Interface connection circuit, interface connection system, chip and electronic device

Abstract

The application relates to the technical field of integrated circuits, in particular to an interface connection circuit, an interface connection system, a chip and an electronic device, which comprise a first connection node and a second connection node; a first connection module comprising a first resistance unit and a first switch unit, the first switch unit being connected between the first resistance unit and the first connection node; and a second connection module comprising a second resistance unit and a second switch unit, the second switch unit being connected between the second resistance unit and the second connection node, the resistance value of the second resistance unit being different from that of the first resistance unit; in the above manner, the interface connection circuit is connected with a first interface, when the first interface is connected with a power supply device, the first connection module and the second connection module are connected respectively, the pull-down of the first resistance unit is used for representing the connection state of the interface connection circuit and the power supply device, and the pull-down of the second resistance unit is used for representing the support of super-large power charging, which is beneficial to reducing the cost.

Description

Technical Field

[0001] This application relates to the field of integrated circuit technology, and in particular to an interface connection circuit, an interface connection system, a chip, and an electronic device. Background Technology

[0002] Currently, power supply electronic devices typically have a Type-C interface. When a powered electronic device connected to the Type-C interface supports ultra-high power charging, the power supply electronic device charges it using ultra-high power. In related technologies, powered electronic devices supporting ultra-high power charging usually have a USB electronic tag chip. The power supply electronic device determines whether the powered electronic device supports ultra-high power charging by interacting with the USB electronic tag chip. However, this method is not conducive to cost reduction. Utility Model Content

[0003] In view of the above problems, embodiments of this application provide an interface connection circuit, an interface connection system, a chip, and an electronic device to solve the aforementioned technical problems that are not conducive to simplifying circuit structure and reducing costs.

[0004] In a first aspect, embodiments of this application provide an interface connection circuit, including:

[0005] The first connection node is connected to the first detection pin of the first interface;

[0006] The second connection node is connected to the second detection pin of the first interface;

[0007] The first connection module includes a first resistor unit and a first switch unit, wherein the first switch unit is connected between the first resistor unit and the first connection node;

[0008] The second connection module includes a second resistor unit and a second switch unit. The second switch unit is connected between the second resistor unit and the second connection node. The resistance value of the second resistor unit is different from the resistance value of the first resistor unit.

[0009] When the first interface is connected to the power supply device, the first connection module and the second connection module are respectively turned on. The pull-down of the first resistor unit is used to characterize the connection status between the interface connection circuit and the power supply device, and the pull-down of the second resistor unit is used to characterize support for ultra-high power charging.

[0010] Secondly, embodiments of this application provide an interface connection system, including a first interface connection circuit and a second interface connection circuit, wherein the first interface connection circuit is the interface connection circuit described above.

[0011] The second interface connection circuit includes:

[0012] The sixth connection module includes a first power supply and a sixth switch unit, wherein the sixth switch unit is connected between the first connection node and the first power supply;

[0013] The seventh connection module includes a second power supply and a seventh switch unit, wherein the seventh switch unit is connected between the second connection node and the second power supply;

[0014] The operating current of the sixth connection module is the same as that of the seventh connection module.

[0015] Thirdly, embodiments of this application provide a chip, which includes the interface connection circuit described above.

[0016] Fourthly, embodiments of this application provide an electronic device, which includes the chip described above.

[0017] The interface connection circuit, interface connection system, chip, and electronic device provided in this application include a first connection node and a second connection node; a first connection module includes a first resistor unit and a first switch unit, the first switch unit being connected between the first resistor unit and the first connection node; a second connection module includes a second resistor unit and a second switch unit, the second switch unit being connected between the second resistor unit and the second connection node, the resistance value of the second resistor unit being different from the resistance value of the first resistor unit; through the above method, the interface connection circuit is connected to a first interface, when the first interface is connected to a power supply device, the first connection module and the second connection module are respectively turned on, the pull-down of the first resistor unit is used to characterize the connection state between the interface connection circuit and the power supply device, the pull-down of the second resistor unit is used to characterize support for ultra-high power charging, and the ultra-high power charging identification function is achieved without configuring a USB electronic tag chip, which is beneficial to reduce costs and simplify the circuit structure.

