Splicing structure for heat-conducting silica gel gasket

Abstract

The utility model belongs to silica gel gasket technical field, specifically is a kind of splicing structure for heat-conducting silica gel gasket, including main piece, vice piece and two mounting devices, vice piece is located in the side of main piece;Two mounting devices are respectively arranged on the surface of main piece and vice piece, and mounting device includes frame, and frame is sleeved on the surface of main piece, and the inner surface of frame is fixedly connected with four top strips, and the position of four top strips close to main piece is fixedly connected with three antiskid strips, and the position of frame bottom end close to positioning pin is equipped with filling device, and filling device includes elastic sleeve, and elastic sleeve is sleeved on the surface of positioning pin, and the surface of elastic sleeve is fixedly connected with two clamps, and the position of frame bottom end close to clamp is fixedly connected with limiting column;By setting the whole device, main piece or vice piece can be conveniently installed and disassembled, the situation that there is residual when replacing main piece is reduced using glue bonding mode, and main piece or vice piece can also be conveniently spliced together for use.

Description

Technical Field

[0001] This utility model relates to the field of silicone pad technology, specifically a splicing structure for thermally conductive silicone pads. Background Technology

[0002] Thermally conductive silicone pads are a type of polymer composite material made of silicone as the base material and by adding high thermal conductivity fillers such as metal oxides (such as aluminum oxide and boron nitride) or carbon materials (such as graphene). Their core function is to fill the air gap between electronic components and heat sinks, effectively reducing contact thermal resistance and improving heat dissipation efficiency, while also providing insulation, shock absorption, and sealing.

[0003] Regarding the above and existing related technologies: When using circuit boards, thermally conductive silicone pads are required in some locations to assist in heat dissipation. Traditionally, thermally conductive silicone pads are glued to the circuit board. Since the circuit board heats the thermally conductive silicone pads during use, residue may remain on the circuit board when the thermally conductive silicone pads need to be replaced. Therefore, a splicing structure for thermally conductive silicone pads is proposed to address the above problems. Utility Model Content

[0004] In order to overcome the shortcomings of the prior art, at least one technical problem raised in the background art is solved.

[0005] The technical solution adopted by this utility model to solve its technical problem is as follows: The splicing structure for a thermally conductive silicone pad of this utility model includes a main piece, a secondary piece, and two mounting devices. The secondary piece is located on one side of the main piece. The two mounting devices are respectively set on the surface of the main piece and the secondary piece. The mounting device includes a frame, which is fitted onto the surface of the main piece. Four top strips are fixedly connected to the inner surface of the frame. Three anti-slip strips are fixedly connected to the four top strips near the main piece. Positioning pins are threaded to the inner surfaces of the four corners of the frame. When the main piece moves, it will press against the surface of the top strips and anti-slip strips. Then, the frame is placed in a suitable position on the circuit board, and the positioning pins are rotated to the inner wall of the frame and the inner wall of the mounting hole of the circuit board. By setting the frame, top strips, anti-slip strips, and positioning pins, the position of the main piece can be restricted, while reducing the residue left when removing the main piece bonded with traditional glue.

[0006] Preferably, threaded holes are provided at all four corners of the frame surface, and the surface of the positioning pin is threadedly connected to the inner wall of the threaded hole of the frame. When the positioning pin rotates, the positioning pin will rotate to the inner wall of the threaded hole, and the threaded hole can accommodate the positioning pin.

[0007] Preferably, the surface of the frame is fixedly connected to two limiting strips and two storage strips. The limiting strips are inserted into the inner surface of the storage strips. By setting the limiting strips and storage strips, the main piece and the secondary piece can be spliced ​​together.

[0008] Preferably, the surface of the storage strip is provided with a storage groove, and the limiting strip is inserted into the inner surface of the storage groove of the storage strip. When the limiting strip moves, the limiting strip will be inserted into the inner surface of the storage groove of the storage strip. By providing a storage groove, the storage strip can conveniently store the limiting strip.

