A novel wafer fixing disc self-cleaning system

Abstract

The utility model provides a novel wafer fixing disc self -cleaning system, include: wafer fixing disc top is linked with mechanical arm, the sleeve is set in wafer fixing disc bottom, and the sleeve is metal filament meshed disc, contact cleaning module and non - contact cleaning module are side by side set below wafer fixing disc through bolt connection, and the sleeve and high temperature non - stick cloth are additionally arranged in wafer fixing disc bottom, can effectively prevent the stickiness of most foreign matters, the high -speed airflow of gas knife spouted in non - contact cleaning module and the high -speed gas eddy current of the cavity of the side wall inclination, will the fine adhesion particle on wafer fixing disc and its bottom high temperature non - stick cloth, wafer edge angle material residue, carry out peeling, and then through rubber roller, the particle and some gelatinous foreign matters that wafer fixing disc and its bottom high temperature non - stick cloth are not completely fallen off are adhered.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor processing equipment, and in particular to the field of wafer loading module cleaning system development technology, specifically a novel wafer fixing disk self-cleaning system. Background Technology

[0002] In the grinding process of semiconductor packaging, wafer holders fix the wafers in a vacuum. Before packaging, the wafers need to be thinned to less than 70 micrometers through a back-side thinning process. Any abnormal local stress can easily cause cracking. Since the wafer holder fixes the wafers in a vacuum, some foreign fine particles, such as silicon powder, chip scraps, and gel-like foreign matter, may adhere to the surface of the holder due to environmental factors. This can cause unevenness in the contact surface between the wafer and the chuck, forming local high-pressure points under grinding pressure, which aggravates the stress concentration effect and ultimately causes the wafer to break. Summary of the Invention

[0003] In view of the shortcomings of the prior art described above, the purpose of this utility model is to provide a novel self-cleaning system for wafer holders to solve the difficulties of the prior art.

[0004] To achieve the above and other related objectives, this utility model provides a novel self-cleaning system for wafer holders, comprising:

[0005] Wafer holding tray 2, the top of which is connected to robotic arm 1;

[0006] The sleeve 3 is fitted onto the bottom of the wafer fixing disk 2, and the sleeve 3 is a metal wire mesh disk;

[0007] The contact cleaning module 5 and the non-contact cleaning module 6 are connected by bolts and arranged side by side below the wafer fixing disk 2.

[0008] According to the preferred embodiment, the bottom of the wafer fixing disk 2 is provided with several air holes at equal intervals.

[0009] According to the preferred embodiment, the bottom of the card sleeve 3 is fitted with a high-temperature non-stick cloth 4.

[0010] According to the preferred embodiment, the contact cleaning module 5 includes:

[0011] Cylinder 51, which is located directly below the wafer fixing disk 2;

[0012] Mounting base 52, which is bolted to the top of cylinder 51;

[0013] A rubber roller 53 is fitted onto the top of the mounting base 52.

[0014] According to the preferred embodiment, the first cylinder 51 is set on a fixed path traveled by the robotic arm 1, and the bottom of the first cylinder 51 is set on the metal platform on the left and right sides of the work platform or the conveyor by bolts or welding.

[0015] According to the preferred embodiment, the non-contact cleaning module 6 includes:

[0016] Cylinder 61 is a second cylinder, which is bolted or welded to one side of cylinder 51.

[0017] A pneumatic cleaning box 62 is bolted to the top of the second cylinder 61. The pneumatic cleaning box 62 is a hollow cavity 63 formed by four side walls.

[0018] An air knife 64 is inserted at the bottom center of the cavity 63. The air knife 64 is conical and has air outlet holes 65 around its perimeter.

[0019] According to the preferred embodiment, the inner walls of the pneumatic cleaning box 62 are inclined so that the cross-section of the cavity 63 is an inverted trapezoid.

[0020] This invention employs a wafer fixing tray, a ferrule, a high-temperature non-stick cloth, a contact cleaning module, and a non-contact cleaning module. During the wafer fixing tray's return to the unloading area controlled by the robotic arm, it decelerates as it passes over the areas above the contact and non-contact cleaning modules. In both modules, cylinders 1 and 2 activate to push the pneumatic cleaning box and mounting base towards the wafer fixing tray, causing the top of the pneumatic cleaning box and the rubber roller to sequentially contact the wafer fixing tray. In the non-contact cleaning module, the high-speed airflow from the air knife and the high-speed gas vortex generated by the inclined cavity on the sidewall peel off fine particles and wafer scrap residue from the wafer fixing tray and the high-temperature non-stick cloth at its bottom. Finally, the rubber roller adheres any remaining particles and some gelatinous foreign matter from the wafer fixing tray and the high-temperature non-stick cloth at its bottom, achieving the following beneficial effects:

[0021] 1. The contact cleaning module and the non-contact cleaning module work together with the robotic arm to achieve seamless "cleaning while moving" operation;

[0022] 2. Adding a self-cleaning step will not affect production efficiency;

[0023] 3. Effectively removes foreign matter from the surface of the wafer holder, preventing quality problems caused by foreign matter to the wafer.

