Insulation layer measuring device
By using a non-contact insulation layer measurement device, which combines a laser probe and a guide rail drive, the problems of product damage and low accuracy caused by traditional contact measurement are solved, and high-precision, non-destructive insulation layer thickness measurement is achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- SHENZHEN JIADUJIA ELECTRONICS TECH CO LTD
- Filing Date
- 2025-06-26
- Publication Date
- 2026-06-12
AI Technical Summary
Traditional contact-based methods for measuring insulation thickness can damage products and are not very accurate.
A non-contact insulation layer measurement device is adopted, which uses a laser probe to emit laser beams of different powers. The multi-dimensional movement of the laser probe is realized through a guide rail and a drive device, and the insulation layer thickness is calculated by combining the time difference of the laser beams.
It achieves high-precision, non-destructive insulation layer thickness measurement, adapts to PCBs of different shapes and sizes, and improves the flexibility and accuracy of measurement.
Smart Images

Figure CN224353783U_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic circuit technology, and in particular to an insulating layer measuring device. Background Technology
[0002] In the PCB manufacturing process, an insulating layer is usually required to cover the PCB. The accurate measurement of the insulation layer thickness is crucial to ensuring the quality and performance of the PCB.
[0003] Traditional methods for measuring insulation layers are generally contact-based, which can damage the product and result in low accuracy. Therefore, developing a high-precision, non-contact insulation layer measuring device is of significant practical importance. Utility Model Content
[0004] This application provides an insulation layer measuring device, which aims to solve the problems of product damage caused by traditional contact-type insulation layer thickness measurement and low measurement accuracy.
[0005] To solve the above-mentioned technical problems, this application proposes an insulation layer measuring device, which includes: a laser probe, a first guide rail, a second guide rail, a first driving device, and a second driving device;
[0006] The laser probe is used to emit a first laser beam and a second laser beam with different powers. The first laser beam is reflected back to the laser probe after irradiating the insulating layer on the PCB board, and the second laser beam passes through the insulating layer, irradiates the PCB board, and is reflected back to the laser probe.
[0007] The first guide rail is horizontally arranged, the second guide rail is vertically arranged, the laser probe is slidably assembled with the first guide rail and the second guide rail, the first driving device is used to drive the laser probe to move along the first guide rail, and the second driving device is used to drive the laser probe to move along the second guide rail.
[0008] Furthermore, the insulation layer measuring device also includes a third guide rail and a third driving device. The third guide rail is perpendicular to the vertical plane, and the laser probe is slidably assembled with the third guide rail. The third driving device is used to drive the laser probe to move along the third guide rail so as to adjust the distance between the laser probe and the insulation layer.
[0009] Furthermore, the insulation layer measuring device also includes a first fixing block, on which a first groove is provided. The direction of the first groove is parallel to the direction of the first guide rail. The first groove is used to insert the PCB board to facilitate positioning of the PCB board.
[0010] Furthermore, the insulation layer measuring device also includes a second fixing block, on which a second groove is provided. The direction of the second groove is parallel to the direction of the first groove. The end of the PCB board away from the first groove is inserted into the second groove, thereby fixing the position of the PCB board.
[0011] Furthermore, the insulation layer measuring device also includes a fourth guide rail, which is vertically arranged. The second fixing block is slidably assembled with the fourth guide rail and can move along the fourth guide rail to clamp the PCB board between the first fixing block and the second fixing block.
[0012] Furthermore, the insulation layer measuring device also includes a first support plate, which is L-shaped, and the third guide rail is fixedly mounted on the first support plate, while the first support plate is slidably mounted on the second guide rail.
[0013] Furthermore, the insulation layer measuring device also includes a second support plate, the second guide rail is fixedly mounted on the second support plate, and the side of the second support plate away from the second guide rail is slidably assembled with the first guide rail.
