Embedded semiconductor chip handler test cabinet

Abstract

The utility model provides a kind of embedded semiconductor chip sorting machine test cabinet, including cabinet, the rack assembly for placing sorting machine is fixedly installed in the cabinet, the rack assembly includes the support frame fixedly installed in the bottom four corners of the cabinet, along the support frame height direction is spaced apart and is installed with several placement plates, every the placement plate four corners with the inside connection of the support frame so that the placement plate can be detachably mounted on the support frame, several the placement plate is installed on the support frame and forms several placement layers for placing sorting machine, the cabinet both sides are installed with several heat dissipation components, the heat dissipation component is used to heat dissipation when the sorting machine on every the placement layer works;Rack assembly can place multiple sorting machines simultaneously, and the spacing of adjacent two placement plates up and down can be adjusted according to the size of sorting machine;Cabinet is installed with multiple heat dissipation components for discharging the heat generated when sorting machine works.

Description

Technical Field

[0001] This utility model relates to the technical field of test cabinets, and in particular to a test cabinet for embedded semiconductor chip sorting machines. Background Technology

[0002] With the rapid development of the semiconductor industry, chip sorting machines, as key equipment in the back-end processes of semiconductor manufacturing, directly affect the production quality and cost of chips through their testing efficiency and accuracy. Traditional semiconductor chip sorting machine testing systems typically employ open testing platforms or simple rack structures, which have the following drawbacks:

[0003] Insufficient heat dissipation: Most existing test cabinets use a single fan cooling design, which cannot meet the concentrated heat generated during high-density integrated circuit testing, resulting in excessively high equipment temperature and affecting test stability.

[0004] Low space utilization: The internal layout of traditional cabinets is fixed and cannot be flexibly adjusted according to sorting machine modules of different sizes, resulting in wasted space or difficulty in module installation. Utility Model Content

[0005] The main purpose of this utility model is to provide a test cabinet for an embedded semiconductor chip sorting machine, which addresses the shortcomings of the existing technology.

[0006] To achieve the above objectives, the present invention provides the following technical solution:

[0007] An embedded semiconductor chip sorting machine testing cabinet includes a cabinet body. A rack assembly for placing the sorting machine is fixedly installed inside the cabinet body. The rack assembly includes support frames fixedly installed at the four bottom corners of the cabinet body. A plurality of placement plates are spaced apart along the height direction of the support frames. Each placement plate has its four corners connected to the inner side of the support frames so that the placement plate can be detachably mounted on the support frames. The plurality of placement plates mounted on the support frames form a plurality of placement layers for placing the sorting machine. A plurality of heat dissipation components are installed on both sides of the cabinet body to dissipate heat from the sorting machine on each placement layer during operation.

[0008] Preferably, the support frame has a plurality of grooves arranged vertically on its side, and the side of the placement plate at the connection with the support frame has holes or slots. The placement plate is detachably installed on the support frame by means of fasteners passing through the grooves and holes or slots.

[0009] Preferably, the placement plate has an array of several heat dissipation slots.

[0010] Preferably, a baffle is fixedly installed on the upper end of the placement plate.

[0011] Preferably, the heat dissipation components are installed at both the bottom and top of the cabinet.

[0012] Preferably, at least two of the heat dissipation components are installed on both sides of the placement layer, at the bottom of the cabinet, and at the top of the cabinet.

[0013] Preferably, the heat dissipation assembly includes a mesh cover, a metal plate, a filter, a fan body, and a protective mesh. The fan body is fixedly installed inside the cabinet with its air outlet facing the sorting machine on the placement layer. The protective mesh is installed outside the air outlet of the fan body, the filter is installed outside the air inlet of the fan body, the metal plate is installed outside the filter, and the mesh cover is installed outside the metal plate.

[0014] Preferably, the bottom of the cabinet is equipped with casters.

[0015] Compared with the prior art, the present invention will have at least the following beneficial effects:

[0016] ① Multiple sorting machines can be placed on the frame assembly simultaneously, and the spacing between two adjacent placement plates can be adjusted according to the size of the sorting machines. Specifically, the support frame has several grooves arranged vertically on its side, and the side where the placement plate connects to the support frame has slots. The placement plate is detachably installed on the support frame by passing a fastener through the grooves and slots. When it is necessary to adjust the spacing between two adjacent placement plates, the fastener is loosened, the placement plate is moved up and down and the slots on the placement plate are aligned with the grooves on the support frame, and then the fastener is passed through the grooves and slots to fix the placement plate on the support frame. This achieves the adjustment of the spacing between two adjacent placement plates, so that semiconductor chip sorting machines of different sizes can be placed on different placement plates.

