Display device and electronic device including the same

Abstract

A display device and an electronic device are provided. The display device includes a substrate, a driver chip, a plurality of pad electrodes, and a circuit board. The substrate includes a display area and a pad area arranged adjacent to one side of the display area. The driver chip is arranged in the pad area and in a first direction on one side of the display area. The plurality of pad electrodes are arranged in the pad area and along a second direction perpendicular to the first direction. The circuit board includes a plurality of guide electrodes connected to the plurality of pad electrodes, wherein a portion of the circuit board overlaps with at least a portion of the pad area of ​​the substrate.

Description

Technical Field

[0001] The embodiments relate to display devices. More specifically, the embodiments relate to display devices including circuit boards and electronic devices including display devices. Background Technology

[0002] With the development of information technology, display devices, which serve as the communication interface between users and information, are constantly evolving. A display device includes a display panel and a circuit board. The circuit board is connected to the display panel to provide it with the various signals and voltages required to drive the display panel. Utility Model Content

[0003] A display device according to an embodiment of the present disclosure includes a substrate comprising a display area and a pad area arranged adjacent to one side of the display area, a driver chip arranged in the pad area and located in a first direction on one side of the display area, a plurality of pad electrodes arranged in the pad area and arranged in a second direction perpendicular to the first direction, and a circuit board including a plurality of guide electrodes connected to the plurality of pad electrodes, wherein a portion of the circuit board overlaps with at least a portion of the pad area of ​​the substrate.

[0004] According to the implementation method, the driver chip is mounted on the substrate.

[0005] According to the implementation method, multiple pad electrodes are arranged spaced apart from the driver chip along the second direction.

[0006] According to one embodiment, at least a portion of the circuit board overlaps with the driver chip in a second direction.

[0007] According to an embodiment, the display device further includes an adhesive film disposed between a plurality of pad electrodes and a plurality of guide electrodes for connecting the plurality of pad electrodes to the plurality of guide electrodes.

[0008] According to the implementation method, the circuit board is flexible.

[0009] According to the implementation method, the circuit board is rigid.

[0010] According to an embodiment, the substrate is recessed to define trenches, and the trenches are arranged in a first direction of a plurality of pad electrodes.

[0011] A display device according to an embodiment of the present disclosure includes a substrate comprising a display area and a pad area arranged adjacent to one side of the display area, a first driver chip and a second driver chip arranged in the pad area and located in a first direction on one side of the display area, a plurality of first pad electrodes arranged in the pad area adjacent to the first driver chip and arranged in a second direction perpendicular to the first direction, a plurality of second pad electrodes arranged in the pad area adjacent to the second driver chip and arranged in the second direction, and a first circuit board, wherein a portion of the first circuit board overlaps with at least a portion of the pad area of ​​the substrate and is connected to the first pad electrodes.

[0012] An electronic device according to embodiments of the present disclosure includes a processor, a memory having stored applications for execution by the processor, a display device, and a user interface configured to sense user input via touch or cursor selection of icons presented on a display panel, wherein, upon receiving user input, the processor executes one or more of the stored applications. The display device includes a substrate comprising a display area and a pad area arranged adjacent to one side of the display area, a driver chip arranged in the pad area and on one side of the display area in a first direction, a plurality of pad electrodes arranged in the pad area and along a second direction perpendicular to the first direction, and a circuit board, wherein a portion of the circuit board overlaps with at least a portion of the pad area of ​​the substrate and is connected to the pad electrodes.

[0013] However, the effects of this disclosure are not limited to those described above, and can be extended in various ways without departing from the spirit and scope of this disclosure. Attached Figure Description

[0014] Figure 1 This is a plan view showing a display device according to an embodiment of the present disclosure.

[0015] Figure 2 It is shown Figure 1 A plan view of the display panel and circuit board before their connection.

[0016] Figure 3 It is along Figure 1 The cross-sectional view taken from line I-I'.

[0017] Figure 4 It is shown Figure 3 A magnified view of region AA.

[0018] Figure 5 It is along Figure 1 The cross-sectional view taken from line II-II'.

[0019] Figure 6 This is a plan view showing a display device according to an embodiment of the present disclosure.

[0020] Figure 7 It is shown Figure 6 A plan view of the display panel, the first circuit board, and the second circuit board before their connection.

[0021] Figure 8 It is along Figure 6 The cross-sectional view taken from line III-III'.

[0022] Figure 9 It is shown Figure 8 A magnified view of region BB.

[0023] Figure 10 It is along Figure 6 A cross-sectional view taken from line IV-IV'.

[0024] Figure 11 This is a plan view showing a display device according to an embodiment of the present disclosure.

[0025] Figure 12 It is shown Figure 11 A plan view of the display panel, the first circuit board, and the second circuit board before their connection.

[0026] Figure 13 It is shown Figure 11 A plan view of the first circuit board bent.

[0027] Figure 14 It is along Figure 13 A cross-sectional view taken from line V-V'.

[0028] Figure 15 This is a plan view showing a display device according to an embodiment of the present disclosure.