[0014] Furthermore, the insulation layer measuring device also includes a fifth guide rail, which is parallel to and spaced apart from the first guide rail. The end of the second support plate away from the first guide rail is slidably assembled with the fifth guide rail to stabilize the position of the second support plate.
[0015] Furthermore, the insulation layer measuring device also includes a display screen for displaying the operating parameters of the insulation layer measuring device.
[0016] The beneficial effects of this application are as follows: The insulation layer measuring device provided in this application includes a laser probe, a first guide rail, a second guide rail, a first driving device, and a second driving device. The laser probe is used to emit a first laser beam and a second laser beam with different powers. The first laser beam irradiates the insulation layer on the PCB board and is reflected back to the laser probe. The second laser beam passes through the insulation layer, irradiates the PCB board, and is reflected back to the laser probe. The first guide rail is horizontally set, and the second guide rail is vertically set. The laser probe is slidably assembled with the first and second guide rails. The first driving device is used to drive the laser probe to move along the first guide rail, and the second driving device is used to drive the laser probe to move along the second guide rail. The insulation layer measuring device calculates the thickness of the insulation layer based on the time difference between the first and second laser beams. By driving the laser probe to move along the first and second guide rails, the laser probe can accurately measure the thickness of the insulation layer on the entire surface of the PCB board without damaging the product. Attached Figure Description
[0017] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Wherein:
[0018] Figure 1 This is a schematic diagram of the overall appearance of the insulation layer measuring device in one embodiment of the present invention;
[0019] Figure 2 This is a three-dimensional structural schematic diagram of the insulation layer measuring device in one embodiment of the present invention;
[0020] Figure 3 This is a three-dimensional structural schematic diagram of the insulation layer measuring device in one embodiment of the present invention from another perspective;
[0021] Figure 4 This is a three-dimensional structural diagram of the second guide rail and its related parts in one embodiment of the present invention.
[0022] Explanation of reference numerals in the attached drawings: 10, PCB board; 100, laser probe; 200, first guide rail; 210, first driving device; 220, second support plate; 221, fifth guide rail; 300, second guide rail; 310, second driving device; 400, support column; 410, connecting plate; 420, assembly plate; 500, third guide rail; 510, third driving device; 520, first support plate; 600, substrate; 610, first fixing block; 620, second fixing block; 700, fourth guide rail; 800, display screen; 900, housing. Detailed Implementation
[0023] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.
[0024] Those skilled in the art will understand that, unless explicitly stated otherwise, the singular forms “a,” “an,” “the,” and “the” used herein may also include the plural forms. It should be further understood that the term “comprising” as used in the specification of this application means the presence of features, integers, steps, operations, elements, modules, and / or components, but does not exclude the presence or addition of one or more other features, integers, steps, operations, elements, modules, components, and / or groups thereof. It should be understood that when we say an element is “connected” or “coupled” to another element, it can be directly connected or coupled to the other element, or there may be intermediate elements. Furthermore, “connected” or “coupled” as used herein can include wireless connections or wireless coupling. The term “and / or” as used herein includes all or any modules and all combinations of one or more associated listed items.
[0025] Those skilled in the art will understand that, unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. It should also be understood that terms such as those defined in general dictionaries should be understood to have the same meaning as in the context of the prior art, and should not be interpreted in an idealized or overly formal sense unless specifically defined as herein.
[0026] like Figure 2 As shown, this application provides an insulation layer measuring device, which includes a laser probe 100, a first guide rail 200, a second guide rail 300, a first driving device 210, and a second driving device 310. The laser probe 100 is used to emit a first laser beam and a second laser beam with different powers. The first laser beam irradiates the insulation layer on the PCB board 10 and is reflected back to the laser probe 100. The second laser beam passes through the insulation layer, irradiates the PCB board 10, and is reflected back to the laser probe 100. The first guide rail 200 is set horizontally, and the second guide rail 300 is set vertically. The laser probe 100 is slidably assembled with the first guide rail 200 and the second guide rail 300. The first driving device 210 is used to drive the laser probe 100 to move along the first guide rail 200, and the second driving device 310 is used to drive the laser probe 100 to move along the second guide rail 300.
