold plate branch flow channels are connected to the first cold plate manifold and the first cold plate branch flow channel; gaps are provided between the first cold plate branch flow channels.

[0020] In some embodiments, the outer diameter of the first cold plate branch flow channel is set to a range of 2 to 5 mm; the gap between the first cold plate branch flow channels is set to a range of 3 to 5 mm.

[0021] In some embodiments, the chip cold plate includes:

[0022] The second cold plate diversion channel has a second refrigerant inlet at one end;

[0023] The second cold plate manifold has a second refrigerant outlet at one end; the second cold plate manifold is parallel to the second cold plate branch flow channel; a plurality of second cold plate branch flow channels are provided between the second cold plate manifold and the second cold plate branch flow channel; the second cold plate branch flow channels are connected to the second cold plate manifold and the second cold plate branch flow channel; gaps are provided between the second cold plate branch flow channels.

[0024] In some embodiments, the second cold plate branch channel, the second cold plate confluence channel, and the second cold plate branch channel are made of copper, with an outer diameter of 5 mm and a wall thickness of 1 mm.

[0025] A metal plate is provided between the second cold plate branch channels, and the distance between the second cold plate branch channels is set to 7mm.

[0026] In some embodiments, the chip cold plate includes:

[0027] A cold plate outer welding ring is provided, and a cold plate substrate is provided inside the cold plate outer welding ring; a plurality of welding points are provided on one side of the cold plate substrate, and the distance between adjacent welding points is equal;

[0028] A cold plate cover is welded to a cold plate substrate via the welding points; the cold plate cover has a curved structure, and a containment space for containing the CO2 working fluid is formed between the cold plate cover and the cold plate substrate.

[0029] In some embodiments, the diameter of the welding point is 2 mm; the distance between adjacent welding points is 6 mm; the thickness of the cold plate substrate is 5 mm; and the thickness of the cold plate cover plate is set to a range of 1 to 1.5 mm.

[0030] This application provides a CO2-powered heat pipe type chip cold plate, comprising: a plate heat exchanger connected to a refrigerant inlet pipe and a refrigerant outlet pipe; the plate heat exchanger is configured to receive CO2 transmitted through the refrigerant inlet pipe for heat exchange and condense it into CO2 working fluid; at least one chip cold plate connected to the plate heat exchanger via a CO2 heat pipe inlet pipe and a CO2 heat pipe outlet pipe; the CO2 heat pipe inlet pipe is configured to transmit the CO2 working fluid to the chip cold plate, and the CO2 heat pipe outlet pipe is configured to transmit the CO2 working fluid to the plate heat exchanger, thereby solving the problems of insufficient flow control accuracy and lag in dynamic heat load response that still exist in the current integrated application of power heat pipe technology and CO2 cold plates. Attached Figure Description

[0031] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0032] Figure 1 This is a schematic diagram of the CO2-powered heat pipe type chip cold plate in this application;

[0033] Figure 2 This is a schematic diagram of the first structure of the chip cold plate in one embodiment of this application;

[0034] Figure 3 This is a schematic diagram of the second structure of the chip cold plate in one embodiment of this application;

[0035] Figure 4 This is a schematic diagram of the first structure of the chip cold plate in another embodiment of this application;

[0036] Figure 5 This is a schematic diagram of the second structure of the chip cold plate in another embodiment of this application;

[0037] Figure 6 This is a schematic diagram of the first structure of the chip cold plate in another embodiment of this application;

[0038] Figure 7 This is a schematic diagram of the second structure of the chip cold plate in another embodiment of this application.

[0039] Explanation of reference numerals in the attached figures:

[0040] 1-Plate heat exchanger; 11-Refrigerant inlet pipe; 111-Electric throttle valve; 12-Refrigerant outlet pipe; 121-First pressure sensor; 122-First temperature sensor; 2-Chip cold plate; 21-CO2 heat pipe inlet pipe; 211-Electromagnetic pump; 22-CO2 heat pipe outlet pipe; 221-Second pressure sensor; 222-Second temperature sensor; 23-First cold plate branch channel; 231-First refrigerant inlet; 24-First cold plate confluence channel; 241-First refrigerant outlet; 25-First cold plate branch channel; 26-Second cold plate branch channel; 261-Second refrigerant inlet; 27-Second cold plate confluence channel; 271-Second refrigerant outlet; 28-Second cold plate branch channel; 281-Metal plate; 29-Cold plate outer welding ring; 30-Cold plate substrate; 301-Welding point; 31-Cold plate cover plate. 3-Control module. Detailed Implementation

[0041] To enable those skilled in the art to better understand the technical solutions in this application, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this application.