[0017] ② Multiple heat dissipation components are installed on the cabinet to dissipate the heat generated when the sorting machine is working. Specifically, at least two heat dissipation components are installed on both sides of the placement layer, the bottom of the cabinet, and the top of the cabinet, which can improve the heat dissipation efficiency of the semiconductor chip sorting machine on the rack assembly. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this utility model or the prior art, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are merely exemplary embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort, wherein:

[0019] Figure 1 This is a schematic diagram of the test cabinet for the embedded semiconductor chip sorting machine of this utility model;

[0020] Figure 2 This is a schematic diagram of the test cabinet for the embedded semiconductor chip sorting machine of this utility model, excluding the outer shell;

[0021] Figure 3 This is a front sectional view of the test cabinet for the embedded semiconductor chip sorting machine of this utility model;

[0022] Figure 4 This is a schematic diagram of the rack assembly in the test cabinet of the embedded semiconductor chip sorting machine of this utility model;

[0023] Figure 5 for Figure 4 Enlarged view of point A;

[0024] Figure 6 for Figure 4 A schematic diagram of the decomposition process;

[0025] Figure 7 for Figure 6 Enlarged view of point B;

[0026] Figure 8 This is a schematic diagram of the heat dissipation component in the test cabinet of the embedded semiconductor chip sorting machine of this utility model;

[0027] Figure 9 This is an exploded view of the heat dissipation components in the test cabinet of the embedded semiconductor chip sorting machine of this utility model.

[0028] The reference numerals in the figures include:

[0029] 1. Cabinet; 2. Support frame; 3. Placement board; 4. Groove; 5. Hole slot; 6. Heat dissipation slot; 7. Baffle; 8. Mesh cover; 9. Metal plate; 10. Filter screen; 11. Fan body; 110. Air inlet; 111. Air outlet; 12. Protective net; 13. Casters; 14. Sorting machine. Detailed Implementation

[0030] The technical solutions in the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely exemplary embodiments of this utility model, and not the only embodiments.

[0031] like Figures 1 to 9As shown, the test cabinet for the embedded semiconductor chip sorting machine includes a cabinet body 1. A rack assembly for placing the sorting machine 14 is fixedly installed inside the cabinet body 1. The rack assembly includes support frames 2 fixedly installed at the four bottom corners inside the cabinet body 1. Several placement plates 3 are installed at intervals along the height direction of the support frames 2. The four corners of each placement plate 3 are connected to the inside of the support frames 2 so that the placement plate 3 can be detachably installed on the support frames 2. Several placement plates 3 are installed on the support frames 2 to form several placement layers for placing the sorting machine 14. Several heat dissipation components are installed on both sides of the cabinet body 1. The heat dissipation components are all set facing the semiconductor chip sorting machine 14 on the placement plates 3. Each side of each placement plate 3 is provided with a corresponding heat dissipation component. When the semiconductor chip sorting machine 14 is working, it will generate a certain amount of heat, which needs to be dissipated from the cabinet body 1 in time. The heat dissipation components can be used to dissipate heat from the sorting machine 14 on each placement layer when it is working.

[0032] like Figures 4 to 7 As shown, each support frame 2 has several grooves 4 arranged vertically on its side, and each placement plate 3 has a hole 5 on its side at the connection with each support frame 2. The placement plate 3 is detachably installed on the support frame 2 by passing a fastener through the grooves 4 and the hole 5. When it is necessary to adjust the distance between two adjacent placement plates 3, the fastener is loosened, the placement plate 3 is moved up and down and the hole 5 on the placement plate 3 is aligned with the groove 4 on the support frame 2, and then the fastener is passed through the grooves 4 and the hole 5 to fix the placement plate 3 on the support frame 2. This achieves the adjustment of the distance between two adjacent placement plates 3, so that semiconductor chip sorting machines 14 of different sizes can be placed on different placement plates 3.

[0033] Each placement plate 3 has several heat dissipation slots 6 arrayed on it. When the semiconductor chip sorter 14 is placed on the placement plate 3 for testing, it will generate a certain amount of heat. Therefore, it is necessary to dissipate and disperse the generated heat in a timely manner. Thus, heat dissipation slots 6 are set on the placement plate 3. Setting multiple heat dissipation slots 6 can accelerate the rate of heat dissipation.

[0034] Each placement plate 3 has a baffle 7 fixedly installed at the end of its upper surface. The baffle 7 can protect the semiconductor chip sorter 14 placed on the placement plate 3 and prevent the semiconductor chip sorter 14 from tilting and tipping over when it is working.

