Splitter pressure control structure, splitter and factory

Abstract

This utility model relates to the field of chip processing technology, and discloses a chip dicing pressure control structure, a chip dicing machine, and a factory. The chip dicing pressure control structure includes: a displacement plate that fixes the chip dicing blade and slides on a guide rail; a pressure sensor whose sensing end contacts the displacement plate and moves in real time via the displacement plate to obtain the real-time processing pressure of the chip dicing blade; a power structure that drives the displacement plate to slide along the guide rail; a controller that is signal-connected to the power structure and the pressure sensor; the controller receives the real-time processing pressure of the chip dicing blade transmitted by the pressure sensor in real time, compares the real-time processing pressure with the set processing pressure, and moves the displacement plate via the power structure to make the real-time processing pressure equal to the set processing pressure. This application forms a closed-loop control through real-time and precise control of the chip dicing pressure, without the need for manual intervention. The processing pressure is monitored by the pressure sensor in conjunction with the controller, ensuring the stability of the chip dicing process.

Description

Technical Field

[0001] This utility model relates to the field of chip processing technology, specifically to a cleaver pressure control structure, a chip cleaver, and a factory. Background Technology

[0002] During the cleaving process of optical communication semiconductor chips using a cleaving tool, due to the inherent characteristics of the optical communication semiconductor chip material, it is difficult to control the processing pressure of the cleaving tool on the optical communication semiconductor chip, resulting in poor cleaving effect. Utility Model Content

[0003] In view of this, the present invention provides a cleaving blade pressure control structure to solve the problem that in the existing process of cleaving optical communication semiconductor chips using a cleaving blade, it is difficult to control the processing pressure of the cleaving blade on the optical communication semiconductor chip due to the characteristics of the optical communication semiconductor chip material itself, resulting in poor cleaving effect.

[0004] In a first aspect, this utility model provides a blade pressure control structure, comprising:

[0005] The guide rail is fixedly mounted on the base plate;

[0006] A displacement plate is fixedly mounted with a cracking blade, and the displacement plate is slidably connected to the guide rail along the direction in which the cracking blade applies pressure to the chip.

[0007] A pressure sensor is fixed to the base plate by a fixing plate; the sensing end of the pressure sensor is in contact with the displacement plate; the pressure sensor is adapted to obtain the real-time processing pressure of the cutting tool on the chip by the movement of the displacement plate in real time.

[0008] A power structure is connected to the displacement plate, and the power structure is adapted to drive the displacement plate to slide along the guide rail;

[0009] The controller is signal-connected to both the power structure and the pressure sensor. The controller is adapted to receive the real-time processing pressure of the cleaving blade on the chip from the pressure sensor, and compares this real-time processing pressure with the set processing pressure of the cleaving blade on the chip. The power structure then moves the displacement plate to ensure that the real-time processing pressure equals the set processing pressure. Beneficial effects: This application adopts the above technical solution, ensuring closed-loop control of the cleaving blade throughout the entire cleaving process by accurately controlling the processing pressure in real time. No manual intervention is required during the cleaving process; the entire cleaving pressure value is monitored by the pressure sensor and controller, ensuring the stability of the cleaving process and thus ensuring the cleaving effect on the chip.

[0010] Optionally, the guide rail is a micro-motion guide rail. Beneficial effects: This application adopts the above technical solution, utilizing the precision motion structure of the micro-motion guide rail to achieve precise movement, thereby cooperating with a pressure sensor to achieve precise control of the cutting pressure.

[0011] Optionally, the accuracy of the real-time processing pressure acquired by the pressure sensor is not less than 0.01N.

[0012] Optionally, it also includes:

[0013] The control instrument is signal-connected to both the pressure sensor and the controller; the control instrument is adapted to display the real-time processing pressure value acquired by the pressure sensor, and to input the set processing pressure of the cutting tool on the chip into the controller. Beneficial effect: This application adopts the above technical solution to achieve the display of real-time processing pressure values, facilitating monitoring.

[0014] Optionally, it also includes:

[0015] An angle adjustment plate is disposed between the cracking blade and the displacement plate; the cracking blade is fixedly mounted on the angle adjustment plate, and the angle adjustment plate is rotatably mounted on the displacement plate; the angle adjustment plate is adapted to adjust the installation angle of the cracking blade.

[0016] Optionally, the chip is an optical communication semiconductor chip.

[0017] Secondly, this utility model also provides a flaking machine, including: the aforementioned flaking blade pressure control structure.