[0009] Preferably, a filling device is provided at the bottom end of the frame near the positioning pin. The filling device includes an elastic sleeve, which is fitted onto the surface of the positioning pin. Two locking blocks are fixedly connected to the surface of the elastic sleeve. A limiting post is fixedly connected at the bottom end of the frame near the locking blocks. The locking blocks are fitted onto the surface of the limiting post. When the positioning pin rotates, the positioning pin passes through the elastic sleeve. By setting the elastic sleeve, locking blocks, and limiting post, the gap between the frame and the circuit board can be filled.

[0010] Preferably, a pad is fixedly connected to the bottom end of the elastic sleeve. When the elastic sleeve moves, the elastic sleeve will drive the pad to press against the upper surface of the circuit board. By setting the pad, the contact area between the elastic sleeve and the circuit board can be increased.

[0011] Preferably, the surface of the card block has a card hole, and the limiting post is inserted into the inner surface of the card hole of the card block. When the card block moves, the card block will fit onto the surface of the limiting post through the card hole. The limiting post can be accommodated by opening the card hole.

[0012] The advantages of this utility model are:

[0013] 1. When the main piece and the auxiliary piece need to be used together, the main piece and the auxiliary piece are inserted into the inner surfaces of the two frames respectively. When the main piece moves, it will press against the surface of the top strip and the anti-slip strip. Part of the structure of the top strip and the anti-slip strip will be inserted into the inner surface of the main piece. Then, push the two frames, and the two frames will drive the limiting strip and the storage strip to move respectively. The limiting strip is inserted into the inner surface of the storage groove of the storage strip, and the limiting strip will press against the inner surface of the storage strip. Then, place the two frames on the upper surface of the circuit board, and the main piece and the auxiliary piece will adhere to the upper surface of the circuit board. Then, rotate the positioning pin to the inner wall of the threaded hole of the frame and the inner wall of the mounting hole of the circuit board. By setting the entire device, it is convenient to install and disassemble the main piece or the auxiliary piece, reducing the situation of residue when replacing the main piece when using glue bonding method. At the same time, it is also convenient to splice the main piece or the auxiliary piece together for use.

[0014] 2. In this utility model, when installing the frame, pushing the elastic sleeve causes the elastic sleeve to move the locking block. The locking block is fitted onto the surface of the limiting post through the locking hole. When the frame moves, the frame will move the elastic sleeve and the pad. The pad is pressed against the upper surface of the circuit board, and the elastic sleeve will undergo a certain deformation. When the positioning pin is installed, the positioning pin will pass through the elastic sleeve. By setting the entire device, the gap between the frame and the circuit board can be filled, reducing the situation of frame movement. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a three-dimensional structural diagram of the main sheet in a splicing structure for a thermally conductive silicone pad;

[0017] Figure 2 In a splicing structure for a thermally conductive silicone pad Figure 1 A schematic diagram of the structure at point A;

[0018] Figure 3 This is a top view of the main sheet in a splicing structure for a thermally conductive silicone pad;

[0019] Figure 4 This is a bottom view of the main sheet in a splicing structure for a thermally conductive silicone pad;

[0020] Figure 5 In a splicing structure for a thermally conductive silicone pad Figure 4 A schematic diagram of the structure at point B.

[0021] In the diagram: 1. Main piece; 2. Sub-piece; 3. Mounting device; 31. Frame; 32. Top strip; 33. Anti-slip strip; 34. Positioning pin; 35. Threaded hole; 36. Limiting strip; 37. Storage strip; 38. Storage groove; 4. Filling device; 41. Elastic sleeve; 42. Pad; 43. Locking block; 44. Limiting post; 45. Locking hole. Detailed Implementation

[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present utility model.

