Electronic chassis and electronic device

Abstract

The application discloses an electronic case and electronic equipment, wherein the electronic case comprises a case body, a cover plate and a partition plate, the case body has a case bottom wall and a case opening arranged opposite to the case bottom wall; the cover plate covers the case opening; the partition plate is located between the cover plate and the case bottom wall, and separates an inner cavity of the case body into a first cavity and a second cavity; the first cavity is used for loading a circuit board and forms a containing space required for pouring and sealing the circuit board. Since the second cavity can occupy part of the excess space in the electronic case, the amount of pouring glue can be reduced when pouring glue into the electronic case, so that the cost of pouring and sealing the electronic case is greatly reduced.

Description

Technical Field

[0001] This application relates to the technical field of electronic enclosure potting, and more specifically, to an electronic enclosure and electronic equipment. Background Technology

[0002] Currently, to ensure the airtightness of electronic components inside electronic enclosures, potting is often used for sealing. For example, common micro or small inverters are often sealed using potting. When injecting potting compound into the electronic enclosure, the entire enclosure often needs to be filled with it. Therefore, the amount of potting compound required for sealing is relatively large, resulting in high costs.

[0003] In summary, how to reduce the amount of potting compound required for sealing electronic chassis has become a technical problem that urgently needs to be solved by those skilled in the art. Utility Model Content

[0004] In view of this, this application provides an electronic enclosure and electronic device to reduce the amount of potting compound required for sealing the electronic enclosure.

[0005] To achieve the above objectives, this application provides the following technical solution:

[0006] An electronic enclosure, comprising:

[0007] The enclosure has a bottom wall and an opening opposite to the bottom wall;

[0008] A cover plate that closes to the opening of the chassis;

[0009] A partition is located between the cover plate and the bottom wall of the chassis, and divides the inner cavity of the chassis into a first cavity and a second cavity;

[0010] The first cavity is used to load the circuit board and form the accommodating space required for potting the circuit board.

[0011] In some embodiments of this application, the side of the cover plate facing the opening of the chassis is a first plate surface, and the partition is disposed on the first plate surface and surrounds the first plate surface to form the second cavity.

[0012] In some embodiments of this application, the circumferential edge of the first plate is provided with a first sealing structure adapted to the opening of the chassis, and the partition is disposed in the inner periphery of the first sealing structure;

[0013] Alternatively, the partition may have a second sealing structure along its circumferential edge that is adapted to the opening of the chassis.

[0014] In some embodiments of this application, the partition is disposed on the inner sidewall of the box;

[0015] Alternatively, the partition has a flange extending toward the bottom wall of the chassis, the flange being disposed on the bottom wall of the chassis;

[0016] Alternatively, the outer edge of the partition is disposed on the side of the circuit board facing the cover plate.

[0017] In some embodiments of this application, the side of the partition facing away from the cover plate is provided with a conformal structure, which is used to conformally adapt to electronic devices on the circuit board.

[0018] In some embodiments of this application, the conformal structure includes a first conformal structure and / or a second conformal structure;

[0019] Wherein, the first conformal structure is a concave structure formed by the partition recessing towards the interior of the second cavity, the concave structure being used to match electronic devices at a first height position on the circuit board; the second conformal structure is a convex structure formed by the partition protruding towards the first cavity, the convex structure being used to match electronic devices at a second height position on the circuit board; wherein, in the first direction, the first height position is higher than the second height position, and the first direction is the direction of the bottom wall of the chassis towards the cover plate.

[0020] In some embodiments of this application, heat dissipation teeth are also provided on the inner wall of the second cavity.

[0021] In some embodiments of this application, one end of the heat dissipation tooth is connected to the cover plate, and the other end is a free end;

[0022] Alternatively, one end of the heat dissipation tooth is connected to the partition plate, and the other end is a free end;

[0023] Alternatively, one end of the heat dissipation fin is connected to the cover plate, and the other end is connected to the partition plate;

[0024] Alternatively, one end of some of the heat dissipation teeth may be connected to the cover plate, while the other end is free; or one end of some of the heat dissipation teeth may be connected to the partition plate, while the other end is free.

[0025] In some embodiments of this application, the arrangement of the heat dissipation fins corresponds to at least a portion of the electronic components on the circuit board.

[0026] In some embodiments of this application, one end of the heat dissipation tooth is disposed on the side cavity wall of the second cavity, and the other end is a free end.

[0027] In some embodiments of this application, a heat dissipation duct is further provided inside the second cavity, and a ventilation opening is provided on the cover plate to connect the heat dissipation duct with the external environment.

[0028] In some embodiments of this application, a heat dissipation duct and a fan are further provided inside the second cavity, and the fan is used to provide airflow power for the heat dissipation duct.

[0029] In some embodiments of this application, the heat dissipation duct is configured as an internal circulation duct that is not interconnected with the external environment; or, the heat dissipation duct is configured as an external circulation duct that is interconnected with the external environment.