[0024] The preferred embodiments of the present invention will be described in more detail below with reference to the accompanying drawings, so as to facilitate an understanding of the features and advantages of the present invention. Attached Figure Description

[0025] Figure 1 The diagram shown is a structural schematic of this utility model.

[0026] Label Explanation

[0027] 1. Robotic arm;

[0028] 2. Wafer holder;

[0029] 3. Card sleeve;

[0030] 4. High-temperature non-stick fabric;

[0031] 5. Contact cleaning module; 51. Cylinder No. 1; 52. Mounting base; 53. Rubber roller;

[0032] 6. Non-contact cleaning module; 61. No. 2 cylinder; 62. Pneumatic cleaning box; 63. Cavity; 64. Air knife; 65. Air outlet; Detailed Implementation

[0033] To make the objectives, technical solutions, and advantages of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. The same reference numerals in the drawings represent the same components. It should be noted that the described embodiments are only some, not all, of the embodiments of this utility model. All other embodiments obtained by those skilled in the art based on the described embodiments of this utility model without creative effort are within the scope of protection of this utility model.

[0034] Compared to the embodiments shown in the accompanying drawings, feasible embodiments within the scope of protection of this utility model may have fewer components, have other components not shown in the drawings, different components, components arranged differently, or components with different connections, etc. Furthermore, two or more components shown in the drawings may be implemented in a single component, or a single component shown in the drawings may be implemented as multiple separate components.

[0035] Unless otherwise defined, the technical or scientific terms used herein shall have the ordinary meaning understood by one of ordinary skill in the art to which this invention pertains. The terms “first,” “second,” and similar terms used in this patent application specification and claims do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, “an” or “a” and similar terms do not necessarily indicate a quantity limitation. Terms such as “comprising” or “including” mean that the element or object preceding the word encompasses the element or object listed following the word and its equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. Terms such as “upper,” “lower,” “left,” and “right” are used only to indicate relative positional relationships; these relative positional relationships may change accordingly when the absolute position of the described object changes.

[0036] This invention proposes a novel self-cleaning system for wafer mounting disks, used in the cleaning of wafer loading modules. This invention does not limit the specific specifications and types of wafers to be gripped, but the structure of the wafer mounting disk 2, the sleeve 3, the high-temperature non-stick cloth 4, the contact cleaning module 5, and the non-contact cleaning module 6 is particularly suitable for realizing the self-cleaning of wafer mounting disks.

[0037] In general, the novel self-cleaning system for wafer holders proposed in this utility model mainly includes: a wafer holder 2, a retainer 3, a high-temperature non-stick cloth 4, a contact cleaning module 5, and a non-contact cleaning module 6, wherein references can be found... Figure 1 It shows the arrangement of the wafer holding plate 2, the ferrule 3, the high-temperature non-stick cloth 4, the contact cleaning module 5, and the non-contact cleaning module 6.

[0038] When using the novel wafer holder self-cleaning system proposed in this utility model: The robotic arm 1 controls the wafer holder 2 to pick up the wafer from the unloading area and move it to the processing area. During its return journey to the unloading area, the robotic arm 1 controls the wafer holder 2 to decelerate when passing over the area above the contact cleaning module 5 and the non-contact cleaning module 6. The second cylinder 61 and the first cylinder 51 in the contact cleaning module 5 and the non-contact cleaning module 6 respectively push the pneumatic cleaning box 62 and the mounting base 52 towards the wafer holder 2, causing the top of the pneumatic cleaning box 62 and the rubber roller 53 to sequentially contact the wafer holder 2. It should be noted that the wafer holder 2 passes through the non-contact cleaning module 6 first and then the contact cleaning module 6. In module 5, the high-speed airflow ejected by the air knife 64 in the non-contact cleaning module 6, combined with the high-speed gas vortex generated by the inclined cavity 63, peels off the fine particles and wafer scrap residues attached to the wafer holder 2 and the high-temperature non-stick cloth 4 at its bottom. Then, the rubber roller 53 adheres any remaining particles and some gelatinous foreign matter that have not completely detached from the wafer holder 2 and the high-temperature non-stick cloth 4 at its bottom. The contact cleaning module 5 and the non-contact cleaning module 6 work together with the robotic arm 1 to achieve seamless "cleaning while moving" operation. The addition of the self-cleaning step does not affect production efficiency, effectively removes foreign matter from the surface of the wafer holder 2, and prevents quality problems caused by foreign matter to the wafer.

