A power device heat dissipation assembly and controller

Abstract

The application discloses a power device heat dissipation assembly and a controller, and belongs to the technical field of controllers. The heat dissipation assembly comprises a heat dissipation piece, the heat dissipation piece comprises a base body and heat dissipation teeth, the heat dissipation teeth are arranged on one side of the base body, a plurality of the heat dissipation teeth are arranged at intervals, and gaps exist between two adjacent heat dissipation teeth. A power device is arranged in the gaps. The power device is arranged in the gaps formed between the two adjacent heat dissipation teeth, so that the assembly form between the power device and the heat dissipation piece is simplified, and the space utilization is improved.

Description

Technical Field

[0001] This application relates to the field of controller technology, and in particular to a heat dissipation component and controller for a power device. Background Technology

[0002] In the field of power device structure for air-cooled motor controllers, IGBT (Insulated Gate Bipolar Transistor) is a key power device in air-cooled motor controllers. It generates a lot of heat when it is working. Air cooling requires the use of heat sinks, thermal grease and other components to quickly dissipate the heat generated by the IGBT to ensure its stable operation.

[0003] However, the assembly method of power devices and heat sinks results in low space utilization. Utility Model Content

[0004] This application provides a power device heat dissipation assembly, which aims to overcome the technical problem of low space utilization in the current assembly form of power devices and heat sinks; another objective of this application is to provide a controller.

[0005] Technical solution: The power device heat dissipation assembly in this application embodiment includes:

[0006] A heat sink includes a base and heat sink teeth. The heat sink teeth are disposed on one side of the base, and there are multiple heat sink teeth arranged at intervals. There is a gap between two adjacent heat sink teeth, and a power device is disposed in the gap.

[0007] In some embodiments, the substrate has a through mounting port, and the power device has a portion protruding from the mounting port to the side of the substrate opposite to the heat dissipation teeth.

[0008] In some embodiments, the power device includes a connected body and pins, the body being housed within the gap and sandwiched between two adjacent heat dissipation teeth, and the pins protruding from the mounting opening to the side of the base opposite to the heat dissipation teeth.

[0009] In some embodiments, a plurality of the heat dissipation teeth are arranged along a first direction and form at least two of the gaps;

[0010] The number of power devices is multiple, and at least two of the power devices are disposed in different gaps.

[0011] In some embodiments, the power devices in two adjacent gaps are staggered along a second direction, where the first direction intersects the second direction.

[0012] In some embodiments, in the first direction, there are at least two heat dissipation teeth between two adjacent power devices.

[0013] In some embodiments, the substrate has a plurality of mounting ports, and the power devices are configured in a one-to-one correspondence with the mounting ports.

[0014] In some embodiments, the heat dissipation fins are arranged along a first direction;

[0015] The power devices are at least two in number and are spaced apart along a second direction, the first direction intersecting the second direction.

[0016] In some embodiments, along a third direction, the length of the heat dissipation tooth is greater than the length of the power device, and the third direction, the first direction, and the second direction intersect each other.

[0017] In some embodiments, the heat sink further includes a connecting block disposed within the gap and connecting two adjacent heat sink teeth respectively, and the power device is supported on the connecting block.

[0018] In some embodiments, the power device heat dissipation assembly further includes a heat-conducting element, which connects the power device unit and the heat dissipation teeth respectively.

[0019] In some embodiments, the substrate has a boss on the side opposite to the heat dissipation teeth, and in the third direction, the projection of the boss does not overlap with the projection of the power device.

[0020] In some embodiments, a limiting structure is formed between two adjacent heat dissipation teeth.

[0021] This application also discloses a controller, including a power device heat dissipation assembly as described in the above embodiments.

[0022] In some embodiments, the controller further includes a printed circuit board connected to the side of the substrate away from the heat dissipation fins, and the power device is connected to the printed circuit board.

[0023] Beneficial Effects: The power device heat dissipation assembly in this embodiment includes a heat sink and a power device. The heat sink includes a base and at least two heat dissipation teeth. The heat dissipation teeth are disposed on one side of the base and are arranged at intervals, with a gap between adjacent heat dissipation teeth. An assembly opening is provided on the base, communicating with the gap. The power device is housed within the gap and protrudes from the assembly opening to the side of the base opposite to the heat dissipation teeth. By using the gap formed between adjacent heat dissipation teeth and arranging the power device within the gap, the assembly method between the power device and the heat sink is simplified, reducing the number of parts, improving assembly efficiency, and reducing production costs.