[0018] Thirdly, this utility model also provides a factory, comprising:

[0019] Multiple of the aforementioned flaking machines;

[0020] A production execution system (PES) is provided, with signal connections to the controllers of multiple dicing machines. The PES is adapted to control the real-time processing pressure of the dicing blades on the chips on each of the multiple dicing machines. Beneficial effects: This application employs the above technical solution to achieve real-time detection, feedback, and control of the dicing blade processing pressure in a digital unmanned factory, realizing unmanned operation and digital management. Attached Figure Description

[0021] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1This is a front view schematic diagram of the crack blade pressure control structure provided in the embodiment of this utility model.

[0023] Figure 2 This is a three-dimensional structural diagram of the blade pressure control structure provided in the embodiment of this utility model.

[0024] Figure 3 This is a schematic diagram of the process for controlling the cutting blade pressure in an embodiment of this utility model.

[0025] Explanation of reference numerals in the attached figures:

[0026] 1. Base plate; 2. Fixing plate; 3. Pressure sensor; 4. Displacement plate; 5. Angle adjustment plate; 6. Crack cutter; 7. Guide rail. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this utility model clearer, the technical solutions of the embodiments of this utility model will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this utility model, not all embodiments. Based on the embodiments of this utility model, all other embodiments obtained by those skilled in the art without creative effort are within the protection scope of this utility model.

[0028] like Figures 1 to 2 One specific embodiment of the cracking blade pressure control structure shown includes: a guide rail 7, a displacement plate 4, a pressure sensor 3, a power structure, and a controller. The cracking blade pressure control structure described in this application can be applied to equipment requiring stable working pressure while simultaneously enabling real-time control of the operating status. Furthermore, it can be applied to unmanned factories for digital management.

[0029] like Figure 2As shown, the guide rail 7 is fixedly mounted on the base plate 1. The displacement plate 4 is fixedly mounted with the cracking blade 6, and the displacement plate 4 is slidably connected to the guide rail 7 along the direction in which the cracking blade 6 applies pressure to the chip; that is, the guide rail 7 is arranged along the direction in which the cracking blade 6 applies pressure to the chip. The pressure sensor 3 is fixed to the base plate 1 by a fixing plate 2; the sensing end of the pressure sensor 3 is in contact with the displacement plate 4; the pressure sensor 3 is adapted to obtain the real-time processing pressure of the cracking blade 6 on the chip through the movement of the displacement plate 4. The power structure is connected to the displacement plate 4, and the power structure is adapted to drive the displacement plate 4 to slide along the guide rail 7; the power structure can be a linear motor, a cylinder, or a hydraulic cylinder, etc. The controller is signal-connected to the power structure and the pressure sensor 3; the controller is adapted to receive the real-time processing pressure of the cracking blade 6 on the chip transmitted by the pressure sensor 3 in real time, and compare the real-time processing pressure with the set processing pressure of the cracking blade 6 on the chip, so as to drive the displacement plate 4 to move through the power structure, so that the real-time processing pressure is equal to the set processing pressure.

[0030] Specifically, the guide rail 7 is a micro-motion guide rail. The chip is an optical communication semiconductor chip. The accuracy of the real-time processing pressure acquired by the pressure sensor 3 is not less than 0.01N; of course, the accuracy of the real-time processing pressure acquired by the pressure sensor 3 can be 0.01N.

[0031] Furthermore, the cracking blade pressure control structure described in this application also includes: a control instrument, which is signal-connected to both the pressure sensor 3 and the controller; the control instrument is adapted to display the real-time processing pressure value obtained by the pressure sensor 3 in real time, and to input the set processing pressure of the cracking blade 6 on the chip to the controller.

[0032] Furthermore, such as Figure 1 As shown, the cracking blade pressure control structure of this application further includes: an angle adjustment plate 5, which is disposed between the cracking blade 6 and the displacement plate 4; the cracking blade 6 is fixedly installed on the angle adjustment plate 5, and the angle adjustment plate 5 is rotatably installed on the displacement plate 4; the angle adjustment plate 5 is adapted to adjust the installation angle of the cracking blade 6.

[0033] Compared with traditional structural pressure control methods, the pressure control structure of the splitting tool described in this application is more precise, has a lower failure rate, and can achieve full closed-loop control of the entire splitting process.

[0034] This application also provides a flaking machine, including: the aforementioned flaking blade pressure control structure.

[0035] This application also provides a factory comprising: a plurality of said dicing machines and a production execution system; the production execution system is signal-connected to the controllers of the plurality of said dicing machines; the production execution system is adapted to control the real-time processing pressure of the dicing blades 6 on the plurality of dicing machines for each pair of chips.

