A raw material melting and cooling device for alloy production

Abstract

The utility model relates to alloy preparation technical field, and disclose a kind of raw material smelting cooling device for alloy preparation, including base, heat exchange cylinder and cooling box, the heat exchange cylinder and cooling box are respectively fixedly connected on the upper surface of base, the bottom end side wall of cooling box is fixedly connected with water pump, the side wall of water pump is fixedly connected with drainage tube, the drainage tube extends to the inside of heat exchange cylinder.The cooling liquid temperature of the utility model provided after heat absorption rises, flows back in cooling box by reflux pipe, the cooling liquid temperature reduces in cooling box, while starting motor, motor drives stirring frame to rotate, stirs cooling liquid, so that the temperature distribution of cooling liquid is more uniform, improves refrigeration efficiency, cooling frame and reinforcing plate enhance the cooling diffusion range of semiconductor refrigeration piece, improve cooling efficiency, ensure the reliability of semiconductor refrigeration piece in working process.

Description

Technical Field

[0001] This utility model relates to the field of alloy preparation technology, and in particular to a raw material melting and cooling device for alloy preparation. Background Technology

[0002] Alloy preparation is the process of fusing two or more metals or metals with non-metallic elements together using certain methods to form alloy materials with specific properties. In the actual alloy preparation process, it is necessary to rationally select the preparation process and equipment based on factors such as the specific alloy type, performance requirements, and production scale, and strictly control the process parameters of each step to ensure the production of high-quality alloy materials and products.

[0003] In the existing technology, the raw materials after melting need to be cooled during the alloy preparation process. However, the coolant used for cooling will rise in temperature after continuous cooling and cannot cool down on its own, which will affect the subsequent cooling effect. Utility Model Content

[0004] The purpose of this invention is to solve the problem in the prior art that in the alloy preparation process, the raw materials after melting need to be cooled, but the cooling liquid used for cooling will rise in temperature after continuous cooling and cannot cool down on its own, which will affect the subsequent cooling effect. Therefore, this invention proposes a raw material melting and cooling device for alloy preparation.

[0005] To achieve the above objectives, the present invention adopts the following technical solution:

[0006] A raw material melting and cooling device for alloy preparation includes a base, a heat exchange cylinder, and a cooling box. The heat exchange cylinder and the cooling box are respectively fixedly connected to the upper surface of the base. A water pump is fixedly connected to the bottom side wall of the cooling box, and a drain pipe is fixedly connected to the side wall of the water pump, extending into the interior of the heat exchange cylinder. A return pipe is fixedly connected to the top side wall of the heat exchange cylinder, with one end of the return pipe away from the heat exchange cylinder extending into the interior of the cooling box. A motor is fixedly connected to the side wall of the cooling box, and the output shaft of the motor extends into the interior of the cooling box and is fixedly connected to a stirring frame. A semiconductor refrigeration chip is fixedly connected to the inner wall of the cooling box, and a cooling fan is fixedly connected to the side wall of the cooling box located on the semiconductor refrigeration chip.

[0007] Preferably, a cooling rack is fixedly connected to one side of the semiconductor refrigeration chip inside the cooling box, and a reinforcing plate is fixedly connected to the connection between the cooling rack and the semiconductor refrigeration chip.

[0008] Preferably, a placement cylinder is slidably provided inside the heat exchange cylinder, and the inner wall of the placement cylinder has multiple through holes.

[0009] Preferably, a cylinder is fixedly connected to the side wall of the heat exchange cylinder, a connecting seat is fixedly connected to the piston rod end of the cylinder, a connecting rod is fixedly connected to the side wall of the connecting seat, and the end of the connecting rod away from the connecting seat is fixedly connected to the placement cylinder.

[0010] Preferably, the inner wall of the heat exchange cylinder is provided with a guide groove, and a guide block is slidably provided on the inner wall of the guide groove. The guide block is fixedly connected to the cylinder wall of the placement cylinder.

[0011] Preferably, the inner wall of the guide block is provided with a plurality of rolling balls, which are respectively rolled on the inner wall of the heat exchange cylinder located in the guide groove.

[0012] Compared with the prior art, the present invention provides a raw material melting and cooling device for alloy preparation, which has the following beneficial effects:

[0013] 1. The raw material melting and cooling device for alloy preparation involves the cooling liquid absorbing heat and its temperature rising. It then flows back into the cooling tank through a return pipe. Inside the cooling tank, the cooling liquid receives cooling from the semiconductor refrigeration chip, causing its temperature to drop. Simultaneously, a motor is started, which drives a stirring rack to rotate and stir the cooling liquid, making the temperature distribution of the cooling liquid more uniform and improving the cooling efficiency. The cooling rack and reinforcing plate enhance the cooling diffusion range of the semiconductor refrigeration chip, further improving the cooling efficiency and ensuring the reliability of the semiconductor refrigeration chip during operation.