[0018] These or other aspects of this application will become more apparent in the following description of the embodiments. Attached Figure Description

[0019] Figure 1 A schematic diagram of the interface connection circuit provided in an embodiment of this application is shown.

[0020] Figure 2 This illustration shows a first connection diagram between an interface connection circuit and a first electronic device according to an embodiment of this application.

[0021] Figure 3 A schematic diagram of the interface connection circuit provided in an embodiment of this application is shown.

[0022] Figure 4This illustration shows a second connection diagram between an interface connection circuit and a first electronic device according to an embodiment of this application.

[0023] Figure 5 A schematic diagram showing the connection between an interface connection circuit and a second electronic device according to an embodiment of this application is shown.

[0024] Figure 6 A schematic diagram of the interface connection system provided in an embodiment of this application is shown.

[0025] Figure 7 A schematic diagram of the chip structure provided in an embodiment of this application is shown.

[0026] Figure 8 A schematic diagram of the structure of an electronic device provided in an embodiment of this application is shown. Detailed Implementation

[0027] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.

[0028] To enable those skilled in the art to better understand the solutions of this application, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0029] In the embodiments of this application, it should be noted that, in this document, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.

[0030] Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0031] In the description of the embodiments of this application, the words "example" or "for example" are used to indicate exemplification, illustration, or description. Any embodiment or design described as "example" or "for example" in the embodiments of this application is not to be construed as being more preferred or having more advantages than another embodiment or design. The use of the words "example" or "for example" is intended to present relative concepts in a clear manner.

[0032] Furthermore, in the embodiments of this application, "multiple" refers to two or more. Therefore, in the embodiments of this application, "multiple" can also be understood as "at least two". "At least one" can be understood as one or more, such as one, two, or more. For example, including at least one means including one, two, or more, and is not limited to which ones are included. For example, including at least one of A, B, and C, then it could include A, B, C, A and B, A and C, B and C, or A and B and C.

[0033] It should be noted that in the embodiments of this application, "and / or" describes the relationship between associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. In addition, the character " / ", unless otherwise specified, generally indicates that the associated objects before and after it are in an "or" relationship.

[0034] It should be noted that in the embodiments of this application, "connection" can be understood as electrical connection. The connection between two electrical components can be a direct or indirect connection between the two electrical components. For example, the connection between A and B can be a direct connection between A and B, or an indirect connection between A and B through one or more other electrical components.

[0035] In the background technology, powered electronic devices that support ultra-high power charging are usually equipped with USB electronic tag (Electrically Marked Cable, eMarker) chips. For example, the powered electronic device can put the USB electronic tag chip in the cable, and the power supply electronic device determines that the powered electronic device supports ultra-high power charging by interacting with the data of the USB electronic tag chip.

[0036] One embodiment of this application provides an interface connection circuit 100, which is connected to a first interface 200. The first interface 200 is used to connect to a first electronic device 300. When the first electronic device 300 is connected to the first interface 200, the interface connection circuit 100 of this embodiment is connected to the first electronic device 300.

[0037] Please see Figure 1 and Figure 2As shown, the interface connection circuit 100 of this embodiment includes a first connection node 100a, a second connection node 100b, a first connection module 10, and a second connection module 20. The first connection node 100a is connected to the first detection pin 201 of the first interface 200, and the first connection module 10 is correspondingly configured with the first connection node 100a. The second connection node 100b is connected to the second detection pin 201 of the first interface 200, and the second connection module 20 is correspondingly configured with the second connection node 100b.

[0038] The first connection module 10 includes a first resistor unit 11 and a first switch unit 12. The first switch unit 12 is connected between the first resistor unit 11 and the first connection node 100a. The first switch unit 12 is used to control the connection and disconnection between the first resistor unit 11 and the first connection node 100a.