[0030] In some embodiments of this application, a liquid cooling medium is disposed in the second cavity, and an inlet and an outlet communicating with the second cavity are provided on the cover plate, the inlet and the outlet being used to connect to a liquid cooling device.

[0031] In some embodiments of this application, the second cavity is configured as a sealed cavity, the second cavity is filled with a phase change medium, and the volume of the second cavity is greater than the volume of the phase change medium.

[0032] In some embodiments of this application, a condenser plate is further provided on the inner wall of the second cavity above the liquid surface of the phase change medium. One end of the condenser plate is fixed to the inner wall of the second cavity, and the other end of the condenser plate is a free end.

[0033] The height of the free end of the condenser relative to the liquid surface of the phase change medium is lower than the height of the fixed end of the condenser relative to the liquid surface of the phase change medium.

[0034] In some embodiments of this application, the portion of the partition facing away from the cover plate is arranged close to the surface of the circuit board.

[0035] In some embodiments of this application, the partition is fixedly connected to the circuit board at a position close to it;

[0036] Alternatively, the position of the partition close to the circuit board is not fixed.

[0037] In some embodiments of this application, the number of partitions is multiple, and their distribution positions correspond to the distribution positions of at least some electronic devices on the circuit board.

[0038] In some embodiments of this application, at least some of the electronic components on the circuit board are bonded to the first board surface for heat transfer;

[0039] Alternatively, at least some of the electronic components on the circuit board can transfer heat to the first board surface through a thermally conductive layer.

[0040] In some embodiments of this application, the cover plate and the partition plate are either separate fixed connection structures or integrated structures.

[0041] In some embodiments of this application, the side of the cover plate facing away from the chassis opening is a second plate surface, and the second plate surface is a plane.

[0042] To address the high cost of potting and sealing electronic chassis, the electronic chassis provided in this application divides the internal cavity of the chassis into a first cavity and a second cavity distributed sequentially along a first direction using a partition. The first cavity is used to load circuit boards and form the space required for circuit board potting. The first direction is the direction from the bottom wall of the chassis towards the cover plate. When potting the electronic chassis, only the first cavity needs to be potted, and the space occupied by the second cavity does not need to be potted, thereby reducing the amount of potting compound used and significantly reducing the cost of potting and sealing the electronic chassis.

[0043] In addition, this application also provides an electronic device, including an electronic chassis, which is the electronic chassis described in any of the above-described solutions. Since the aforementioned electronic chassis has the above-mentioned technical effects, the electronic device having this electronic chassis should also have the corresponding technical effects, which will not be elaborated further here.

[0044] The technical features mentioned above, those to be mentioned below, and those shown individually in the accompanying drawings can be combined arbitrarily, provided that the combined technical features are not contradictory. All feasible combinations of features are the technical content explicitly described herein. Any one of the multiple sub-features contained in the same statement can be applied independently, without necessarily being applied together with other sub-features. Attached Figure Description

[0045] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0046] Figure 1 This is a schematic diagram of a first cross-sectional structure of an electronic chassis provided in an embodiment of this application;

[0047] Figure 2 A schematic diagram of the split structure of the electronic chassis provided in the embodiments of this application;

[0048] Figure 3 This is a schematic diagram of a second cross-sectional structure of an electronic chassis provided in an embodiment of this application;

[0049] Figure 4 This is a schematic diagram of a third cross-sectional structure of an electronic chassis provided in an embodiment of this application;

[0050] Figure 5 This is a fourth cross-sectional view of the electronic chassis provided in an embodiment of this application;

[0051] Figure 6 A fifth cross-sectional view of the electronic chassis provided in an embodiment of this application;

[0052] Figure 7 A sixth cross-sectional view of an electronic chassis provided in an embodiment of this application;

[0053] Figure 8 A seventh cross-sectional view of an electronic chassis provided in an embodiment of this application;

[0054] Figure 9 A schematic diagram of a first structure provided in an embodiment of this application, showing a partition disposed on a cover plate;

[0055] Figure 10 This is a schematic diagram of a first structure in which heat dissipation fins are provided in the second cavity according to an embodiment of this application;

[0056] Figure 11 This is a schematic diagram of a second structure in which heat dissipation fins are provided in the second cavity according to an embodiment of this application;

[0057] Figure 12 A schematic diagram of a third structure for providing heat dissipation fins in the second chamber according to an embodiment of this application;

[0058] Figure 13 This is a schematic diagram of a fourth structure with heat dissipation fins provided in the second chamber according to an embodiment of this application;

[0059] Figure 14 A schematic diagram of a fifth structure for providing heat dissipation fins in the second chamber according to an embodiment of this application;

[0060] Figure 15 This is a schematic diagram of the structure of a second chamber with an internal condenser plate when a phase change medium is used in an embodiment of this application.

[0061] Figure 16 This is a schematic diagram of the structure of a second chamber with an internal condenser plate when a phase change medium is used in an embodiment of this application.

