A MEMS sensor package structure

Abstract

The utility model relates to the technical field of packaging structure, especially a MEMS sensor packaging structure, including the base plate, the top surface embedded type installation of base plate a plurality of symmetrical setting conductive sheet, the top surface bonding of base plate has ASIC chip and MEMS chip, ASIC chip and MEMS chip all are through the wire with conductive sheet electric connection. The utility model has the advantages of: this packaging structure ensures the stable operation of chip through the efficient heat dissipation design. The heat-conducting gel encapsulation glue filled in the encapsulation frame can closely adhere to the surface of ASIC chip and MEMS chip and quickly absorb the heat generated by the chip. At the same time, the combination of the heat-conducting plate and the fin heat sink further enhances the heat dissipation effect. The heat-conducting plate is embedded in the encapsulation glue, which can timely conduct the heat of the chip to the fin heat sink. The fins increase the heat dissipation area and accelerate the diffusion of heat to the outside. This structure design breaks the limitation of low heat dissipation efficiency of traditional packaging and effectively avoids the temperature overheat caused by heat accumulation of the chip.

Description

Technical Field

[0001] This utility model relates to the field of packaging structure technology, and in particular to a MEMS sensor packaging structure. Background Technology

[0002] MEMS sensor packaging structures are microelectromechanical systems. These structures isolate MEMS sensors from corrosive gases and dust in harsh industrial environments, allowing the sensors to stably identify gas composition and concentration. In short, they create a stable and suitable microenvironment for MEMS sensors, ensuring sensing accuracy and extending lifespan. This is a crucial support for MEMS sensors, transforming them from laboratory chips to practical applications, and driving the adoption of MEMS technology across multiple industries.

[0003] In practical applications, as MEMS sensors become smaller and more integrated, the power density per unit area of ​​the chip increases, making heat dissipation a more prominent issue. For example, in consumer electronics, when a mobile phone MEMS microphone is working continuously, the heat cannot be dissipated in time, which will cause the chip's operating temperature to rise, affecting the sensitivity and accuracy of sound signal acquisition, and even causing signal distortion. Utility Model Content

[0004] The purpose of this invention is to at least solve one of the aforementioned technical defects.

[0005] Therefore, one objective of this invention is to propose a MEMS sensor packaging structure to solve the problems mentioned in the background art and overcome the shortcomings of the prior art.

[0006] To achieve the above objectives, one embodiment of this utility model provides a MEMS sensor packaging structure, including a substrate. A plurality of symmetrically arranged conductive sheets are embedded in the top surface of the substrate. An ASIC chip and a MEMS chip are bonded to the top surface of the substrate. Both the ASIC chip and the MEMS chip are electrically connected to the conductive sheets via wires. A packaging frame is bonded to the bottom surface of the substrate. The ASIC chip and the MEMS chip are located inside the packaging frame. Connecting grooves are formed through the left and right sides of the packaging frame. A heat-conducting plate is slidably connected to the inner wall of each connecting groove. A finned heat sink is fixedly connected to one side of each heat-conducting plate. Encapsulating adhesive is filled between the inner wall of the packaging frame and the substrate. Both heat-conducting plates are encapsulated within the encapsulating adhesive.

[0007] Preferably, in any of the above embodiments, a plurality of symmetrically arranged guide plates are fixedly connected to the bottom surface of the substrate, and guide grooves are provided on both the left and right sides of the encapsulation frame, and the encapsulation frame is slidably connected to the guide plates through the guide grooves.

[0008] Preferably, in any of the above solutions, the bottom surface of the encapsulation frame is fixedly connected to two symmetrically arranged clamping plates, and the encapsulation frame is engaged with the substrate through the two clamping plates.

[0009] Preferably, in any of the above solutions, the left and right sides of the encapsulation frame are provided with embedding slots, and the two finned heat sinks are respectively located inside the two embedding slots.

[0010] Preferably, the encapsulating adhesive is made of thermally conductive gel, and the finned heat sink and the heat-conducting plate are both made of aluminum alloy.

[0011] Preferably, the top surface of the encapsulation frame is provided with a glue injection hole, and the bottom surface of each heat-conducting plate is provided with two symmetrically arranged connecting slots.

[0012] Preferably, in any of the above solutions, a limiting frame is fixedly connected inside the encapsulation frame, and the end of the heat-conducting plate away from the fin heat sink is slidably connected to the limiting frame.