[0029] Figure 16 It is shown Figure 15 A plan view of the bent circuit board.

[0030] Figure 17 This is a plan view showing a display device according to an embodiment of the present disclosure.

[0031] Figure 18 This is a plan view showing a display device according to an embodiment of the present disclosure.

[0032] Figure 19 This is a block diagram illustrating an electronic device according to an embodiment of the present disclosure.

[0033] Figure 20 This is a schematic diagram illustrating an electronic device according to various embodiments. Detailed Implementation

[0034] In the following, a display device and an electronic device including the display device according to embodiments of the present disclosure will be described in more detail with reference to the accompanying drawings. In the drawings, the same reference numerals will be used for the same parts, and redundant descriptions of the same parts will be omitted.

[0035] In a display device, a circuit board can be connected to a display panel to supply the signals and voltages required to drive the display panel. A bonding tool can be used during the process of connecting the circuit board to pad areas arranged on a substrate.

[0036] In order to use the bonding tool, sufficient space is needed to apply it to the substrate without interfering with the driver chip.

[0037] In embodiments of this disclosure, the pad electrodes connected to the circuit board may not be positioned directly below the driver chip in a plan view. Instead, the pad electrodes may be arranged on the left and / or right sides of each driver chip.

[0038] This arrangement creates space on the left and / or right side of the driver chip for applying bonding tools to the substrate, without requiring a separate space below the driver chip.

[0039] As a result, the width of the pad area can be reduced, which helps to minimize dead zones in the display device. Furthermore, the reduction in dead zones improves the visibility of the display device.

[0040] Figure 1 This is a plan view showing a display device according to an embodiment of the present disclosure. Figure 2 It is shown Figure 1 A plan view of the display panel and circuit board before their connection. Figure 3 It is along Figure 1 The cross-sectional view taken from line I-I'. Figure 4 It is shown Figure 3 A magnified view of region AA. Figure 5 It is along Figure 1 The cross-sectional view taken from line II-II'.

[0041] Reference Figures 1 to 5 The display device DD according to embodiments of the present disclosure may include a display panel DP, a driver chip DIC, and a circuit board CB.

[0042] The display panel (DP) may include a display area (DA) and a non-display area (NDA). The display area (DA) is the area capable of displaying an image by generating light or adjusting the transmittance of light supplied from an external light source. The non-display area (NDA) is the area where no image is displayed.

[0043] Multiple pixels PX can be arranged in a display area DA. The multiple pixels PX can be arranged in a matrix along a first direction DR1 and a second direction DR2 perpendicular to the first direction DR1. Each of the multiple pixels PX can emit light. When each of the multiple pixels PX emits light, the display area DA can display an image. For example, the first direction DR1 and the second direction DR2 can define a plane, and the image can be displayed along a third direction DR3, which can be referred to as the normal direction of the plane.

[0044] The non-display area NDA may be located around the display area DA. For example, the non-display area NDA may surround the display area DA. The driving unit may be located in the non-display area NDA. The driving unit may provide signals and / or voltages to multiple pixels PX. For example, the driving unit may include a scan driving unit, a light emission driving unit, a power supply voltage generation unit, a timing controller, etc.

[0045] like Figure 3 and Figure 4 As shown, the display panel DP may include a first substrate SUB1 and a second substrate SUB2 disposed on the first substrate SUB1. The display panel DP may also include a sealing member that bonds the first substrate SUB1 and the second substrate SUB2. For example, the sealing member may be disposed between the first substrate SUB1 and the second substrate SUB2.

[0046] The first substrate SUB1 may include pixels PX and light-emitting elements disposed in each pixel PX. The first substrate SUB1 may be a display substrate that provides light required to display an image. In embodiments of this disclosure, the first substrate SUB1 may be a rigid substrate including glass, quartz, etc. In embodiments of this disclosure, the first substrate SUB1 may be a flexible substrate including soft glass, polymer materials, etc.

[0047] The second substrate SUB2 may face the first substrate SUB1. For example, the second substrate SUB2 may be disposed on the upper surface of the first substrate SUB1. For example, the second substrate SUB2 may be a packaging substrate disposed on the first substrate SUB1 to encapsulate the light-emitting element. The second substrate SUB2 can prevent damage to the light-emitting element from air or moisture. The second substrate SUB2 may include a transparent plate or a transparent film. For example, the second substrate SUB2 may include glass, quartz, etc.

[0048] The first substrate SUB1 may include a display area DA and a non-display area NDA. For example, the first substrate SUB1 may include a display area DA and a non-display area NDA, and correspondingly, the display panel DP may include a display area DA and a non-display area NDA. The first substrate SUB1 may have a planar area larger than that of the second substrate SUB2. For example, the first substrate SUB1 may further protrude in the first direction DR1 from an edge of the second substrate SUB2 extending along the second direction DR2 in the first direction DR1. The remaining edges of the first substrate SUB1 may be aligned with the remaining edges of the second substrate SUB2.