[0014] 2. The raw material melting and cooling device for alloy preparation uses a water pump to pump the coolant in the cooling tank into the heat exchange cylinder through the diversion pipe. The coolant flows in the heat exchange cylinder and exchanges heat with the alloy raw material placed therein, absorbing the heat of the alloy raw material and cooling it.

[0015] 3. The raw material melting and cooling device for alloy preparation involves retracting the piston rod of the cylinder, which drives the placement cylinder to descend to a suitable position outside the heat exchange cylinder via the connecting seat and connecting rod. The melted alloy raw material is then placed into the placement cylinder. Multiple through holes on the inner wall of the placement cylinder allow the coolant to fully contact the alloy raw material, improving the cooling effect. Subsequently, the piston rod of the cylinder extends, driving the placement cylinder to rise, which facilitates the lifting of the cooled alloy raw material for subsequent removal. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a raw material melting and cooling device for alloy preparation proposed in this utility model;

[0017] Figure 2 for Figure 1 A three-dimensional view of the structure of the middle slider;

[0018] Figure 3 for Figure 1 Three-dimensional view of the central cooling rack.

[0019] In the diagram: 1. Base, 2. Heat exchange cylinder, 3. Cooling box, 4. Water pump, 5. Drain pipe, 6. Return pipe, 7. Motor, 8. Stirring rack, 9. Cooling fan, 10. Semiconductor cooling chip, 11. Cooling rack, 12. Reinforcing plate, 13. Cylinder, 14. Connecting seat, 15. Connecting rod, 16. Placement cylinder, 17. Guide block, 18. Ball bearing. Detailed Implementation

[0020] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present utility model. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments.

[0021] Reference Figure 1-3 A raw material melting and cooling device for alloy preparation includes a base 1, a heat exchange cylinder 2, and a cooling box 3. The heat exchange cylinder 2 and the cooling box 3 are respectively fixedly connected to the upper surface of the base 1. A water pump 4 is fixedly connected to the bottom side wall of the cooling box 3. A diversion pipe 5 is fixedly connected to the side wall of the water pump 4 and extends into the interior of the heat exchange cylinder 2. A return pipe 6 is fixedly connected to the top side wall of the heat exchange cylinder 2 and extends into the interior of the cooling box 3 at one end away from the heat exchange cylinder 2. A motor 7 is fixedly connected to the side wall of the cooling box 3. The output shaft of the motor 7 extends into the interior of the cooling box 3 and is fixedly connected to a stirring rack 8. A semiconductor refrigeration chip 10 is fixedly connected to the inner wall of the cooling box 3. A cooling fan 9 is fixedly connected to the side wall of the semiconductor refrigeration chip 10 in the cooling box 3.

[0022] A cooling rack 11 is fixedly connected to one side of the semiconductor refrigeration chip 10 inside the cooling box 3. A reinforcing plate 12 is also fixedly connected to the connection between the cooling rack 11 and the semiconductor refrigeration chip 10. A placement cylinder 16 is slidably provided inside the heat exchange cylinder 2. Multiple through holes are opened on the inner wall of the placement cylinder 16. A cylinder 13 is fixedly connected to the side wall of the heat exchange cylinder 2. A connecting seat 14 is fixedly connected to the end of the piston rod of the cylinder 13. A connecting rod 15 is fixedly connected to the side wall of the connecting seat 14. The end of the connecting rod 15 away from the connecting seat 14 is fixedly connected to the placement cylinder 16.

[0023] In use, the device uses base 1 as the basic support structure. Heat exchange cylinder 2 and cooling tank 3 are fixed on the upper surface of base 1. Water pump 4 is installed on the bottom side wall of cooling tank 3. Water pump 4 pumps the coolant in cooling tank 3 into heat exchange cylinder 2 through diversion pipe 5. The coolant flows in heat exchange cylinder 2 and exchanges heat with the alloy raw material placed therein, absorbing the heat of the alloy raw material and cooling it. After absorbing heat, the temperature of the coolant rises and flows back into cooling tank 3 through return pipe 6. In cooling tank 3, the coolant receives the cooling effect of semiconductor refrigeration chip 10 and its temperature decreases. At the same time, motor 7 is started, and motor 7 drives stirring frame 8 to rotate, stirring the coolant to make the temperature distribution of the coolant more uniform and improve the cooling efficiency. Cooling fan 9 dissipates heat from semiconductor refrigeration chip 10 during operation to ensure the normal operation of semiconductor refrigeration chip 10. The cooled coolant is pumped back into heat exchange cylinder 2 by water pump 4, and so on, to achieve continuous cooling of alloy raw material.