[0039] The top of the wafer holding plate 2 is connected to the robotic arm 1, and the wafer holding plate 2 is controlled by the robotic arm 1. Several air holes are evenly spaced at the bottom of the wafer holding plate 2 for vacuuming. A sleeve 3 is installed at the bottom of the wafer holding plate 2. The sleeve 3 is a metal wire mesh disk. Together with the high-temperature non-stick cloth 4 at the bottom of the sleeve 3, the structure of the wafer holding plate 2 is improved, which can effectively prevent most foreign objects from sticking. At the same time, the sleeve 3 and the high-temperature non-stick cloth 4 are set as one piece, which simplifies the disassembly and assembly steps, makes it more efficient, and facilitates overall replacement.

[0040] The aforementioned contact cleaning module 5 and non-contact cleaning module 6 are bolted together and arranged side-by-side below the wafer mounting plate 2. The contact cleaning module 5 includes: a first cylinder 51, a mounting base 52, and a rubber roller 53. The first cylinder 51 is positioned directly below the wafer mounting plate 2, along the fixed path traversed by the robotic arm 1. The bottom of the first cylinder 51 is bolted or welded to the metal platforms on either side of the work platform or conveyor. The rubber roller 53 is secured to the top of the mounting base 52. The non-contact cleaning module 6 includes... Includes: a second cylinder 61, a pneumatic cleaning box 62, and an air knife 64. The second cylinder 61 is bolted or welded to one side of the first cylinder 51. The pneumatic cleaning box 62 is bolted to the top of the first cylinder 51. The pneumatic cleaning box 62 is a hollow cavity 63 formed by four side walls. The inner side walls of the pneumatic cleaning box 62 are inclined so that the cross section of the cavity 63 is an inverted trapezoid, which facilitates the formation of vortex in the airflow inside the pneumatic cleaning box 62. An air knife 64 is inserted through the center of the bottom of the cavity 63. Air outlet holes 65 are opened around the air knife 64.

[0041] The above embodiments are merely illustrative of the principles and effects of this utility model and are not intended to limit the scope of this utility model. Any person skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of this utility model. Therefore, all equivalent modifications or alterations made by those skilled in the art without departing from the spirit and technical concept disclosed in this utility model should still be covered by the claims of this utility model.

Claims

1. A novel self-cleaning system for wafer holders, characterized in that, include: A wafer holding disk (2), the top of which is connected to a robotic arm (1); The sleeve (3) is attached to the bottom of the wafer fixing disk (2), and the sleeve (3) is a metal wire mesh disk; The contact cleaning module (5) and the non-contact cleaning module (6) are connected by bolts and arranged side by side below the wafer fixing disk (2).

2. The novel wafer holder self-cleaning system according to claim 1, characterized in that, The bottom of the wafer fixing disk (2) has several air holes at equal intervals.

3. The novel wafer holder self-cleaning system according to claim 2, characterized in that, The bottom of the card sleeve (3) is fitted with a high-temperature non-stick cloth (4).

4. The novel wafer holder self-cleaning system according to claim 3, characterized in that, The contact cleaning module (5) includes: Cylinder No. 1 (51) is located directly below the wafer holder (2); Mounting base (52), which is bolted to the top of cylinder No. 1 (51); A rubber roller (53) is mounted on top of a mounting base (52).

5. The novel wafer holder self-cleaning system according to claim 4, characterized in that, The non-contact cleaning module (6) includes: Cylinder No. 2 (61) is mounted on one side of Cylinder No. 1 (51) by bolt or welding; A pneumatic cleaning box (62) is bolted to the top of the second cylinder (61). The pneumatic cleaning box (62) is a hollow cavity (63) formed by four side walls. An air knife (64) is inserted at the bottom center of the cavity (63). The air knife (64) is conical and has air outlet holes (65) around its perimeter.

6. The novel wafer holder self-cleaning system according to claim 5, characterized in that, The inner walls of the pneumatic cleaning box (62) are inclined so that the cross-section of the cavity (63) is an inverted trapezoid.

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