[0024] The controller in this application includes the power device heat dissipation assembly as described in the above embodiments. Therefore, it can have all the technical features and effects of the power device heat dissipation assembly described above, which will not be repeated here. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a three-dimensional structural diagram of the power device heat dissipation assembly provided in an exemplary embodiment of this disclosure;

[0027] Figure 2 This is a top view of the heat dissipation assembly for power devices provided in an exemplary embodiment of this disclosure.

[0028] Figure 3 yes Figure 2 A cross-sectional view along the AA direction;

[0029] Figure 4 This is a three-dimensional structural schematic diagram of a power device heat dissipation assembly provided in another exemplary embodiment of this disclosure;

[0030] Figure 5 This is a top view of a power device heat dissipation assembly provided in another exemplary embodiment of this disclosure;

[0031] Figure 6 yes Figure 5 A cross-sectional view along the BB direction;

[0032] Figure 7 This is a schematic diagram of a limiting structure formed between two adjacent heat dissipation teeth in a power device heat dissipation assembly provided in an exemplary embodiment of this disclosure;

[0033] Figure 8 This is a perspective view of the controller provided in an exemplary embodiment of this disclosure, and the printed circuit board is also shown in the figure;

[0034] Figure 9 This is a top view of the controller provided in an exemplary embodiment of the present disclosure, showing the printed circuit board and pins.

[0035] Explanation of reference numerals in the attached figures:

[0036] 10. Heat sink; 100. Gap; 101. Assembly port; 110. Base; 120. Heat dissipation fins; 130. Connecting block; 140. Boss; 20. Power device; 210. Body; 220. Pin; 30. Thermal conductive component; 40. Printed circuit board; X, first direction; Y, second direction; Z, third direction. Detailed Implementation

[0037] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0038] In the description of this application, it should be understood that the terms "upper," "lower," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or component referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application. In the description of this application, "multiple" means two or more, and "at least one" can refer to one, two, or more, unless otherwise explicitly specified. The terms "first," "second," and "third," etc., are only for the convenience of description and are used to name parts or embodiments by number, and do not imply any order of importance between the parts or embodiments.

[0039] It should also be noted that in the accompanying drawings of this application, arrows marked X indicate the first direction X, arrows marked Y indicate the second direction Y, and arrows marked Z indicate the third direction Z. The introduction of the first direction X, the second direction Y, and the third direction Z in the description of this application is to more clearly define the structure and relative positional relationships of the components in the power device heat dissipation assembly. In actual implementation, the third direction Z is generally a vertical direction or height direction, and the first direction X and the second direction Y are generally horizontal directions. The first direction X, the second direction Y, and the third direction Z intersect each other. Optionally, the first direction X, the second direction Y, and the third direction Z are perpendicular to each other to optimize the layout of the power device heat dissipation assembly. In the description of this application, "perpendicular" means completely perpendicular to 90° or almost completely perpendicular; for example, an angle between 80° and 100° is considered perpendicular. Similarly, "parallel" means completely parallel or almost completely parallel; for example, a completely parallel angle within 10° is considered parallel.

[0040] As a preamble to the embodiments of this application, the traditional power device structure of an air-cooled motor controller, in order to meet the heat dissipation requirements of IGBTs, involves laying the IGBT flat on the surface of a heat sink and adding components such as silicone grease, ceramic gaskets, and springs between the IGBT and the heat sink. Silicone grease is used to fill the tiny gaps at the contact surface, enhancing heat conduction efficiency; ceramic gaskets serve both electrical insulation and auxiliary heat dissipation functions; and springs provide pressure to ensure a tight fit between the IGBT and the heat sink, achieving efficient heat dissipation. However, this assembly method of power devices and heat sinks results in low space utilization. Furthermore, the assembly method of power devices and heat sinks is complex. On the other hand, the stacking of multiple components introduces additional thermal resistance, hindering heat transfer and affecting overall heat dissipation performance, making it difficult to fully meet the stringent heat dissipation requirements of IGBTs.

[0041] In view of this, embodiments of this application provide a power device heat dissipation assembly, which aims to solve at least one of the above-mentioned technical problems.

