Wafer suction force adjusting device suitable for sputtering table wafer transfer mechanism

Abstract

The utility model relates to a kind of wafer suction force adjusting devices suitable for sputtering table transmission piece mechanism, belong to the technical field of semiconductor manufacturing equipment. Including weighing sensor, the weighing sensor is located in the bottom of sheet sorting device suction cup, the sheet sorting device suction cup is connected vacuum pipeline, proportioning valve is equipped on the vacuum pipeline, the proportioning valve is connected with weighing sensor signal, the weighing sensor is weighed and is fed back to proportioning valve to the weight of wafer on suction cup, and then proportioning valve opening degree is adjusted;Vacuum pipeline is equipped with digital display pressure switch, the digital display pressure switch detects the pressure in vacuum pipeline, the output signal of digital display pressure switch is connected with the controller of transmission piece mechanism by relay module. The vacuum pressure value in vacuum pipeline can be observed by digital display pressure switch, and the vacuum value needed in actual operation is simultaneously matched.

Description

Technical Field

[0001] This utility model relates to a wafer suction force adjustment device suitable for a sputtering stage wafer transfer mechanism, belonging to the field of semiconductor manufacturing equipment technology. Background Technology

[0002] Sputtering stations are widely used in semiconductor wafer production and are one of the key pieces of equipment in semiconductor wafer manufacturing. The principle is that electrons collide with argon atoms as they fly toward the substrate under the action of an electric field E, causing them to ionize and produce Ar positive ions and new electrons. The new electrons fly toward the substrate, and the Ar ions are accelerated toward the cathode target under the action of the electric field, and bombard the target surface with high energy, causing the target material to be sputtered.

[0003] Currently, the wafer transfer mechanism in sputtering stations used in discrete device manufacturing consists of a transfer arm that picks up the wafers from the basket and transfers them to a wafer sorter. After the wafer sorter positions and tidies the wafers, the transfer arm removes them from the sorter and places them on a rotating arm before transferring them into the equipment cavity. Throughout this process, the transfer arm, wafer sorter, and rotating arm all require vacuum to hold the wafers. The wafer position is fed back via a vacuum switch signal. However, because the vacuum pressure signal switch is contact-based, its magnitude cannot be adjusted according to the actual wafer handling conditions; instead, the vacuum pressure is adjusted only when the pressure switch is engaged. This can lead to situations where, although the system functions normally, the suction force at the wafer transfer mechanism is excessive, causing the wafers to deform. Summary of the Invention

[0004] The technical problem to be solved by this utility model is to provide a wafer suction force adjustment device suitable for the wafer transfer mechanism of a sputtering stage, which can adjust the vacuum pipeline pressure of the wafer transfer mechanism according to the weight of the wafer, so as to match the vacuum value required in actual operation, and avoid wafer deformation caused by excessive vacuum pressure or wafer falling due to insufficient vacuum pressure.

[0005] The technical solution adopted by this utility model to solve the above problems is as follows: a wafer suction force adjustment device suitable for a sputtering stage wafer transfer mechanism, including a weighing sensor, the weighing sensor being located at the bottom of the wafer handler suction cup, the wafer handler suction cup being connected to a vacuum pipe, a proportional valve being provided on the vacuum pipe, the proportional valve being signal-connected to the weighing sensor, the weighing sensor weighing the wafer on the suction cup and feeding back the weight to the proportional valve, thereby adjusting the opening of the proportional valve; a digital display pressure switch being provided on the vacuum pipe, the digital display pressure switch detecting the pressure inside the vacuum pipe, the output signal of the digital display pressure switch being connected to the controller of the wafer transfer mechanism through a relay module.

[0006] The proportional valve is an electric proportional valve.

[0007] The digital pressure switch is of type PNP.

[0008] The relay module operates on a 24V power supply.

[0009] Compared with the prior art, the advantages of this utility model are as follows: A wafer suction force adjustment device suitable for sputtering stage wafer transfer mechanism can observe the vacuum pressure value in the vacuum pipeline through a digital display pressure switch. At the same time, the weighing sensor weighs the wafer on the suction cup and feeds back to the proportional valve, thereby adjusting the opening of the proportional valve according to the weight of the wafer, and thus adjusting the vacuum suction force of the suction cup. This facilitates matching the vacuum value required in actual operation and avoids wafer deformation caused by excessive vacuum pressure adjustment or wafer falling due to insufficient vacuum pressure adjustment. Attached Figure Description

[0010] Figure 1 This is a schematic diagram of the sputtering stage plate transfer mechanism;

[0011] Figure 2 This is a schematic diagram of a wafer suction force adjustment device applicable to a sputtering stage wafer transfer mechanism according to the present invention;

[0012] In the diagram, 1 is the load cell, 2 is the suction cup, 3 is the vacuum pipe, 4 is the proportional valve, 5 is the digital pressure switch, 6 is the relay module, and 7 is the controller. Detailed Implementation

[0013] The present invention will be further described in detail below with reference to the accompanying drawings and embodiments.

