A silicon wafer slicing machine diamond wire guide wheel structure

Abstract

The utility model provides a kind of silicon wafer slicing machine diamond wire guide wheel structure, including wheel body, rim, the rim is annular structure, is set and is installed in the outer edge portion of wheel body;The outside of rim is equipped with multiple annular wire slots with V-shaped cross section;The outer side of wheel body is provided with annular fixed sheet, and the rim is set on the fixed sheet, and fixed screw is screwed in the screw hole of the inside of rim by passing through the through hole on fixed sheet, to fix and install the rim on wheel body. The outside of fixed sheet is tapered surface for the rim to be set on wheel body. The outside of wheel body is provided with limit block that is clamped in the limit slot opened in the inside of rim. The utility model is set by detachable rim structure, when the wire slot opened in the outside of rim needs to be replaced when greater abrasion occurs, just need to be disassembled from wheel body, replace new rim, so that the whole guide wheel does not need to be replaced, it is convenient to operate, saves resources, reduces the cost of silicon wafer production.

Description

Technical Field

[0001] This utility model relates to the field of silicon wafer production technology, specifically to a diamond wire guide wheel structure for a silicon wafer slicing machine. Background Technology

[0002] A silicon wafer slicing machine is a machine that cuts silicon rods into silicon wafers. The slicing machine mainly uses high-speed moving diamond wire to cut the silicon rods into wafers. The diamond wire needs to be wound around guide wheels for guidance. Currently, the guide wheel structure is a fixed, integrated unit. Replacing the guide wheel requires disassembling the entire wheel, which is complex. Furthermore, after a period of use, the grooves used to hold the diamond wire will wear down, necessitating the replacement of the entire guide wheel, wasting resources and increasing silicon wafer production costs. Therefore, the silicon wafer slicing machine diamond wire guide wheel structure provided by this utility model allows for the replacement of only a portion of the structure, eliminating the need to replace the entire guide wheel, thus saving resources and reducing costs. Utility Model Content

[0003] In order to overcome the problems existing in the background art, this utility model provides a diamond wire guide wheel structure for a silicon wafer slicing machine, so as to solve the technical problem mentioned in the background art that after a period of use, the wire groove 3 used to fix the diamond wire will wear out, thus requiring the replacement of the entire guide wheel, wasting resources and increasing the cost of silicon wafer production.

[0004] To achieve the above objectives, this utility model is implemented through the following technical solution:

[0005] A diamond wire guide wheel structure for a silicon wafer slicing machine includes a wheel body 1 and a wheel rim 2. The wheel rim 2 is an annular structure, sleeved and installed on the outer edge of the wheel body 1. The outer side of the wheel rim 2 has multiple annular wire grooves 3 with a V-shaped cross-section. Annular fixing plates 4 are provided on both sides of the outer edge of the wheel body 1. The wheel rim 2 is sleeved on the fixing plates 4, and a fixing screw 5 passes through the through hole on the fixing plate 4 and is threaded into the threaded hole on the inner side of the wheel rim 2, thereby fixing the wheel rim 2 on the wheel body 1.

[0006] Preferably, the outer surface of the fixing piece 4 is a tapered surface that facilitates the wheel rim 2 being fitted onto the wheel body 1.

[0007] Preferably, the outer side of the wheel body 1 is provided with a limiting block 101 that slides into the limiting groove 201 opened on the inner side of the wheel rim 2.

[0008] Preferably, a polyurethane gasket 6 is embedded in the bottom of the groove 3.

[0009] Preferably, the wheel rim 2 is provided with an annular oil trough 7 containing cooling oil located below the groove 3.

[0010] Preferably, the side wall of the wheel rim 2 is provided with a threaded through hole for filling the oil groove 7 with cooling oil, and a locking screw 701 is installed in the threaded through hole to seal the oil groove 7.

[0011] Preferably, an annular venting groove 8 is provided inside the annular protrusion between two adjacent wire grooves 3, and air blowing holes 801 that are inclined downward and communicate with the venting groove 8 are evenly opened on the side wall of the wire groove 3, and an air inlet 802 is opened on the top of the annular protrusion.

[0012] Preferably, the V-shaped opening angle of the groove 3 is 31-33 degrees, and the bottom of the groove 3 is an arc structure with an R angle of 32 degrees.

