Plastic heat sink
By designing a plastic heat sink, combining thermal conductive components and a plastic heat sink, the problems of heavy weight and low heat exchange efficiency of metal heat sinks are solved, achieving lightweight and efficient heat dissipation, which is suitable for electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-07-16
- Publication Date
- 2026-06-09
AI Technical Summary
In existing electronic devices, metal heat sinks are heavy, costly, complex to process, and difficult to integrate with plastic structures. Plastic heat sink designs have low heat exchange efficiency and are prone to local heat accumulation, which cannot effectively improve heat dissipation performance.
Design a plastic heat sink comprising a heat-conducting component and a plastic heat sink body. The heat-conducting component has a fixing flange and a fixing groove around its periphery. The base of the plastic heat sink body has heat dissipation fins and heat dissipation channels. The heat-conducting component is housed in the accommodating space by embedded injection molding. The insulation of plastic and the molding ability of the mold are utilized, combined with air cooling or water cooling auxiliary heat dissipation.
It achieves lightweight and cost-effective heat dissipation, improves heat dissipation efficiency, avoids internal heat accumulation, and is suitable for lightweight and low-power miniaturized electronic devices.
Smart Images
Figure CN224343644U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of heat sink technology, and in particular to a plastic heat sink. Background Technology
[0002] In existing electronic devices or module structures, heat dissipation mechanisms mostly rely on metal heat sinks, such as extruded aluminum heat sinks, copper substrates, or metal thermally conductive covers, which rapidly conduct and dissipate heat through the high thermal conductivity of the metal. However, such structures typically suffer from drawbacks such as heavy weight, high cost, complex manufacturing, and poor integration, making them particularly inefficient in lightweight, low-power, and miniaturized electronic devices. Furthermore, the bonding between metal components and plastic structures requires additional processes, such as screw fixing, double-sided adhesive bonding, or solder joint setup, preventing the formation of an integrated module and resulting in increased assembly costs and reduced reliability.
[0003] On the other hand, although some technologies use plastic materials as part of the structural components or shell, existing plastic heat dissipation designs are mostly flat or hollow plate structures, lacking effective airflow design or multi-fin three-dimensional heat dissipation configurations. Their heat exchange efficiency is limited, and they are prone to localized heat accumulation. In addition, the poor thermal conductivity of plastics means that without finned structures or auxiliary airflow guidance designs, they can only serve a covering or decorative function, failing to actually improve heat dissipation performance. This is the key area that those in this industry urgently need to research and improve. Utility Model Content
[0004] The purpose of this invention is to provide a plastic heat sink to overcome the aforementioned shortcomings of the existing technology.
[0005] To achieve the above objectives, the present invention adopts the following technical solution:
[0006] A plastic heat sink includes a heat-conducting component and a plastic heat sink body, characterized in that: a plurality of fixed flanges are provided at the periphery of the heat-conducting component, and a fixing groove is formed between each of the fixed flanges.
[0007] The base of the plastic heat sink has a plurality of heat dissipation fins protruding from its surface, and a plurality of heat dissipation channels are formed between each heat dissipation fin. An accommodating space for housing the heat-conducting component is formed at the bottom of the base. A plurality of assembly blocks corresponding to each fixing groove are protruding on the inner wall of the bottom of the base, and an assembly groove corresponding to accommodating each fixing flange is formed between each assembly block. Each fixing flange and each assembly block are respectively assembled into the fixing groove and the assembly groove to form a stable position.
[0008] Preferably, the plastic heat dissipation system is formed around the heat-conducting component by embedding and injection, so as to house the heat-conducting component within the receiving space.
[0009] Preferably, the surface of the heat-conducting component is provided with a plurality of positioning holes, and the bottom surface of the base of the plastic heat sink has a plurality of positioning posts protruding downwards corresponding to the positioning holes assembled in the heat-conducting component.
[0010] Preferably, the heat-conducting component has a plurality of exposed portions at its corners, and the base of the plastic heat sink has a plurality of heat dissipation grooves cut at the corners of each of the exposed portions of the heat-conducting component.
[0011] Preferably, each of the fixed flanges of the heat-conducting component has a first limiting surface extending obliquely on its two opposite sides, and each of the assembly blocks of the plastic heat sink has a second limiting surface on its two sides that is obliquely oriented corresponding to the first limiting surface of each fixed flange.
