A double-layer microneedle fin manifold microchannel heat sink
By designing a double-layer micro-needle finned manifold microchannel heat sink, the problems of temperature inhomogeneity and pressure drop loss of traditional microchannel heat sinks are solved, achieving a highly efficient chip heat dissipation effect.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-21
- Publication Date
- 2026-06-09
Smart Images
Figure CN224343762U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the technical field of microchannel heat sink design for cooling, and more specifically, to a double-layer micro-needle manifold microchannel heat sink. Background Technology
[0002] According to Moore's Law, the number of transistors that can be placed on an integrated circuit roughly doubles every 18 months, and chip performance also doubles. At the same time, the heat flux density of electronic chips is also increasing dramatically, and traditional cooling technologies can no longer meet current heat dissipation demands, limiting further improvements in chip performance. Harpole and Eninger et al. proposed the concept of manifold microchannels (MMCs), a structure that combines excellent heat transfer capabilities with low pressure drop losses, making it a promising and effective method for cooling high-power chips.
[0003] However, current research on manifold microchannel heat sinks mainly focuses on single-layer structures. Some enhanced heat transfer structures also increase pressure drop, and single-layer structures also suffer from poor heat sink temperature uniformity, which limits further improvement in the performance of microchannel heat sinks. Utility Model Content
[0004] In view of the technical problems of traditional manifold microchannel heat transfer enhancement mentioned in the background technology, a double-layer micro-needle fin manifold microchannel heat sink is provided.
[0005] The technical means adopted in this utility model are as follows:
[0006] A double-layer micro-needle manifold microchannel heat sink includes: a lower microchannel layer, an upper microchannel layer, an outlet layer, and an inlet layer arranged sequentially from bottom to top; the contact surface between the inlet layer and the outlet layer is a first surface, the contact surface between the outlet layer and the upper microchannel layer is a second surface, and the contact surface between the upper microchannel layer and the lower microchannel layer is a third surface.
[0007] The inlet layer is provided with a coolant inlet I; the outlet layer is also provided with a coolant inlet II, and the outlet layer is also provided with a coolant outlet;
[0008] Both the upper microchannel layer and the lower microchannel layer are provided with needle fins within the microchannels to agitate and transfer heat from the coolant.
[0009] Furthermore, the coolant outlet is provided with the manifold; the manifold and the first surface form an outlet flow channel, which collects the coolant and discharges it from the entire heat sink.
[0010] Furthermore, the upper microchannel layer and the second surface form a coolant flow channel for the upper microchannel layer.
[0011] Furthermore, the lower microchannel layer and the third surface form a coolant flow channel for the lower microchannel layer.
[0012] Furthermore, the needle-wing can be any one or more combinations of cylindrical, rhomboid, and rectangular shapes.
[0013] Furthermore, the coolant inlet I is a through opening provided on the inlet layer.
[0014] Compared with the prior art, the present invention has the following advantages:
[0015] 1. The manifold microchannel heat exchanger of this utility model improves the temperature uniformity of the manifold microchannel, and the double-layer needle-fin manifold microchannel heat sink can significantly improve the problem of uneven temperature at the bottom of the manifold microchannel heat sink.
[0016] 2. The manifold microchannel heat exchanger of this utility model can improve heat exchange efficiency by using micro-needle fins to enhance disturbance, while increasing the flow area through a double-layer structure to reduce pressure drop. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0018] Figure 1 This is an overall schematic diagram of the double-layer microneedle fin manifold microchannel heat sink structure of this utility model;
[0019] Figure 2 This is a top view of the inlet layer of the double-layer microneedle fin manifold microchannel heat sink microchannel of this utility model;
[0020] Figure 3(a) is a top view of the outlet layer of the double-layer microneedle manifold microchannel heat sink of this utility model;
[0021] Figure 3(b) is a top view of the outlet layer of the double-layer microneedle manifold microchannel heat sink of this utility model;
[0022] Figure 4(a) is a top view of the upper microchannel layer of the double-layer microneedle manifold microchannel heat sink of this utility model;
[0023] Figure 4(b) is a top view of the upper microchannel layer of the double-layer microneedle manifold microchannel heat sink of this utility model;
[0024] Figure 5 This is a top view of the microchannel layer under the heat sink of the double-layer microneedle manifold microchannel of the present invention;
[0025] Figure 6 This is an exploded view of the entire double-layer microneedle fin manifold microchannel heat sink of this utility model.
[0026] Among them, 1 is the inlet layer; 2 is the outlet layer; 3 is the upper microchannel layer; 4 is the lower microchannel layer; 5 is the coolant inlet; 6 is the manifold; 7 is the coolant outlet; and 8 is the cylindrical needle fin. Detailed Implementation
[0027] It should be noted that, where there is no conflict, the embodiments and features in the embodiments of this utility model can be combined with each other. The present utility model will now be described in detail with reference to the accompanying drawings and embodiments.
[0028] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit this utility model or its application or use. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this utility model.
[0029] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to the present invention. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0030] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following figures denote similar items; therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.
[0031] In the description of this utility model, it should be understood that the orientation or positional relationship indicated by directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" is usually based on the orientation or positional relationship shown in the accompanying drawings, and is only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours relative to the outline of each component itself.