[0013] Compared with the prior art, the advantages and beneficial effects of this utility model are as follows:

[0014] 1. Addressing the issue of insufficient heat dissipation caused by increased chip power density in MEMS sensors, this packaging structure ensures stable chip operation through an efficient heat dissipation design. The thermally conductive gel encapsulant filling the package frame tightly adheres to the surfaces of the ASIC chip and MEMS chip, quickly absorbing the heat generated by the chip. Simultaneously, the combination of a heat-conducting plate and a finned heat sink further enhances the heat dissipation effect. The heat-conducting plate, embedded in the encapsulant, promptly conducts heat from the chip to the finned heat sink, utilizing the fins to increase the heat dissipation area and accelerate heat diffusion to the outside. This structural design overcomes the limitations of traditional packaging's low heat dissipation efficiency, effectively preventing the chip from overheating due to heat accumulation. This ensures the signal acquisition accuracy of the MEMS sensor under high-power operation, preventing performance degradation issues such as audio signal distortion, and ensuring stable sensor operation in consumer electronics and other fields.

[0015] 2. This MEMS sensor packaging structure offers significant advantages in structural stability and ease of assembly. The sliding fit between the guide plate on the bottom surface of the substrate and the guide groove of the packaging frame, along with the snap-fit ​​design between the bottom plate of the packaging frame and the substrate, ensures precise positioning and a stable connection between the packaging frame and the substrate. Assembly can be completed quickly without complex operations, reducing assembly difficulty and time costs. Simultaneously, the limiting frame on the inner wall of the packaging frame limits the position of the heat-conducting plate, ensuring accurate positioning during packaging and preventing misalignment from affecting heat dissipation. Furthermore, the design of the injection hole on the top surface of the packaging frame and the connecting slot on the bottom surface of the heat-conducting plate facilitates the injection and uniform filling of encapsulant, ensuring that the encapsulant fully encapsulates the chip and the heat-conducting plate, forming a stable packaging system. These structural elements work together to improve the overall stability of the packaging structure and simplify the assembly process, which is beneficial for the mass production and application promotion of MEMS sensors. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of the assembly of this utility model;

[0017] Figure 2 This is a cross-sectional structural diagram of the assembly of this utility model;

[0018] Figure 3 This is an exploded structural diagram of the assembly of this utility model;

[0019] Figure 4 This is a schematic diagram of the packaging frame of this utility model.

[0020] In the diagram: 1-substrate, 2-conductive sheet, 3-ASIC chip, 4-MEMS chip, 5-package frame, 6-connection groove, 7-heat conductive plate, 8-fin heat sink, 9-encapsulation adhesive, 10-guide plate, 11-guide groove, 12-card plate, 13-embedding groove, 14-injection hole, 15-connecting slot, 16-limiting frame. Detailed Implementation

[0021] The present invention will be further described below with reference to the accompanying drawings, but the scope of protection of the present invention is not limited thereto.

[0022] like Figures 1 to 4As shown, a MEMS sensor packaging structure includes a substrate 1. Several symmetrically arranged conductive sheets 2 are embedded in the top surface of the substrate 1. An ASIC chip 3 and a MEMS chip 4 are bonded to the top surface of the substrate 1. The ASIC chip 3 and the MEMS chip 4 are electrically connected to the conductive sheets 2 through wires. A packaging frame 5 is bonded to the bottom surface of the substrate 1. The ASIC chip 3 and the MEMS chip 4 are located inside the packaging frame 5. Connection grooves 6 are opened through the left and right sides of the packaging frame 5. A heat-conducting plate 7 is slidably connected to the inner wall of each connection groove 6. A finned heat sink 8 is fixedly connected to one side of each heat-conducting plate 7. The space between the inner wall of the packaging frame 5 and the substrate 1 is filled with encapsulating adhesive 9. Both heat-conducting plates 7 are covered inside the encapsulating adhesive 9.

[0023] As an optional technical solution of this utility model, a plurality of symmetrically arranged guide plates 10 are fixedly connected to the bottom surface of the substrate 1. Guide grooves 11 are provided on both the left and right sides of the encapsulation frame 5. The encapsulation frame 5 is slidably connected to the guide plates 10 through the guide grooves 11. The guide plates 10 on the bottom surface of the substrate 1 and the guide grooves 11 of the encapsulation frame 5 slide in cooperation, providing precise positioning and guidance for the installation of the encapsulation frame 5. During the encapsulation process, the construction personnel can quickly and accurately install the encapsulation frame 5 onto the substrate 1 through the mutual guidance of the guide plates 10 and the guide grooves 11, avoiding gaps between the encapsulation frame 5 and the substrate 1 due to positional deviations.

