A laser

Abstract

The utility model provides a kind of laser, including semiconductor DDL light module and laser exit head, and laser exit head is set to the light outlet end of semiconductor DDL light module;Semiconductor DDL light module includes at least one light unit, light unit includes upstream LD laser module, downstream LD laser module, total reflection mirror and staggered mirror, total reflection mirror is correspondingly set with upstream LD laser module, for reflecting the upstream laser beam generated by upstream LD laser module, staggered mirror is correspondingly set with downstream LD laser module, for reflecting the downstream laser beam generated by downstream LD laser module, upstream laser beam can pass through staggered mirror, and with downstream laser beam staggered distribution forms sub-beam.The semiconductor DDL light module of the utility model is directly connected with exit head, and power loss can be reduced;By setting staggered mirror, it can make the two LD laser modules of the light unit are side by side arrangement, and it is beneficial to improve the compactness of semiconductor DDL light module structure.

Description

Technical Field

[0001] This utility model relates to the field of laser technology, and in particular to a laser. Background Technology

[0002] Traditional lasers mostly use optical fibers to transmit the beam. There is power loss in the process of transmitting the beam through optical fibers, which also increases the maintenance points of the laser. In addition, the LD laser modules located at the light source module are staggered to avoid affecting the beam transmission between them, which increases the size of the light source module and makes it inconvenient to use. Utility Model Content

[0003] In view of the shortcomings of the existing technology, the purpose of this utility model is to provide a laser with a compact structure and low laser power loss.

[0004] The embodiments of this utility model are achieved through the following technical solutions:

[0005] A laser includes a semiconductor DDL optical module and a laser emitter head, the laser emitter head being disposed at the light-emitting end of the semiconductor DDL optical module; the semiconductor DDL optical module includes at least one optical unit, the optical unit including an upstream LD laser module, a downstream LD laser module, a total reflection mirror, and an interleaved reflector, wherein the total reflection mirror is disposed corresponding to the upstream LD laser module and is used to reflect the upstream laser beam generated by the upstream LD laser module, the interleaved reflector is disposed corresponding to the downstream LD laser module and is used to reflect the downstream laser beam generated by the downstream LD laser module, the upstream laser beam can pass through the interleaved reflector and is interleaved with the downstream laser beam to form sub-beams, and the sub-beams corresponding to any two optical units are misaligned.

[0006] According to a preferred embodiment, the semiconductor DDL optical module further includes a cooling plate, a first beam combiner with total reflection, a half-wave plate, and a polarizing beam combiner. Multiple optical units are present; some of the optical units are located on a first side of the cooling plate, and another portion are located on a second side of the cooling plate. The first beam combiner with total reflection is located on the first side of the cooling plate, and the half-wave plate and polarizing beam combiner are located on the second side of the cooling plate. All sub-beams located on the first side of the cooling plate are reflected and combined by the first beam combiner with total reflection to form a first combined beam. All sub-beams located on the second side of the cooling plate pass through the half-wave plate to form a second combined beam. The first combined beam and the second combined beam are combined by the polarizing beam combiner to form a semiconductor laser, which is projected onto the laser output head.

[0007] According to a preferred embodiment, the laser further includes a fiber laser module, which produces fiber laser, and the semiconductor laser and the fiber laser are combined through the laser output head.

[0008] According to a preferred embodiment, the laser emitter includes a wavelength beam combiner and a second beam combiner with total reflection. The second beam combiner is correspondingly disposed to the fiber laser module. The fiber laser is reflected to the wavelength beam combiner through the second beam combiner. The semiconductor laser and the fiber laser are combined through the wavelength beam combiner.

[0009] According to a preferred embodiment, the laser further includes a wedge prism, and in the fiber laser transmission path, the second beam combiner is located downstream of the wedge prism, and the fiber laser passes sequentially through the wedge prism, the second beam combiner, and the wavelength beam combiner.

[0010] According to a preferred embodiment, the laser further includes a driving element, the wedge prism is mounted on the driving element and driven to rotate by the driving element so that the fiber laser forms an annular spot.

[0011] According to a preferred embodiment, the driving component is a hollow motor.