[0027] In one specific embodiment, the laser probe 100 is a key component of the entire insulation layer measurement device, capable of emitting two laser beams with different powers. The first laser beam, due to its relatively low power, only reflects off the surface of the insulation layer, while the second laser beam, with higher power, penetrates the insulation layer and reflects off the surface of the PCB board 10. These two laser beams, upon returning to the laser probe 100, follow different paths, resulting in a time difference. The insulation layer measurement device includes a processor, which can accurately calculate the thickness of the insulation layer based on the time difference detected by the laser probe 100.
[0028] The insulation layer measuring device also includes two spaced-apart support columns 400, which are vertically arranged. A first guide rail 200 is placed horizontally and fixedly assembled with the two support columns 400. A second guide rail 300 is vertically arranged perpendicular to the first guide rail 200. The laser probe 100 is slidably assembled with the first guide rail 200 and the second guide rail 300. In this embodiment, both the first driving device 210 and the second driving device 310 are motors. The first driving device 210 and the second driving device 310 are used to drive the laser probe 100 to move along the first guide rail 200 and the second guide rail 300, respectively, thereby realizing the measurement of the insulation layer thickness at different positions on the PCB board 10 in a vertical plane.
[0029] In summary, this application, based on the principle of non-contact measurement, avoids physical damage to the PCB board 10 and the insulating layer. Compared with traditional contact measurement, it is not affected by factors such as the contact pressure between the measuring head and the surface of the object being measured, greatly improving measurement accuracy and reliability. Moreover, through the movement of the guide rails in two directions, it can flexibly measure the insulating layer at different locations on the PCB board 10, adapting to PCB boards 10 of various shapes and sizes.
[0030] like Figure 2 As shown, the insulation layer measuring device also includes a third guide rail 500 and a third driving device 510. The third guide rail 500 is perpendicular to the vertical plane. The laser probe 100 is slidably assembled with the third guide rail 500. The third driving device 510 is used to drive the laser probe 100 to move along the third guide rail 500 so as to adjust the distance between the laser probe 100 and the insulation layer.
[0031] In one specific embodiment, the direction of the third guide rail 500 is perpendicular to the vertical plane, meaning it is perpendicular to the plane formed by the first guide rail 200 and the second guide rail 300, providing the laser probe 100 with a third dimension of movement. The laser probe 100 is slidably mounted to the third guide rail 500, and the third drive device 510 controls the movement of the laser probe 100 along the third guide rail 500. The third guide rail 500 is designed to allow for more flexible adjustment of the distance between the laser probe 100 and the insulating layer. Because different PCB boards 10 may have different thicknesses, the position of the insulating layer may also vary. By adjusting the distance between the laser probe 100 and the insulating layer, it can be ensured that the laser beam can accurately irradiate the insulating layer and penetrate the insulating layer to reach the PCB board 10, thereby ensuring the accuracy of the measurement.
[0032] In summary, the addition of the third guide rail 500 and the third drive device 510 significantly enhances the adaptability of the insulation layer measurement device to PCB boards 10 of varying thicknesses. It is no longer limited to measuring PCB boards 10 within a specific thickness range; regardless of whether the PCB board 10 is thick or thin, the accuracy of the measurement can be ensured by adjusting the distance between the laser probe 100 and the insulation layer. This design further expands the application range of the insulation layer measurement device and improves its versatility and practicality.
[0033] like Figure 3 As shown, the insulation layer measuring device also includes a first fixing block 610, on which a first groove is provided. The direction of the first groove is parallel to the direction of the first guide rail 200. The first groove is used to insert the PCB board 10 so as to position the PCB board 10.