[0062] Figure 17 A schematic diagram of a structure provided in this application, showing that the first chamber and the second chamber are arranged along a second direction and that there is a certain gap between the partition and the circuit board;

[0063] Figure 18 A schematic diagram of a structure provided in an embodiment of this application, showing a first chamber and a second chamber arranged along a second direction with a partition plate attached to a circuit board;

[0064] Figure 19 This is a schematic diagram of a second structure provided in an embodiment of this application, in which the partition is disposed on the cover plate.

[0065] in, Figures 1-19 middle:

[0066] 10-Box;

[0067] 101 - Bottom wall of the chassis;

[0068] 102 - Chassis opening;

[0069] 11-Cover plate;

[0070] 111 - First panel;

[0071] 112 - Second panel;

[0072] 113 - First sealing structure;

[0073] 12-Partition;

[0074] 120 - Second sealing structure;

[0075] 121 - Irregular structure;

[0076] 1211 - First conformal structure;

[0077] 1212 - Second conformal structure;

[0078] 122 - Flip the edge;

[0079] 123 - outer edge;

[0080] 13-First cavity;

[0081] 14-Second cavity;

[0082] 140 - Lateral cavity wall;

[0083] 141 - Heat dissipation airflow;

[0084] 142 - Ventilation opening;

[0085] 143 - Condenser plate;

[0086] 15 - Circuit board;

[0087] 151-Electronic Components;

[0088] 16- Heat dissipation teeth. Detailed Implementation

[0089] The core of this application is to provide an electronic enclosure and electronic device to reduce the amount of potting compound required for sealing the electronic enclosure.

[0090] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0091] In related technologies, to ensure the airtightness of electronic components within an electronic enclosure, potting compound is often used for sealing. For example, common micro or small inverters frequently employ potting. When injecting potting compound into the enclosure, the entire enclosure often needs to be filled. However, the electronic components on the circuit boards inside the enclosure typically vary in height, with the product's height generally determined by the tallest component. Therefore, when the enclosure cover is closed onto the main body of the enclosure, there will be significant empty space for the shorter components on the circuit boards. The potting compound must then fill this empty space. Consequently, a large amount of potting compound is required for sealing, ultimately leading to higher costs.

[0092] Based on this, the present application provides an electronic chassis that reduces the amount of potting compound required for sealing the electronic chassis.

[0093] Specifically, refer to Figure 1 As shown, the electronic chassis provided in this application embodiment includes a chassis 10, a cover plate 11, and a partition plate 12. The chassis 10 has a chassis bottom wall 101 and a chassis opening 102. The chassis bottom wall 101 and the chassis side wall enclose the inner cavity of the chassis 10, and the side opposite to the chassis bottom wall 101 forms the chassis opening 102. Through the chassis opening 102, the circuit board 15 and related electronic components can be installed into the inner cavity of the chassis 10. The cover plate 11 is mainly used to cover the chassis opening 102 to close the chassis 10. The covering method can be, but is not limited to, fastening with fasteners. The partition plate 12 is located between the cover plate 11 and the chassis bottom wall 101 and divides the inner cavity of the chassis 10 into a first cavity 13 and a second cavity 14. The first cavity 13 is used to load the circuit board 15 and form the accommodating space required for potting the circuit board 15.

[0094] The electronic chassis divides the inner cavity of the chassis 10 into a first cavity 13 and a second cavity 14 by a partition 12. The first cavity 13 is used to load the circuit board 15 and form the space required for potting the circuit board 15. When potting the electronic chassis, only the first cavity 13 needs to be potted, and the space occupied by the second cavity 14 does not need to be potted. This reduces the amount of potting compound used and greatly reduces the cost of potting and sealing the electronic chassis.

[0095] Specifically, the first cavity 13 and the second cavity 14 can be designed as follows: Figure 1 The components shown are arranged sequentially along a first direction, which is the direction from the bottom wall 101 of the chassis towards the cover plate 11; other directions are also possible. Figure 17 and Figure 18 The arrangement shown is along a second direction, which is specifically the direction of extension along the bottom wall 101 of the chassis.

[0096] In addition, if the interior of the second cavity 14 is not filled with other materials or is filled with lighter materials, this type of electronic chassis can also help reduce the weight of the electronic chassis 1. This is because in the related technology, the internal space occupied by the second cavity 14 of the electronic chassis needs to be filled with potting compound. By replacing the original potting space with the second cavity 14, not only can the amount of potting compound be reduced, but the overall weight of the electronic chassis 1 can also be reduced.

[0097] In addition, the fixing method of the partition 12 can be selected according to actual needs. It is mainly necessary to be located between the cover plate 11 and the bottom wall 101 of the chassis and to divide the chassis 10 into the first chamber 13 and the second chamber 14.