[0039] The second connection module 20 includes a second resistor unit 21 and a second switch unit 22. The second switch unit 22 is connected between the second resistor unit 21 and the second connection node 100b. The second switch unit 22 is used to control the connection between the second resistor unit 21 and the second connection node 100b. The resistance value of the second resistor unit 21 may be different from the resistance value of the first resistor unit 11.

[0040] Specifically, the first resistor unit 11 is used to characterize the connection between the interface connection circuit 100 and the power supply equipment, and the second resistor unit 21 is used to characterize the power receiving equipment where the interface connection circuit 100 is located to support ultra-high power charging.

[0041] When the first electronic device 300 is connected to the first interface 200, the first electronic device 300 is also connected to the interface connection circuit 100. The output terminal of the first power supply 301 in the first electronic device 300 is connected to the first connection node 100a, and the output terminal of the second power supply 302 in the first electronic device 300 is connected to the second connection node 100b. At this time, the first electronic device 300 is the power supply terminal (source terminal), and the interface connection circuit 100 is the connection circuit for the power receiving terminal (sink terminal). The first switch unit 12 and the second switch unit 22 are respectively turned on. The first power supply 301 and the first resistor unit 11 form a first connection path, and the second power supply 302 and the second resistor unit 21 form a second connection path. The pull-up of the first resistor unit 11 in the first connection path is used to characterize the connection state between the interface connection circuit 100 and the first electronic device 300, and the pull-up of the second resistor unit 21 in the second connection path is used to characterize support for ultra-high power charging. The first electronic device 300 recognizes that the interface connection circuit 100 has been connected through the first resistor unit 11, and the first electronic device 300 recognizes that the currently connected powered device can support high-power charging through the second resistor unit 21. For example, high-power charging can be a charging power greater than or equal to 60W. For example, the first resistor unit 11 may include a first resistor R1, and the second resistor unit 21 may include a second resistor R2.

[0042] In this embodiment, the interface connection circuit is connected to the first interface. When the first interface is connected to the power supply device, the first connection module and the second connection module are respectively turned on. The pull-up of the first resistor unit is used to characterize the connection status between the interface connection circuit and the power supply device, and the pull-up of the second resistor unit is used to characterize the support for ultra-high power charging. The ultra-high power charging identification function is realized without setting a USB electronic tag chip, and the circuit structure is simplified.

[0043] As one implementation method, please refer to Figure 2 As shown, the first interface 200 is connected to the first electronic device 300 via a first cable 203. The first cable 203 includes a first connecting line 2031 and a second connecting line 2032. The first connecting line 2031 is used to connect the first detection pin 201 and the output terminal of the first power supply 301, and the second connecting line 2032 is used to connect the second detection pin 202 and the output terminal of the second power supply 302. In some embodiments, please refer to [further details]. Figure 2As shown, the first electronic device 300 includes a second interface 303, which includes a third detection pin 3031 and a fourth detection pin 3032. The output terminal of the first power supply 301 is connected to the third detection pin 3031, and the output terminal of the second power supply 302 is connected to the fourth detection pin 3032. The second interface 303 and the first interface 200 are connected through a first cable 203 to enable the first electronic device 300 to connect to the first interface 200. The first connecting line 2031 is used to connect the first detection pin 201 and the third detection pin 3031, and the second connecting line 2032 is used to connect the second detection pin 202 and the fourth detection pin 3032.

[0044] In some embodiments, the first resistor unit 11 is connected in series between the first connection node 100a and the ground terminal, and the second resistor unit 21 is connected in series between the second connection node 100b and the ground terminal.

[0045] In some implementations, please refer to Figure 3 As shown, the interface connection circuit 100 of this embodiment also includes a first control module 30. The first control module 30 is connected to the first connection node 100a and the second connection node 100b respectively. The first control module 30 is used to send first data carrying first preset packet header information.