[0034] In one specific embodiment, the insulation layer measuring device further includes a substrate 600, which is horizontally disposed between two support columns 400. A first fixing block 610 is provided in the middle of the upper surface of the substrate 600. The first fixing block 610 is elongated and fixedly installed on the substrate 600. An elongated first groove is provided on the first fixing block 610, and the direction of the first groove is parallel to the first guide rail 200. When it is necessary to measure the insulation layer thickness on the PCB board 10, the PCB board 10 is inserted into the first groove. Since the first groove is aligned with the first guide rail 200, the position of the PCB board 10 in the vertical plane can be initially determined, laying the foundation for subsequent accurate measurement of the insulation layer thickness. At the same time, by inserting the PCB board 10 into the groove, the operation is simple and convenient, and the position of the PCB board 10 can be quickly fixed, improving measurement efficiency.
[0035] In summary, the design of the first fixing block 610 and the first groove provides a simple and effective positioning method for the PCB board 10. It can quickly and accurately determine the position of the PCB board 10 in the vertical plane. At the same time, this positioning method is easy to operate and can improve measurement efficiency, and is especially suitable for measuring the insulation layer thickness of the PCB board 10 in mass production.
[0036] like Figure 3 As shown, the insulation layer measuring device also includes a second fixing block 620. The second fixing block 620 is provided with a second groove. The direction of the second groove is parallel to the direction of the first groove. The end of the PCB board 10 away from the first groove is inserted into the second groove, so that the position of the PCB board 10 is fixed.
[0037] In one specific embodiment, the second fixing block 620 is arranged parallel to and spaced apart from the first fixing block 610, with the second fixing block 620 positioned above the first fixing block 610. The second fixing block 620 has a long, narrow second groove parallel to the direction of the first groove. The function of the second groove is to further stabilize the position of the PCB board 10. When one end of the PCB board 10 is inserted into the first groove, the other end is inserted into the second groove, thus fixing both ends of the PCB board 10. This method of fixing both ends improves the stability of the PCB board 10 during measurement compared to positioning from only one end. In actual measurement, due to factors such as the movement of the laser probe 100 and potential environmental vibrations, if the PCB board 10 is not securely fixed, the measurement position can easily shift, affecting the accuracy of the measurement results. The cooperation between the second fixing block 620 and the first fixing block 610 effectively solves this problem.
[0038] like Figure 3 As shown, the insulation layer measuring device also includes a fourth guide rail 700, which is vertically arranged. The second fixing block 620 is slidably assembled with the fourth guide rail 700. The second fixing block 620 can move along the fourth guide rail 700 to clamp the PCB board 10 between the first fixing block 610 and the second fixing block 620.
[0039] In one specific embodiment, two fourth guide rails 700 are provided, and the two fourth guide rails 700 are respectively fixedly mounted on two support columns 400. The fourth guide rails 700 are vertically arranged. The insulation layer measuring device also includes a connecting plate 410 and an assembly plate 420. The connecting plate 410 is horizontally arranged and slidably assembled with the two fourth guide rails 700. Two assembly plates 420 are provided and are arranged in parallel and spaced apart. The two assembly plates 420 are fixedly assembled with the connecting plate 410. The second fixing block 620 is located between the two assembly plates 420, and both ends of the second fixing block 620 are fixedly installed with the two assembly plates 420 to realize the sliding connection between the second fixing block 620 and the fourth guide rails 700. The insulation layer measuring device also includes a fourth driving device. The fourth driving device drives the second fixing block 620 to move along the fourth guide rails 700, which can realize the tight clamping of the PCB board 10 between the first fixing block 610 and the second fixing block 620.
[0040] In summary, the fourth guide rail 700 allows for more flexible and precise fixing of PCB boards 10 of varying heights by the insulation layer measuring device. By adjusting the position of the second fixing block 620 according to the actual height of the PCB board 10, a suitable clamping force can be provided, ensuring the stability of the PCB board 10 during measurement and preventing damage caused by improper clamping force. This further improves the versatility and adaptability of the insulation layer measuring device, enabling it to meet the measurement needs of PCB boards 10 of various heights.