[0042] Because the integration of power heat pipe technology with CO2 cold plates in some technologies still faces problems such as insufficient flow control accuracy and lag in dynamic heat load response, this application provides a CO2 power heat pipe type chip cold plate to solve this technical problem. The structure of each part of the CO2 power heat pipe type chip cold plate is described below:

[0043] like Figure 1 The diagram shown is a structural schematic of the CO2-powered heat pipe type chip cold plate in this application.

[0044] This application provides a CO2-powered heat pipe type chip cold plate, comprising:

[0045] A plate heat exchanger 1 is connected to a refrigerant inlet pipe 11 and a refrigerant outlet pipe 12; the plate heat exchanger 1 is configured to receive CO2 transmitted by the refrigerant inlet pipe 11 for heat exchange and condense it into CO2 working fluid.

[0046] At least one chip cold plate 2 is connected to the plate heat exchanger 1 via a carbon dioxide heat pipe inlet pipe 21 and a carbon dioxide heat pipe outlet pipe 22; the carbon dioxide heat pipe inlet pipe 21 is configured to transfer the CO2 working fluid to the chip cold plate 2, and the carbon dioxide heat pipe outlet pipe 22 is configured to transfer the CO2 working fluid to the plate heat exchanger 1.

[0047] For example, refrigerant enters plate heat exchanger 1 through refrigerant inlet pipe 11 and exchanges heat with carbon dioxide entering through carbon dioxide heat pipe inlet pipe 21, thereby condensing the carbon dioxide working fluid. The condensed carbon dioxide refrigerant flows out of plate heat exchanger 1 and into refrigerant outlet pipe 12. The condensed carbon dioxide working fluid in plate heat exchanger 1 enters chip cold plate 2 through carbon dioxide heat pipe outlet pipe 22 for evaporation and heat absorption to cool the server chip. The evaporated carbon dioxide working fluid in chip cold plate 2 enters plate heat exchanger 1 through refrigerant outlet pipe 12 for condensation, thus performing carbon dioxide powered heat pipe circulation.

[0048] This application provides a CO2-powered heat pipe type chip cooling plate, which utilizes the high heat exchange efficiency of carbon dioxide and combines it with a powered heat pipe to cool data center chips more efficiently.

[0049] In this embodiment, the refrigerant inlet pipe 11 is equipped with an electric throttle valve 111; the refrigerant outlet pipe 12 is equipped with a first pressure sensor 121 and a first temperature sensor 122; the first pressure sensor 121 is configured to acquire the pressure value of the refrigerant; the first temperature sensor 122 is configured to acquire the temperature value of the refrigerant.

[0050] Specifically, the electric throttle valve 111 is used to regulate the refrigerant flow rate. The electric throttle valve 111 is installed on the refrigerant inlet pipe 11. By changing the valve opening, the refrigerant flow rate entering the subsequent refrigeration system can be precisely controlled. For example, when the system needs to increase the cooling capacity, the throttle valve opening can be appropriately increased to allow more refrigerant to enter the system; when the cooling capacity needs to be reduced, the opening can be decreased to limit the refrigerant flow rate.

[0051] The electric throttle valve 111 is also used to maintain stable system pressure, which helps to maintain stable internal pressure in the refrigeration system. By adjusting the flow rate, the refrigerant can enter the system at a suitable pressure under different operating conditions, avoiding adverse effects on system performance and equipment safety due to excessively high or low pressure. For example, when the system load changes, the electric throttle valve 111 can automatically adjust its opening to ensure that the system pressure is within the normal range.

[0052] Specifically, the first pressure sensor 121 is used to acquire the refrigerant pressure value. The first pressure sensor 121 is installed on the refrigerant outlet pipe 12 and can accurately measure the refrigerant pressure value at that location in real time. The pressure value reflects the pressure of the refrigerant at the outlet.

[0053] The first pressure sensor 121 provides a basis for system control: the acquired pressure value is transmitted to the control module 3, which adjusts the electric throttle valve 111 and other related parameters based on this pressure value to achieve precise control of the refrigeration system. For example, when the pressure value deviates from the set range, the control module 3 will issue a command to adjust the opening of the electric throttle valve 111 to restore the pressure to the normal level.

[0054] The first pressure sensor 121 is also used to ensure the safe operation of the system: by monitoring the pressure in real time, when the pressure rises or falls abnormally, the system can take timely measures, such as issuing an alarm or automatically shutting down, to prevent equipment damage or safety accidents caused by abnormal pressure.

