A Mini LED chip desoldering device

Abstract

This utility model relates to the technical field of chip desoldering devices and discloses a Mini LED chip desoldering device. It adopts a sleeve-type closed and isolated heating structure. The sleeve is provided with exhaust slots on its periphery. During the desoldering process, the sleeve shields and isolates the outside of the chip to be desoldered. The exhaust slots located at the upper part allow hot air to be discharged directionally from the upper position, which can effectively avoid secondary rework of the circuit board caused by blowing air to heat nearby components. The sleeve shielding can effectively improve the heating efficiency of the chip inside the sleeve, which is conducive to improving the chip desoldering efficiency. Furthermore, it adopts a vacuum suction cup-type chip picking structure. Before heating, the suction cup base is pushed by a spring to make stable contact with the upper part of the chip. With the vacuum suction generated by the exhaust, the chip can be firmly separated and picked up when it is heated and moved upward. During the process, the chip can be protected from hard external force, which provides excellent protection for the chip and the circuit board structure.

Description

Technical Field

[0001] This utility model relates to the technical field of chip desoldering devices, specifically a Mini LED chip desoldering device. Background Technology

[0002] Mini LED (submillimeter-sized light-emitting diode) is a display backlight technology based on miniaturized LED chips. Its chip size is between that of traditional LEDs and Micro LEDs. Through array design, it achieves characteristics such as high brightness, high contrast, and long lifespan, and is widely used in high-end displays, televisions, automotive equipment, and other fields.

[0003] In the repair process of Mini LED products, it is often necessary to desolder and re-solder working chips (power control chips, rectifiers, voltage regulators, etc.) that are found to be abnormal or damaged using a desoldering device. In order to separate the chips, hot air is needed to heat the chip area during the disassembly process. For chips in densely packed areas, due to the presence of capacitors, resistors and other chip components nearby, the surrounding chips and components are easily loosened by heat during the blowing and heating process. After repair, the chip solder joints are prone to loosening and poor contact, which increases the repair time. Therefore, a Mini LED chip desoldering device is proposed. Utility Model Content

[0004] The purpose of this invention is to provide a Mini LED chip desoldering device to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a Mini LED chip desoldering device, comprising an insulating sleeve and a desoldering mechanism, wherein the insulating sleeve is installed outside the desoldering mechanism, a support frame pad is installed at the lower part of the insulating sleeve, and an exhaust vent is provided on the periphery of the insulating sleeve.

[0006] The disassembly mechanism includes a heating blower base, a suction cup mounting post, a suction cup base, a sealing ring seat, and a spring. The heating blower base is installed inside the insulating sleeve. Heating blower holes are evenly arranged at the lower part of the heating blower base. The suction cup base is vertically movable at the bottom center of the heating blower base by the suction cup mounting post and the spring. The sealing ring seat is installed at the lower part of the suction cup base.

[0007] Preferably, the aforementioned insulating sleeve is rectangular, and mounting brackets are fixedly installed on both sides of the upper part of the insulating sleeve. The insulating sleeve is connected and installed to the servo drive structure through the mounting brackets.

[0008] Preferably, the aforementioned support frame pad is fitted into the lower opening side of the insulating sleeve through a slot, and the exhaust slots are evenly spaced and uniformly opened through the periphery of the insulating sleeve wall.

[0009] Preferably, the heating blower base is configured as an upper and lower split, and the heating blower base is fixedly installed inside the insulating sleeve by side bolts.

[0010] Preferably, the heating blower base is provided with an air storage chamber in the middle, and hot air connecting pipes are fixedly installed on both sides of the upper part of the air storage chamber, and the heating blower hole is opened through the lower part of the air storage chamber.

[0011] Preferably, the suction cup base is configured as an upper and lower split, with a vacuum chamber in the middle of the suction cup base, a suction cup mounting post fixedly connected to the upper part of the vacuum chamber, a suction connecting pipe fixedly connected to the upper end of the suction cup mounting post, and suction holes evenly distributed through the lower part of the suction cup base.

[0012] Preferably, the suction cup mounting post is movably inserted and installed inside the guide hole provided in the middle of the heating blower base. An adjusting nut is threaded on the upper end rod of the suction cup mounting post, and the spring is fitted on the lower end rod of the suction cup mounting post. The lower part of the spring is pushed against the upper part of the suction cup base.