[0023] Please see Figure 1-5As shown, a splicing structure for a thermally conductive silicone pad includes a main sheet 1, a secondary sheet 2, and two mounting devices 3. The secondary sheet 2 is located on one side of the main sheet 1. The two mounting devices 3 are respectively disposed on the surfaces of the main sheet 1 and the secondary sheet 2. Each mounting device 3 includes a frame 31, which is fitted onto the surface of the main sheet 1. Four top strips 32 are fixedly connected to the inner surface of the frame 31, and three anti-slip strips 33 are fixedly connected to the four top strips 32 near the main sheet 1. The inner surfaces of the four corners of the frame 31 are threaded together. There is a positioning pin 34; during operation, the main piece 1 is inserted into the inner surface of the frame 31. When the main piece 1 moves, it will press against the surface of the top strip 32 and the anti-slip strip 33. Then, the frame 31 is placed in a suitable position on the circuit board. Then, the main piece 1 is attached to the component that needs heat dissipation. Then, the positioning pin 34 is rotated to the inner wall of the frame 31 and the inner wall of the circuit board mounting hole. By setting the frame 31, the top strip 32, the anti-slip strip 33 and the positioning pin 34, the position of the main piece 1 can be restricted, while reducing the situation where there is residue when the main piece 1 is removed by traditional glue bonding.

[0024] Threaded holes 35 are provided at the four corners of the surface of the frame 31. The surface of the positioning pin 34 is threadedly connected to the inner wall of the threaded hole 35 of the frame 31. During operation, the positioning pin 34 will rotate to the inner wall of the threaded hole 35. The opening of the threaded hole 35 can accommodate the positioning pin 34.

[0025] Two limiting strips 36 are fixedly connected to the surface of the frame 31, and two storage strips 37 are fixedly connected to the surface of the frame 31. During operation, pushing the two frames 31 will cause the limiting strips 36 and storage strips 37 to move respectively. The limiting strips 36 will be inserted into the inner surface of the storage strips 37. By setting the limiting strips 36 and storage strips 37, the main piece 1 and the secondary piece 2 can be spliced ​​together.

[0026] The surface of the storage strip 37 is provided with a storage groove 38, and the limiting strip 36 is inserted into the inner surface of the storage groove 38 of the storage strip 37. During operation, the limiting strip 36 will be inserted into the inner surface of the storage groove 38 of the storage strip 37. The storage groove 38 makes it convenient for the storage strip 37 to store the limiting strip 36.

[0027] A filling device 4 is provided at the bottom end of the frame 31 near the positioning pin 34. The filling device 4 includes an elastic sleeve 41, which is fitted onto the surface of the positioning pin 34. Two locking blocks 43 are fixedly connected to the surface of the elastic sleeve 41. A limiting post 44 is fixedly connected at the bottom end of the frame 31 near the locking blocks 43, and the locking blocks 43 are fitted onto the surface of the limiting post 44. During operation, pushing the elastic sleeve 41 causes the locking blocks 43 to move, and the locking blocks 43 are fitted onto the surface of the limiting post 44. When the positioning pin 34 rotates, the positioning pin 34 passes through the elastic sleeve 41. By setting the elastic sleeve 41, locking blocks 43 and limiting post 44, the gap between the frame 31 and the circuit board can be filled.

[0028] The bottom end of the elastic sleeve 41 is fixedly connected to a pad 42. During operation, the elastic sleeve 41 will drive the pad 42 to press against the upper surface of the circuit board. By setting the pad 42, the contact area between the elastic sleeve 41 and the circuit board can be increased.

[0029] The surface of the card block 43 is provided with a card hole 45, and the limiting post 44 is inserted into the inner surface of the card hole 45 of the card block 43. During operation, the card block 43 will be fitted onto the surface of the limiting post 44 through the card hole 45, and the limiting post 44 can be accommodated by opening the card hole 45.