[0012] Preferably, each of the exposed portions of the plastic heat sink has an inclined guide surface on each side corresponding to one side of the fixing flange.
[0013] Preferably, the thermally conductive component can be made of aluminum, copper, galvanized iron, stainless steel, aluminum alloy, or iron thermally conductive materials.
[0014] Preferably, the plastic heat dissipation system can be a plastic material of styrene copolymer, polycarbonate or thermally conductive plastic.
[0015] The beneficial effects of this utility model are: the plastic heat dissipation system can reduce the metal content of the heat dissipation fins, significantly reduce the overall weight of the heat dissipation fins, achieve the purpose of lightweighting, and the plastic material is less expensive than the metal material, thereby achieving the effect of saving costs and lightweighting to adapt to various occasions.
[0016] The heat dissipation fins of this plastic heat sink can be quickly molded into various shapes and, taking advantage of the insulating properties of plastic, can directly contact circuit boards or electronic components without worrying about short circuits or other problems. Attached Figure Description
[0017] Figure 1 This is a schematic diagram of the structure of a plastic heat sink according to the present invention;
[0018] Figure 2 This is a perspective view of a plastic heat sink according to the present invention.
[0019] Figure 3 This is an exploded perspective view of a plastic heat sink according to the present invention.
[0020] Figure 4 This is an exploded perspective view of a plastic heat sink according to this utility model.
[0021] Figure 5 This is a side sectional view of a plastic heat sink according to the present invention;
[0022] Figure 6 This is a side sectional view of a plastic heat sink according to this utility model from another perspective;
[0023] In the figure: 1: heat-conducting component, 10: positioning hole, 11: fixing flange, 110: fixing groove, 111: first limiting surface, 12: exposed part, 121: guide slope, 2: plastic heat sink, 21: base, 210: accommodating space, 2100: heat dissipation groove, 211: heat dissipation fin, 2110: heat dissipation channel, 22: assembly block, 220: assembly groove, 221: second limiting surface, 23: positioning post. Detailed Implementation
[0024] Reference Figures 1 to 4 A plastic heat sink includes a heat-conducting component 1 and a plastic heat sink 2, and the connection relationship of the aforementioned components is as follows;
[0025] The surface of the heat-conducting component 1 is provided with a plurality of positioning holes 10, and a plurality of fixing flanges 11 are protruding at the periphery of the heat-conducting component 1 and a plurality of exposed portions 12 are formed at the corners of the heat-conducting component 1. A fixing groove 110 is formed between each fixing flange 11 and each exposed portion 12. A first limiting surface 111 extends obliquely on each of the two opposite sides of each fixing flange 11, and an oblique guide surface 121 is formed on each of the two sides of each exposed portion 12 corresponding to one side of each fixing flange 11.
[0026] The plastic heat sink 2 has a base 21 with a plurality of heat dissipation fins 211 protruding from its surface, and a plurality of heat dissipation channels 2110 formed between each heat dissipation fin 211. A receiving space 210 for housing the heat conduction component 1 is formed at the bottom of the base 21. A plurality of heat dissipation grooves 2100 are cut at the corners of each exposed part 12 of the heat conduction component 1 on the base 21. A plurality of assembly blocks 22 corresponding to each fixing groove 110 are protruding on the bottom inner wall surface of the base 21. A second limiting surface 221, which is inclined to the first limiting surface 111 of each fixing flange 11, is provided on both sides of each assembly block 22. An assembly groove 220 corresponding to accommodating each fixing flange 11 is formed between each assembly block 22. A plurality of positioning posts 23 protrude downward from the bottom surface of the base 21 and are assembled in the positioning holes 10 of the heat conduction component 1.
[0027] The aforementioned heat-conducting component 1 can be made of heat-conducting materials or metals such as aluminum, copper, galvanized iron, stainless steel, aluminum alloy, or iron. Such simple and uniform variations and modifications do not limit the scope of protection of this invention and are hereby stated.
[0028] The plastic heat sink 2 can be made of plastic materials such as styrene copolymer (ABS), polycarbonate (PC) or thermally conductive plastic. Such simple and uniform variations and modifications do not limit the scope of protection of this creation, and are hereby declared.