[0013] Preferably, the sealing ring seat is annular in shape, and the sealing ring seat is fitted onto the lower part of the suction cup mounting post. The upper ring seat portion of the sealing ring seat is engaged and snapped into the annular groove provided at the lower part of the suction cup mounting post.

[0014] Compared with the prior art, the present invention, by adopting the above technical solution, has the following technical effects:

[0015] This desoldering device employs a sleeve-enclosed, isolated heating structure. During desoldering, the sleeve shields and isolates the chip from external contact. Combined with an upward-positioned exhaust vent, hot air is directed outwards, effectively preventing secondary rework of the circuit board caused by blowing air onto nearby components. The sleeve shielding also improves the heating efficiency of the chip inside, enhancing chip removal efficiency. Furthermore, it utilizes a vacuum suction cup chip pickup structure. Before heating, the suction cup base is spring-loaded and makes stable contact with the upper part of the chip. The vacuum suction generated by the exhaust system securely separates and picks up the chip as it moves upwards during heating. This process prevents the chip from being subjected to harsh external forces, providing excellent protection for both the chip and the circuit board structure. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0017] Figure 1 This is a schematic diagram of the overall upper three-dimensional structure of this utility model;

[0018] Figure 2 This is a schematic diagram of the overall lower three-dimensional structure of this utility model;

[0019] Figure 3 A schematic diagram of the upper structure of the disassembly mechanism of this utility model;

[0020] Figure 4 A schematic diagram of the lower structure of the disassembly mechanism of this utility model;

[0021] Figure 5 This is a schematic diagram of the middle cross-sectional structure of the disassembly mechanism of this utility model.

[0022] Explanation of reference numerals in the attached drawings: 1. Isolation sleeve; 2. Support frame pad; 3. Exhaust vent; 4. Heating blower base; 5. Suction cup mounting post; 6. Suction cup base; 7. Sealing ring seat; 8. Spring; 9. Hot air connecting pipe; 10. Heating blower hole; 11. Suction connecting pipe; 12. Adjusting nut; 13. Mounting side seat. Detailed Implementation

[0023] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0024] It should be noted that the structures, proportions, sizes, etc., shown in the accompanying drawings of this specification are only for the purpose of assisting those skilled in the art in understanding and reading the content disclosed in the specification, and are not intended to limit the conditions under which this application can be implemented. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in the proportions, or adjustments to the size should still fall within the scope of the technical content disclosed in this application, provided that they do not affect the effects and purposes that this application can produce.

[0025] Example

[0026] Please see Figure 1-5 This utility model provides a technical solution: a Mini LED chip desoldering device, including an insulating sleeve 1 and a removal mechanism. The insulating sleeve 1 is installed outside the removal mechanism for shielding and protecting against air blowing and heating, as shown in the attached figure. Figure 1As shown, the isolation sleeve 1 is a rectangular sleeve. To facilitate connection and installation with external drive equipment, mounting brackets 13 are fixedly installed on both sides of the upper part of the isolation sleeve 1. The isolation sleeve 1 is connected and installed to the servo drive structure through the mounting brackets 13. To provide support and protection for the circuit board, as shown in the attached figure... Figure 2 As shown, a support frame pad 2 is installed at the lower part of the insulating sleeve 1. The support frame pad 2 is fitted into the lower opening side of the insulating sleeve 1 through a slot, which can prevent the insulating sleeve 1 from damaging the circuit board by hard collision. In order to facilitate the circulation of hot air, an exhaust slot 3 is provided on the periphery of the insulating sleeve 1. The exhaust slot 3 is evenly and uniformly opened through the periphery of the sleeve wall of the insulating sleeve 1. The sleeve adopts a closed and isolated heating structure. During the desoldering operation, the external of the chip to be removed is shielded and isolated by the insulating sleeve 1. With the exhaust slot 3 set at the upper part, the hot air flow can be directed out from the upper position, which can effectively avoid the secondary rework of the circuit board caused by blowing and heating nearby components. Moreover, the shielding of the sleeve can effectively improve the heating efficiency of the chip inside the insulating sleeve 1, which is conducive to improving the chip removal efficiency.