[0055] The first temperature sensor 122 is used to obtain the refrigerant temperature value: The first temperature sensor 122 is also set on the refrigerant outlet pipe 12 to measure the temperature value of the refrigerant at that location in real time.

[0056] The first temperature sensor 122 is also used to calculate parameters such as superheat: combined with the pressure value measured by the first pressure sensor 121, the superheat of the refrigerant can be calculated. Superheat is an important indicator for measuring the operating status of a refrigeration system. By monitoring the superheat, it can be determined whether the refrigeration system is operating efficiently and stably. For example, excessively high superheat may indicate that the throttle valve opening is too large, resulting in insufficient refrigerant flow; excessively low superheat may indicate other problems in the system, such as excessive refrigerant charge.

[0057] The first temperature sensor 122 is also used to assist in system adjustment and optimization: the measured temperature value is fed back to the control system, helping the control system adjust the working state of components such as the electric throttle valve 111, so as to achieve precise control of the refrigeration system temperature and improve the system's refrigeration efficiency and stability. At the same time, through long-term monitoring and analysis of temperature data, the operation of the refrigeration system can also be optimized, reducing energy consumption and extending the service life of the equipment.

[0058] In this embodiment, the carbon dioxide heat pipe inlet pipe 21 is equipped with an electromagnetic pump 211; the carbon dioxide heat pipe outlet pipe 22 is equipped with a second pressure sensor 221 and a second temperature sensor 222; the second pressure sensor 221 is configured to acquire the pressure value of the CO2 working fluid; the second temperature sensor 222 is configured to acquire the temperature value of the CO2 working fluid.

[0059] The CO2-powered heat pipe type chip cold plate also includes:

[0060] Control module 3, connected to electromagnetic pump 211, second pressure sensor 221, and second temperature sensor 222; control module 3 is configured to:

[0061] The saturation temperature of the CO2 working fluid at the specified pressure value is determined; based on the temperature value and the saturation temperature of the CO2 working fluid, the superheat of the CO2 working fluid is calculated; based on the superheat, the switching frequency of the electromagnetic pump 211 is determined to ensure that the superheat of the CO2 working fluid reaches a preset value. The switching frequency of the electromagnetic pump 211 is controlled by the superheat of the chip cold plate 2, keeping the superheat at 1K.

[0062] The superheat degree represents the difference between the superheat temperature and the saturation temperature of the refrigerant under the same evaporation pressure in the refrigeration cycle.

[0063] In this embodiment, the switching frequency of the electromagnetic pump 211 is controlled by the superheat of the chip cold plate 2, keeping the superheat at 1K, which optimizes the operating efficiency of the electromagnetic pump 211. As the power source for refrigerant circulation, the energy consumption of the electromagnetic pump 211 is closely related to its switching frequency. By controlling the switching frequency of the electromagnetic pump 211 through superheat control, unnecessary high-frequency operation under unnecessarily active conditions can be avoided. For example, when the chip generates less heat, the superheat is lower, and the switching frequency of the electromagnetic pump 211 will be reduced accordingly, decreasing unnecessary energy consumption and thus reducing the overall energy consumption of the cooling system. It also extends the equipment's lifespan: reasonable switching frequency control reduces frequent start-stop and prolonged high-load operation of the electromagnetic pump 211, reducing wear and aging. Controlling the superheat at 1K allows the electromagnetic pump 211 to operate in a more stable state, reducing equipment failures caused by frequent adjustments or overload operation, extending the service life of the electromagnetic pump 211, and reducing maintenance costs.

[0064] like Figure 2 and Figure 3 As shown, Figure 1 A schematic diagram of the structure of the chip cold plate 2 in one embodiment.

[0065] In this embodiment, the present application provides an aluminum alloy microchannel cold plate, wherein the chip cold plate 2 includes:

[0066] A first cold plate diversion channel 23 is provided with a first refrigerant inlet 231 on its side wall; a first cold plate confluence channel 24 is provided with a first refrigerant outlet 241 on its side wall; the first cold plate confluence channel 24 is parallel to the first cold plate diversion channel 23, and a plurality of first cold plate branch channels 25 are provided between the first cold plate confluence channel 24 and the first cold plate diversion channel 23, and the first cold plate branch channels 25 are connected to the first cold plate confluence channel 24 and the first cold plate diversion channel 23; gaps are provided between the first cold plate branch channels 25.