[0029] Please refer to Figures 5 and 6, which are side cross-sectional views and another side cross-sectional view of the plastic heat sink of this invention. As can be clearly seen from the figures, in practical application, the plastic heat sink 2 is first formed onto the surface of the heat-conducting component 1 using an injection molding method. The heat-conducting component 1 is housed within the receiving space 210 at the bottom of the plastic heat sink 2, and the fixing flanges 11 of the heat-conducting component 1 are respectively assembled into the respective assembly slots 220 of the plastic heat sink 2. Simultaneously, the assembly blocks 22 of the plastic heat sink 2 are also assembled into the fixing slots 110 of the heat-conducting component 1. Furthermore, the first limiting surfaces 111 of the fixing flanges 11 and the guide slopes 121 of the exposed portions 12 are mutually abutted against the second limiting surfaces 221 on both sides of the assembly blocks 22 to form a barrier, thereby preventing the heat-conducting component 1 from contacting the plastic heat sink. The heat sink 2 is detached from each other, and the exposed parts 12 of the heat-conducting component 1 are exposed at the heat dissipation grooves 2100 of the plastic heat sink 2. When heat accumulates at the corners during the heat dissipation process, the exposed parts 12, together with air cooling or water cooling, remove the accumulated heat to achieve the effect of auxiliary heat dissipation. The positioning posts 23 protruding downward from the bottom surface of the base 21 of the plastic heat sink 2 are formed in the positioning holes 10 of the heat-conducting component 1 after being embedded and injected. The plastic heat sink of this invention can conduct heat energy through the heat-conducting component 1. Finally, the lightweight plastic heat sink 2 guides the circulation of airflow, thereby increasing the contact area between heat energy and air. The heat dissipation channels 2110 formed between the heat dissipation fins 211 assist in temperature equalization and heat dissipation to avoid internal heat accumulation.
[0030] The advantages of this invention are that the plastic heat sink 2 can reduce the metal content of the heat sink fins, significantly reduce the overall weight of the heat sink, achieve the purpose of lightweighting, and the plastic material is less expensive than the metal material, thereby achieving the effect of saving costs and lightweighting to adapt to various occasions.
[0031] The heat dissipation fins 211 of the plastic heat sink 2 can be quickly molded into various shapes and, in conjunction with the insulating properties of plastic, can directly contact circuit boards or electronic components without worrying about short circuits or other problems.
[0032] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.
Claims
1. A plastic heat sink, comprising a heat-conducting component and a plastic heat sink body, characterized in that: The heat-conducting component is provided with several fixed flanges at its periphery, and each of the fixed flanges is provided with a fixed groove. The base of the plastic heat sink has a plurality of heat dissipation fins protruding from its surface, and a plurality of heat dissipation channels are formed between each heat dissipation fin. An accommodating space for housing the heat-conducting component is formed at the bottom of the base. A plurality of assembly blocks corresponding to each fixing groove are protruding on the inner wall of the bottom of the base, and an assembly groove corresponding to accommodating each fixing flange is formed between each assembly block. Each fixing flange and each assembly block are respectively assembled into the fixing groove and the assembly groove to form a stable position.
2. The plastic heat sink according to claim 1, characterized in that: The plastic heat dissipation system is formed around the heat-conducting component by embedding and injection, so as to house the heat-conducting component within the receiving space.
3. A plastic heat sink according to claim 1, characterized in that: The surface of the heat-conducting component is provided with a plurality of positioning holes, and the bottom surface of the base of the plastic heat sink has a plurality of positioning posts protruding downwards, corresponding to the positioning holes assembled in the heat-conducting component.
4. A plastic heat sink according to claim 1, characterized in that: The heat-conducting component has a plurality of exposed portions at its corners, and the base of the plastic heat sink has a plurality of heat dissipation grooves cut at the corners of each of the exposed portions of the heat-conducting component.
5. A plastic heat sink according to claim 1, characterized in that: Each of the fixed flanges of the heat-conducting component has a first limiting surface extending obliquely on its two opposite sides, while each of the assembly blocks of the plastic heat sink has a second limiting surface on its two sides that is obliquely oriented corresponding to the first limiting surface of each fixed flange.
6. A plastic heat sink according to claim 4, characterized in that: Each of the exposed portions of the plastic heat sink has an inclined guide surface on each side corresponding to one side of the fixing flange.
7. A plastic heat sink according to claim 1, characterized in that: The thermally conductive component can be made of thermally conductive materials such as aluminum, copper, galvanized iron, stainless steel, aluminum alloy, or iron.
8. A plastic heat sink according to claim 1, characterized in that: The plastic heat dissipation system can be made of styrene copolymer, polycarbonate, or thermally conductive plastic materials.