[0046] The first preset header information can be used to indicate that the data sender supports ultra-high power charging. The first data carrying the first preset header information can include the first preset header information and charging power data. In a specific application scenario, the first preset header information can be an ultra-high power charging identifier. The first electronic device 300 identifies that the currently connected powered device supports ultra-high power charging through the second resistor unit 21. At the same time, the first control module 30 sends the first data carrying the first preset header information to the first electronic device 300. The first electronic device 300 identifies the charging power data of the powered device through the first data carrying the first preset header information. For example, the first control module 30 can simulate a USB electronic tag chip to communicate with the first electronic device 300. The first preset header information can be a first physical header, which is configured to be the same as the physical header of the data sent by the USB electronic tag (Electrically Marked Cable, eMarker) chip. For example, the first preset header information can include SOP' or SOP.

[0047] In this embodiment, the first data carrying the first preset header information is sent by the first control module to simulate the communication between the first electronic device and the USB electronic tag, which helps to simplify the circuit structure and reduce costs.

[0048] In some implementations, the first control module 30 is also used to receive second data carrying second preset header information.

[0049] The second data, carrying the second preset header information, is data sent from the first electronic device 300 to the first control module 30. The second preset header information can be used to indicate that the data receiver supports ultra-high power charging. The second data carrying the second preset header information may include the second preset header information and a charging power acquisition request.

[0050] In a specific application scenario, the first electronic device 300 identifies, through the second resistor unit 21, that the currently connected powered device supports ultra-high power charging. The first electronic device 300 sends a message carrying second preset header information to the first control module 30. After receiving the second data carrying the second preset header information, the first control module 30 obtains the corresponding charging power data according to the charging power acquisition request, and assembles first data based on the first preset header information and the charging power data. The first control module 30 then sends the first data carrying the first preset header information back to the first electronic device 300, and the first electronic device 300 identifies the charging power data of the powered device through the first data carrying the first preset header information. For example, the second preset header information can be a second physical header, which can be configured to be the same as the physical header of the data received by the USB electronically marked cable (eMarker) chip. For instance, the second preset header information may include a Standard Operating Procedure (SOP).

[0051] In this embodiment, the first control module receives second data carrying second preset header information to simulate communication between the first electronic device and the USB electronic tag, which helps to simplify the circuit structure and reduce costs.

[0052] In some implementations, the first control module 30 is used to control the on / off state of the first switching unit 12 and the second switching unit 22, respectively.

[0053] When the first interface 200 is connected to the first electronic device 300 via the first cable 203, the first control module 30 controls the first switch unit 12 to turn on and the second switch unit 22 to turn on.

[0054] For example, the first control module 30 may be a first PD (Power Delivery) module, which receives power output from the first electronic device 300 through the first interface 200 to charge the powered device.

[0055] In some implementations, please refer to Figure 4As shown, the interface connection circuit 100 of this embodiment further includes a third connection module 40. The third connection module 40 includes a third resistor unit 41 and a third switch unit 42. The third switch unit 42 is connected between the third resistor unit 41 and the second connection node 100b. The resistance value of the third resistor unit 41 is the same as the resistance value of the first resistor unit 11. The third resistor unit 41 is connected in series between the second connection node 100b and the ground terminal. For example, the third resistor unit 41 may include a third resistor R3.

[0056] In a specific application scenario, the first interface 200 is connected to the first electronic device 300 via a second cable 204. The second cable 204 includes a third connecting line 2041, which is used to connect the first detection pin 201 or the second detection pin 202. Figure 4 The example shown is that the third connection line 2041 is used to connect to the first detection pin 201. The first electronic device 300 includes a second interface 303, which includes a third detection pin 3031 and a fourth detection pin 3032. The output terminal of the first power supply 301 is connected to the third detection pin 3031, and the output terminal of the second power supply 302 is connected to the fourth detection pin 3032. The second interface 303 and the first interface 200 are connected through the second cable 204 to enable the first electronic device 300 to connect to the first interface 200.