[0049] The non-display area NDA may include a pad area PA. The pad area PA may be located on a first direction DR1 on one side of the display area DA. For example, the pad area PA may have a shape extending in a second direction DR2.

[0050] like Figure 1 and Figure 2 As shown, the display panel DP may further include scan lines SL and data lines DL. In embodiments of this disclosure, the scan lines SL may extend in the second direction DR2 and may be arranged along the first direction DR1. The data lines DL may extend in the first direction DR1 and may be arranged along the second direction DR2.

[0051] Each pixel PX can be connected to at least one scan line SL and at least one data line DL. The scan line SL can receive a scan signal from the scan drive unit and send the scan signal to the pixel PX. The scan signal selects the pixel PX to which data voltage is supplied, and the data voltage can be supplied to the selected pixel PX.

[0052] Each of the driver chips (DICs) may be disposed in a pad area PA on a display panel DP (e.g., a first substrate SUB1). For example, the driver chip DIC may be disposed on the first substrate SUB1. For example, the driver chip DIC may be located on a first direction DR1 of the display area DA. The driver chips DICs may be arranged to be spaced apart from each other along a second direction DR2. The driver chip DICs may be electrically connected to at least one of the data lines DL extending from the display area DA. Each of the driver chips DICs may provide a data voltage to a pixel PX. For example, each of the driver chips DICs may be a data driver unit.

[0053] The driver chip DIC can be integrated onto the display panel DP (e.g., the first substrate SUB1). For example, as... Figure 1 and Figure 2 As shown, the driver chip DIC can be directly mounted in the pad area PA of the display panel DP (e.g., the first substrate SUB1) using chip-on-glass (COG) or chip-on-plastic (COP) methods.

[0054] The display panel DP may include pad electrodes PE. The pad electrodes PE may be disposed in a pad region PA on a first substrate SUB1. For example, the pad electrodes PE may be located on a first direction DR1 of the display region DA. In embodiments of this disclosure, the pad electrodes PE may be disposed along a second direction DR2. The pad electrodes PE may be electrically connected to the driver chip DIC and the circuit board CB.

[0055] In a plan view, the pad electrodes PE and the driver chip DIC can be arranged side-by-side along the second direction DR2. In embodiments of this disclosure, the pad electrodes PE can be arranged between the driver chips DIC in a plane. For example, the pad electrodes PE can be arranged on the second direction DR2 of one of the driver chips DIC, and the pad electrodes PE can be arranged in the opposite direction to the second direction DR2 of the other driver chip DIC.

[0056] The pad electrode PE may not overlap with the driver chip DIC in the first direction DR1. For example, the pad electrode PE may not be arranged in the first direction DR1 of the driver chip DIC. For example, in a plan view, the pad electrode PE may not be arranged below the driver chip DIC, but may be arranged on the left and / or right side of each of the driver chips DIC. For example, the pad electrode PE may be arranged spaced apart from the driver chip DIC along the second direction DR2.

[0057] The pad electrode PE may include a conductive material. Examples of conductive materials that can be used as pad electrode PE include metals, alloys, metal nitrides, conductive metal oxides, transparent conductive materials, etc. Conductive materials can be used alone or in combination.

[0058] The display device DD may also include connection wiring arranged in the pad area PA. The connection wiring electrically connects the driver chip DIC to the pad electrode PE.

[0059] The circuit board CB can be arranged in the pad area PA on the first substrate SUB1. For example, the circuit board CB can overlap a portion of the pad area PA. One end of the circuit board CB can be electrically connected to the pad electrode PE. Accordingly, the circuit board CB can be electrically connected to the driver chip DIC through the pad electrode PE and connection wiring. The circuit board CB can be directly connected to the pad electrode PE. Accordingly, the dead zone of the display device DD can be reduced. In addition, the manufacturing process of the display device DD can be simplified. Furthermore, the manufacturing cost of the display device DD can be reduced.

[0060] At least a portion of the circuit board CB may overlap with the driver chip DIC along the second direction DR2. For example, the pad electrode PE may be arranged side by side with the driver chip DIC along the second direction DR2, and correspondingly, at least a portion of the circuit board CB connected to the pad electrode PE may overlap with the driver chip DIC along the second direction DR2. For example, the portion of the circuit board CB connected to the pad electrode PE may be arranged on the left and / or right side of each of the driver chips DIC.

[0061] The circuit board CB can be electrically connected to an external device. The circuit board CB can use image signals and multiple timing signals input from the external device to generate scan control signals, data control signals, and image data, and the generated scan control signals, data control signals, and image data can be provided to the driver chip DIC. In embodiments of this disclosure, the circuit board CB can be a printed circuit board (PCB).

[0062] like Figure 2 , Figure 4 and Figure 5 As shown, the circuit board CB may include a base substrate BS and a guide electrode LE.

[0063] In embodiments of this disclosure, the base substrate BS may be a rigid substrate. For example, the base substrate BS may not be substantially flexible. In this case, the circuit board CB may be rigid. In embodiments of this disclosure, the base substrate BS may be a flexible substrate. For example, the base substrate BS may be flexible, such that the circuit board CB may be flexible.