[0041] like Figure 4 As shown, the insulation layer measuring device also includes a first support plate 520, which is L-shaped. A third guide rail 500 is fixedly mounted on the first support plate 520, and the first support plate 520 is slidably mounted on the second guide rail 300.
[0042] In one specific embodiment, the third guide rail 500 is fixedly mounted on the first support plate 520, providing a stable supporting foundation for the third guide rail 500. On the other hand, the first support plate 520 is slidably assembled with the second guide rail 300, thus establishing a kinematic connection between the third guide rail 500 and the second guide rail 300. Since the second guide rail 300 is vertically arranged, the sliding of the first support plate 520 along the second guide rail 300 can drive the third guide rail 500 and the laser probe 100 mounted on the third guide rail 500 to move vertically. This design integrates the kinematic relationships between the different guide rails, making the movement of the laser probe 100 in three-dimensional space more coordinated and orderly.
[0043] In summary, the L-shaped design of the first support plate 520 and its assembly relationship with the second and third guide rails 500 optimize the overall structure of the insulation layer measuring device. This makes the movement of the laser probe 100 in three-dimensional space more coordinated and the operation more convenient and efficient. At the same time, this integrated design reduces structural complexity and improves the stability of the equipment.
[0044] like Figure 4 As shown, the insulation layer measuring device also includes a second support plate 220, and a second guide rail 300 is fixedly installed on the second support plate 220. The side of the second support plate 220 away from the second guide rail 300 is slidably assembled with the first guide rail 200.
[0045] In one specific embodiment, the second support plate 220 is rectangular in shape and vertically arranged. In the structure of the insulation layer measuring device, the second support plate 220 supports the second guide rail 300 and enables the movement of the second guide rail 300 and the first guide rail 200. The second guide rail 300 is fixedly mounted on the second support plate 220, providing stable support. The side of the second support plate 220 away from the second guide rail 300 is slidably fitted with the first guide rail 200, thus establishing a movement connection between the two. When the first driving device 210 drives the second support plate 220 to move along the first guide rail 200, the second guide rail 300 and components such as the laser probe 100 mounted on the second guide rail 300 also move horizontally. This design makes the movements of the various components of the insulation layer measuring device interconnected, forming an organic whole.
[0046] In summary, the placement of the second carrier plate 220 optimizes the motion control structure of the insulation layer measurement device, making the movement of the laser probe 100 in the horizontal and vertical directions more coordinated. This improves measurement efficiency, enabling rapid and comprehensive measurement of the insulation layer at different locations on the PCB board 10.
[0047] like Figure 2 As shown, the insulation layer measuring device also includes a fifth guide rail 221, which is arranged parallel to and spaced apart from the first guide rail 200. The end of the second support plate 220 away from the first guide rail 200 is slidably assembled with the fifth guide rail 221 to stabilize the position of the second support plate 220.
[0048] In one specific embodiment, the fifth guide rail 221 is arranged parallel to and spaced apart from the first guide rail 200, and the fifth guide rail 221 is fixedly assembled to the side of the substrate 600. The main function of the fifth guide rail 221 is to further stabilize the position of the second support plate 220. The end of the second support plate 220 away from the first guide rail 200 is slidably assembled with the fifth guide rail 221, thus forming a double-sided support for the second support plate 220. When the second support plate 220 moves along the first guide rail 200, the fifth guide rail 221 can share part of the weight and lateral force generated during movement from the second support plate 220 and the components such as the second guide rail 300 and the laser probe 100 mounted on it. This double-sided guide rail support design is similar to installing two stable "tracks" on the second support plate 220, making it more stable during movement and reducing measurement errors caused by the instability of the second support plate 220.