[0067] Specifically, the outer diameter of the first cold plate branch flow channel 25 is set in the range of 2 to 5 mm; the gap between the first cold plate branch flow channels 25 is set in the range of 3 to 5 mm.

[0068] Specifically, the aluminum alloy microchannel cold plate includes a first refrigerant inlet 231, a first cold plate branch channel 23, a first cold plate tributary channel 25, a first cold plate confluence channel 24, and a first refrigerant outlet 241. The first cold plate tributary channel 25 is set to 2-5mm according to pressure, cooling capacity, and other requirements, and the gap between the first cold plate tributary channels 25 is set to 3-5mm according to requirements.

[0069] like Figure 4 and Figure 5 As shown, Figure 1 A schematic diagram of the structure of the chip cold plate 2 in another embodiment.

[0070] In this embodiment, this application provides an aluminum alloy copper tube composite heat exchange cold plate, wherein the chip cold plate 2 includes:

[0071] The second cold plate branch channel 26 has a second refrigerant inlet 261 at one end; the second cold plate confluence channel 27 has a second refrigerant outlet 271 at one end; the second cold plate confluence channel 27 is parallel to the second cold plate branch channel 26, and a plurality of second cold plate branch channels 28 are provided between the second cold plate confluence channel 27 and the second cold plate branch channel 26, and the second cold plate branch channels 28 are connected to the second cold plate confluence channel 27 and the second cold plate branch channel 26; gaps are provided between the second cold plate branch channels 28.

[0072] Specifically, the second cold plate branch channel 26, the second cold plate confluence channel 27, and the second cold plate branch channel 28 are made of copper, with an outer diameter of 5 mm and a wall thickness of 1 mm; a metal plate 281 is provided between the second cold plate branch channels 28, and the distance between the second cold plate branch channels 28 is set to 7 mm.

[0073] Specifically, the aluminum alloy-copper tube composite heat exchange cold plate includes a second refrigerant inlet 261, a second cold plate branch channel 26, a second cold plate tributary channel 28, a second cold plate confluence channel 27, and a second refrigerant outlet 271. The second cold plate branch channel 26, second cold plate tributary channel 28, and second cold plate confluence channel 27 are made of copper with an outer diameter of 5mm and a wall thickness of 1mm. The gaps between the second cold plate tributary channels 28 are made of aluminum alloy with 7mm holes for enhanced pressure resistance. The copper and aluminum alloy are bonded to the aluminum alloy plate via hydraulic expansion joints.

[0074] like Figure 6 and Figure 7 As shown, Figure 1 A schematic diagram of the structure of the chip cold plate 2 in another embodiment.

[0075] In this embodiment, this application provides an aluminum alloy / copper / stainless steel honeycomb heat exchange cold plate, wherein the chip cold plate 2 includes:

[0076] A cold plate outer welding ring 29 is provided, and a cold plate substrate 30 is provided inside the cold plate outer welding ring 29; a plurality of welding points 301 are provided on one side of the cold plate substrate 30, and the distance between adjacent welding points 301 is equal; a cold plate cover plate 31 is welded to the cold plate substrate 30 through the welding points 301; the cold plate cover plate 31 has a curved structure, and a receiving space for accommodating the CO2 working fluid is formed between the cold plate cover plate 31 and the cold plate substrate 30.

[0077] Specifically, the diameter of the welding point 301 is 2mm; the distance between adjacent welding points 301 is 6mm; the thickness of the cold plate substrate 30 is 5mm; and the thickness of the cold plate cover plate 31 is set in the range of 1 to 1.5mm.

[0078] Specifically, the aluminum alloy / copper / stainless steel honeycomb heat exchange cold plate includes a perimeter welding ring 29, welding points 301, a cold plate substrate 30, and a cold plate cover plate 31. The aluminum alloy / copper / stainless steel honeycomb heat exchange cold plate can be made of aluminum alloy, copper, or stainless steel, depending on the requirements. The diameter of welding points 301 is 2mm, and the center-to-center distance of the three welding points forming an equilateral triangle is 6mm. The thickness of the cold plate substrate 30 is 5mm, and the thickness of the cold plate cover plate 31 can be set to 1-1.5mm as required. After welding the cold plate substrate 30 and the cold plate cover plate 31, the cover plate is expanded by water pressure, forming a honeycomb-shaped flow channel in the cold plate cover plate 31. This results in stronger heat exchange disturbance and more complete heat exchange. The maximum height of the flow channel is expanded to 1.5-2mm as required.