[0064] The guide electrodes LE can be disposed on the surface of the base substrate BS facing the display panel DP. The guide electrodes LE can be electrically connected to the pad electrodes PE. Each of the guide electrodes LE can overlap with the pad electrodes PE in a plan view. For example, the guide electrodes LE can be arranged to correspond to the pad electrodes PE in a plan view. In embodiments of this disclosure, the guide electrodes LE can be disposed along a second direction DR2.

[0065] In a plan view, the guide electrode LE and the driver chip DIC may be arranged side-by-side along the second direction DR2. In embodiments of this disclosure, the guide electrode LE may be arranged between the driver chips DIC in the plan view. For example, the guide electrode LE may be located on the second direction DR2 of one of the driver chips DIC, and the guide electrode LE may be located in the opposite direction to the second direction DR2 of the other driver chip DIC.

[0066] The guide electrode LE may not overlap with the driver chip DIC in the first direction DR1. For example, the guide electrode LE may not be arranged in the first direction DR1 of the driver chip DIC. For example, in a plan view, the guide electrode LE may not be arranged below the driver chip DIC, but may be arranged on the left and / or right side of each of the driver chips DIC. For example, the guide electrode LE may be arranged spaced apart from the driver chip DIC along the second direction DR2.

[0067] The guiding electrode LE may include a conductive material. Examples of conductive materials that can be used as the guiding electrode LE include metals, alloys, metal nitrides, conductive metal oxides, transparent conductive materials, etc. Conductive materials can be used alone or in combination with each other.

[0068] The circuit board CB can be connected to the pad electrode PE via an adhesive film ACF. For example, the guide electrode LE of the circuit board CB can be connected to the pad electrode PE via the adhesive film ACF. For example, the adhesive film ACF can be disposed between the pad electrode PE and the guide electrode LE.

[0069] The adhesive film ACF may include an adhesive member RS ​​and conductive balls CDB dispersed within the adhesive member RS. The circuit board CB can be connected to the pad area PA on the first substrate SUB1 via the adhesive member RS, and can be electrically connected to the pad electrode PE via the conductive balls CDB located between the pad electrode PE and the guide electrode LE.

[0070] The adhesive component RS may include an insulating adhesive material. For example, the adhesive component RS may include a thermosetting resin, a UV-curable resin, a thermoplastic resin, etc. Each of the conductive spheres CDB may include a conductive material. For example, each of the conductive spheres CDB may include polymer particles and a metal coating coated on the polymer particles. However, this disclosure is not necessarily limited thereto, and the conductive spheres CDB may include conductive nanowires or conductive adhesives.

[0071] In a plan view, the adhesive film ACF and the driver chip DIC can be arranged side-by-side along the second direction DR2. In embodiments of this disclosure, the adhesive film ACF can be arranged between the driver chips DIC in the plan view. For example, the adhesive film ACF can be located on the second direction DR2 of one of the driver chips DIC, and the adhesive film ACF can be located in the opposite direction to the second direction DR2 of another driver chip among the driver chips DIC.

[0072] The adhesive film ACF may not overlap with the driver chip DIC in the first direction DR1. For example, the adhesive film ACF may not be arranged in the first direction DR1 of the driver chip DIC. For example, in a plan view, the adhesive film ACF may not be arranged below the driver chip DIC, but may be arranged on the left and / or right side of each of the driver chips DIC. For example, the adhesive film ACF may be arranged spaced apart from the driver chip DIC along the second direction DR2.

[0073] In the process of attaching the circuit board CB to the pad area PA on the first substrate SUB1, a bonding tool can be used. The bonding tool can be a thermocompression bonding device that provides heat and pressure. The bonding tool can provide heat and pressure in the direction opposite to that of the third party DR3. For example, the bonding tool can provide heat and pressure toward the first substrate SUB1. When pressure is applied using the bonding tool, the pad electrode PE and the guide electrode LE can be bonded to each other through the adhesive film ACF, and the conductive ball CDB can electrically connect the pad electrode PE and the guide electrode LE.

[0074] For the use of a bonding tool, space is needed to allow the bonding tool to be applied to the first substrate SUB1 without interfering with the driver chip DIC. In the display device DD according to an embodiment of the present disclosure, in a plan view, the pad electrodes PE connected to the circuit board CB may not be arranged below the driver chip DIC, but may be placed on the left and / or right sides of each of the driver chips DIC. For example, space may be formed on the left and / or right sides of each of the driver chips DIC for applying the bonding tool to the first substrate SUB1 without interfering with the driver chip DIC, and a separate space may not be formed below the driver chip DIC for applying the bonding tool to the first substrate SUB1. Accordingly, the width of the pad region PA in the first direction DR1 can be reduced. For example, the dead zone of the display device DD can be reduced. Accordingly, the visibility of the display device DD can be improved.