[0013] The beneficial effects of this utility model are: by setting a detachable wheel rim 2 structure, when the groove 3 opened on the outer side of the wheel rim 2 is worn and needs to be replaced, it is only necessary to remove the wheel rim 2 from the wheel body 1 and replace it with a new wheel rim 2, so that the entire guide wheel does not need to be replaced. This is convenient to operate, saves resources, and reduces the cost of silicon wafer production. Attached Figure Description

[0014] Figure 1 This is a three-dimensional structural diagram of the present invention.

[0015] Figure 2 This is a schematic diagram of the separation structure between the wheel body and the wheel rim.

[0016] Figure 3 This is a three-dimensional cross-sectional view of the present invention. Figure 1 .

[0017] Figure 4 This is a three-dimensional cross-sectional view of the present invention. Figure 2 . Detailed Implementation

[0018] To make the objectives, technical solutions, and beneficial effects of this utility model clearer, the preferred embodiments of this utility model will be described in detail below with reference to the accompanying drawings, so as to facilitate the understanding of those skilled in the art.

[0019] like Figure 1-4As shown, this utility model provides a diamond wire guide wheel structure for a silicon wafer slicing machine, including a wheel body 1 and a wheel rim 2. The wheel rim 2 is an annular structure, which is sleeved and installed on the outer edge of the wheel body 1. The outer side of the wheel rim 2 is provided with multiple annular wire grooves 3 with a V-shaped cross-section. Annular fixing plates 4 are provided on both sides of the outer edge of the wheel body 1. The wheel rim 2 is sleeved on the fixing plates 4, and the fixing screws 5 are threaded through the through holes on the fixing plates 4 and threaded into the threaded holes on the inner side of the wheel rim 2, thereby fixing the wheel rim 2 on the wheel body 1. The guide wheel is installed on the slicing machine. The diamond wire passes around the groove 3 opened on the wheel rim 2. Under the guidance of the guide wheel, the diamond wire moves at high speed to cut the silicon rod. When the groove 3 is severely worn and needs to be replaced, the fixing screw 5 connecting the wheel body 1 and the wheel rim 2 is removed, the wheel rim 2 is removed from the wheel body 1, and the new wheel rim 2 is fitted onto the outer edge of the wheel body 1 and the outer side of the fixing plate 4. The fixing screw 5 is threaded through the through hole on the fixing plate 4 and connected to the threaded hole on the inner side of the wheel rim 2, thus installing the new wheel rim 2 on the wheel body 1. Therefore, it is not necessary to replace the entire guide wheel, which is convenient to operate, saves resources, and reduces the cost of silicon wafer production.

[0020] The outer surface of the fixing piece 4 is a tapered surface that facilitates the fitting of the rim 2 onto the wheel body 1. The tapered surface makes it easier for the rim 2 to fit onto the wheel body 1.

[0021] The outer side of the wheel body 1 is provided with a limiting block 101 that slides into the limiting groove 201 opened on the inner side of the wheel rim 2. When the wheel rim 2 is sleeved on the wheel body 1, the limiting groove 201 is locked onto the limiting block 101, so that the through hole on the fixing piece 4 corresponds to the threaded hole on the wheel rim 2, and it is easy to fix it by fixing screw 5.

[0022] The bottom of the wire groove 3 is fitted with a polyurethane washer 6. The polyurethane material is elastic, and the diamond wire is supported on the polyurethane washer 6, which can buffer the vibration of the diamond wire and reduce the wear of the diamond wire on the wire groove 3.

[0023] The rim 2 has an annular oil groove 7 containing cooling oil located below the groove 3. During prolonged operation, the guide wheel generates heat; the cooling oil in the oil groove 7 reduces the temperature at the groove 3, extending the guide wheel's operating time.

[0024] The side wall of the wheel rim 2 has a threaded through hole for filling the oil groove 7 with cooling oil. A locking screw 701 is installed in the threaded through hole to seal the oil groove 7. Cooling oil in the oil groove 7 can be added or replaced through the threaded through hole, and the threaded through hole can be blocked by the locking screw 701 to prevent leakage of cooling oil.

