Double-platform automatic soldering mechanism

Abstract

The utility model discloses a kind of double-platform automatic soldering mechanism, it includes, workbench, two tray supports are equipped on workbench, tray support is equipped on each with tray, each tray can be independently moved on tray support, spot welder bearing bracket on workbench is movably equipped with soldering machine, electric welding gun head is equipped on soldering machine, soldering machine can switch job between two trays, ensure that printed circuit board on each tray independently complete soldering operation, and the operation of two trays does not interfere with each other. The utility model is set through double platform, allow a worker to carry out mainboard handling, place and check on one tray at the same time, another tray carries out soldering operation, effectively reduce waiting time, realize seamless link, improve production efficiency and save labor cost, the rhythm of two trays, both avoid worker fatigue and operation confusion, also ensure that work flow is smooth, simultaneously make worker be able to concentrate on the operation of each tray, reduce failure, improve product quality.

Description

Technical Field

[0001] This utility model relates to the field of motherboard soldering technology, and in particular to a dual-platform automatic soldering mechanism. Background Technology

[0002] An automatic motherboard soldering machine is a highly automated piece of equipment specifically designed for soldering electronic components onto printed circuit boards (PCBs). It achieves precise and efficient soldering operations through automation technology, making it suitable for mass production and high-quality electronic manufacturing. In practical applications, a configuration of one platform per soldering machine or multiple platforms per soldering machine is typically used to improve production efficiency.

[0003] However, the soldering process itself relies less on manual operation; the main challenge lies in the handling of the motherboard after soldering. Due to the special nature of motherboards, they must be handled with care after soldering to avoid solder joints falling off or component damage. Specifically, workers need to perform the following tasks: solder quality inspection (ensuring solder joints are strong, without cold solder joints or short circuits), and motherboard handling (moving motherboards from the soldering machine to the next process or storage area). Although configuring multiple platforms for one spot soldering machine can improve soldering efficiency, in practice, this method is unlikely to significantly reduce labor costs because subsequent motherboard handling still requires manual intervention. Furthermore, the soldering process does not require extremely high production rates in the overall motherboard manufacturing process; therefore, the focus of optimization should be on reducing manual operation and improving processing efficiency. Utility Model Content

[0004] The purpose of this section is to outline some aspects of embodiments of the present invention and to briefly describe some preferred embodiments. Simplifications or omissions may be made in this section, as well as in the abstract and title of this application, to avoid obscuring the purpose of these documents; however, such simplifications or omissions should not be construed as limiting the scope of the present invention.

[0005] To address the aforementioned problems, this utility model provides the following technical solution:

[0006] A dual-platform automatic soldering mechanism includes a worktable with two tray supports, each tray being movable independently on its support. A soldering machine is mounted on a spot welding machine support on the worktable, and the soldering machine is equipped with a soldering gun. The soldering machine can switch between the two trays to ensure that the printed circuit boards on each tray can be soldered independently, and that the operation of the two trays does not interfere with each other.

[0007] Based on the above technical solution, the present invention can be further improved as follows.

[0008] As a preferred embodiment of the dual-platform automatic soldering mechanism of this utility model, a separate moving mechanism is provided between the two trays and the worktable. The moving mechanism is a cylinder used to drive the trays to move back and forth along the tray support. The soldering machine moves back and forth on the spot welding machine support through another moving mechanism, which is used to drive the soldering machine to switch between the two trays.

[0009] In a preferred embodiment of the dual-platform automatic soldering mechanism of this utility model, the number of the moving mechanisms is three.

[0010] As a preferred embodiment of the dual-platform automatic soldering mechanism of this utility model, the tray is provided with limiting blocks at both ends, the tray support is provided with limiting grooves, and the limiting blocks are movably sleeved in the limiting grooves.

[0011] As a preferred embodiment of the dual-platform automatic soldering mechanism of this utility model, the upper surface of the tray is provided with an adapter groove and an exhaust hole, one end of the exhaust hole is connected to the outside of the tray, and the other end is connected to the adapter groove.

[0012] As a preferred embodiment of the dual-platform automatic soldering mechanism of this utility model, a piston is provided in the adapter slot by means of a spring, the other end of the exhaust hole is located between the piston and the bottom of the adapter slot, and a support plate is provided on the piston.

[0013] As a preferred embodiment of the dual-platform automatic soldering mechanism of this utility model, the top of the support plate is flush with the upper surface of the tray, and a buffer pad is provided at the contact point between the support plate and the tray.

[0014] The beneficial effects of this utility model are: the dual-tray design allows one worker to move, place and inspect motherboards on one tray while soldering operations can be performed on the other tray.

[0015] This alternating work mode can effectively reduce waiting time, achieve seamless connection, and significantly improve overall production efficiency;

[0016] With the clever design of the double pallet, only one worker is needed to complete the work that originally required multiple people to work together, saving a job position and reducing labor costs;

[0017] The rhythm design of the two trays is very suitable for the workers' operating habits, so that the workers will not feel too tired, nor will the operation be chaotic due to too many trays;

[0018] Workers can easily switch between two pallets, ensuring a smooth workflow. With a moderate number of pallets, workers can focus more on the operations on each pallet, reducing quality problems caused by operational errors. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort. Among them:

[0020] Figure 1 This is a perspective view of the entire embodiment.