[0030] Working principle: When the main piece 1 and the auxiliary piece 2 need to be used together, the main piece 1 and the auxiliary piece 2 are respectively inserted into the inner surfaces of the two frames 31. When the main piece 1 moves, it will press against the surface of the top strip 32 and the anti-slip strip 33. Part of the structure of the top strip 32 and the anti-slip strip 33 will be inserted into the inner surface of the main piece 1. Then, push the two frames 31, and the two frames 31 will respectively drive the limiting strip 36 and the storage strip 37 to move. The limiting strip 36 is inserted into the inner surface of the storage groove 38 of the storage strip 37, and the limiting strip 36 will press against the inner surface of the storage strip 37. Then, place the two frames 31 on the upper surface of the circuit board, and the main piece 1 and the auxiliary piece 2 will adhere to the upper surface of the circuit board. Then, rotate the positioning pin 34 to the inner wall of the threaded hole 35 of the frame 31 and the inner wall of the mounting hole of the circuit board. The entire device allows for easy installation and disassembly of the main piece 1 or the secondary piece 2, reducing the possibility of residue when replacing the main piece 1 due to the use of glue. It also facilitates the splicing of the main piece 1 or the secondary piece 2 together. When installing the frame 31, pushing the elastic sleeve 41 causes the locking block 43 to move. The locking block 43 fits onto the surface of the limiting post 44 through the locking hole 45. When the frame 31 moves, it will move the elastic sleeve 41 and the pad 42. The pad 42 presses against the upper surface of the circuit board, and the elastic sleeve 41 will deform to a certain extent. When the positioning pin 34 is installed, the positioning pin 34 will pass through the elastic sleeve 41. By setting the entire device, it can fill the gap between the frame 31 and the circuit board, reducing the possibility of the frame 31 moving randomly.

[0031] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0032] The foregoing has shown and described the basic principles, main features, and advantages of this utility model. Those skilled in the art should understand that this utility model is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of this utility model. Various changes and modifications can be made to this utility model without departing from its spirit and scope, and all such changes and modifications fall within the scope of the claimed utility model.

Claims

1. A splicing structure for a thermally conductive silicone pad, comprising a main sheet (1), a secondary sheet (2), and two mounting devices (3), wherein the secondary sheet (2) is located on one side of the main sheet (1); characterized in that: The two mounting devices (3) are respectively set on the surface of the main piece (1) and the auxiliary piece (2). The mounting device (3) includes a frame (31), which is fitted on the surface of the main piece (1). Four top strips (32) are fixedly connected to the inner surface of the frame (31). Three anti-slip strips (33) are fixedly connected to the four top strips (32) near the position of the main piece (1). Positioning pins (34) are threadedly connected to the inner surface of the four corners of the frame (31).

2. The splicing structure for a thermally conductive silicone pad according to claim 1, characterized in that: The four corners of the frame (31) are provided with threaded holes (35), and the surface of the positioning pin (34) is threaded to the inner wall of the threaded hole (35) of the frame (31).

3. The splicing structure for a thermally conductive silicone pad according to claim 1, characterized in that: The surface of the frame (31) is fixedly connected to two limiting strips (36), and the surface of the frame (31) is fixedly connected to two storage strips (37).

4. The splicing structure for a thermally conductive silicone pad according to claim 3, characterized in that: The surface of the storage strip (37) is provided with a storage groove (38), and the limiting strip (36) is inserted into the inner surface of the storage groove (38) of the storage strip (37).

5. The splicing structure for a thermally conductive silicone pad according to claim 1, characterized in that: A filling device (4) is provided at the bottom end of the frame (31) near the positioning pin (34). The filling device (4) includes an elastic sleeve (41). The elastic sleeve (41) is fitted on the surface of the positioning pin (34). Two locking blocks (43) are fixedly connected to the surface of the elastic sleeve (41). A limiting post (44) is fixedly connected at the bottom end of the frame (31) near the locking block (43). The locking block (43) is fitted on the surface of the limiting post (44).

6. The splicing structure for a thermally conductive silicone pad according to claim 5, characterized in that: The bottom end of the elastic sleeve (41) is fixedly connected to a gasket (42).

7. The splicing structure for a thermally conductive silicone pad according to claim 5, characterized in that: The surface of the card block (43) is provided with a card hole (45), and the limiting post (44) is inserted into the inner surface of the card hole (45) of the card block (43).

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