[0098] For example, refer to Figure 2 and Figure 3 As shown, the cover plate 11 has a first plate surface 111 and a second plate surface 112. The first plate surface 111 faces the chassis opening 102 of the electronic chassis, that is, the side of the cover plate 11 opposite to the circuit board 15 inside the electronic chassis. The second plate surface 112 is the side away from the chassis opening 102, that is, the side of the cover plate 11 opposite to the circuit board 15 inside the electronic chassis 1. The partition 12 can be optionally disposed on the first plate surface 111 and together with the first plate surface 111 to form a second cavity 14. That is, the cover plate 11 and the partition 12 form a second cavity 14. The space inside the electronic chassis other than the second cavity 14 is the first cavity 13 (that is, the component cavity). The space inside the component cavity other than the components such as the circuit board 15 is the potting space. By designing the partition on the cover plate 11, it is more convenient to install the circuit board 15 and other components inside the chassis 10.

[0099] Specifically, the cover plate 11 and the partition plate 12 can be designed as a separate fixed connection structure, such as, but not limited to, fastener connection, welding, adhesive bonding, etc. Furthermore, depending on the potting method, the cover plate 11 and the partition plate 12 can also be sealed, and the sealing method is not limited, such as, but not limited to, welding, screw connection, adhesive bonding, sealing strip connection, etc. Of course, the cover plate 11 and the partition plate 12 can also be designed as a one-piece structure, such as, but not limited to, using one-piece blow molding to construct a one-piece structure.

[0100] In a further embodiment, when the partition 12 is disposed on the cover 11, it is to ensure the connection or sealing between the chassis opening 102 of the enclosure 10 and the chassis cover.

[0101] For example, refer to Figure 4 As shown, the circumferential edge of the first plate 111 may be provided with a first sealing structure 113 adapted to the chassis opening 102, and the partition 12 is disposed within the inner perimeter of the first sealing structure 113. At this time, the chassis opening 102 and the cover plate 11 are sealed together or fastened together. With this structural design, the partition 12 only needs to meet the function of separating the cavity, making the processing and manufacturing simpler and more convenient.

[0102] Another example, see reference Figure 5 As shown, the circumferential edge of the partition 12 can be provided with a second sealing structure 120 that matches the chassis opening 102. At this time, the chassis opening 102 and the partition 12 are sealed or fastened together. This structural design allows the edges of the cover plate 11 and the partition 12 to fit better. When the two adopt a separate fixed connection structure, it is more convenient to assemble and connect the two.

[0103] It is understood that the above-mentioned method of setting the partition 12 on the cover plate 11 is merely an example of the embodiments of this application. In actual application, the partition 12 can also be fixed in other positions.

[0104] For example, refer to Figure 6 As shown, the partition 12 can be optionally installed on the inner wall of the housing 10. The specific installation method can be, but is not limited to, welding, snap-fit ​​connection, or edge flanging and fastening with fasteners; no further specific limitations are made here. By installing the partition 12 on the inner wall of the housing 10, the removal and installation of the cover 11 does not affect the integrity of the enclosure of the first chamber 13. Therefore, with this structure, sealant can be applied first, and then the cover 11 can be installed, making the installation arrangement more flexible.

[0105] Another example, see reference Figure 7 As shown, the partition 12 may have a flange 122 extending toward the bottom wall 101 of the chassis, and the flange 122 is disposed on the bottom wall 101 of the chassis. The specific disposal method may be, but is not limited to, welding, snap-fit ​​connection, or edge flange fixed by fasteners, etc., and no further specific limitation is made here. By disposing of the partition 12 on the bottom wall 101 of the chassis, the removal and installation of the cover 11 can also be made without affecting the enclosure integrity of the first chamber 13. Therefore, with this structure, the cover 11 can be installed after the sealant is poured, and the installation arrangement is more flexible.

[0106] Another example is, see reference. Figure 8As shown, the outer edge 123 of the partition 12 can also be disposed on the side of the circuit board 15 facing the cover plate 11. Specific disposal methods include, but are not limited to, welding, snap-fit ​​connection, or edge flanging and fastening with fasteners; no further specific limitations are made here. By disposing of the partition 12 on the circuit board 15, the disassembly and assembly of the cover plate 11 can also be made without affecting the enclosure integrity of the first chamber 13. Therefore, with this structure, the cover plate 11 can be installed after potting, making the installation arrangement more flexible.

[0107] In some other specific implementation schemes, refer to Figure 2 and Figure 3 As shown, the partition 12 has a conformal structure 121 on the side facing away from the cover plate 11. The conformal structure 121 is mainly used to conformally adapt to the electronic device 151 on the circuit board 15. Specifically, this conformal adaptation refers to matching the height of the electronic device 151 on the circuit board 15 along a direction perpendicular to the circuit board 15. Specifically, it can abut against or maintain a small gap with the top and circumferential surfaces of the electronic device 151, such as a gap of 2mm-5mm. When abutting, it facilitates heat transfer from the electronic device 151 to the partition 12, and then the partition 12 transfers the heat to the cover plate 11, thus improving heat dissipation. With a gap, it is easier to apply thermally conductive adhesive or potting compound to enhance sealing performance. Generally, electronic devices 151 with higher heat dissipation requirements on the circuit board 15 can be placed closer to the cover plate 11 and the partition 12 to allow heat to dissipate more quickly.