[0057] The third connecting line 2041 is used to connect the first detection pin 201 and the third detection pin 3031. When the first detection pin 201 and the third detection pin 3031 are connected, the first switching unit 12 is turned on, the third detection pin 3031 detects the pull-up of the first resistor unit 11, and the fourth detection pin 3032 is left floating. Alternatively, the third connecting line 2041 is used to connect the first detection pin 201 and the fourth detection pin 3032. When the first detection pin 201 and the fourth detection pin 3032 are connected, the first switching unit 12 is turned on, the fourth detection pin 3032 detects the pull-up of the first resistor unit 11, and the third detection pin 3031 is left floating.

[0058] The third connecting line 2041 is used to connect the second detection pin 202 and the third detection pin 3031. When the second detection pin 202 and the third detection pin 3031 are connected, the third switch unit 42 is turned on, the third detection pin 3031 detects the pull-up of the third resistor unit 41, and the fourth detection pin 3032 is left floating. Alternatively, the third connecting line 2041 is used to connect the second detection pin 202 and the fourth detection pin 3032. When the second detection pin 202 and the fourth detection pin 3032 are connected, the third switch unit 42 is turned on, the fourth detection pin 3032 detects the pull-up of the third resistor unit 41, and the third detection pin 3031 is left floating.

[0059] When the second detection pin 201 and the fourth detection pin 3032 are connected, the third switch unit 42 is turned on, the third detection pin 3031 detects the pull-up of the third resistor unit 41, and the third detection pin 3031 is left floating.

[0060] In this embodiment, when the first electronic device 300 is connected to the first interface 200 via a first cable 203 with two connecting lines, both the first connection module 10 and the second connection module 20 are turned on; when the first electronic device 300 is connected to the first interface 200 via a second cable 204 with one connecting line, either the first connection module 10 or the third connection module 40 is turned on; this is applicable to both dual-connection-line and single-connection-line application scenarios.

[0061] In the interface connection circuit 100, the first connection module 10, the second connection module 20, and the third connection module 40 can be connection modules for the power receiving end (sink end), respectively.

[0062] In some implementations, the first control module 30 is also used to control the on / off state of the third switching unit 42.

[0063] In some implementations, the first interface 200 can be a Type-C interface, and the first detection pin 201 and the second detection pin 202 can be the CC1 (Configuration Channel) pin and the CC2 pin, respectively. The second interface 303 can be a Type-C interface, and the third detection pin 3031 and the fourth detection pin 3032 can be the CC1 pin and the CC2 pin, respectively.

[0064] In some implementations, please refer to Figure 5 As shown, the interface connection circuit 100 of this embodiment further includes a fourth connection module 50 and a fifth connection module 60. The fourth connection module 50 includes a first power supply unit 51 and a fourth switch unit 52. The fifth connection module 60 includes a second power supply unit 61 and a fifth switch unit 62. The fourth switch unit 52 is connected between the first power supply unit 51 and the first connection node 100a. The fifth switch unit 62 is connected between the second power supply unit 61 and the second connection node 100b. The operating current of the fourth connection module 50 and the operating current of the fifth connection module 60 are the same.

[0065] In the interface connection circuit 100, the fourth connection module 50 and the fifth connection module 60 can be connection modules for the power supply end (source end), respectively.

[0066] In a specific application scenario, the first interface 200 is connected to the second electronic device 400 via the second cable 204. The second electronic device 400 includes a third interface 401, a first pull-down resistor 4021, and a second pull-down resistor 4022. The third interface 401 includes a fifth detection pin 4011 and a sixth detection pin 4012. The first pull-down resistor 4021 is connected in series between the fifth detection pin 4011 and the ground terminal, and the second pull-down resistor 4022 is connected in series between the sixth detection pin 4012 and the ground terminal.

[0067] The first interface 200 can be connected to the second electronic device 400 via the second cable 204 in the following ways: The fifth detection pin 4011 is connected to the fourth connection module 50, the fourth switch unit 52 is turned on, the first detection pin 201 detects the pull-down of the first pull-down resistor 4021, and the second detection pin 202 is left floating; or, the fifth detection pin 4011 is connected to the fifth connection module 60, the fifth switch unit 62 is turned on, the second detection pin 202 detects the pull-down of the first pull-down resistor 4021, and the first detection pin 201 is left floating; or, the sixth detection pin 4012 is connected to the fourth connection module 50, the fourth switch unit 52 is turned on, the first detection pin 201 detects the pull-down of the second pull-down resistor 4022, and the second detection pin 202 is left floating; or, the sixth detection pin 4012 is connected to the fifth connection module 60, the fifth switch unit 62 is turned on, the second detection pin 202 detects the pull-down of the second pull-down resistor 4022, and the first detection pin 201 is left floating.