[0032] For ease of description, spatial relative terms such as "above," "over," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation besides the orientation of the device as described in the figures. For example, if the device in the figures is inverted, a device described as "above" or "above" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.
[0033] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.
[0034] like Figure 1-6 As shown, this utility model provides a double-layer micro-needle fin manifold microchannel heat sink, comprising: a lower microchannel layer 4, an upper microchannel layer 3, an outlet layer 2, and an inlet layer 1 arranged sequentially from bottom to top; the contact surface between the inlet layer 1 and the outlet layer 2 is a first surface, the contact surface between the outlet layer 2 and the upper microchannel layer 3 is a second surface, and the contact surface between the upper microchannel layer 3 and the lower microchannel layer 4 is a third surface.
[0035] Meanwhile, as a preferred embodiment, in this application, such as Figure 1 As shown in Figure 2, the coolant can enter through the coolant inlet 5 in the center of the inlet layer, exchange heat inside the heat sink, enter the manifold 6, and then be discharged. The second and fourth inlets from the left lead to the upper microchannel layer, and the first, third, and fifth inlets from the left lead to the lower microchannel layer after passing through the micro-needle fins of the upper microchannel layer.
[0036] As a preferred implementation method, such as Figure 3a As shown in Figure b, the coolant enters the microchannel layer from the coolant inlet 5 in the center of the outlet layer, and after heat exchange, returns to the coolant outlet 7 of the outlet layer and is discharged through the manifolds 6 on both sides.
[0037] As a preferred implementation method, such as... Figure 4a As shown in Figure b, the coolant enters through the inlet and jets through the upper microchannel layer. It then flows outwards along the discontinuous microchannels formed by the microneedles 8. The microneedles enhance heat transfer by generating turbulence, and the coolant then flows upwards towards the outlet channel. The coolant inlet 5 and outlet 7 of the lower microchannel layer are located at the central perforation of the microneedles in the upper microchannel layer.
[0038] As a preferred implementation method, such as... Figure 5 As shown in a and b, the coolant enters from the inlet, flows through the central perforation of the microneedle fins in the upper microchannel layer, and then jets into the lower microchannel layer. It flows outwards along the discontinuous microchannels formed by the microneedle fins for heat exchange. Afterwards, it flows upwards through the microneedle fins of the upper microchannel layer to the outlet, and finally is discharged through the manifold.
[0039] As a preferred implementation method, such as Figure 6 As shown, the double-layer micro-needle fin manifold microchannel heat sink structure includes: micro-needle fins 8, coolant outlet 7, coolant manifold 6, coolant outlet 5, lower microchannel layer 4, upper microchannel layer 3, outlet layer 2, and inlet layer 1. The double-layer micro-needle fin manifold microchannel heat sink structure can enhance heat transfer by creating turbulence through the micro-needle fins. The double-layer structure can reduce pressure drop loss under the same mass flow rate. The coolant in the upper microchannel layer can cool the coolant in the lower microchannel layer, further improving the temperature uniformity at the bottom of the heat sink.
[0040] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this utility model, and are not intended to limit it. Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this utility model.
Claims
1. A two-tiered microspine finned manifold microchannel heat sink characterized by, The application relates to a heat sink for cooling electronic components, which comprises: a lower micro-channel layer (4), an upper micro-channel layer (3), an outlet layer (2) and an inlet layer (1) arranged in sequence from bottom to top; the contact surface of the inlet layer (1) and the outlet layer (2) is a first surface, the contact surface of the outlet layer (2) and the upper micro-channel layer (3) is a second surface, and the contact surface of the upper micro-channel layer (3) and the lower micro-channel layer (4) is a third surface; a cooling liquid inlet I is arranged on the inlet layer (1); a cooling liquid inlet II is also arranged on the outlet layer (2), and a cooling liquid outlet (7) is further arranged on the outlet layer (2); the upper micro-channel layer (3) and the lower micro-channel layer (4) are both provided with needle fins (8) for disturbing the heat exchange of the cooling liquid in the micro-channels.
2. The dual-layer microneedle finned manifold microchannel heat sink of claim 1, wherein, A flow collecting groove (6) is arranged at the outlet of the cooling liquid outlet (7); the flow collecting groove (6) and the first surface form an outlet flow channel, and the cooling liquid is collected and discharged from the whole heat sink.
3. The dual-layer microneedle finned manifold microchannel heat sink of claim 1, wherein, The upper micro-channel layer (3) and the second surface form a cooling liquid flow channel of the upper micro-channel layer.
4. The dual-layer microneedle finned manifold microchannel heat sink of claim 1, wherein, The lower micro-channel layer (4) and the third surface form a cooling liquid flow channel of the lower micro-channel layer.
5. The dual-layer microneedle finned manifold microchannel heat sink of claim 1, wherein, The needle fin (8) is in any one or a combination of a cylindrical shape, a rhombic shape and a rectangular shape.
6. The dual-layer microneedle finned manifold microchannel heat sink of claim 1, wherein, The cooling liquid inlet I is a through opening arranged on the inlet layer (1).