[0024] As an optional technical solution of this utility model, the bottom surface of the packaging frame 5 is fixedly connected to two symmetrically arranged clamping plates 12. The packaging frame 5 is clamped to the substrate 1 through the two clamping plates 12. After the guide plate 10 and guide groove 11 are initially positioned, the clamping of the clamping plates 12 to the substrate 1 can stably limit the packaging frame 5 from the bottom, preventing the packaging frame 5 from shifting or loosening in the vertical direction. This clamping method not only improves the overall stability of the packaging structure, but also disperses the external forces subjected to it during the packaging process and use to a certain extent, avoiding the separation of the packaging frame 5 from the substrate 1 due to external forces, and ensuring the safety of the MEMS chip 4 and ASIC chip 3 inside the package.

[0025] As an optional technical solution of this utility model, the left and right sides of the encapsulation frame 5 are provided with embedding grooves 13, and the two finned heat sinks 8 are respectively located inside the two embedding grooves 13. The finned heat sinks 8 are embedded inside the embedding grooves 13, so that the finned heat sinks 8 can fit tightly with the encapsulation frame 5, effectively reducing the thermal resistance on the heat dissipation path and improving the heat conduction efficiency.

[0026] As an optional technical solution of this utility model, the encapsulating adhesive 9 is made of thermally conductive gel, and the finned heat sink 8 and the heat-conducting plate 7 are both made of aluminum alloy. The thermally conductive gel can tightly fill the gap between the encapsulation frame 5 and the substrate 1, and fully contact the ASIC chip 3, MEMS chip 4 and the heat-conducting plate 7, quickly absorbing the heat generated by the chip and rapidly transferring it to the finned heat sink 8 through the heat-conducting plate 7. The aluminum alloy material has good thermal conductivity and light weight characteristics, and the finned heat sink 8, with its large-area fin structure, can quickly dissipate heat to the external environment.

[0027] As an optional technical solution of this utility model, the top surface of the encapsulation frame 5 is provided with a glue injection hole 14, and the bottom surface of each heat conduction plate 7 is provided with two symmetrically arranged connecting slots 15. The glue injection hole 14 facilitates the injection of thermal conductive gel into the encapsulation frame 5, while the connecting slots 15 enable the encapsulation glue 9 to be more evenly distributed between the encapsulation frame 5 and the substrate 1 during the filling process, ensuring that components such as the chip and the heat conduction plate 7 can be fully wrapped by the encapsulation glue 9.

[0028] As an optional technical solution of this utility model, a limiting frame 16 is fixedly connected inside the encapsulation frame 5. The end of the heat-conducting plate 7 away from the finned heat sink 8 is slidably connected to the limiting frame 16, and the limiting frame 16 is slidably connected to the end of the heat-conducting plate 7 away from the finned heat sink 8. This ensures that the heat-conducting plate 7 can be accurately positioned during installation, avoiding the impact of positional deviation on the heat dissipation effect. At the same time, the limiting frame 16 can provide stable support for the heat-conducting plate 7 during the curing process of the encapsulating adhesive 9.

[0029] A MEMS sensor packaging structure, the working principle of which is as follows:

[0030] 1): The thermally conductive gel encapsulant 9 filled inside the encapsulation frame 5 can tightly adhere to the surfaces of the ASIC chip 3 and the MEMS chip 4, and quickly absorb the heat generated by the chip.

[0031] 2): The combination of heat-conducting plate 7 and finned heat sink 8 further enhances the heat dissipation effect. The heat-conducting plate 7 is embedded in the encapsulating glue 9, which can conduct the heat of the chip to the finned heat sink 8 in a timely manner. The fins increase the heat dissipation area and accelerate the heat diffusion to the outside.

[0032] 3): The guide plate 10 on the bottom surface of the substrate 1 slides with the guide groove 11 of the packaging frame 5, and the snap-fit ​​design of the bottom plate 12 of the packaging frame 5 and the substrate 1 enables the packaging frame 5 and the substrate 1 to be accurately positioned and stably connected, and the assembly can be completed quickly without complicated operations during the assembly process.