[0079] This application provides a CO2-powered heat pipe type chip cooling plate, which has the following advantages:

[0080] 1. This application provides a carbon dioxide powered heat pipe type chip cooling plate for data centers, using natural working fluid carbon dioxide as the refrigerant. Carbon dioxide is non-toxic, non-flammable, has zero ozone depletion potential (ODP), and extremely low global warming potential (GWP=1). Combined with the efficient phase change heat transfer capability of powered heat pipe technology, it significantly improves chip heat dissipation efficiency and can meet the needs of high power density chips (≥500W / cm²) in data centers. 2 To meet the stable operation requirements of [the system], while reducing the negative impact on the environment.

[0081] 2. This application provides a carbon dioxide-powered heat pipe type chip cold plate for data centers, offering three customized cold plate structures: an aluminum alloy microchannel cold plate, a copper tube composite cold plate, and a honeycomb heat exchange cold plate, each optimized for different heat dissipation scenarios: the microchannel cold plate achieves high-flow-rate uniform heat dissipation through dense flow channels (pore diameter 2-5mm, edge distance 3-5mm); the copper tube composite cold plate combines copper flow paths (outer diameter 5mm, wall thickness 1mm) with an aluminum alloy substrate, balancing pressure resistance and lightweight; the honeycomb cold plate forms honeycomb flow channels (height 1.5-2mm) through a water pressure expansion process, enhancing fluid turbulence and heat exchange area, suitable for scenarios with high local heat flux density, and meeting the diverse heat dissipation needs of data centers.

[0082] 3. This application provides a carbon dioxide-powered heat pipe type chip cooling plate for data centers. Based on real-time data feedback from an electric regulating valve, temperature sensor, and pressure sensor, it uses an electromagnetic pump to precisely regulate refrigerant flow and superheat (control accuracy ≤1K) to achieve closed-loop control of system operating parameters. This technology can dynamically match changes in chip heat load, reducing ineffective energy consumption by more than 20%, while improving system response speed to the millisecond level, ensuring an optimal balance between heat dissipation performance and energy efficiency.

[0083] 4. This application provides a honeycomb heat exchange cold plate in a carbon dioxide powered heat pipe type chip cold plate for data centers. The honeycomb heat exchange cold plate adopts a water pressure expansion process of substrate (thickness 5mm) and cover plate (thickness 1-1.5mm) to form a regular honeycomb flow channel, which increases the heat exchange area by 40%-50% and significantly improves the convective heat transfer coefficient through fluid boundary layer disturbance. The aluminum alloy / copper composite cold plate achieves seamless interface bonding through inter-metal water pressure expansion technology, reducing the interface thermal resistance by 15%-20%. At the same time, the substrate aperture (7mm) and copper tube layout are optimized to ensure the synergistic improvement of heat dissipation uniformity and pressure resistance (pressure resistance ≥3MPa).

[0084] 5. This application provides a carbon dioxide powered heat pipe type chip cold plate for data centers, which adopts high-precision welding technology (such as equilateral triangle welding points, center distance 6mm, diameter 2mm) and pressure-resistant materials (stainless steel, copper pipe, etc.), combined with water pressure expansion process, to achieve full sealing of the internal flow channel of the cold plate (leakage rate <0.01%), ensuring that the cold plate can maintain structural stability under long-term alternating thermal stress, improving service life, and reducing maintenance frequency and cost.

[0085] The above detailed embodiments further illustrate the purpose, technical solution, and beneficial effects of the embodiments of this application. It should be understood that the above are merely specific embodiments of the embodiments of this application and are not intended to limit the protection scope of the embodiments of this application. Any modifications, equivalent substitutions, improvements, etc., made on the basis of the technical solutions of the embodiments of this application should be included within the protection scope of the embodiments of this application.

Claims

1. A CO2-powered heat pipe type chip cooling plate, characterized in that, include: A plate heat exchanger (1) is connected to a refrigerant inlet pipe (11) and a refrigerant outlet pipe (12); the plate heat exchanger (1) is configured to receive CO2 transmitted by the refrigerant inlet pipe (11) for heat exchange and condense it into CO2 working fluid; At least one chip cold plate (2) is connected to the plate heat exchanger (1) via a carbon dioxide heat pipe inlet pipe (21) and a carbon dioxide heat pipe outlet pipe (22); the carbon dioxide heat pipe inlet pipe (21) is configured to transfer the CO2 working fluid to the chip cold plate (2), and the carbon dioxide heat pipe outlet pipe (22) is configured to transfer the CO2 working fluid to the plate heat exchanger (1).

