A conveying structure of adhesive tape and silicon wafer

Abstract

The utility model discloses a kind of conveying structure of adhesive tape and silicon wafer, including molten adhesive support and molten adhesive platform, molten adhesive support is provided with two groups of molten adhesive front-back module along with front-back direction, and the driving end of each group of molten adhesive front-back module is provided with molten adhesive vertical moving slide rail, and the lower portion of molten adhesive platform is connected with molten adhesive vertical moving sliding block, molten adhesive vertical moving sliding block slides on molten adhesive vertical moving slide rail, and molten adhesive heating tube is inserted in the inside of molten adhesive platform.The conveying structure of the adhesive tape and silicon wafer is hot-melted to the adhesive tape between silicon wafer placed on platform, so that silicon wafer is connected and bonded together, and two groups of molten adhesive front-back module are lifted by height, realize front-back butt joint, mutually do not affect processing technology, ensure that the series welding of subsequent silicon wafer and welding wire is carried out smoothly.

Description

Technical Field

[0001] This utility model relates to the technical field of silicon wafer string bonding, and more particularly to a conveying structure for adhesive strips and silicon wafers. Background Technology

[0002] Photovoltaic silicon wafers are the core and most valuable component of a solar power system. Their function is to convert solar energy into electrical energy, which is then stored in batteries or used directly as a power source. In BC batteries (back-contact batteries, which can be combined with various circuits), adhesive strips are placed on a platform, and silicon wafers are then placed on the strips, with the strips positioned between the wafers. Heating is then used to bond the wafers together. Single front-and-rear module systems are slow, and conventional dual-module systems occupy more space in the lateral direction. Utility Model Content

[0003] One objective of this invention is to provide a conveying structure for adhesive strips and silicon wafers. By controlling the lifting structure on the front and rear modules of the melting adhesive, the two melting platforms can be connected to each other without affecting each other, with one receiving the adhesive strip and the other receiving the silicon wafer, thus not delaying processing time and improving efficiency.

[0004] To achieve this objective, the present invention adopts the following technical solution:

[0005] A conveying structure for adhesive strips and silicon wafers includes a melt adhesive adhesion bracket and a melt adhesive platform. The melt adhesive adhesion bracket has two sets of melt adhesive front and rear modules arranged along the front and rear direction. Each set of melt adhesive front and rear modules has a melt adhesive vertical movement slide rail on its drive end. A melt adhesive vertical movement slider is connected below the melt adhesive platform and slides on the melt adhesive vertical movement slide rail. A melt adhesive heating tube is inserted inside the melt adhesive platform.

[0006] As a preferred technical solution, a melting plate is fixed to the lower end of the melting platform, a melting vertical movement motor is installed on the melting plate, the melting vertical movement motor is driven by a melting lifting screw, a melting lifting nut is threaded onto the melting lifting screw, the melting lifting nut is fixed on the glue strip transverse movement module, and both the upper and lower ends of the melting lifting screw are bearing connected to the melting plate.

[0007] As a preferred technical solution, both the lower end of the melt lifting screw and the drive end of the melt vertical movement motor are equipped with melt lifting synchronous pulleys, and a melt lifting synchronous belt is connected between the melt lifting synchronous pulleys.

[0008] As a preferred technical solution, the melt adhesive platform is provided with a plurality of platform adsorption holes, and a platform air pipe connector is connected to the outside of the melt adhesive platform, and the platform adsorption holes are connected to the platform air pipe connector.

[0009] As a preferred technical solution, a plurality of molten adhesive support plates are arranged on the molten adhesive platform, and the molten adhesive support plates are provided with a silicon wafer placement area and an adhesive strip placement area, and the platform adsorption holes are distributed in the silicon wafer placement area and the adhesive strip placement area.

[0010] The beneficial effects of this utility model are as follows: It provides a conveying structure for adhesive strips and silicon wafers. This conveying structure heat-melts the adhesive strips between the silicon wafers placed on the platform, so that the silicon wafers are connected in series and bonded together. The two sets of molten adhesive front and rear modules are connected front and rear by lifting and lowering the height, without affecting the processing technology, and ensuring the smooth progress of subsequent serial welding of silicon wafers and welding wires. Attached Figure Description

[0011] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0012] Figure 1 This is a schematic diagram of the overall structure of a conveying structure for an adhesive strip and a silicon wafer as described in the embodiment.

[0013] Figure 2 This is a schematic diagram of the first structure of the melt adhesive platform described in the embodiment;

[0014] Figure 3 This is a schematic diagram of the second structure of the melt adhesive platform described in the embodiment;

[0015] Figure 4 This is a diagram of the lifting structure of the melt adhesive platform described in the embodiment;

[0016] Figure 5 This is a schematic diagram of the structure of the melt support plate described in the embodiment.

[0017] Figures 1 to 5 middle:

[0018] 1. Melt adhesive adhesion bracket; 2. Melt adhesive platform; 3. Melt adhesive front and rear modules; 4. Melt adhesive vertical movement slide rail; 5. Melt adhesive vertical movement slider; 6. Melt adhesive heating element; 7. Melt adhesive upright plate; 8. Melt adhesive vertical movement motor; 9. Melt adhesive lifting screw; 10. Melt adhesive lifting nut; 11. Melt adhesive lifting synchronous pulley; 12. Melt adhesive lifting synchronous belt; 13. Platform suction hole; 14. Platform air pipe connector; 15. Melt adhesive support plate; 16. Silicon wafer placement area; 17. Adhesive strip placement area. Detailed Implementation

[0019] The technical solution of this utility model will be further described below with reference to the accompanying drawings and specific embodiments.