[0025] An annular venting groove 8 is provided inside the annular protrusion between two adjacent wire grooves 3. The sidewalls of the wire grooves 3 are evenly provided with downward-sloping air holes 801 that communicate with the venting grooves 8. An air inlet 802 is provided at the top of the annular protrusion. Because the diamond wire cuts the silicon rod, silicon powder remains on the wire. A large accumulation of silicon powder in the wire grooves 3 increases wear. Therefore, when the machine is stopped, air can be blown into the air inlet 802 using a syringe or other air-blowing device, allowing air to pass through the venting grooves 8 and exit through the air holes 801. The air holes 801 are angled towards the bottom of the wire grooves 3, blowing away the silicon powder accumulated in the wire grooves 3, thereby reducing wear and extending the service life of the guide rollers.

[0026] The V-shaped opening angle of the groove 3 is 31-33 degrees, and the bottom of the groove 3 is an arc structure with a radius of 32 degrees. This can reduce the occurrence of wire skipping.

[0027] Work process:

[0028] The guide wheel is installed on the slicing machine. The diamond wire passes around the groove 3 opened on the wheel rim 2. Under the guidance of the guide wheel, the diamond wire moves at high speed to cut the silicon rod. When the groove 3 is severely worn and needs to be replaced, the fixing screw 5 connecting the wheel body 1 and the wheel rim 2 is removed, the wheel rim 2 is removed from the wheel body 1, and the new wheel rim 2 is fitted onto the outer edge of the wheel body 1 and the outer side of the fixing plate 4. It is positioned by the limiting block 101 and the limiting groove 201. The fixing screw 5 is threaded through the through hole on the fixing plate 4 and connected to the threaded hole on the inner side of the wheel rim 2, thus installing the new wheel rim 2 on the wheel body 1. Therefore, it is not necessary to replace the entire guide wheel, which is convenient to operate, saves resources, and reduces the cost of silicon wafer production.

[0029] Finally, it should be noted that the above preferred embodiments are only used to illustrate the technical solution of this utility model and are not intended to limit it. Although the utility model has been described in detail through the above preferred embodiments, those skilled in the art should understand that various changes can be made to it in form and detail without departing from the scope defined by the claims of this utility model.

Claims

1. A diamond wire guide wheel structure for a silicon wafer slicing machine, characterized in that: The wheel includes a wheel body (1) and a wheel rim (2). The wheel rim (2) is an annular structure and is fitted and installed on the outer edge of the wheel body (1). The outer side of the wheel rim (2) is provided with multiple annular grooves (3) with a V-shaped cross-section. The outer sides of the wheel body (1) are provided with annular fixing plates (4). The wheel rim (2) is fitted on the fixing plates (4). The fixing screws (5) are threaded through the through holes on the fixing plates (4) and connected to the threaded holes on the inner side of the wheel rim (2), thereby fixing the wheel rim (2) on the wheel body (1).

2. The diamond wire guide wheel structure of a silicon wafer slicing machine according to claim 1, characterized in that: The outer surface of the fixing piece (4) is a conical surface that facilitates the wheel rim (2) to be fitted onto the wheel body (1).

3. The diamond wire guide wheel structure of a silicon wafer slicing machine according to claim 1 or 2, characterized in that: The outer side of the wheel body (1) is provided with a limiting block (101) that slides into the limiting groove (201) opened on the inner side of the wheel rim (2).

4. The diamond wire guide wheel structure of a silicon wafer slicing machine according to claim 3, characterized in that: The bottom of the groove (3) is fitted with a polyurethane gasket (6).

5. The diamond wire guide wheel structure of a silicon wafer slicing machine according to any one of claims 1, 2, 4, characterized in that: The rim (2) is provided with an annular oil trough (7) containing cooling oil located below the groove (3).

6. The diamond wire guide wheel structure of a silicon wafer slicing machine according to claim 5, characterized in that: The side wall of the wheel rim (2) is provided with a threaded through hole for filling the oil groove (7) with cooling oil, and a locking screw (701) for sealing the oil groove (7) is installed in the threaded through hole.

7. The diamond wire guide wheel structure of a silicon wafer slicing machine according to claim 6, characterized in that: An annular ventilation groove (8) is provided inside the annular protrusion between two adjacent wire grooves (3). The side wall of the wire groove (3) is evenly provided with downward inclined air blowing holes (801) that are connected to the ventilation groove (8). An air inlet hole (802) is provided at the top of the annular protrusion.

8. The diamond wire guide wheel structure of a silicon wafer slicing machine according to claim 1, characterized in that: The V-shaped opening angle of the groove (3) is 31-33 degrees, and the bottom of the groove (3) is a circular arc structure with an R angle of 32 degrees.

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