[0024] The cooling rack 11 and the reinforcing plate 12 enhance the cooling diffusion range of the thermoelectric cooler 10, improve cooling efficiency, and ensure the reliability of the thermoelectric cooler 10 during operation.

[0025] When cylinder 13 is activated, the piston rod of cylinder 13 retracts, driving the placement cylinder 16 to descend to a suitable position outside the heat exchange cylinder 2 via connecting seat 14 and connecting rod 15. The molten alloy raw material is then placed into the placement cylinder 16. Multiple through holes on the inner wall of the placement cylinder 16 allow the coolant to fully contact the alloy raw material, improving the cooling effect. Subsequently, the piston rod of cylinder 13 extends, driving the placement cylinder 16 to rise, facilitating the lifting of the cooled alloy raw material for subsequent removal.

[0026] To ensure that the placement cylinder 16 does not shift during the lifting and lowering process, such as Figure 1-3 As shown, the inner wall of the heat exchange cylinder 2 is provided with a guide groove, and a guide block 17 is slidably provided on the inner wall of the guide groove. The guide block 17 is fixedly connected to the cylinder wall of the placement cylinder 16. Multiple balls 18 are rolled on the inner wall of the guide block 17, and the multiple balls 18 are respectively rolled on the inner wall of the heat exchange cylinder 2 located in the guide groove.

[0027] The guide groove on the inner wall of the heat exchange cylinder 2 and the guide block 17 on the wall of the placement cylinder 16 cooperate with each other to guide the lifting and lowering of the placement cylinder 16, ensuring that the placement cylinder 16 will not deviate during the lifting and lowering process. Multiple balls 18 on the inner wall of the guide block 17 are rolled on the inner wall of the guide groove of the heat exchange cylinder 2, reducing the friction between the guide block 17 and the guide groove, making the lifting and lowering of the placement cylinder 16 smoother.

[0028] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A raw material melting and cooling device for alloy preparation, comprising a base (1), a heat exchange cylinder (2), and a cooling box (3), characterized in that: The heat exchange cylinder (2) and the cooling box (3) are respectively fixedly connected to the upper surface of the base (1). A water pump (4) is fixedly connected to the bottom side wall of the cooling box (3). A drain pipe (5) is fixedly connected to the side wall of the water pump (4). The drain pipe (5) extends into the interior of the heat exchange cylinder (2). A return pipe (6) is fixedly connected to the top side wall of the heat exchange cylinder (2). The end of the return pipe (6) away from the heat exchange cylinder (2) extends into the interior of the cooling box (3). A motor (7) is fixedly connected to the side wall of the cooling box (3). The output shaft of the motor (7) extends into the interior of the cooling box (3) and is fixedly connected to a stirring rack (8). A semiconductor refrigeration chip (10) is fixedly connected to the inner wall of the cooling box (3). A cooling fan (9) is fixedly connected to the side wall of the semiconductor refrigeration chip (10) of the cooling box (3).

2. The raw material melting and cooling device for alloy preparation according to claim 1, characterized in that: The semiconductor refrigeration chip (10) is fixedly connected to a cooling rack (11) on one side inside the cooling box (3), and a reinforcing plate (12) is fixedly connected to the connection between the cooling rack (11) and the semiconductor refrigeration chip (10).

3. The raw material melting and cooling device for alloy preparation according to claim 1, characterized in that: The heat exchange cylinder (2) has a sliding placement cylinder (16) inside, and the inner wall of the placement cylinder (16) has multiple through holes.

4. The raw material melting and cooling device for alloy preparation according to claim 1, characterized in that: A cylinder (13) is fixedly connected to the side wall of the heat exchange cylinder (2). A connecting seat (14) is fixedly connected to the piston rod end of the cylinder (13). A connecting rod (15) is fixedly connected to the side wall of the connecting seat (14). The end of the connecting rod (15) away from the connecting seat (14) is fixedly connected to the placement cylinder (16).

5. The raw material melting and cooling device for alloy preparation according to claim 1, characterized in that: The heat exchange cylinder (2) has a guide groove on its inner wall, and a guide block (17) is slidably provided on the inner wall of the guide groove. The guide block (17) is fixedly connected to the cylinder wall of the placement cylinder (16).

6. The raw material melting and cooling device for alloy preparation according to claim 5, characterized in that: The inner wall of the guide block (17) is provided with a plurality of balls (18), which are respectively arranged on the inner wall of the heat exchange cylinder (2) located in the guide groove.

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