[0020] like Figures 1 to 5As shown in this embodiment, a conveying structure for adhesive strips and silicon wafers includes a melt adhesive adhesion bracket 1 and a melt adhesive platform 2. The melt adhesive adhesion bracket 1 is provided with two sets of melt adhesive front and rear modules 3 along the front and rear direction. Each set of melt adhesive front and rear modules 3 is provided with a melt adhesive vertical movement slide rail 4 on its driving end. A melt adhesive vertical movement slider 5 is connected to the bottom of the melt adhesive platform 2. The melt adhesive vertical movement slider 5 slides on the melt adhesive vertical movement slide rail 4. A melt adhesive heating tube 6 is inserted inside the melt adhesive platform 2.

[0021] Two sets of front and rear melting modules 3 control the forward and backward movement of a melting platform 2. The two melting platforms 2 alternately receive adhesive strips and silicon wafers. When they meet in the middle, the melting platforms 2 can be raised and lowered under the drive of the vertical sliding rail 4. The two melting platforms 2 form a height difference without affecting each other, which improves the efficiency of receiving adhesive strips and silicon wafers.

[0022] A melting platform 2 is fixed to the lower end of a melting plate 7. A melting vertical motor 8 is installed on the melting plate 7. The melting vertical motor 8 is driven by a melting lifting screw 9. A melting lifting nut 10 is threaded onto the melting lifting screw 9. The melting lifting nut 10 is fixed on the glue strip transverse module. Both the upper and lower ends of the melting lifting screw 9 are connected to the melting plate 7 by bearings. A melting lifting synchronous pulley 11 is installed at the lower end of the melting lifting screw 9 and the drive end of the melting vertical motor 8. A melting lifting synchronous belt 12 is driven between the melting lifting synchronous pulleys 11.

[0023] The melt adhesive vertical movement motor 8 provides power. When the melt adhesive lifting synchronous wheel 11 rotates, the melt adhesive lifting synchronous belt 12 drives the melt adhesive lifting screw 9 to rotate. Under the action of the fixed melt adhesive lifting nut 10, the melt adhesive lifting screw 9 drives the melt adhesive vertical plate 7 to move upward or downward as a whole. The left and right melt adhesive platforms 2 will not touch each other in the middle position of the melt adhesive adhesion bracket 1.

[0024] The melting platform 2 is provided with several platform adsorption holes 13. The outside of the melting platform 2 is connected to a platform air pipe connector 14. The platform adsorption holes 13 are connected to the platform air pipe connector 14. Several melting support plates 15 are arranged on the melting platform 2. The melting support plates 15 are provided with a silicon wafer placement area 16 and a glue strip placement area 17. The platform adsorption holes 13 are distributed in the silicon wafer placement area 16 and the glue strip placement area 17.

[0025] The adhesive strip is cut and placed in the adhesive strip placement area 17, and is attracted by the platform adsorption hole 13. Then the silicon wafer is placed on the silicon wafer placement area 16, with an adhesive strip between two adjacent silicon wafers. The silicon wafer is also attracted by the platform adsorption hole 13. The adhesive strip is heated by the molten adhesive heating tube 6, causing it to melt onto the silicon wafer and stick the silicon wafers together.

[0026] It should be stated that the above-described specific embodiments are merely preferred embodiments of this utility model and the technical principles applied thereto. Within the scope of the technology disclosed in this utility model, any variations or substitutions that are easily conceived by those skilled in the art should be covered within the protection scope of this utility model.

Claims

1. A conveying structure for adhesive strips and silicon wafers, characterized in that, The device includes a melt adhesive adhesion bracket and a melt adhesive platform. The melt adhesive adhesion bracket has two sets of melt adhesive front and rear modules arranged along the front and rear direction. Each set of melt adhesive front and rear modules has a melt adhesive vertical movement slide rail on its drive end. A melt adhesive vertical movement slider is connected to the bottom of the melt adhesive platform. The melt adhesive vertical movement slider slides on the melt adhesive vertical movement slide rail. A melt adhesive heating tube is inserted inside the melt adhesive platform.

2. The conveying structure for adhesive strips and silicon wafers according to claim 1, characterized in that, The lower end of the melting platform is fixed with a melting plate, and a melting vertical movement motor is installed on the melting plate. The melting vertical movement motor is driven by a melting lifting screw, and a melting lifting nut is threaded onto the melting lifting screw. The melting lifting nut is fixed on the glue strip transverse movement module, and both the upper and lower ends of the melting lifting screw are bearing connected to the melting plate.

3. The conveying structure for adhesive strips and silicon wafers according to claim 2, characterized in that, Both the lower end of the melt lifting screw and the drive end of the melt vertical movement motor are equipped with melt lifting synchronous pulleys, and a melt lifting synchronous belt is connected between the melt lifting synchronous pulleys.

4. The conveying structure for adhesive strips and silicon wafers according to claim 1, characterized in that, The melting platform is provided with a number of platform adsorption holes, and a platform air pipe connector is connected to the outside of the melting platform. The platform adsorption holes are connected to the platform air pipe connector.

5. The conveying structure for adhesive strips and silicon wafers according to claim 4, characterized in that, The melting platform is provided with several melting support plates, and the melting support plates are provided with silicon wafer placement area and adhesive strip placement area. The platform adsorption holes are distributed in the silicon wafer placement area and the adhesive strip placement area.

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