[0012] The technical solution of this utility model embodiment has at least the following advantages and beneficial effects:

[0013] The laser provided by this utility model has a semiconductor DDL optical module directly connected to the output head. The beam generated by the semiconductor DDL optical module is directly transmitted to the output head and then emitted. Compared with the traditional fiber optic transmission method, it can reduce power loss and facilitate maintenance. By setting up staggered reflectors, the two LD laser modules constituting the optical unit can be arranged side by side, that is, the upstream LD laser module and the downstream LD laser module are arranged side by side, without affecting the smooth beam combining and spatial transmission of the upstream and downstream laser beams. This is beneficial to improving the structural compactness of the semiconductor DDL optical module, and thus helps to reduce the size of the laser. Attached Figure Description

[0014] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this utility model and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 A three-dimensional structural diagram of a laser provided for an embodiment of this utility model;

[0016] Figure 2 A schematic diagram of the structure of the semiconductor DDL optical module provided in this embodiment of the utility model;

[0017] Figure 3 A simplified structural diagram of a laser provided for an embodiment of this utility model;

[0018] Figure 4 A schematic diagram of the composite beam output by the laser provided in an embodiment of this utility model.

[0019] Icons: 1. Semiconductor DDL optical module; 100. First beam combiner; 101. Second beam combiner; 102. Semiconductor laser; 11. Cooling plate; 12. Optical unit; 121. Upstream LD laser module; 122. Downstream LD laser module; 123. Total reflection mirror; 124. Interleaved reflection mirror; 13. First beam combiner total reflection mirror; 14. Half-wave plate; 15. Polarizing beam combiner; 2. Laser output head; 21. Second beam combiner total reflection mirror; 22. Wavelength beam combiner; 3. Fiber laser module; 30. Fiber laser; 4. Driver; 5. Wedge prism. Detailed Implementation

[0020] To better understand and implement this invention, the technical solutions in the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings.

[0021] In the description of this utility model, it should be noted that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", and "outer" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this utility model.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention.

[0023] Please refer to Figures 1 to 4A laser includes a semiconductor DDL optical module 1 and a laser emitter 2, the laser emitter 2 being disposed at the light-emitting end of the semiconductor DDL optical module 1; the semiconductor DDL optical module 1 includes at least one optical unit 12, the optical unit 12 including an upstream LD laser module 121, a downstream LD laser module 122, a total reflection mirror 123 and an interleaved reflection mirror 124, wherein the total reflection mirror 123 is disposed corresponding to the upstream LD laser module 121 and is used to reflect the upstream laser beam generated by the upstream LD laser module 121, the interleaved reflection mirror 124 is disposed corresponding to the downstream LD laser module 122 and is used to reflect the downstream laser beam generated by the downstream LD laser module 122, the upstream laser beam can pass through the interleaved reflection mirror 124 and is interleaved with the downstream laser beam to form sub-beams, and the sub-beams corresponding to any two optical units 12 are misaligned. In this embodiment, the semiconductor DDL optical module 1 is directly connected to the output head, or in other words, the semiconductor DDL optical module 1 is integrated with the output head. The light beam generated by the semiconductor DDL optical module 1 is directly transmitted to the output head and then emitted. Compared with the traditional fiber optic transmission method, this reduces power loss and facilitates maintenance. By setting the staggered reflector 124, the two LD laser modules constituting the optical unit 12 can be arranged side by side, that is, the upstream LD laser module 121 and the downstream LD laser module 122 are arranged side by side without affecting the smooth beam combining and spatial transmission of the upstream and downstream laser beams. This is beneficial to improving the structural compactness of the semiconductor DDL optical module 1, and thus helps to reduce the size of the laser.

[0024] like Figure 2 As shown, in this embodiment, the semiconductor DDL optical module 1 further includes a cooling plate 11, a first beam combiner 13, a half-wave plate 14, and a polarizing beam combiner 15. There are multiple optical units 12; some optical units 12 are located on the first side of the cooling plate 11, and other optical units 12 are located on the second side of the cooling plate 11. The first beam combiner 13 is located on the first side of the cooling plate 11, and the half-wave plate 14 and the polarizing beam combiner 15 are located on the second side of the cooling plate 11. All sub-beams located on the first side of the cooling plate 11 are reflected and combined by the first beam combiner 13 to form a first combined beam 100. All sub-beams located on the second side of the cooling plate 11 pass through the half-wave plate 14 to form a second combined beam 101. The first combined beam 100 and the second combined beam 101 are combined by the polarizing beam combiner 15 to form a semiconductor laser 102. The semiconductor laser 102 is projected onto the laser output head 2. This configuration allows for full utilization of the cooling plate 11, while also arranging more optical units 12 within the effective area of ​​the cooling plate 11, thereby effectively increasing the output power of the semiconductor DDL optical module 1.