[0108] For example, the conformal structure 121 corresponding to the higher electronic device 151 on the circuit board 15 is a concave structure formed on the partition 12, and the conformal structure 121 corresponding to the lower electronic device 151 on the circuit board 15 is a protruding structure formed on the partition 12. The purpose is to make up for the empty space caused by the height difference between the higher electronic device 151 and the lower electronic device 151, so as to reduce the amount of potting compound.

[0109] For example, although the height dimensions of some electronic components 151 on the circuit board 15 are relatively similar, their mounting positions on the circuit board 15 are relatively far apart. At this time, there will still be a large amount of empty space between them. In this case, through the design of the conformal structure 121, the empty space between them is occupied by the second cavity 14 formed by the partition 12 and the first plate surface 111, thereby reducing the amount of potting compound.

[0110] As another example, the conformal structure 121 on the partition 12 can be designed such that one conformal structure corresponds to at least one electronic device 151, that is, one conformal structure 121 can correspond to one electronic device 151, or one conformal structure 121 can correspond to multiple (i.e., two or more) electronic devices 151. In actual applications, specific configurations can be made according to actual needs, and no specific limitations are made here.

[0111] In a further implementation plan, refer to Figure 2 and Figure 9 The aforementioned conformal structure 121 may specifically include a first conformal structure 1211 and / or a second conformal structure 1212. That is, the conformal structure 121 may have only the first conformal structure 1211, only the second conformal structure 1212, or both. Specifically, the first conformal structure 1211 may be a concave structure formed by the partition 12 recessing towards the interior of the second cavity 14, which is used to match the electronic device 151 at a first height position on the circuit board 15. The second conformal structure 1212 is a protruding structure formed by the partition 12 protruding towards the first cavity 13, which is used to match the electronic device 151 at a second height position on the circuit board 15. The first height position is higher than the second height position in the first direction. The first conformal structure 1211 corresponds to the electronic device 151 with a higher height dimension on the circuit board 15, and the second conformal structure 1212 corresponds to the electronic device 151 with a lower height dimension on the circuit board 15. As described above, this structural form can compensate for the empty space caused by the height difference between the taller electronic component 151 and the lower electronic component 151, thereby reducing the amount of potting compound.

[0112] In some other specific implementation schemes, refer to Figure 10 As shown, the inner wall of the second cavity 14 can also be provided with heat dissipation fins 16 to improve the heat dissipation capacity of the second cavity 14. The specific arrangement of the heat dissipation fins 16 can be selected according to actual needs.

[0113] For example, refer to Figure 10 As shown, one end of the heat dissipation denticle 16 can be connected to the cover plate 11, while the other end is free. With this design, the second chamber 14 can transfer heat to the cover plate 11 through the heat dissipation denticle 16, and the second plate surface 112 of the cover plate 11 is in the external environment, so it can dissipate heat more quickly.

[0114] Another example, see reference Figure 11As shown, one end of the heat dissipation fin 16 can be connected to the partition 12, while the other end is free. With this design, the partition 12 can transfer heat to the second chamber 14 through the heat dissipation fin 16, and then to the cover plate 11 through the second chamber 14. The second surface 112 of the cover plate 11 is in the external environment, so it can dissipate heat more quickly.

[0115] Another example is, see reference. Figure 12 As shown, one end of the heat dissipation fin 16 is connected to the cover plate 11, and the other end is connected to the partition plate 12. With this design, the heat of the partition plate 12 can be transferred to the cover plate 11 through the heat dissipation fin, and the second plate surface 112 of the cover plate 11 is in the external environment, so the heat can be dissipated more quickly.

[0116] Another example is, see reference. Figure 13 As shown, one end of some of the heat dissipation teeth 16 is connected to the cover plate 11, and the other end is a free end; one end of some of the heat dissipation teeth 16 is connected to the partition plate 12, and the other end is a free end. With this design, the heat of the partition plate 12 can be transferred to the cover plate 11 through the heat dissipation teeth, and the second plate surface 112 of the cover plate 11 is in the external environment, so the heat can be dissipated more quickly.

[0117] Further implementation plans will continue to refer to Figure 13 As shown, the arrangement of the heat dissipation teeth 16 corresponds to at least some of the electronic devices 151 (generally electronic devices 151 with high heat dissipation requirements) on the circuit board 15. By designing this structure, the heat dissipation performance of these electronic devices 151 can be improved.

[0118] In addition, refer to Figure 14 As shown, one end of the aforementioned heat dissipation fin 16 is disposed on the lateral cavity wall 140 of the second cavity 14, and the other end is a free end. The lateral cavity wall 140 refers to the cavity wall of the second cavity 14 excluding the two opposing cavity walls in the first direction. This lateral cavity wall can be a portion of the partition 12 or the inner wall of the housing 10. This design also improves the heat dissipation effect of the second cavity 14.