[0042] Please see Figure 1 As shown, the heat dissipation assembly for the power device 20 in this embodiment includes a heat sink 10. The heat sink 10 includes a base 110 and heat dissipation teeth 120. Multiple heat dissipation teeth 120 are disposed on one side of the base 110 and arranged at intervals. A gap 100 exists between adjacent heat dissipation teeth 120, and the power device 20 is disposed within the gap 100. It should be understood that the size of the gap 100 can match the size of the power device 20. It should be noted that the power device 20 has two large surfaces arranged opposite each other; the large surface can be understood as the surface with the largest area on the power device 20. In two adjacent heat dissipation teeth 120, one heat dissipation tooth 120 contacts one of the large surfaces, and the other heat dissipation tooth 120 contacts the other large surface, so that the power device 20 is placed vertically within the gap 100, thereby reducing the space occupied by the power device 20 and improving space utilization. By using the gap 100 formed between two adjacent heat dissipation teeth 120, and arranging the power device 20 within the gap 100, the assembly of the power device 20 and the heat sink 10 is simplified, the number of parts is reduced, the assembly efficiency is improved, and the production cost is reduced.

[0043] Please combine Figure 1 And see Figure 2 and Figure 3 As shown, the base 110 has a through mounting port 101, and the power device 20 has a portion protruding from the mounting port 101 to the side of the base 110 opposite to the heat dissipation teeth 120. The mounting port 101 can lead out the pins 220 of the power device 20 to reserve a channel for connecting the power device 20 to external circuit components.

[0044] Please refer to Figure 3. In some embodiments, the power device 20 includes a body 210 and pins 220 connected together. The body 210 is housed within the gap 100 and sandwiched between two adjacent heat dissipation teeth 120. The pins 220 protrude from the assembly port 101 to the side of the base 110 opposite to the heat dissipation teeth 120. It should be understood that by sandwiching the body 210 of the power device 20 between two adjacent heat dissipation teeth 120, the contact area between the power device 20 and the heat dissipation teeth 120 is increased, thereby increasing the connection stability. At the same time, the heat dissipation area of ​​the body 210 is increased, allowing the concentrated heat of the power device 20 to be quickly transferred to the heat dissipation teeth 120, thus improving the heat dissipation efficiency. It should also be understood that the power device 20 adopts a vertical structure, that is, two large surfaces of the power device 20 facing away from each other are each connected to a heat dissipation tooth 120, thereby further increasing the heat dissipation surface and improving the heat dissipation efficiency.

[0045] Please see Figure 3 or Figure 6 As shown, in some embodiments, multiple heat dissipation fins are arranged along a first direction and form at least two gaps; the number of power devices is multiple, and at least two power devices are disposed in different gaps. It should be understood that by distributing the power devices 20 within different gaps 100, the space of the heat sink 10 is fully utilized, the layout is more regular, and different power devices 20 are isolated, facilitating maintenance and management and avoiding interference between adjacent power devices 20. By arranging multiple power devices 20 in an array to form multiple columns spaced along the first direction X, each column is disposed in a different gap 100, wherein each column has at least one power device 20, and the multiple power devices 20 in each column are arranged spaced along the second direction Y. Through the above layout, integrated management of the power devices 20 is achieved, improving overall heat dissipation efficiency and optimizing the space utilization of the heat dissipation components of the power devices 20. It should also be understood that by using an array layout combined with a vertical structure of the power devices 20 (each of the two large, back-to-back surfaces contacts a heat dissipation fin 120), the overall size of the heat dissipation components of the power devices 20 can be reduced, manufacturability difficulty can be reduced, and power density can be increased.

[0046] Please see Figures 4 to 6 As shown, in some embodiments, the power devices 20 within two adjacent gaps 100 are staggered along the second direction Y, and the first direction X intersects the second direction Y. It should be understood that by staggering the power devices 20 within two adjacent gaps 100 along the second direction Y, it is ensured that there are no obstructions on the side of the heat dissipation fin 120 away from the power devices 20, thereby improving the heat dissipation efficiency of the heat dissipation fin 120; furthermore, the staggered arrangement allows for airflow channels within the gaps 100, thereby improving the heat dissipation efficiency of the power devices 20 of the air-cooled motor controller.

[0047] Please see Figures 1 to 3As shown, in some embodiments, at least two heat dissipation teeth 120 are provided between two adjacent power devices 20 in the first direction X. It should be understood that by reserving two heat dissipation teeth 120 between two adjacent power devices 20 in the first direction X, the gap 100 between the two heat dissipation teeth 120 is used to provide an airflow channel, ensuring that the heat dissipation between two power devices 20 arranged at intervals along the first direction X does not affect each other, heat is not easily accumulated on the heat dissipation teeth 120, the heat dissipation path is optimized, and the heat dissipation efficiency is improved.