[0075] Figure 6 This is a plan view showing a display device according to an embodiment of the present disclosure. Figure 7 It is shown Figure 6 A plan view of the display panel, the first circuit board, and the second circuit board before their assembly. Figure 8 It is along Figure 6 The cross-sectional view taken from line III-III'. Figure 9 It is shown Figure 8 A magnified view of region BB. Figure 10 It is along Figure 6 A cross-sectional view taken from line IV-IV'.

[0076] Reference Figures 6 to 10The display device DD1 according to the embodiments of the present disclosure may include a display panel DP1, a driver chip DIC, a first circuit board CB1, and a second circuit board CB2.

[0077] Apart from Figures 6 to 10 The display panel DP1 includes a first pad electrode PE1 instead of a pad electrode PE (see [link]). Figure 1 In addition to, Figures 6 to 10 The DP1 display panel can be used with Figures 1 to 5 The display panel DP is essentially the same. Without a detailed description of the components, it can be assumed that the components are the same. Figures 1 to 5 The corresponding elements already described are at least similar.

[0078] In addition, refer to Figures 1 to 5 The description of the driver chip DIC can also be applied to Figures 6 to 10 The driver chip DIC.

[0079] The display panel DP1 may include a first pad electrode PE1. The first pad electrode PE1 may be disposed in a pad region PA on a first substrate SUB1. For example, the first pad electrode PE1 may be located on a first direction DR1 of the display region DA. In embodiments of this disclosure, the first pad electrode PE1 may be disposed along a second direction DR2. The first pad electrode PE1 may be electrically connected to a driver chip DIC, a first circuit board CB1, and a second circuit board CB2.

[0080] In a plan view, the first pad electrode PE1 and the driver chip DIC can be arranged side by side along the second direction DR2. In embodiments of this disclosure, the first pad electrode PE1 can be arranged in a plane between the driver chips DIC. For example, the first pad electrode PE1 can be located on the second direction DR2 of one of the driver chips DIC, and the first pad electrode PE1 can be located in the opposite direction to the second direction DR2 of the other driver chip DIC.

[0081] The first pad electrode PE1 may not overlap with the driver chip DIC in the first direction DR1. For example, the first pad electrode PE1 may not be arranged in the first direction DR1 of the driver chip DIC. For example, in a plan view, the first pad electrode PE1 may not be arranged below the driver chip DIC, but may be arranged on the left and / or right side of each of the driver chips DIC.

[0082] The first pad electrode PE1 may include a conductive material. Examples of conductive materials that can be used as the first pad electrode PE1 include metals, alloys, metal nitrides, conductive metal oxides, transparent conductive materials, etc. Conductive materials can be used alone or in combination with each other.

[0083] The display device DD1 may also include connection wiring arranged in the pad area PA. The connection wiring can electrically connect the driver chip DIC to the first pad electrode PE1.

[0084] First circuit boards CB1 may be disposed in pad regions PA on a first substrate SUB1. For example, the first circuit boards CB1 may overlap a portion of the pad regions PA. One end of each of the first circuit boards CB1 may be electrically connected to a first pad electrode PE1. Accordingly, the first circuit boards CB1 may be electrically connected to the driver chip DIC via the first pad electrode PE1 and connection wiring. The first circuit boards CB1 may be directly coupled to the first pad electrode PE1.

[0085] At least a portion of the first circuit board CB1 may overlap with the driver chip DIC along the second direction DR2. For example, the first pad electrode PE1 may be arranged side by side with the driver chip DIC along the second direction DR2, and correspondingly, at least a portion of each of the first circuit boards CB1 connected to the first pad electrode PE1 may overlap with the driver chip DIC along the second direction DR2.

[0086] The other end of each of the first circuit boards CB1 can be electrically connected to a second circuit board CB2. The second circuit board CB2 can be electrically connected to an external device. The second circuit board CB2 can use image signals and multiple timing signals input from the external device to generate scan control signals, data control signals, and image data, and the generated scan control signals, data control signals, and image data can be provided to the driver chip DIC through the first circuit board CB1. In embodiments of this disclosure, the second circuit board CB2 can be a printed circuit board (PCB).

[0087] like Figure 7 , Figure 9 and Figure 10 As shown, each of the first circuit boards CB1 may include a first base substrate BS1 and a first guide electrode LE1.

[0088] In embodiments of this disclosure, the first base substrate BS1 may be a flexible substrate. For example, the first base substrate BS1 may be flexible. In this case, the first circuit board CB1 may be flexible. In embodiments of this disclosure, the first base substrate BS1 may be a rigid substrate. For example, the first base substrate BS1 may not be substantially flexible. In this case, the first circuit board CB1 may be rigid.

[0089] A first guiding electrode LE1 may be disposed on the side of the first base substrate BS1 facing the display panel DP1. The first guiding electrode LE1 may be electrically connected to a first pad electrode PE1. Each of the first guiding electrodes LE1 may overlap with the first pad electrode PE1 in a plan view. For example, the first guiding electrode LE1 may be arranged to correspond to the first pad electrode PE1 in a plan view. In embodiments of this disclosure, the first guiding electrodes LE1 may be disposed along a second direction DR2. For example, each of the first guiding electrodes LE1 may be disposed adjacent to each other along a horizontal line.