[0119] In some specific implementation plans, continue to refer to Figure 14As shown, a heat dissipation duct 141 can also be provided inside the second chamber 14, and a vent 142 (specifically including an air inlet and an air outlet) is provided on the cover plate 11 to connect the heat dissipation duct with the external environment. By designing the heat dissipation duct 141 and the vent 142, the airflow inside the second chamber 14 can communicate with the external environment. Specifically, the external airflow can enter the heat dissipation duct 141 through the air inlet and then flow out of the heat dissipation duct 141 through the air outlet, thereby achieving heat dissipation by utilizing the heat exchange between the external airflow and the duct wall of the heat dissipation duct 141, thereby improving the heat exchange effect of the second chamber 14. Of course, it is understood that the heat dissipation teeth 16 described in the aforementioned scheme can also be provided inside the second chamber 14, and the heat dissipation teeth 16 can form a corresponding heat dissipation duct.

[0120] In some other specific implementation schemes, refer to Figure 15 As shown, a heat dissipation duct 141 and a fan 144 can also be provided inside the second cavity 14. The fan 144 is used to provide airflow power for the heat dissipation duct 141, and the air cooling effect of the heat dissipation duct 141 can be improved under the action of the fan 144.

[0121] For example, refer to Figure 15 Understanding the structure of the vent 142, the heat dissipation duct 141 can be specifically constructed as an internal circulation duct that is not interconnected with the external environment. The advantage of this structure is that it prevents debris from entering the interior of the heat dissipation duct 141. In this structure, the main function of the fan 144 is to agitate the airflow within the heat dissipation duct 141 to improve the uniformity of heat dissipation.

[0122] Another example, see reference. Figure 15 The heat dissipation duct 141 can also be configured as an external circulation duct that communicates with the external environment. Under the combined action of the fan 144 and the vent 142 (specifically including the air inlet and the air outlet), the heat exchange effect between the external environment airflow and the airflow in the second chamber 14 can be accelerated, which can improve the air cooling effect of the heat dissipation duct 141.

[0123] It is understood that, in addition to being constructed as a heat dissipation duct 141, the second cavity 14 may also contain a liquid cooling medium in some specific embodiments. The cover plate 11 has an inlet and an outlet connecting to the second cavity 14, which are used to connect to a liquid cooling device. The liquid cooling device is connected to the inlet and outlet via liquid cooling pipes. Activating the liquid cooling device allows the coolant to circulate through the second cavity 14. In this state, the second cavity 14 acts as a liquid cooling radiator, enabling rapid liquid cooling of the second cavity 14. This quickly removes the heat transferred from the first cavity 13 to the second cavity 14, thus improving the heat dissipation of the electronic components 151 on the circuit board 15 within the first cavity 13.

[0124] In some other specific implementation schemes, refer to Figure 16 As shown, the second cavity 14 can be specifically constructed as a sealed cavity, and the second cavity 14 can be filled with a phase change medium. The volume of the second cavity 14 is larger than the volume of the phase change medium; that is, the phase change medium cannot completely fill the cavity 14, leaving sufficient space for the phase change medium to undergo a phase change. Through the phase change, the phase change medium can rapidly transfer heat from the second cavity 14 to the enclosing walls of the second cavity 14, thereby achieving heat dissipation.

[0125] Further implementation plans will continue to refer to Figure 16 As shown, a condenser plate 143 can also be provided on the inner wall of the second cavity 14 above the liquid surface of the phase change medium. One end of the condenser plate 143 is fixed to the inner wall of the second cavity 14, and the other end is a free end. The height of the free end of the condenser plate 143 relative to the liquid surface of the phase change medium is lower than the height of the fixed end of the condenser plate 143 relative to the liquid surface of the phase change medium. This design of the condenser plate 143 increases the contact area for condensation and reduces the likelihood of condensate adhering to the wall and failing to fall back down. Specifically, the condenser plate 143 can be placed on the side of the cover plate 11 facing the partition plate 12, i.e., the first plate surface 111. This design allows heat to be quickly transferred to the cover plate through the condenser plate 143, improving the heat dissipation effect of the cover plate 11. Of course, it can also be designed on other inner walls of the second cavity 14; no further specific limitations are made here.

[0126] In some other specific implementation schemes, refer to Figure 17 and Figure 18 As shown, the portion of the partition 12 facing away from the cover plate 11 can be designed to be arranged close to the circuit board 15. Specifically, this arrangement of the partition 12 close to the circuit board 15 can be referenced... Figure 17As shown, there is a certain gap between the partition 12 and the board surface of the circuit board 15. By designing this structure, potting compound can fill the space between them, improving the sealing effect of the circuit board 15. Alternatively, it can be referenced... Figure 18 As shown, the partition 12 is directly attached to the surface of the circuit board 15. In practical applications, the arrangement can be selected according to actual needs, with more specific limitations here. By designing the structure to be close to the surface of the circuit board 15 as described above, excess space inside the electronic chassis 1 can be minimized, reducing the amount of potting compound required. At the same time, the partition 12 can also provide a certain limiting effect on the circuit board 15, helping to improve the stability of the installation position of the circuit board 15.

[0127] For example, refer to Figure 17 and Figure 18 As shown, the position of the partition 12 and the circuit board 15 is not fixed, and there can be a certain gap between them, or they can be directly attached.