[0021] Figure 2 This is an example. Figure 2 A partial view.

[0022] Figure 3 This is an example. Figure 1 A cross-sectional view of the tray section.

[0023] Figure 4 This is a partial cross-sectional view of the tray in this embodiment.

[0024] In the figure: workbench 100, spot welding machine support bracket 101, tray bracket 102, and limiting groove 102a;

[0025] Soldering machine 200, welding gun head 201;

[0026] Tray 300, limit block 301, adapter groove 302, vent 303, piston 305, bearing plate 306, buffer pad 306a. Detailed Implementation

[0027] To make the above-mentioned objectives, features and advantages of this utility model more apparent and understandable, the specific embodiments of this utility model will be described in detail below with reference to the accompanying drawings.

[0028] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Those skilled in the art can make similar extensions without departing from the spirit of the present invention. Therefore, the present invention is not limited to the specific embodiments disclosed below.

[0029] Secondly, the term "an embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that excludes other embodiments.

[0030] Example

[0031] Reference Figures 1 to 4 This embodiment of the present invention provides a dual-platform automatic soldering mechanism. The workbench 100 is mainly used for soldering operations on printed circuit boards (PCBs). The workbench 100 is provided with two tray supports 102, and each tray support 102 is equipped with a tray 300. The tray 300 is used to support the printed circuit board, and each tray 300 can move independently on the tray support 102. The workbench 100 is also provided with a spot welding machine support 101, on which a soldering machine 200 is installed. The soldering machine 200 is equipped with a welding gun head 201 for performing soldering operations.

[0032] Specifically, the dual-pallet setup allows a worker to handle motherboards on one pallet while soldering operations are performed on the other. This alternating work pattern effectively reduces waiting time, achieves seamless workflow, improves overall production efficiency, and saves a work position. The rhythm design of the two pallets is well-suited to worker habits, preventing excessive fatigue and avoiding operational chaos caused by too many pallets. A worker can easily switch between the two pallets, ensuring a smooth workflow. Because of the moderate number of pallets, workers can focus more on the operations on each pallet, reducing quality issues caused by operational errors. In contrast, three or more pallets can easily lead to worker clutter, and a single pallet can reduce production efficiency.

[0033] The working principle of this embodiment;

[0034] Each tray 300 is driven by a servo motor mounted on the tray support 102. The servo motors, controlled by an electronic control system, ensure independent and stable movement of each tray 300. The soldering machine 200 moves on the spot welding machine support 101 via a linear motor, also controlled by an electronic control system, enabling rapid and precise switching between the two trays 300. The welding torch head 201 is driven by a stepper motor, controlled by the electronic control system, to achieve precise lifting and lowering of the soldering torch head and soldering operations. The electronic control system includes a PLC (Programmable Logic Controller) and a touchscreen interface. The PLC receives sensor signals such as tray position sensors and soldering machine position sensors, and controls the operation of the servo motors, linear motors, and stepper motors according to a preset program. The touchscreen interface is used to set soldering parameters such as soldering time and temperature, and to monitor the system's operating status.

[0035] Specific operating procedures

[0036] The operator places the printed circuit board on tray 300 and starts the system through the touch screen interface;

[0037] According to the preset program, the electronic control system controls the servo motor to drive the tray 300 to move below the soldering machine 200. The tray position sensor provides real-time feedback of position information to ensure positioning accuracy.

[0038] The electronic control system controls a linear motor to move the soldering machine 200 above the target tray 300;

[0039] The electronic control system controls the stepper motor to drive the welding gun head 201 down to the solder joint position on the printed circuit board and starts the soldering process, which includes heating, soldering, and cooling steps. The soldering temperature and time are precisely controlled by the electronic control system.

[0040] Once the soldering operation on one tray 300 is completed, the electronic control system controls the linear motor to move the soldering machine 200 above another tray 300, and at the same time controls the servo motor to move the tray 300 that has completed soldering to the unloading position;

[0041] The system repeats the above steps to achieve continuous operation between the two pallets 300.

[0042] In another embodiment, a separate moving mechanism is provided between the two trays 300 and the worktable 100. The moving mechanism is a cylinder, which is used to drive the trays 300 to reciprocate along the tray support 102. The soldering machine 200 reciprocates on the spot welding machine support 101 through another moving mechanism. The other moving mechanism is used to drive the soldering machine 200 to switch between the two trays 300. By using a cylinder as the driving structure to replace more complex driving mechanisms such as servo motors, linear motors or robotic arms, the cost can be significantly saved while meeting functional requirements.

[0043] In another embodiment, such as Figure 2 , Figure 3 As shown, the pallet 300 is provided with limiting blocks 301 at both ends, and the pallet support 102 is provided with limiting grooves 102a. The limiting blocks 301 are movably sleeved in the limiting grooves 102a to improve the stability of the pallet 300 driven by the cylinder structure.