[0090] In a plan view, the first guide electrode LE1 and the driver chip DIC may be arranged side-by-side along the second direction DR2. In embodiments of this disclosure, the first guide electrode LE1 may be arranged between the driver chips DIC in the plan view. For example, the first guide electrode LE1 may be located on the second direction DR2 of one of the driver chips DIC, and the first guide electrode LE1 may be located in the opposite direction to the second direction DR2 of the other driver chip DIC.

[0091] The first guiding electrode LE1 may not overlap with the driver chip DIC in the first direction DR1. For example, the first guiding electrode LE1 may not be arranged in the first direction DR1 of the driver chip DIC. For example, in a plan view, the first guiding electrode LE1 may not be arranged below the driver chip DIC, but may be arranged on the left and / or right side of each of the driver chips DIC.

[0092] The first guiding electrode LE1 may include a conductive material. Examples of conductive materials that can be used as the first guiding electrode LE1 include metals, alloys, metal nitrides, conductive metal oxides, transparent conductive materials, etc. The conductive materials can be used alone or in combination with each other.

[0093] The first circuit board CB1 can be connected to the first pad electrode PE1 via the first adhesive film ACF1. For example, the first guide electrode LE1 of the first circuit board CB1 can be connected to the first pad electrode PE1 via the first adhesive film ACF1. For example, the first adhesive film ACF1 can be disposed between the first pad electrode PE1 and the first guide electrode LE1.

[0094] The first adhesive film ACF1 may include a first adhesive member RS1 and a first conductive ball CDB1 distributed within the first adhesive member RS1. The first circuit board CB1 can be connected to the pad area PA on the first substrate SUB1 through the first adhesive member RS1, and can be electrically connected to the first pad electrode PE1 through the first conductive ball CDB1 located between the first pad electrode PE1 and the first guide electrode LE1.

[0095] The first adhesive member RS1 may include an insulating adhesive material. For example, the first adhesive member RS1 may include a thermosetting resin, a UV-curable resin, a thermoplastic resin, etc. Each of the first conductive balls CDB1 may include a conductive material. For example, each of the first conductive balls CDB1 may include polymer particles and a metal coating coated on the polymer particles. However, this disclosure is not necessarily limited thereto, and each of the first conductive balls CDB1 may be a nanowire or conductive adhesive made of a conductive material.

[0096] In a plan view, the first adhesive film ACF1 and the driver chip DIC may be arranged side by side along the second direction DR2. In embodiments of this disclosure, the first adhesive film ACF1 may be arranged between the driver chips DIC in the plan view. For example, the first adhesive film ACF1 may be located on the second direction DR2 of one of the driver chips DIC, and the first adhesive film ACF1 may be located in the opposite direction to the second direction DR2 of the other driver chip DIC.

[0097] The first adhesive film ACF1 may not overlap with the driver chip DIC in the first direction DR1. For example, the first adhesive film ACF1 may not be arranged on the first direction DR1 of the driver chip DIC. For example, in a plan view, the first adhesive film ACF1 may not be arranged below the driver chip DIC, but may be arranged on the left and / or right side of each of the driver chips DIC.

[0098] like Figure 7 and Figure 9 As shown, the second circuit board CB2 may include a second base substrate BS2 and a second pad electrode PE2. Furthermore, the first circuit board CB1 may also include a second guide electrode LE2.

[0099] In embodiments of this disclosure, the second base substrate BS2 may be a rigid substrate. For example, the second base substrate BS2 may not be substantially flexible. In this case, the second circuit board CB2 may be rigid. In embodiments of this disclosure, the second base substrate BS2 may be a flexible substrate. For example, the second base substrate BS2 may be flexible. In this case, the second circuit board CB2 may be flexible.

[0100] The second pad electrode PE2 may be disposed on the side of the second base substrate BS2 facing the first circuit board CB1. In embodiments of this disclosure, the second pad electrode PE2 may be disposed along a second direction DR2. The second pad electrode PE2 may be electrically connected to the first circuit board CB1.

[0101] The second pad electrode PE2 may include a conductive material. Examples of conductive materials that can be used as the second pad electrode PE2 include metals, alloys, metal nitrides, conductive metal oxides, transparent conductive materials, etc. The conductive materials can be used alone or in combination with each other.

[0102] The second guiding electrode LE2 may be disposed on the side of the first base substrate BS1 facing the second circuit board CB2. For example, the second guiding electrode LE2 may be disposed on the opposite side of the first base substrate BS1 where the first guiding electrode LE1 is disposed. The second guiding electrode LE2 may be electrically connected to the second pad electrode PE2. In a plan view, each of the second guiding electrodes LE2 may overlap with the second pad electrode PE2. For example, the second guiding electrode LE2 may be arranged to correspond to the second pad electrode PE2 in a plan view. In an embodiment of this disclosure, the second guiding electrode LE2 may be disposed along a second direction DR2.