[0036] like Figure 3 The diagram illustrates a cutting tool pressure control process applied in the aforementioned factory, comprising the following steps:

[0037] The cleaving blade 6 performs cleaving processing on the chip.

[0038] The power structure controls the cutting blade 6 to apply processing pressure to the chip; specifically, the power control structure drives the displacement plate 4 to move, which in turn drives the cutting blade 6 to move, thereby achieving the effect of adjusting and controlling the processing pressure of the cutting blade 6.

[0039] The controller receives the real-time processing pressure of the cutting blade 6 on the chip from the pressure sensor 3, and compares the real-time processing pressure with the set processing pressure of the cutting blade 6 on the chip, so as to control the movement of the displacement plate 4 through the power structure, so that the real-time processing pressure is equal to the set processing pressure.

[0040] The production execution system controls the real-time processing pressure of the six cracking blades on the chip dicing machine.

[0041] Furthermore, when the slicing blade pressure control structure includes a control instrument, the control instrument is signal-connected to the pressure sensor 3, the controller, and the production execution system; the control instrument is adapted to display the real-time processing pressure value obtained by the pressure sensor 3, and to input the set processing pressure of the slicing blade 6 on the chip to the controller; the production execution system is adapted to display the display content of the control instruments on each slicing machine in real time, and to input the set processing pressure of the slicing blade 6 on the chip to the control instruments on each slicing machine respectively.

[0042] This application's technical solution utilizes a precision mechanical structure—a micro-motion guide rail—along with pressure sensor 3 feedback, to achieve closed-loop control. This results in more stable processing pressure throughout the dicing process, improving chip cleaving yield. By connecting to control instruments, real-time acquisition and monitoring of the dicing processing pressure can be achieved. Furthermore, this application's technical solution connects the controllers of each dicing machine to the production execution system, realizing automated control of the entire factory.

[0043] Although embodiments of the present invention have been described in conjunction with the accompanying drawings, those skilled in the art can make various modifications and variations without departing from the spirit and scope of the present invention, and such modifications and variations all fall within the scope defined by the appended claims.

Claims

1. A split blade pressure control structure, characterized by, include: The guide rail (7) is fixedly mounted on the base plate (1); A displacement plate (4) is fixedly mounted with a cracking blade (6), and the displacement plate (4) is slidably connected to the guide rail (7) along the direction in which the cracking blade (6) applies pressure to the chip; The pressure sensor (3) is fixed on the base plate (1) by the fixing plate (2); the sensing end of the pressure sensor (3) is in contact with the displacement plate (4); the pressure sensor (3) is adapted to obtain the real-time processing pressure of the cutting tool (6) on the chip by the movement of the displacement plate (4); A power structure is connected to the displacement plate (4), and the power structure is adapted to drive the displacement plate (4) to slide along the guide rail (7); The controller is connected to the power structure and the pressure sensor (3) in real time. The controller is adapted to receive the real-time processing pressure of the cracking blade (6) on the chip transmitted by the pressure sensor (3) in real time, and compare the real-time processing pressure with the set processing pressure of the cracking blade (6) on the chip, so as to drive the displacement plate (4) to move through the power structure, so that the real-time processing pressure is equal to the set processing pressure.

2. The cracking blade pressure control structure according to claim 1, characterized in that, The guide rail (7) is a micro-motion guide rail.

3. The cracking blade pressure control structure according to claim 1, characterized in that, The accuracy of the real-time processing pressure obtained by the pressure sensor (3) is not less than 0.01N.

4. The cracking blade pressure control structure according to claim 1, characterized in that, Also includes: The control instrument is connected to both the pressure sensor (3) and the controller. The control instrument is adapted to display the real-time processing pressure value obtained by the pressure sensor (3) and to input the set processing pressure of the chip cutter (6) to the controller.

5. The blade pressure control structure according to any one of claims 1-4, characterized in that, Also includes: An angle adjustment plate (5) is disposed between the cracking blade (6) and the displacement plate (4); the cracking blade (6) is fixedly installed on the angle adjustment plate (5), and the angle adjustment plate (5) is rotatably installed on the displacement plate (4); the angle adjustment plate (5) is adapted to adjust the installation angle of the cracking blade (6).

6. The blade pressure control structure according to any one of claims 1-4, characterized in that, The chip is an optical communication semiconductor chip.

7. A flaking machine, characterized in that, include: The blade pressure control structure according to any one of claims 1-6.

8. A factory, characterized in that, include: The dicing machine as described in claims 7; The production execution system is signal-connected to the controllers of multiple said dicing machines; The production execution system is adapted to control the real-time processing pressure of the chip by the cleaving blades (6) on multiple cleaving machines.

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