Clamping device for detecting circuit board for BMS (Battery Management System)

By introducing a buffer pad, a thin-film pressure sensor, and a bidirectional lead screw structure driven by a drive motor into the clamping device, the shortcomings of existing clamping devices in dynamic protection are solved, achieving stable clamping of circuit boards and multi-angle detection, thus improving the stability and applicability of the detection.

CN224382976UActive Publication Date: 2026-06-19SUZHOU XINBOHONG ELECTRONIC TECHNOLOGY CO LTD
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Patent Information

Application Number
CN202521588948.3
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2025-07-29
Publication Date
2026-06-19
Estimated Expiration
2035-07-29

AI Technical Summary

Technical Problem

Existing BMS circuit board inspection clamping devices are not convenient for providing effective dynamic protection for circuit boards during use, cannot adapt to changes in the external environment and the inspection process, and are at risk of clamping failure and overvoltage damage, making it difficult to meet the inspection needs of high-precision fields such as new energy vehicles and aerospace.

Method used

The design employs a combination of buffer pads, thin-film pressure sensors, and silicone pads, along with a bidirectional lead screw structure driven by a miniature electric cylinder and a drive motor, to achieve stable clamping and dynamic pressure adjustment of circuit boards, adapting to the testing needs of circuit boards of different sizes and angles.

Benefits of technology

It improves the stability and accuracy of circuit board testing, avoids clamping damage, expands the scope of application, meets diverse testing needs, and enhances the convenience and comprehensiveness of testing.

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Abstract

The utility model relates to the circuit board detection equipment technical field, and discloses a BMS circuit board detection clamping device comprising a mounting rack, one side of the mounting rack is symmetrically provided with a first clamping seat and a second clamping seat, the inner side of the first clamping seat and the inner side of the second clamping seat are respectively provided with a buffer pad, and the buffer pads are arranged in the first clamping seat and the second clamping seat. Micro electric cylinders are vertically installed on the upper surfaces of the first clamping base and the second clamping base correspondingly, the transmission ends of the bottom ends of the micro electric cylinders are rigidly connected with pressing plates, and film pressure sensors are pasted and fixed to the middle positions of the bottom faces of the pressing plates. According to the clamping device for circuit board detection for the BMS, buffer pads are arranged on the inner sides of the first clamping seat and the second clamping seat, and a thin film pressure sensor and a silica gel pad are arranged on the bottom surface of a pressing plate, so that the circuit board can be stably clamped, meanwhile, damage to the circuit board caused by too large clamping force is avoided, and the thin film pressure sensor monitors the clamping pressure in real time; and the clamping force is uniform and appropriate, so that the stability and the detection precision in the circuit board detection process are improved.
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