[0027] The removal mechanism is used to pick up and adsorb the chip structure. The removal mechanism includes a heated blower base 4, a suction cup mounting post 5, a suction cup base 6, a sealing ring seat 7, and a spring 8. The heated blower base 4 is installed inside the insulating sleeve 1. Specifically, see attached... Figure 5 As shown, the heating blower base 4 is set in two separate parts, upper and lower. The heating blower base 4 is fixedly installed inside the insulating sleeve 1 by side bolts for hot air supply and connection. In order to facilitate the flow of hot air, an air storage cavity is set in the middle of the heating blower base 4. In order to facilitate the supply of hot air, hot air connecting pipes 9 are fixedly installed on both sides of the upper part of the air storage cavity. In order to realize the blowing heating, heating blower holes 10 are evenly arranged in the lower part of the heating blower base 4. The heating blower holes 10 are opened through the lower part of the air storage cavity.

[0028] The suction cup base 6 is supported by the suction cup mounting post 5 and pushed vertically by the spring 8 to be installed in the middle of the bottom side of the heating blower base 4. See attached diagram for details. Figure 5 As shown, the suction cup base 6 is a split upper and lower part. A vacuum chamber is located in the middle of the suction cup base 6. To connect and support the suction cup base 6, a suction cup mounting post 5 is fixedly installed in the upper part of the vacuum chamber. The suction cup mounting post 5 is movably inserted into the guide hole located in the middle of the heating blower base 4. The suction cup base 6 can slide vertically through the guide. To limit and adjust the sliding of the suction cup mounting post 5, see attached... Figure 3As shown, an adjusting nut 12 is threaded onto the upper end of the suction cup mounting post 5. A spring 8 is fitted onto the lower end of the suction cup mounting post 5. The lower part of the spring 8 is pushed against the upper part of the suction cup base 6, providing elastic pushing force for the contact support of the suction cup base 6. To provide vacuum suction, a suction connection pipe 11 is fixedly connected to the upper end of the suction cup mounting post 5. To achieve vacuum suction connection, as shown in the attached diagram... Figure 4 As shown, suction holes are evenly distributed throughout the lower part of the suction cup base 6. To improve the contact sealing, a sealing ring seat 7 is installed on the lower part of the suction cup base 6. The sealing ring seat 7 is annular in shape and is fitted onto the lower part of the suction cup mounting post 5. The upper ring seat of the sealing ring seat 7 is engaged with the annular groove provided on the lower part of the suction cup mounting post 5. The chip picking structure adopts a vacuum suction cup. Before heating, the suction cup base 6 is pushed against the upper part of the chip by the spring 8 for stable contact. With the vacuum suction generated by the exhaust, the chip can be firmly separated and picked up when it is heated and moved upward. During the process, the chip can be protected from being subjected to hard external force, which has excellent protection for the chip and the circuit board structure.

[0029] Working principle or structural principle: During operation, after the circuit board is clamped and positioned, the isolation sleeve 1 is precisely moved to the top of the abnormal chip by the servo mechanism. Then, the isolation sleeve 1 is precisely fitted onto the outside of the chip to be removed by slowly moving downward. During the downward movement, the sealing ring seat 7 at the bottom of the suction cup base 6 is stably attached to the top of the chip. At the same time, the vacuum suction generated by the suction pipe 11 makes the suction cup base 6 and the chip stably adsorbed and combined. Then, hot air is input through the hot air pipe 9 and blown out through the heating air hole 10 at the bottom of the heating air blower seat 4 to heat the chip inside the isolation sleeve 1. At the same time, the heated airflow is directed out from the exhaust slot 3 at the upper position, which can effectively avoid heating nearby components. After heating for 5-15 seconds, the blowing stops. Then, the isolation sleeve 1 slowly moves upward. When the spring 8 extends and resets, the chip is adsorbed by the suction cup base 6 to separate from the circuit board, completing the chip removal work.