[0049] In summary, the fifth guide rail 221 significantly improves the stability of the second support plate 220, thereby enhancing the stability and measurement accuracy of the laser probe 100 during the measurement process.
[0050] like Figure 1 As shown, the insulation layer measuring device also includes a display screen 800, which is used to display the operating parameters of the insulation layer measuring device.
[0051] In one specific embodiment, the display screen 800 serves as a crucial part of the human-machine interface for the insulation layer measuring device, visually displaying the measuring machine's operating parameters. These parameters include, but are not limited to, the measured insulation layer thickness data, the position information of the laser probe 100, the measurement time, and the measurement mode. By observing the parameters on the display screen 800, operators can monitor the measuring machine's operating status in real time. This visualized display of operating parameters allows operators to more conveniently operate and monitor the insulation layer measuring device, improving the efficiency of the measurement work.
[0052] like Figure 1 As shown, the insulation layer measuring device also includes a housing 900, and the components in the insulation layer measuring device are mounted based on the housing 900.
[0053] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.
Claims
1. An insulation layer measuring device for measuring the thickness of an insulation layer on a PCB board, characterized in that, Includes: a laser probe, a first guide rail, a second guide rail, a first drive unit, and a second drive unit; The laser probe is used to emit a first laser beam and a second laser beam with different powers. The first laser beam is reflected back to the laser probe after irradiating the insulating layer on the PCB board, and the second laser beam passes through the insulating layer, irradiates the PCB board, and is reflected back to the laser probe. The first guide rail is horizontally arranged, the second guide rail is vertically arranged, the laser probe is slidably assembled with the first guide rail and the second guide rail, the first driving device is used to drive the laser probe to move along the first guide rail, and the second driving device is used to drive the laser probe to move along the second guide rail.
2. The insulation layer measuring device according to claim 1, characterized in that, The insulation layer measuring device further includes a third guide rail and a third driving device. The third guide rail is perpendicular to the vertical plane. The laser probe is slidably assembled with the third guide rail. The third driving device is used to drive the laser probe to move along the third guide rail so as to adjust the distance between the laser probe and the insulation layer.
3. The insulation layer measuring device according to claim 1, characterized in that, The insulation layer measuring device further includes a first fixing block, on which a first groove is provided. The direction of the first groove is parallel to the direction of the first guide rail. The first groove is used to insert the PCB board to facilitate the positioning of the PCB board.
4. The insulation layer measuring device according to claim 3, characterized in that, The insulation layer measuring device further includes a second fixing block, on which a second groove is provided. The direction of the second groove is parallel to the direction of the first groove. The end of the PCB board away from the first groove is inserted into the second groove, thereby fixing the position of the PCB board.
5. The insulation layer measuring device according to claim 4, characterized in that, The insulation layer measuring device further includes a fourth guide rail, which is vertically arranged. The second fixing block is slidably assembled with the fourth guide rail and can move along the fourth guide rail to clamp the PCB board between the first fixing block and the second fixing block.
6. The insulation layer measuring device according to claim 2, characterized in that, The insulation layer measuring device further includes a first support plate, which is L-shaped. The third guide rail is fixedly mounted on the first support plate, and the first support plate is slidably mounted on the second guide rail.
7. The insulation layer measuring device according to claim 2, characterized in that, The insulation layer measuring device further includes a second support plate, the second guide rail is fixedly mounted on the second support plate, and the side of the second support plate away from the second guide rail is slidably assembled with the first guide rail.
8. The insulation layer measuring device according to claim 7, characterized in that, The insulation layer measuring device further includes a fifth guide rail, which is parallel and spaced apart from the first guide rail. The end of the second support plate away from the first guide rail is slidably assembled with the fifth guide rail to stabilize the position of the second support plate.
9. The insulation layer measuring device according to claim 1, characterized in that, The insulation layer measuring device also includes a display screen, which is used to display the operating parameters of the insulation layer measuring device.