[0103] The first circuit board CB1 can be connected to the second pad electrode PE2 via the second adhesive film ACF2. For example, the second guide electrode LE2 of the first circuit board CB1 can be connected to the second pad electrode PE2 via the second adhesive film ACF2. For example, the second adhesive film ACF2 can be disposed between the second pad electrode PE2 and the second guide electrode LE2.

[0104] The second adhesive film ACF2 may include a second adhesive member RS2 and a second conductive ball CDB2 distributed within the second adhesive member RS2. The first circuit board CB1 can be connected to the second circuit board CB2 via the second adhesive member RS2, and can be electrically connected to the second pad electrode PE2 via the second conductive ball CDB2 located between the second pad electrode PE2 and the second guide electrode LE2.

[0105] The second adhesive member RS2 may include an insulating adhesive material. For example, the second adhesive member RS2 may include a thermosetting resin, a UV-curable resin, a thermoplastic resin, etc. Each of the second conductive spheres CDB2 may include a conductive material. For example, each of the second conductive spheres CDB2 may include polymer particles and a metal coating coated on the polymer particles. However, this disclosure is not necessarily limited thereto, and each of the second conductive spheres CDB2 may be a nanowire or conductive adhesive made of a conductive material.

[0106] In the process of bonding the first circuit board CB1 to the pad area PA on the first substrate SUB1, a bonding tool can be used. When the bonding tool is used for clamping, the first pad electrode PE1 and the first guide electrode LE1 can be bonded to each other through the first adhesive film ACF1, and the first conductive ball CDB1 can electrically connect the first pad electrode PE1 and the first guide electrode LE1.

[0107] In the display device DD1 according to an embodiment of the present disclosure, in a plan view, the first pad electrode PE1 connected to the first circuit board CB1 may not be arranged below the driver chip DIC, but may be placed on the left and / or right side of each of the driver chips DIC. For example, spaces for applying a bonding tool to the first substrate SUB1 without interfering with the driver chip DIC may be formed on the left and / or right side of each of the driver chips DIC, and a separate space for applying the bonding tool to the first substrate SUB1 may not be formed below the driver chip DIC. Accordingly, the width of the pad region PA in the first direction DR1 can be reduced. For example, the dead zone of the display device DD1 can be reduced. Accordingly, the visibility of the display device DD1 can be improved.

[0108] Figure 11 This is a plan view showing a display device according to an embodiment of the present disclosure. Figure 12 It is shown Figure 11 A plan view of the display panel, the first circuit board, and the second circuit board before their connection. Figure 13 It is shown Figure 11 A plan view of the first circuit board bent. Figure 14 It is along Figure 13 A cross-sectional view taken from line V-V'.

[0109] Reference Figures 11 to 14 The display device DD2 according to the embodiments of the present disclosure may include a display panel DP2, a driver chip DIC, a first circuit board CB1, and a second circuit board CB2.

[0110] In addition to the trench TRC defined by the first substrate SUB1, Figures 11 to 14 The DP2 display panel can be used with Figures 6 to 10 The display panel DP1 is essentially the same. Without a detailed description of the components, it can be assumed that the components are the same. Figures 6 to 10 The corresponding elements already described are at least similar.

[0111] In embodiments of this disclosure, at least a portion of the first substrate SUB1 may be recessed to define a trench TRC. For example, a portion of the long side of the first substrate SUB1 extending along the second direction DR2 in the first direction DR1 may be recessed in a direction opposite to the first direction DR1 to define the trench TRC. For example, the trench TRC may be defined in a pad region PA.

[0112] The trench TRC may be located on the first direction DR1 of the first pad electrode PE1. In a plan view, at least a portion of each of the first circuit boards CB1 may overlap with the trench TRC. For example, as Figure 13 and Figure 14As shown, in an embodiment of this disclosure, the flexible first circuit board CB1 is bendable such that the second circuit board CB2 is positioned below the display panel DP2. In this case, at least a portion of each of the first circuit boards CB1 may be located within a trench TRC. For example, the first circuit board CB1 can be bent through the space defined by the trench TRC.

[0113] According to an embodiment of this disclosure in which the first substrate SUB1 defines a trench TRC, the bend formed by bending the first circuit board CB1 can be located within the space defined by the trench TRC. Accordingly, the bend does not protrude beyond the long side of the first substrate SUB1 in the first direction DR1. Accordingly, the total width of the display device DD2 in the first direction DR1 can be reduced. For example, the dead zone of the display device DD2 can be further reduced. Accordingly, the visibility of the display device DD2 can be further improved.

[0114] Figure 15 This is a plan view showing a display device according to an embodiment of the present disclosure. Figure 16 It is shown Figure 15 A plan view of the bent circuit board.

[0115] Reference Figure 15 and Figure 16 The display device DD3 according to the embodiments of the present disclosure may include a display panel DP3, a driver chip DIC, and a circuit board CB.

[0116] In addition to the trench TRC' defined by the first substrate SUB1, Figure 15 and Figure 16 The DP3 display panel can be used with Figures 1 to 5 The display panel DP is essentially the same. Without a detailed description of the components, it can be assumed that the components are the same. Figures 1 to 5 The corresponding elements described in the text are at least similar.