[0048] Please see Figure 1 and Figure 4 As shown, in some embodiments, the substrate 110 has multiple mounting ports 101, and the power devices 20 are configured one-to-one with the mounting ports 101. It should be understood that when at least two power devices 20 are disposed in different gaps 100, by providing multiple mounting ports 101 on the substrate 110, it is ensured that each gap 100 containing a power device 20 is connected to a mounting port 101, thereby enabling the installation of the power devices 20 in different gaps 100.

[0049] Please see Figure 2 As shown, in some embodiments, the heat dissipation fins 120 are arranged along a first direction X; the number of power devices 20 is at least two, and they are arranged at intervals along a second direction Y, where the first direction X intersects the second direction Y. It should be understood that within a single gap 100, at least two power devices 20 are arranged at intervals along the second direction Y, and multiple power devices 20 can share a single mounting port 101, or each power device 20 can have its own mounting port 101. By arranging at least two power devices 20 within a single gap 100, the layout of the power devices 20 is optimized, facilitating centralized management; simultaneously, the heat dissipation path of each power device 20 is optimized, improving overall heat dissipation efficiency.

[0050] Please see Figure 3 and Figure 6 As shown, in some embodiments, along the third direction Z, the length of the heat dissipation denticle 120 is greater than the length of the power device 20, and the third direction Z, the first direction X, and the second direction Y intersect each other. It should be understood that the longer length of the heat dissipation denticle 120 relative to the power device 20 means that the heat dissipation denticle 120 has a larger heat dissipation area, which can quickly conduct heat from the power device 20 to the outside, improving heat dissipation efficiency. Simultaneously, the space within the gap 100 along the third direction Z where the power device 20 is not located can provide an airflow channel, facilitating the rapid conduction of heat from the heat dissipation denticle 120 to the environment, further improving heat dissipation efficiency.

[0051] Please see Figure 3 and Figure 6As shown, in some embodiments, the heat sink 10 further includes a connecting block 130, which is disposed within the gap 100 and connects to two adjacent heat dissipation teeth 120 respectively. The power device 20 is supported on the connecting block 130. It should be understood that the connecting block 130 can serve to support the power device 20, thereby improving the stability of the power device 20. On the other hand, the connecting block 130 and the heat dissipation teeth 120 can be made of the same heat dissipation material, which can increase the heat dissipation surface of the power device 20 and improve the heat dissipation efficiency. Furthermore, the connecting block 130 is connected between adjacent heat dissipation teeth 120, which can balance the temperature, avoid large temperature differences between the heat dissipation teeth 120, ensure the performance of the power device 20, and improve its service life.

[0052] In some embodiments, a limiting structure can be formed between two adjacent heat dissipation teeth 120. Specifically, the limiting structure can be a locking block (not shown), which is disposed on the opposite sidewalls of the two heat dissipation teeth 120 for locking the power device 20.

[0053] Please see Figure 7 As shown, in some other embodiments, by changing the spacing between the two heat dissipation teeth 120 at different positions, a funnel-like limiting structure is formed to self-position the power device 20, thereby ensuring that the power device 20 can be quickly housed in the gap 100, improving assembly efficiency and reducing the risk of the power device 20 falling out of the gap 100.

[0054] Please see Figure 3 and Figure 6 As shown, in some embodiments, the heat dissipation assembly of the power device 20 further includes a thermally conductive element 30, which connects the power device 20 unit to the heat dissipation fins 120. It should be understood that the thermally conductive element 30 in this application can be thermally conductive adhesive. By filling the space between the heat dissipation fins 120 and the power device 20 with thermally conductive adhesive, thermal resistance is reduced and heat conduction efficiency is improved. Simultaneously, the thermally conductive adhesive fills the assembly gap 100 between the power device 20 and the heat dissipation fins 120, thereby improving the heat dissipation uniformity of the power device 20, reducing the manufacturing difficulty of the heat dissipation element 10, and reducing the assembly difficulty of the power device 20. It should be noted that when filling with thermally conductive adhesive, the adhesive can overflow and cover the side of the power device 20 facing the assembly opening 101.

[0055] Please see Figure 1 and Figure 3As shown, in some embodiments, the substrate 110 has a boss 140 on the side opposite to the heat dissipation fins 120. In the third direction Z, the projection of the boss 140 does not overlap with the projection of the power device 20. It should be understood that the boss 140 is provided for mounting and supporting the printed circuit board 40. Specifically, the printed circuit board 40 is disposed on the side of the boss 140 opposite to the substrate 110 to achieve heat dissipation of the printed circuit board 40, further improving the utilization rate of the heat sink 10, reducing the amount of copper plating on the printed circuit board 40, thereby reducing costs.