[0035] Heat dissipation components are installed at the bottom and top of the cabinet 1. The heat dissipation component at the bottom of the cabinet 1 can dissipate heat from the semiconductor chip sorter 14 on the lowest placement layer of the rack assembly inside the cabinet 1, and the heat dissipation component at the top of the cabinet 1 can dissipate heat from the semiconductor chip sorter 14 on the highest placement layer of the rack assembly inside the cabinet 1. Thus, the heat dissipation components on both sides of the cabinet 1, the heat dissipation component at the bottom of the cabinet 1, and the heat dissipation component at the top of the cabinet 1 together form a protective barrier for the several semiconductor chip sorters 14 on the rack assembly. The combined effect of the several heat dissipation components can efficiently dissipate and disperse the heat generated by the several semiconductor chip sorters 14 during operation, and at the same time dissipate and disperse the heat generated by other components inside the cabinet 1 during operation, thus protecting the entire cabinet 1.

[0036] To improve the heat dissipation efficiency of the semiconductor chip sorter 14 on the rack assembly, at least two heat dissipation components are installed on both sides of each placement layer, at the bottom of the cabinet 1, and at the top of the cabinet 1.

[0037] like Figure 8 and Figure 9 As shown, the heat dissipation assembly includes a mesh cover 8, a metal plate 9, a filter 10, a fan body 11, and a protective mesh 12. The fan body 11 is fixedly installed inside the cabinet 1, with its air outlet 111 facing the sorting machine 14 on the placement layer. The protective mesh 12 is installed outside the air outlet 111 of the fan body 11, preventing the fan blades from touching the frame assembly when the fan body 11 is working. The filter 10 is installed outside the air inlet 110 of the fan body 11, preventing debris from entering the fan body 11 and affecting its normal operation. The metal plate 9 is installed outside the filter 10, absorbing heat dissipated from inside the cabinet 1 to outside. The mesh cover 8 is installed outside the metal plate 9, protecting the components of the heat dissipation assembly other than the mesh cover 8.

[0038] To facilitate the movement of cabinet 1, casters 13 are provided at the bottom of cabinet 1.

[0039] It is understandable that other components, such as control switches and power cords, are also installed on cabinet 1. These are all within the scope of existing technology and will not be described in detail here.

[0040] The above description is merely a preferred embodiment of this utility model. The protection scope of this utility model is not limited to the above embodiments. All technical solutions falling within the scope of this utility model's concept are protected. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principle of this utility model should also be considered within the protection scope of this utility model.

Claims

1. A test cabinet for an embedded semiconductor chip sorting machine, comprising a cabinet body (1), characterized in that, The cabinet (1) is fixedly installed with a frame assembly for placing a sorting machine (14). The frame assembly includes a support frame (2) fixedly installed at the four corners of the bottom of the cabinet (1). Several placement plates (3) are installed at intervals along the height direction of the support frame (2). The four corners of each placement plate (3) are connected to the inside of the support frame (2) so that the placement plate (3) can be detachably installed on the support frame (2). Several placement plates (3) are installed on the support frame (2) to form several placement layers for placing the sorting machine (14). Several heat dissipation components are installed on both sides of the cabinet (1). The heat dissipation components are used to dissipate heat when the sorting machine (14) on each placement layer is working.

2. The test cabinet for the embedded semiconductor chip sorting machine according to claim 1, characterized in that, The support frame (2) has several grooves (4) arranged vertically on its side. The side of the placement plate (3) connected to the support frame (2) has holes (5). The placement plate (3) is detachably installed on the support frame (2) by passing a fastener through the grooves (4) and the holes (5).

3. The test cabinet for the embedded semiconductor chip sorting machine according to claim 1, characterized in that, The placement plate (3) has several heat dissipation slots (6) arranged in an array.

4. The test cabinet for the embedded semiconductor chip sorting machine according to claim 3, characterized in that, A baffle (7) is fixedly installed on the upper end of the placement plate (3).

5. The test cabinet for the embedded semiconductor chip sorting machine according to claim 1, characterized in that, The heat dissipation components are installed at both the bottom and top of the cabinet (1).

6. The test cabinet for the embedded semiconductor chip sorting machine according to claim 5, characterized in that, At least two heat dissipation components are installed on both sides of the placement layer, at the bottom of the cabinet (1), and at the top of the cabinet (1).

7. The test cabinet for an embedded semiconductor chip sorting machine according to claim 6, characterized in that, The heat dissipation assembly includes a mesh cover (8), a metal plate (9), a filter (10), a fan body (11), and a protective mesh (12). The fan body (11) is fixedly installed inside the cabinet (1), and the air outlet (111) of the fan body (11) faces the sorting machine (14) on the placement layer. The protective mesh (12) is installed outside the air outlet (111) of the fan body (11). The filter (10) is installed outside the air inlet (110) of the fan body (11). The metal plate (9) is installed outside the filter (10), and the mesh cover (8) is installed outside the metal plate (9).

8. The test cabinet for the embedded semiconductor chip sorting machine according to claim 1, characterized in that, The cabinet (1) is equipped with casters (13) at the bottom.

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