[0068] In this embodiment, when the interface connection circuit 100 is connected to the powered device, the fourth connection module 50 or the fifth connection module 60 is connected to the pull-down resistor of the powered device to realize connection detection.

[0069] The third interface 401 can be a Type-C interface, and the fifth detection pin 4011 and the sixth detection pin 4012 can be the CC1 pin and the CC2 pin, respectively.

[0070] In some implementations, the first power supply unit 51 can be a constant current source, and the second power supply unit 61 can be a constant current source.

[0071] In some implementations, the first control module 30 is also used to control the on / off states of the fourth switch unit 52 and the fifth switch unit 62, respectively.

[0072] One embodiment of this application provides an interface connection system; please refer to [link / reference]. Figure 6 As shown, the interface connection system includes a first interface connection circuit and a second interface connection circuit 500, wherein the first interface connection circuit is the aforementioned interface connection circuit 100.

[0073] The second interface connection circuit 500 includes a sixth connection module 300a and a seventh connection module 300b. The sixth connection module 300a includes a first power supply 301 and a sixth switch unit 3041, with the sixth switch unit 3041 connected between the first connection node 100a and the first power supply 301. The seventh connection module 300b includes a second power supply 302 and a seventh switch unit 3042, with the seventh switch unit 3042 connected between the second connection node 100b and the second power supply 302. The operating current of the sixth connection module 300a and the seventh connection module 300b are the same.

[0074] In a dual-line connection scenario, the first connection node 100a and the second connection node 100b in the first interface connection circuit 100 are respectively connected to the second connection circuit. The first connection module 10 and the second connection module 20 are respectively turned on. At this time, the electronic device where the first interface connection circuit 100 is located is the power receiving end, and the electronic device where the second interface connection circuit is located is the power supply end. The sixth connection module 300a and the seventh connection module 300b are respectively turned on.

[0075] The first power supply 301 and the first resistor unit 11 form a first detection path. The power supply end can detect the pull-down of the first resistor unit 11 through the first detection path to determine that the power receiving end has been connected. The second power supply 302 and the second resistor unit 21 form a second detection path. The power supply end can detect the pull-up of the second resistor unit 21 through the second detection path to determine that the power receiving end supports ultra-high power charging.

[0076] It is easy to understand here that the first detection pin 201 and the second detection pin 202 can be connected to the fourth detection pin 3032 and the third detection pin 3031 respectively. The second power supply 302 and the first resistor unit 11 form the third detection path. The power supply end can detect the pull-down of the first resistor unit 11 through the third detection path to determine that the receiving end has been connected. The first power supply 301 and the second resistor unit 21 form the fourth detection path. The power supply end can detect the pull-down of the second resistor unit 21 through the fourth detection path to determine that the receiving end supports ultra-high power charging.

[0077] In this embodiment, the first interface connection circuit is connected to the second interface connection circuit via two wires. The first connection module and the second connection module are respectively turned on. The pull-down of the first resistor unit is used to characterize the connection status of the power supply equipment where the first interface connection circuit and the second interface connection circuit are located. The pull-down of the second resistor unit is used to characterize support for ultra-high power charging, which helps to simplify the circuit structure and reduce costs.

[0078] In some implementations, the second interface connection circuit 500 is connected to the second interface 302. The second interface 303 includes a third detection pin 3031 and a fourth detection pin 3032. The first power supply 301, the sixth switch unit 3041 and the third detection pin 3031 are connected in sequence, and the second power supply 302, the seventh switch unit 3042 and the fourth detection pin 3032 are connected in sequence.