[0033] In summary, this MEMS sensor packaging structure ensures stable chip operation through efficient heat dissipation design. The thermally conductive gel encapsulant 9 filled within the packaging frame 5 can tightly adhere to the surfaces of the ASIC chip 3 and the MEMS chip 4, quickly absorbing the heat generated by the chips. Simultaneously, the combination of the heat-conducting plate 7 and the finned heat sink 8 further enhances the heat dissipation effect. The heat-conducting plate 7, embedded in the encapsulant 9, can promptly conduct the chip's heat to the finned heat sink 8, utilizing the fins to increase the heat dissipation area and accelerate heat diffusion to the outside. This structural design breaks through the limitations of traditional packaging's low heat dissipation efficiency, effectively preventing the chip from overheating due to heat accumulation, thereby ensuring the signal acquisition accuracy of the MEMS sensor under high-power operation and preventing performance degradation issues such as sound signal distortion. This ensures stable operation of the sensor in consumer electronics and other fields. The sliding engagement between the guide plate 10 on the bottom surface of the substrate 1 and the guide groove 11 of the packaging frame 5, as well as the snap-fit ​​design between the bottom plate 12 of the packaging frame 5 and the substrate 1, allows for precise positioning and a stable connection between the packaging frame 5 and the substrate 1. Assembly can be completed quickly without complex operations during the assembly process, reducing assembly difficulty and time costs. Meanwhile, the limiting frame 16 on the inner wall of the packaging frame 5 limits the position of the heat-conducting plate 7, ensuring its accurate positioning during the packaging process and preventing misalignment from affecting heat dissipation. Furthermore, the design of the injection hole 14 on the top surface of the packaging frame 5 and the connecting slot 15 on the bottom surface of the heat-conducting plate 7 facilitates the injection and uniform filling of the encapsulating adhesive 9, ensuring that the adhesive 9 fully encapsulates the chip and the heat-conducting plate 7, forming a stable packaging system. These structures work together to improve the overall stability of the packaging structure and simplify the assembly process, which is beneficial for the mass production and application promotion of MEMS sensors.

Claims

1. A MEMS sensor packaging structure, characterized in that: The substrate (1) includes a substrate (1) on which a number of symmetrically arranged conductive sheets (2) are embedded. An ASIC chip (3) and a MEMS chip (4) are bonded to the top surface of the substrate (1). The ASIC chip (3) and the MEMS chip (4) are electrically connected to the conductive sheets (2) through wires. A package frame (5) is bonded to the bottom surface of the substrate (1). The ASIC chip (3) and the MEMS chip (4) are located inside the package frame (5). A connecting groove (6) is opened through the left and right sides of the package frame (5). A heat-conducting plate (7) is slidably connected to the inner wall of each connecting groove (6). A finned heat sink (8) is fixedly connected to one side of each heat-conducting plate (7). The inner wall of the package frame (5) and the substrate (1) are filled with encapsulating glue (9). Both heat-conducting plates (7) are covered inside the encapsulating glue (9).

2. The MEMS sensor packaging structure according to claim 1, characterized in that: The bottom surface of the substrate (1) is fixedly connected with several symmetrically arranged guide plates (10), and guide grooves (11) are provided on both the left and right sides of the encapsulation frame (5). The encapsulation frame (5) is slidably connected to the guide plates (10) through the guide grooves (11).

3. The MEMS sensor packaging structure according to claim 2, characterized in that: The bottom surface of the encapsulation frame (5) is fixedly connected to two symmetrically arranged card plates (12), and the encapsulation frame (5) is engaged with the substrate (1) through the two card plates (12).

4. The MEMS sensor packaging structure according to claim 3, characterized in that: The encapsulation frame (5) has an embedding slot (13) on both the left and right sides, and the two finned heat sinks (8) are located inside the two embedding slots (13) respectively.

5. The MEMS sensor packaging structure according to claim 4, characterized in that: The encapsulating adhesive (9) is made of thermally conductive gel, and the finned heat sink (8) and the heat-conducting plate (7) are both made of aluminum alloy.

6. The MEMS sensor packaging structure according to claim 5, characterized in that: The top surface of the encapsulation frame (5) is provided with a glue injection hole (14), and the bottom surface of each heat conduction plate (7) is provided with two symmetrically arranged connecting slots (15).

7. A MEMS sensor packaging structure according to claim 6, characterized in that: The encapsulation frame (5) is fixedly connected to a limiting frame (16), and the end of the heat-conducting plate (7) away from the fin heat sink (8) is slidably connected to the limiting frame (16).

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