[0128] For example, refer to Figure 18 As shown, the partition 12 is fixedly connected to the circuit board 15 at a position close to it. The fixing method can be, but is not limited to, welding, fastener connection, and bonding. Furthermore, depending on the potting method, the partition 12 and the circuit board 15 can also be designed to be sealed. The specific sealing method can be, but is not limited to, sealing strip sealing, sealant bonding sealing, etc., and no specific limitation is made here.

[0129] In some other specific implementation schemes, refer to Figure 19 As shown, there can be multiple partitions 12, arranged in sections on the first board surface 111. Specifically, their distribution positions correspond to the distribution positions of at least some electronic components 151 on the circuit board 15. In this case, the spatial cavities formed by each partition 12 and the first board surface 111 are also multiple. By designing this structure, different electronic components 151 on the circuit board 15 can be isolated and potted according to requirements, resulting in better potting effect. Specifically, it allows for zoned heat dissipation, reducing or eliminating the need for thermally conductive potting compound in non-heat-generating areas, and achieving heat insulation to prevent heat generated by electronic components from being conducted to other components through the potting compound. Furthermore, the connection method between each partition 12 and the cover plate 11 can be the same or different.

[0130] In a further embodiment, at least some of the electronic components 151 on the circuit board 15 can be designed to be bonded together with the first board surface 111 for heat transfer, or they can be designed to transfer heat through a thermally conductive layer. This structural form is more conducive to meeting the heat dissipation requirements of electronic components 151 with relatively high heat dissipation demands.

[0131] Reference Figure 1As shown, the side of the cover plate 11 facing away from the chassis opening 102, i.e., the second panel 112, can be flat. Designing it as flat makes it easier to place nameplates or other labels on the second panel, and also improves the neatness of the appearance.

[0132] In addition, this application also provides an electronic device, including an electronic chassis, which is the electronic chassis described in any of the above-described solutions. Since the aforementioned electronic chassis has the above-mentioned technical effects, the electronic device having this electronic chassis should also have the corresponding technical effects, which will not be elaborated further here.

[0133] It is worth mentioning that the aforementioned electronic enclosure can be used in power conversion equipment, such as inverters. It can also be used in other electronic enclosures that require potting, without specific limitations here.

[0134] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0135] As indicated in this application and claims, unless the context clearly indicates otherwise, the words "a," "an," "a," and / or "the" are not specifically singular and may include the plural. Generally, the terms "comprising" and "including" only indicate the inclusion of expressly identified steps and elements, which do not constitute an exclusive list, and the method or apparatus may also include other steps or elements. An element defined by the phrase "comprising an..." does not exclude the presence of other identical elements in the process, method, product, or apparatus that includes the element.

[0136] In the description of the embodiments of this application, unless otherwise stated, " / " means "or", for example, A / B can mean A or B; "and / or" in this document is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Furthermore, in the description of the embodiments of this application, "multiple" refers to two or more.

[0137] Furthermore, in the description of the embodiments of this application, the terms "first" and "second" are used only for the purpose of distinguishing descriptions and should not be construed as indicating or implying relative importance, nor should they be construed as indicating or implying order.

[0138] This document uses specific examples to illustrate the principles and implementation methods of this application. The descriptions of the embodiments above are only for the purpose of helping to understand the core ideas of this application. It should be noted that those skilled in the art can make several improvements and modifications to this application without departing from the principles of this application, and these improvements and modifications also fall within the protection scope of the claims of this application.

Claims

1. An electronic chassis, characterized in that, include: The enclosure (10) has a bottom wall (101) and an opening (102) opposite to the bottom wall (101). A cover plate (11) is fitted over the chassis opening (102). A partition (12) is located between the cover plate (11) and the bottom wall (101) of the chassis, and divides the inner cavity of the chassis (10) into a first cavity (13) and a second cavity (14). The first cavity (13) is used to load the circuit board (15) and form the containment space required for potting the circuit board (15).

2. The electronic chassis as described in claim 1, characterized in that, The side of the cover plate (11) facing the chassis opening (102) is the first plate surface (111), and the partition plate (12) is disposed on the first plate surface (111) and surrounds the first plate surface (111) to form the second cavity (14).

3. The electronic chassis as described in claim 2, characterized in that, The first plate (111) has a first sealing structure (113) on its circumferential edge that is adapted to the chassis opening (102), and the partition (12) is disposed in the inner circumference of the first sealing structure (113); Alternatively, the partition (12) may have a second sealing structure (120) on its circumferential edge that is adapted to the chassis opening (102).

4. The electronic chassis as described in claim 1, characterized in that, The partition (12) is disposed on the inner side wall of the box (10); Alternatively, the partition (12) has a flange (122) extending toward the bottom wall (101) of the chassis, the flange (122) being disposed on the bottom wall (101) of the chassis. Alternatively, the outer edge (123) of the partition (12) is disposed on the side of the circuit board (15) facing the cover plate (11).