[0079] In some implementations, the first interface 200 can be a Type-C interface, and the first detection pin 201 and the second detection pin 202 can be the CC1 pin and the CC2 pin, respectively. The second interface 303 can be a Type-C interface, and the third detection pin 3031 and the fourth detection pin 3032 can be the CC1 pin and the CC2 pin, respectively.

[0080] In some implementations, the first power supply 301 can be a constant current source, and the second power supply 302 can be a constant current source.

[0081] In some embodiments, the second interface connection circuit 500 further includes a second control module 305, which is used to receive first data carrying first preset header information sent by the first control module 30. For example, the second control module 305 may be a second PD (Power Delivery) module, which outputs power through the second interface 303 to charge the power receiving device where the first interface connection circuit is located.

[0082] The first preset header information can be used to identify that the data sender is a USB electronic tag. The first data carrying the first preset header information may include the first preset header information and charging power data. In a specific application scenario, the second control module 305 identifies that the currently connected powered device can support ultra-high power charging through the second resistor unit 21. At the same time, the first control module 30 sends the first data carrying the first preset header information to the second control module 305. The second control module 305 identifies the charging power data of the powered device through the first data carrying the first preset header information. For example, the first preset header information can be the physical header of the data sent by the USB electronic tag (Electrically Marked Cable, eMarker) chip. For example, the first preset header information may include SOP' or SOP".

[0083] In some implementations, the second control module 305 is used to send second data carrying second preset header information.

[0084] In a specific application scenario, the second control module 305 identifies, through the second resistor unit 21, that the currently connected powered device supports ultra-high power charging. The second control module 305 sends data carrying second preset header information to the first control module 30. Upon receiving second data carrying the second preset header information, the first control module 30 obtains the corresponding charging power data according to the charging power acquisition request, and assembles first data based on the first preset header information and the charging power data. The first control module 30 then sends the first data carrying the first preset header information to the second control module 305, and the second control module 305 identifies the charging power data of the powered device through the first data carrying the first preset header information. For example, the second preset header information can be the physical header of the data received by the USB electronically marked cable (eMarker) chip; for instance, the second preset header information may include a Standard Opening (SOP).

[0085] One embodiment of this application provides a chip 600; please refer to [link / reference]. Figure 7 As shown, chip 600 includes the aforementioned interface connection circuit 100. A chip (Integrated Circuit, IC) is also called a chip, and this chip can be, but is not limited to, a SOC (System on Chip) chip or a SIP (System in Package) chip.

[0086] In this embodiment, when the first interface is connected to the power supply device, the first connection module and the second connection module are respectively turned on. The pull-down of the first resistor unit is used to characterize the connection status between the interface connection circuit and the power supply device, and the pull-down of the second resistor unit is used to characterize support for ultra-high power charging. The chip achieves support for ultra-high power charging identification function without the need to configure a USB electronic tag chip, which helps to reduce costs and simplifies the circuit structure.

[0087] In one implementation, chip 600 can be a PD chip. For example, the PD chip can function as a power supply PD chip to manage power output; for example, the PD chip can also function as a receiving PD chip to receive transmitted power and manage charging.

[0088] This application also provides an electronic device 700, please refer to... Figure 8As shown, the electronic device 700 includes the aforementioned chip 600. The electronic device can be, but is not limited to, a weight scale, body fat scale, nutrition scale, pulse oximeter, body composition analyzer, display, USB (Universal Serial Bus) docking station, automobile, smart wearable device, mobile terminal, and smart home device. Smart wearable devices include, but are not limited to, smartwatches, smart bracelets, and neck massagers. Mobile terminals include, but are not limited to, smartphones, laptops, tablets, and POS (point of sales terminal) machines. Smart home devices include, but are not limited to, smart sockets, smart rice cookers, smart robot vacuums, and smart lights.

[0089] In this embodiment, when the first interface is connected to the power supply device, the first connection module and the second connection module are respectively turned on. The pull-down of the first resistor unit is used to characterize the connection status between the interface connection circuit and the power supply device, and the pull-down of the second resistor unit is used to characterize support for ultra-high power charging. The ultra-high power charging identification function is achieved without configuring a USB electronic tag chip, which helps to reduce costs and simplifies the circuit structure.