[0044] In another embodiment, such as Figure 1 , Figure 4 As shown, the upper surface of the tray 300 is provided with an adapter groove 302 and an exhaust hole 303. One end of the exhaust hole 303 is connected to the outside of the tray 300, and the other end is connected to the adapter groove 302. A piston 305 is provided in the adapter groove 302 by means of a spring. The other end of the exhaust hole 303 is located between the piston 305 and the bottom of the adapter groove 302. A support plate 306 is provided on the piston 305. The top of the support plate 306 is flush with the upper surface of the tray 300, and a buffer pad 306a is provided at the contact point between the support plate 306 and the tray 300.

[0045] By setting an adapter slot 302, an exhaust port 303, a piston 305, a support plate 306, and a buffer pad 306a on the tray 300, pressure buffer protection for the motherboard during the soldering process is achieved. When the soldering gun head 201 applies pressure to the motherboard, the support plate 306 sinks slightly, driving the piston 305 to compress the air in the adapter slot 302. The air is slowly discharged through the exhaust port 303, forming a damping effect. At the same time, the spring provides a reverse support force, and the buffer pad 306a deforms to absorb the impact energy. The three work together to dynamically offset the pressure on the motherboard, effectively reducing the micro-deformation and stress concentration of the motherboard, improving the soldering quality and the safety of the motherboard.

[0046] It is important to note that the constructions and arrangements of this application shown in several different exemplary embodiments are merely illustrative. Although only a few embodiments are described in detail in this disclosure, those who consult this disclosure will readily understand that many modifications are possible (e.g., changes in the size, dimensions, structure, shape and proportion of various elements, as well as parameter values ​​(e.g., temperature, pressure, etc.), mounting arrangements, use of materials, color, orientation, etc.) without substantially departing from the novel teachings and advantages of the subject matter described in this application). For example, an element shown as integrally formed may be composed of multiple parts or elements, the position of elements may be inverted or otherwise altered, and the nature or number or position of discrete elements may be changed or altered. Therefore, all such modifications are intended to be included within the scope of this utility model. The order or sequence of any process or method steps may be changed or reordered according to alternative embodiments. In the claims, any "device plus function" clause is intended to cover the structure described herein that performs the function, and not only structural equivalents but also equivalent structures. Without departing from the scope of this invention, other substitutions, modifications, alterations, and omissions may be made in the design, operation, and arrangement of the exemplary embodiments. Therefore, this invention is not limited to the specific embodiments, but extends to various modifications that still fall within the scope of the appended claims.

[0047] Furthermore, in order to provide a concise description of exemplary embodiments, not all features of actual embodiments (i.e., those features that are not relevant to the best mode of carrying out the present invention as currently considered, or those features that are not relevant to implementing the present invention) may be omitted.

[0048] It should be noted that the above embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although this utility model has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solution of this utility model without departing from the spirit and scope of the technical solution of this utility model, and all such modifications or substitutions should be covered within the scope of the claims of this utility model.

Claims

1. A dual-platform automatic soldering mechanism, characterized in that: The system includes a workbench (100) with two tray supports (102) on it. Each tray support (102) has a tray (300) on it. Each tray (300) can move independently on the tray support (102). A soldering machine (200) is mounted on a spot welding machine support (101) on the workbench (100). The soldering machine (200) has a soldering gun head (201) on it. The soldering machine (200) can switch between the two trays (300) to ensure that the printed circuit boards on each tray (300) can complete the soldering operation independently, and the operation of the two trays (300) does not interfere with each other.

2. The dual-platform automatic soldering mechanism as described in claim 1, characterized in that: A separate moving mechanism is provided between the two trays (300) and the worktable (100). The moving mechanism is a cylinder used to drive the trays (300) to reciprocate along the tray support (102). The soldering machine (200) reciprocates on the spot welding machine support (101) through another moving mechanism. The other moving mechanism is used to drive the soldering machine (200) to switch between the two trays (300).

3. The dual-platform automatic soldering mechanism as described in claim 2, characterized in that: The number of the moving mechanisms is three.

4. The dual-platform automatic soldering mechanism as described in claim 1, characterized in that: The pallet (300) has limiting blocks (301) at both ends, and the pallet support (102) has a limiting groove (102a). The limiting blocks (301) are movably fitted into the limiting groove (102a).

5. The dual-platform automatic soldering mechanism as described in claim 1 or 4, characterized in that: The upper surface of the tray (300) is provided with an adapter groove (302) and an exhaust hole (303). One end of the exhaust hole (303) is connected to the outside of the tray (300), and the other end is connected to the adapter groove (302).

6. The dual-platform automatic soldering mechanism as described in claim 5, characterized in that: A piston (305) is provided in the adapter groove (302) by means of a spring. The other end of the exhaust hole (303) is located between the piston (305) and the bottom of the adapter groove (302). A support plate (306) is provided on the piston (305).

7. The dual-platform automatic soldering mechanism as described in claim 6, characterized in that: The top of the support plate (306) is flush with the upper surface of the tray (300), and a buffer pad (306a) is provided at the contact point between the support plate (306) and the tray (300).

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