2. The CO2-powered heat pipe type chip cooling plate according to claim 1, characterized in that, The refrigerant inlet pipe (11) is equipped with an electric throttle valve (111); The refrigerant outlet pipe (12) is equipped with a first pressure sensor (121) and a first temperature sensor (122); the first pressure sensor (121) is configured to acquire the pressure value of the refrigerant; the first temperature sensor (122) is configured to acquire the temperature value of the refrigerant.

3. The CO2-powered heat pipe type chip cooling plate according to claim 1, characterized in that, The carbon dioxide heat pipe inlet pipe (21) is equipped with an electromagnetic pump (211); The carbon dioxide heat pipe outlet pipe (22) is equipped with a second pressure sensor (221) and a second temperature sensor (222); the second pressure sensor (221) is configured to acquire the pressure value of the CO2 working fluid; the second temperature sensor (222) is configured to acquire the temperature value of the CO2 working fluid.

4. A CO2-powered heat pipe type chip cooling plate according to claim 3, characterized in that, Also includes: Control module (3), which is connected to the electromagnetic pump (211), the second pressure sensor (221), and the second temperature sensor (222); the control module (3) is configured to: Determine the saturation temperature of the CO2 working fluid at the pressure value; Calculate the superheat of the CO2 working fluid based on its temperature and saturation temperature. Based on the superheat, the switching frequency of the electromagnetic pump (211) is determined so that the superheat of the CO2 working fluid reaches a preset value.

5. A CO2-powered heat pipe type chip cooling plate according to claim 1, characterized in that, The chip cold plate (2) includes: The first cold plate diversion channel (23) has a first refrigerant inlet (231) on its side wall; A first cold plate confluence channel (24) is provided with a first refrigerant outlet (241) on its side wall; the first cold plate confluence channel (24) is parallel to the first cold plate branch channel (23); a plurality of first cold plate branch channels (25) are provided between the first cold plate confluence channel (24) and the first cold plate branch channel (23); the first cold plate branch channels (25) are connected to the first cold plate confluence channel (24) and the first cold plate branch channel (23); gaps are provided between the first cold plate branch channels (25).

6. A CO2-powered heat pipe type chip cooling plate according to claim 5, characterized in that, The outer diameter of the first cold plate branch flow channel (25) is set in the range of 2 to 5 mm; the gap between the first cold plate branch flow channels (25) is set in the range of 3 to 5 mm.

7. A CO2-powered heat pipe type chip cooling plate according to claim 1, characterized in that, The chip cold plate (2) includes: The second cold plate diversion channel (26) has a second refrigerant inlet (261) at one end; The second cold plate manifold (27) has a second refrigerant outlet (271) at one end; the second cold plate manifold (27) is parallel to the second cold plate branch flow channel (26); a plurality of second cold plate branch flow channels (28) are provided between the second cold plate manifold (27) and the second cold plate branch flow channel (26); the second cold plate branch flow channels (28) are connected to the second cold plate manifold (27) and the second cold plate branch flow channel (26); gaps are provided between the second cold plate branch flow channels (28).

8. A CO2-powered heat pipe type chip cooling plate according to claim 7, characterized in that, The second cold plate branch flow channel (26), the second cold plate confluence flow channel (27), and the second cold plate branch flow channel (28) are made of copper, with an outer diameter of 5 mm and a wall thickness of 1 mm. A metal plate (281) is provided between the second cold plate branch flow channels (28), and the distance between the second cold plate branch flow channels (28) is set to 7mm.

9. A CO2-powered heat pipe type chip cooling plate according to claim 1, characterized in that, The chip cold plate (2) includes: A cold plate outer welding ring (29) is provided, and a cold plate substrate (30) is provided inside the cold plate outer welding ring (29); a plurality of welding points (301) are provided on one side of the cold plate substrate (30), and the distance between adjacent welding points (301) is equal. The cold plate cover (31) is welded to the cold plate substrate (30) through the welding point (301); the cold plate cover (31) has a curved structure, and a receiving space for accommodating the CO2 working fluid is formed between the cold plate cover (31) and the cold plate substrate (30).

10. A CO2-powered heat pipe type chip cooling plate according to claim 9, characterized in that, The diameter of the welding point (301) is 2 mm; the distance between adjacent welding points (301) is 6 mm; the thickness of the cold plate substrate (30) is 5 mm; and the thickness of the cold plate cover plate (31) is set in the range of 1 to 1.5 mm.

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