5. The electronic chassis as described in claim 1, characterized in that, The partition (12) has a conformal structure (121) on the side facing away from the cover plate (11), which is used to conformally adapt to the electronic devices (151) on the circuit board (15).

6. The electronic chassis as described in claim 5, characterized in that, The conformal structure (121) includes a first conformal structure (1211) and / or a second conformal structure (1212). Wherein, the first conformal structure (1211) is a concave structure formed by the partition (12) recessing towards the interior of the second cavity (14), the concave structure being used to match the electronic device (151) at a first height position on the circuit board (15); the second conformal structure (1212) is a protruding structure formed by the partition (12) protruding towards the first cavity (13), the protruding structure being used to match the electronic device (151) at a second height position on the circuit board (15); wherein, in a first direction, the first height position is higher than the second height position, the first direction being the direction from the bottom wall (101) of the chassis towards the cover plate (11).

7. The electronic chassis as described in any one of claims 1-6, characterized in that, The inner wall of the second cavity (14) is also provided with heat dissipation teeth (16).

8. The electronic chassis as described in claim 7, characterized in that, One end of the heat dissipation tooth (16) is connected to the cover plate (11), and the other end is a free end; Alternatively, one end of the heat dissipation tooth (16) is connected to the partition plate (12), and the other end is a free end; Alternatively, one end of the heat dissipation tooth (16) is connected to the cover plate (11), and the other end is connected to the partition plate (12); Alternatively, one end of some of the heat dissipation teeth (16) is connected to the cover plate (11), and the other end is a free end; one end of some of the heat dissipation teeth (16) is connected to the partition plate (12), and the other end is a free end.

9. The electronic chassis as described in claim 8, characterized in that, The heat dissipation teeth (16) are positioned to correspond to at least some of the electronic devices (151) on the circuit board (15).

10. The electronic chassis as described in claim 7, characterized in that, One end of the heat dissipation tooth (16) is disposed on the side cavity wall (140) of the second cavity (14), and the other end is a free end.

11. The electronic chassis as described in any one of claims 1-6, characterized in that, The second cavity (14) is also provided with a heat dissipation duct (141), and the cover plate (11) is provided with a ventilation opening (142) that connects the heat dissipation duct with the external environment.

12. The electronic chassis as described in any one of claims 1-6, characterized in that, The second cavity (14) is also provided with a heat dissipation duct (141) and a fan (144), the fan (144) being used to provide airflow power for the heat dissipation duct (141).

13. The electronic chassis as described in claim 12, characterized in that, The heat dissipation duct (141) is configured as an internal circulation duct that is not interconnected with the external environment; or, the heat dissipation duct (141) is configured as an external circulation duct that is interconnected with the external environment.

14. The electronic chassis as described in any one of claims 1-6, characterized in that, The second cavity (14) is provided with a liquid cooling medium, and the cover plate (11) is provided with an inlet and an outlet that connect to the second cavity (14). The inlet and the outlet are used to connect to a liquid cooling device.

15. The electronic chassis as described in any one of claims 1-6, characterized in that, The second cavity (14) is configured as a sealed cavity, the second cavity (14) is filled with a phase change medium, and the volume of the second cavity (14) is greater than the volume of the phase change medium.

16. The electronic chassis as described in claim 15, characterized in that, A condenser plate (143) is also provided on the inner wall of the second cavity (14) above the liquid surface of the phase change medium. One end of the condenser plate (143) is fixed to the inner wall of the second cavity (14), and the other end of the condenser plate (143) is a free end. The height of the free end of the condenser plate (143) relative to the liquid surface of the phase change medium is lower than the height of the fixed end of the condenser plate (143) relative to the liquid surface of the phase change medium.

17. The electronic chassis as described in any one of claims 1-6, characterized in that, The partition (12) is arranged with its side facing away from the cover plate (11) close to the surface of the circuit board (15).

18. The electronic chassis as described in claim 17, characterized in that, The partition (12) is fixedly connected to the circuit board (15) at a position close to it; Alternatively, the position of the partition (12) close to the circuit board (15) is not fixed.

19. The electronic chassis as described in any one of claims 1-6, characterized in that, The number of partitions (12) is multiple, and their distribution positions correspond to the distribution positions of at least some electronic devices (151) on the circuit board (15).

20. The electronic chassis as described in claim 19, characterized in that, At least some of the electronic components (151) on the circuit board (15) are bonded to the first surface (111) of the cover plate (11) for heat transfer; Alternatively, at least some of the electronic devices (151) on the circuit board (15) can transfer heat to the first board surface (111) through a heat-conducting layer.

21. The electronic chassis as described in any one of claims 2-6, characterized in that, The cover plate (11) and the partition plate (12) are either separate fixed connection structures or integrated structures.

22. The electronic chassis as described in any one of claims 1-6, characterized in that, The side of the cover plate (11) facing away from the chassis opening (102) is the second plate surface (112), and the second plate surface (112) is a plane.

23. An electronic device, comprising an electronic chassis, characterized in that, The electronic chassis is the electronic chassis as described in any one of claims 1-22.

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