[0014] like Figure 1 , 2 As shown in this embodiment, a wafer suction force adjustment device suitable for a sputtering stage wafer transfer mechanism includes a weighing sensor 1, which is located at the bottom of a wafer handler suction cup 2. The wafer handler suction cup 2 is connected to a vacuum pipe 3, and a proportional valve 4 is provided on the vacuum pipe 3. The proportional valve 4 is signal-connected to the weighing sensor 1. The weighing sensor 1 weighs the wafer on the suction cup 2 and feeds the weight back to the proportional valve. The opening of the proportional valve is adjusted according to the weight of the wafer, thereby adjusting the vacuum level in the vacuum pipe. A digital display pressure switch 5 is provided on the vacuum pipe 3. The output signal of the digital display pressure switch 5 is connected to the controller 7 of the wafer transfer mechanism through a relay module 6. The digital display pressure switch detects the pressure in the vacuum pipe and outputs its signal through the relay module. When the digital display pressure switch meets the set pressure requirement, the relay module closes, thereby activating the controller 7 of the wafer transfer mechanism, satisfying the signal feedback for wafer detection in the sputtering stage wafer transfer mechanism.

[0015] The signal delay for wafer detection in the sputtering stage transfer mechanism can be adjusted by modifying the setting value of the digital pressure switch.

[0016] Digital pressure switches replace traditional vacuum switches, displaying the real-time vacuum pressure value within a vacuum pipeline and outputting a high-level signal (24V) to the relay module. The digital pressure switch is a DPS series digital pressure gauge. It requires a PNP type. When the set pressure is met, the output terminal is connected to the positive terminal of the power supply, outputting a high-level signal (+24V). Operating temperature: -20~65℃, operating humidity: 35%~80%, measuring range: -100kPa~1000kPa, measuring error: ±0.2% of the full range, operating power supply: DC 24V, output terminal: 24V output.

[0017] The relay module is a YKM series relay module. Operating temperature: -40~70℃, operating humidity: 5%~85%, starting current: 21.8mA, operating power: 0.53W, operating power supply: DC 24V, output terminal: switch output.

[0018] Weighing sensor: Installed at the wafer feeder chuck, it detects the weight of the wafer and outputs a detection signal. The weighing sensor model is Vishay series, with a range of 0-50g, an error of ≤±0.02%, an operating temperature of -10~40℃, and an operating humidity of 35%~60%.

[0019] The proportional valve adjusts the suction force of the suction cup based on the signal detected by the load cell. The proportional valve model is SMC ITV series, with a response time of <1s and a pressure range of -100kPa to 0.

[0020] The vacuum pressure value inside the vacuum pipeline can be observed through the digital display pressure switch. At the same time, the weighing sensor weighs the wafer on the suction cup and feeds the weight back to the proportional valve. This allows the opening of the proportional valve to be adjusted according to the weight of the wafer, thereby adjusting the vacuum suction force of the suction cup. This makes it easier to match the vacuum value required in actual operation and avoids wafer deformation caused by excessive vacuum pressure adjustment or wafer falling off due to insufficient vacuum pressure adjustment.

[0021] In addition to the above embodiments, this utility model also includes other implementation methods. All technical solutions formed by equivalent transformation or equivalent substitution should fall within the protection scope of the claims of this utility model.

Claims

1. A wafer suction force adjustment device suitable for a sputtering stage wafer transfer mechanism, characterized in that: The device includes a weighing sensor located at the bottom of the wafer handler's suction cup. The suction cup is connected to a vacuum pipe, and a proportional valve is installed on the vacuum pipe. The proportional valve is signal-connected to the weighing sensor. The weighing sensor weighs the wafers on the suction cup and feeds back the weight to the proportional valve, thereby adjusting the valve's opening. A digital pressure switch is installed on the vacuum pipe to detect the pressure inside the vacuum pipe. The output signal of the digital pressure switch is connected to the controller of the wafer transfer mechanism via a relay module.

2. The wafer suction force adjustment device for a sputtering stage transfer mechanism according to claim 1, characterized in that: The proportional valve is an electric proportional valve.

3. The wafer suction force adjustment device for a sputtering stage transfer mechanism according to claim 1, characterized in that: The digital pressure switch is of type PNP.

4. The wafer suction force adjustment device for a sputtering stage transfer mechanism according to claim 1, characterized in that: The relay module operates on a 24V power supply.

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