Grinding device

By designing a grinding device to grind the oxide layer inside the high-temperature resistant container, the problem of the oxide layer preventing evaporation was solved, enabling the container to be recycled and improving process efficiency.

CN224373659UActive Publication Date: 2026-06-19ANHUI JIMAT NEW MATERIAL TECH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
ANHUI JIMAT NEW MATERIAL TECH CO LTD
Filing Date
2025-05-26
Publication Date
2026-06-19

AI Technical Summary

Technical Problem

In existing vacuum coating technologies, the inner surface of high-temperature containers is oxidized to form an oxide layer, which prevents the smooth evaporation of the evaporated material, leading to the container becoming unusable.

Method used

Design a grinding device including a support component, a grinding component and a locking component, which grinds the oxide layer inside a high-temperature resistant container by means of a grinding shaft and a grinding tool, and uses a buffer component and a dust collection component to improve grinding efficiency and effect.

Benefits of technology

It effectively removes oxide layers, restores the evaporation function of high-temperature resistant containers, avoids container scrapping, saves energy, and improves the efficiency of the vacuum coating process.

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Abstract

This utility model discloses a grinding device. The grinding device includes a support component, a grinding component, and a locking component. The support component includes a support part and a lifting part, with the support part disposed on the lifting part and raised and lowered under the drive of the lifting part. The grinding component is disposed on the support part and includes a grinding shaft, a grinding tool, and a buffer assembly. The grinding shaft extends along the lifting direction of the lifting part and is rotatably mounted on the support part along its own axis, and can be raised and lowered relative to the support part. The buffer assembly is disposed between the grinding shaft and the support part to buffer the raising and lowering of the grinding shaft relative to the support part. The locking component is disposed on the outside of the support component and located at the bottom of the grinding component, and is used to lock the element to be ground. This grinding device can grind the oxide layer inside the cavity of a high-temperature resistant container, preventing the material inside the cavity of the high-temperature resistant container from being oxidized and causing the high-temperature resistant container to malfunction.
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