[0030] In summary, this desoldering device adopts a sleeve-enclosed, isolated heating structure. During desoldering, the sleeve 1 shields and isolates the chip from the outside. Combined with the upper-positioned exhaust port 3, hot air can be directed out from the upper position, effectively preventing secondary rework of the circuit board caused by blowing air to heat nearby components. Furthermore, the sleeve shielding effectively improves the heating efficiency of the chip inside the sleeve 1, which is beneficial to improving chip removal efficiency. In addition, a vacuum suction cup chip picking structure is adopted. Before heating, the suction cup base 6 is pushed and stably contacts the upper part of the chip by the spring 8. Combined with the vacuum suction generated by the exhaust, the chip can be firmly separated and picked up when it is heated and moved upward. During the process, the chip is protected from being subjected to hard external force, providing excellent protection for the chip and circuit board structure.

[0031] Those skilled in the art will understand that the features described in the various embodiments and / or claims of this utility model can be combined or combined in various ways, even if such combinations or combinations are not explicitly described in this utility model. In particular, the features described in the various embodiments and / or claims of this utility model can be combined or combined in various ways without departing from the spirit and teachings of this utility model. All such combinations and / or combinations fall within the scope of this utility model.

Claims

1. A Mini LED chip desoldering device, comprising an insulating sleeve (1) and a desoldering mechanism, characterized in that, The insulating sleeve (1) is installed outside the disassembly mechanism. A support frame pad (2) is installed at the lower part of the insulating sleeve (1). An exhaust slot (3) is provided on the periphery of the insulating sleeve (1). The disassembly mechanism includes a heating blower seat (4), a suction cup mounting post (5), a suction cup base (6), a sealing ring seat (7), and a spring (8). The heating blower seat (4) is installed inside the insulating sleeve (1). Heating blower holes (10) are evenly arranged at the lower part of the heating blower seat (4). The suction cup base (6) is supported by the suction cup mounting post (5) and pushed by the spring (8) to be vertically movable at the bottom center of the heating blower seat (4). The sealing ring seat (7) is installed at the lower part of the suction cup base (6).

2. The Mini LED chip desoldering device according to claim 1, characterized in that: The isolation sleeve (1) is rectangular. Mounting seats (13) are fixedly installed on both sides of the upper part of the isolation sleeve (1). The isolation sleeve (1) is connected and installed to the servo drive structure through the mounting seats (13).

3. The Mini LED chip desoldering device according to claim 2, characterized in that: The support frame pad (2) is fitted into the lower opening side of the isolation sleeve (1) through the slot, and the exhaust slot (3) is evenly and equidistantly opened through the periphery of the sleeve wall of the isolation sleeve (1).

4. The Mini LED chip desoldering device according to claim 1, characterized in that: The heating blower base (4) is set in two separate parts, and the heating blower base (4) is fixedly installed inside the insulating sleeve (1) by side bolts.

5. The Mini LED chip desoldering device according to claim 4, characterized in that: The heating blower base (4) has an air storage chamber in the middle. Hot air connecting pipes (9) are fixedly installed on both sides of the upper part of the air storage chamber. The heating blower hole (10) is opened through the lower part of the air storage chamber.

6. The Mini LED chip desoldering device according to claim 5, characterized in that: The suction cup base (6) is set in two separate parts. A vacuum chamber is set in the middle of the suction cup base (6). A suction cup mounting post (5) is fixedly connected to the upper part of the vacuum chamber. A suction connecting pipe (11) is fixedly connected to the upper end of the suction cup mounting post (5). Suction holes are evenly opened through the lower part of the suction cup base (6).

7. A Mini LED chip desoldering device according to claim 6, characterized in that: The suction cup mounting post (5) is movably inserted and installed inside the guide hole provided in the middle of the heating blower base (4). An adjusting nut (12) is threaded on the upper end rod of the suction cup mounting post (5). The spring (8) is fitted on the lower end rod of the suction cup mounting post (5). The lower part of the spring (8) is pushed against the upper part of the suction cup base (6).

8. The Mini LED chip desoldering device according to claim 7, characterized in that: The outer ring of the sealing ring seat (7) is ring-shaped. The sealing ring seat (7) is fitted onto the lower part of the suction cup mounting post (5). The ring seat part of the upper part of the sealing ring seat (7) is engaged and snapped into the ring groove provided at the lower part of the suction cup mounting post (5).

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