[0090] This electronic device can be a device that supports the USB Power Delivery (USB PD) protocol.

[0091] In one implementation, the electronic device 700 is a laptop computer or a mobile terminal.

[0092] In one implementation, the electronic device 700 is a power bank or a charging adapter.

[0093] The above description is merely an embodiment of this application. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of this application, but these improvements all fall within the protection scope of this application.

Claims

1. An interface connection circuit, characterized in that, include: The first connection node is connected to the first detection pin of the first interface; The second connection node is connected to the second detection pin of the first interface; The first connection module includes a first resistor unit and a first switch unit, wherein the first switch unit is connected between the first resistor unit and the first connection node; The second connection module includes a second resistor unit and a second switch unit. The second switch unit is connected between the second resistor unit and the second connection node. The resistance value of the second resistor unit is different from the resistance value of the first resistor unit. When the first interface is connected to the power supply device, the first connection module and the second connection module are respectively turned on. The pull-down of the first resistor unit is used to characterize the connection status between the interface connection circuit and the power supply device, and the pull-down of the second resistor unit is used to characterize support for ultra-high power charging.

2. The interface connection circuit according to claim 1, characterized in that, The first resistor unit is connected in series between the first connection node and the ground terminal, and the second resistor unit is connected in series between the second connection node and the ground terminal.

3. The interface connection circuit according to claim 2, characterized in that, The first resistor unit is used to characterize the connection between the interface connection circuit and the power supply equipment, and the second resistor unit is used to characterize the power receiving equipment where the interface connection circuit is located to support ultra-high power charging.

4. The interface connection circuit according to claim 1, characterized in that, The interface connection circuit further includes a first control module, which is connected to the first connection node and the second connection node respectively. The first control module is used to send first data carrying first preset header information.

5. The interface connection circuit according to claim 4, characterized in that, The first control module is also used to receive second data carrying second preset header information.

6. The interface connection circuit according to claim 4, characterized in that, The first control module is used to control the on / off state of the first switching unit and the second switching unit, respectively.

7. The interface connection circuit according to claim 4, characterized in that, The interface connection circuit further includes a third connection module, which includes a third resistor unit and a third switch unit. The third switch unit is connected between the third resistor unit and the second connection node, and the resistance value of the third resistor unit is the same as the resistance value of the first resistor unit.

8. The interface connection circuit according to claim 7, characterized in that, The first control module is also used to control the on / off state of the third switching unit.

9. The interface connection circuit according to claim 4, characterized in that, The interface connection circuit further includes a fourth connection module and a fifth connection module. The fourth connection module includes a first power supply unit and a fourth switch unit. The fifth connection module includes a second power supply unit and a fifth switch unit. The fourth switch unit is connected between the first power supply unit and the first connection node. The fifth switch unit is connected between the second power supply unit and the second connection node. The operating current of the fourth connection module and the operating current of the fifth connection module are the same.

10. An interface connection system, characterized in that, It includes a first interface connection circuit and a second interface connection circuit, wherein the first interface connection circuit is the interface connection circuit as described in any one of claims 1 to 8; The second interface connection circuit includes: The sixth connection module includes a first power supply and a sixth switch unit, wherein the sixth switch unit is connected between the first connection node and the first power supply; The seventh connection module includes a second power supply and a seventh switch unit, wherein the seventh switch unit is connected between the second connection node and the second power supply; The operating current of the sixth connection module is the same as that of the seventh connection module.

11. The interface connection system according to claim 10, characterized in that, The second interface connection circuit also includes a second control module, which is used to receive first data carrying first preset header information sent by the first control module.

12. The interface connection system according to claim 11, characterized in that, The second control module is used to send second data carrying second preset header information.

13. A chip, characterized in that, Includes the interface connection circuit as described in any one of claims 1 to 9.

14. An electronic device, characterized in that, Including the chip as described in claim 13.

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