[0025] like Figure 3As shown, the laser also includes a fiber laser module 3, which produces a fiber laser 30. The semiconductor laser 102 and the fiber laser 30 are combined through the laser output head 2. In this way, the laser can output a composite laser.

[0026] like Figure 3 As shown, the laser emitter 2 includes a wavelength combiner 22 and a second total reflection combiner 21. The second combiner is correspondingly positioned to the fiber laser module 3. The fiber laser 30 is reflected by the second combiner to the wavelength combiner 22, and the semiconductor laser 102 and the fiber laser 30 are combined by the wavelength combiner 22. Here, the laser emitter 2 is a composite emitter, used to combine or composite the semiconductor laser 102 and the fiber laser 30.

[0027] In some embodiments, the laser further includes a wedge prism 5. In the transmission path of the fiber laser 30, the second beam combiner is located downstream of the wedge prism 5. The fiber laser 30 passes through the wedge prism 5 and the second beam combiner in sequence to the wavelength beam combiner 22.

[0028] Furthermore, the laser also includes a driving component 4, with a wedge prism 5 mounted on and driven to rotate by the driving component 4, so that the fiber laser 30 forms an annular spot. Optionally, the driving component 4 is a hollow motor.

[0029] The technical means disclosed in this utility model are not limited to those disclosed in the above embodiments, but also include technical solutions composed of any combination of the above technical features. It should be noted that those skilled in the art can make various improvements and modifications without departing from the principle of this utility model, and these improvements and modifications are also considered within the scope of protection of this utility model.

Claims

1. A laser, characterized in that, It includes a semiconductor DDL optical module and a laser emitter, wherein the laser emitter is disposed at the light-emitting end of the semiconductor DDL optical module; The semiconductor DDL optical module includes at least one optical unit. The optical unit includes an upstream LD laser module, a downstream LD laser module, a total reflection mirror, and an interleaved mirror. The total reflection mirror is correspondingly arranged with the upstream LD laser module and is used to reflect the upstream laser beam generated by the upstream LD laser module. The interleaved mirror is correspondingly arranged with the downstream LD laser module and is used to reflect the downstream laser beam generated by the downstream LD laser module. The upstream laser beam can pass through the interleaved mirror and is interleaved with the downstream laser beam to form sub-beams. The sub-beams corresponding to any two optical units are misaligned.

2. The laser according to claim 1, characterized in that, The semiconductor DDL optical module also includes a cooling plate, a first beam combiner with total reflection, a half-wave plate, and a polarizing beam combiner; the optical unit is multiple. Some of the optical units are located on the first side of the cooling plate, and the other part of the optical units are located on the second side of the cooling plate; The first beam combiner is located on the first side of the cooling plate, and the half-wave plate and polarizing beam combiner are located on the second side of the cooling plate. All the sub-beams on the first side of the cooling plate are reflected and combined by the first beam combiner to form a first combined beam. All the sub-beams on the second side of the cooling plate pass through the half-wave plate to form a second combined beam. The first combined beam and the second combined beam are combined by the polarizing beam combiner to form a semiconductor laser. The semiconductor laser is projected onto the laser output head.

3. The laser according to claim 2, characterized in that, The laser also includes a fiber laser module, which produces fiber lasers, and the semiconductor laser and the fiber laser are combined through the laser output head.

4. The laser according to claim 3, characterized in that, The laser emitter head includes a wavelength beam combiner and a second beam combiner with total reflection. The second beam combiner is correspondingly arranged with the fiber laser module. The fiber laser is reflected by the second beam combiner to the wavelength beam combiner. The semiconductor laser and the fiber laser are combined by the wavelength beam combiner.

5. The laser according to claim 4, characterized in that, The laser also includes a wedge prism. In the fiber laser transmission path, the second beam combiner is located downstream of the wedge prism. The fiber laser passes sequentially through the wedge prism, the second beam combiner, and then to the wavelength beam combiner.

6. The laser according to claim 5, characterized in that, The laser also includes a driving element, and the wedge prism is assembled to the driving element and driven to rotate so that the fiber laser forms a ring-shaped spot.

7. The laser according to claim 6, characterized in that, The driving component is a hollow motor.

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