[0056] This application also discloses a controller, including the power device heat dissipation assembly as described in the above embodiments. Therefore, it can possess all the technical features and effects of the power device heat dissipation assembly described above, and will not be repeated here.

[0057] Please see Figure 8 and Figure 9 As shown, in some embodiments, the controller further includes a printed circuit board 40 connected to the side of the substrate 110 opposite to the heat sink 120, and the power device 20 is connected to the printed circuit board 40. It should be understood that, combined with the vertically arranged power device 20, the size of the printed circuit board 40 in this application is further reduced, optimizing the current flow layout. Specifically, the power device 20 is connected to the printed circuit board 40 via pin 220.

[0058] It should also be understood that thermally conductive adhesive can be filled between the boss 140 and the printed circuit board 40 to reduce thermal resistance and improve heat dissipation efficiency. In some embodiments, the printed circuit board 40 is bolted to the heat sink 10.

[0059] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0060] The power device heat dissipation components and controllers provided in the embodiments of this application have been described in detail above, and specific examples have been used to illustrate the principles and implementation methods of this application. The descriptions of the above embodiments are only for the purpose of helping to understand the technical solutions and core ideas of this application. Those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation assembly for a power device, characterized in that, include: The heat sink (10) includes a base (110) and heat sink teeth (120). The heat sink teeth (120) are disposed on one side of the base (110), and there are multiple teeth arranged at intervals. There is a gap (100) between two adjacent heat sink teeth (120), and a power device (20) is disposed in the gap (100).

2. The power device heat dissipation assembly according to claim 1, characterized in that, The substrate (110) has a through mounting port (101), and the power device (20) has a portion protruding from the mounting port (101) to the side of the substrate (110) opposite to the heat dissipation teeth (120).

3. The power device heat dissipation assembly according to claim 2, characterized in that, The power device (20) includes a body (210) and pins (220) connected to each other. The body (210) is housed in the gap (100) and sandwiched between two adjacent heat dissipation teeth (120). The pins (220) protrude from the mounting port (101) to the side of the base (110) opposite to the heat dissipation teeth (120).

4. The power device heat dissipation assembly according to claim 2, characterized in that, The plurality of heat dissipation teeth (120) are arranged along a first direction (X) and form at least two of the gaps (100); The number of power devices (20) is multiple, and at least two of the power devices (20) are disposed in different gaps (100).

5. The power device heat dissipation assembly according to claim 4, characterized in that, The power devices (20) in two adjacent gaps (100) are staggered along the second direction (Y), and the first direction (X) intersects with the second direction (Y).

6. The power device heat dissipation assembly according to claim 4, characterized in that, In the first direction, there are at least two heat dissipation teeth (120) between two adjacent power devices (20).

7. The power device heat dissipation assembly according to claim 5 or 6, characterized in that, The substrate (110) has a plurality of assembly ports (101), and the power device (20) is provided in a one-to-one correspondence with the assembly ports (101).

8. The power device heat dissipation assembly according to claim 1, characterized in that, The heat dissipation teeth (120) are arranged along a first direction (X); The number of power devices (20) is at least two, and they are arranged at intervals along a second direction (Y), where the first direction (X) intersects the second direction (Y).

9. The power device heat dissipation assembly according to claim 1, characterized in that, Along the third direction (Z), the length of the heat dissipation tooth (120) is greater than the length of the power device (20), and the third direction (Z), the first direction (X) and the second direction (Y) intersect each other.

10. The power device heat dissipation assembly according to claim 1, characterized in that, The heat sink (10) also includes a connecting block (130), which is disposed in the gap (100) and connects to two adjacent heat sink teeth (120) respectively. The power device (20) is supported on the connecting block (130).

11. The power device heat dissipation assembly according to claim 1, characterized in that, It also includes a heat-conducting component (30), which is connected to the power device (20) unit and the heat dissipation tooth (120) respectively.

12. The power device heat dissipation assembly according to claim 11, characterized in that, The substrate (110) has a boss (140) on the side away from the heat dissipation tooth (120), and the projection of the boss (140) does not overlap with the projection of the power device (20) in the third direction (Z).

13. The power device heat dissipation assembly according to claim 1, characterized in that, A limiting structure is formed between two adjacent heat dissipation teeth (120).

14. A controller, characterized in that, Includes the power device heat dissipation assembly as described in any one of claims 1 to 13.

15. The controller according to claim 14, characterized in that, The controller also includes a printed circuit board (40), which is connected to the side of the substrate (110) away from the heat dissipation teeth (120), and the power device (20) is connected to the printed circuit board (40).

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