[0117] In embodiments of this disclosure, at least a portion of the first substrate SUB1 may be recessed and define a trench TRC'. For example, a portion of the long side of the first substrate SUB1 extending along the second direction DR2 in the first direction DR1 may be recessed in the opposite direction to the first direction DR1 to define the trench TRC'. For example, the trench TRC' may be defined in the pad region PA.

[0118] The trench TRC' may be located on the first direction DR1 of the pad electrode PE. In a plan view, at least a portion of the circuit board CB may overlap with the trench TRC'. For example, in an embodiment of this disclosure, when the flexible circuit board CB is bent such that a portion of the circuit board CB is located below the display panel DP3, at least a portion of the circuit board CB may be located in the trench TRC'. For example, the circuit board CB may be bent through the space defined by the trench TRC'.

[0119] According to an embodiment of this disclosure in which the first substrate SUB1 defines a trench TRC', the bend formed by bending the circuit board CB can be located within the space defined by the trench TRC'. Accordingly, the bend does not protrude beyond the long side of the first substrate SUB1 in the first direction DR1. Accordingly, the total width of the display device DD3 in the first direction DR1 can be reduced. For example, the dead zone of the display device DD3 can be further reduced. Accordingly, the visibility of the display device DD3 can be further improved.

[0120] Figure 17 This is a plan view showing a display device according to an embodiment of the present disclosure.

[0121] Reference Figure 17 The display device DD4 according to the embodiments of the present disclosure may include a display panel DP, a driver chip DIC, a first circuit board CB1 and a second circuit board CB2.

[0122] In the display device DD4 according to an embodiment of the present disclosure, at least some of the first pad electrodes PE1 may be located on both sides of one of the driver chips DIC along the second direction DR2. For example, in a plan view, the first pad electrodes PE1 may be located on both the left and right sides of each of the driver chips DIC.

[0123] For example, some of the first pad electrodes PE1 may be located on the second direction DR2 of one of the driver chips DICs, and another portion of the first pad electrodes PE1 may be located on the driver chip DIC in a direction opposite to the second direction DR2. Furthermore, yet another portion of the first pad electrodes PE1 may be located on the second direction DR2 of another driver chip in the driver chip DIC, and yet another portion of the first pad electrodes PE1 may be located on the driver chip DIC in a direction opposite to the second direction DR2. For example, the driver chips DICs may be arranged along the second direction DR2 between the first pad electrodes PE1s.

[0124] In a display device DD4 according to one embodiment of the present disclosure, corresponding to the arrangement of the first pad electrodes PE1, at least some of the first circuit boards CB1 may be located on both sides of one of the driver chips DIC along the second direction DR2. For example, in a plan view, the first circuit boards CB1 may be located on both the left and right sides of each of the driver chips DIC.

[0125] Similarly, corresponding to the arrangement of the first pad electrodes PE1, at least some of the first guide electrodes LE1 may be located on both sides of one of the driver chips DIC along the second direction DR2. For example, in a plan view, the first guide electrodes LE1 may be located on both the left and right sides of each of the driver chips DIC.

[0126] According to an embodiment of this disclosure in which the first pad electrode PE1 is located on both the left and right sides of each driver chip DIC in a plan view, the design of the connection wiring connecting the driver chip DIC and the first pad electrode PE1 is relatively easy. For example, the connection wiring can be easily designed without increasing the width of the pad area PA in the first direction DR1. For example, the dead zone of the display device DD4 can be further reduced. Accordingly, the visibility of the display device DD4 can be further improved.

[0127] Figure 18 This is a plan view showing a display device according to an embodiment of the present disclosure.

[0128] Reference Figure 18 The display device DD5 according to embodiments of the present disclosure may include a display panel DP, a driver chip DIC, and a circuit board CB'.

[0129] In a display device DD5 according to one embodiment of the present disclosure, at least some of the pad electrodes PE may be located on opposite sides of one of the driver chips DIC along the second direction DR2. For example, in a plan view, the pad electrodes PE may be located on both the left and right sides of each of the driver chips DIC.

[0130] For example, some of the pad electrodes PE may be located on the second direction DR2 of one of the driver chips DIC, and another portion of the pad electrodes PE may be located on the driver chip DIC in a direction opposite to the second direction DR2. Furthermore, yet another portion of the pad electrodes PE may be located on the second direction DR2 of another driver chip DIC, and yet another portion of the pad electrodes PE may be located on the driver chip DIC in a direction opposite to the second direction DR2. For example, the pad electrodes PE may be arranged between the driver chips DIC along the second direction DR2.

[0131] In the display device DD5 according to an embodiment of the present disclosure, corresponding to the arrangement of the pad electrodes PE, a portion of the circuit board CB' may be located on both sides of one of the driver chips DIC along the second direction DR2. For example, in a plan view, a portion of the circuit board CB' may be located on both the left and right sides of each of the driver chips DIC.

[0132] Similarly, corresponding to the arrangement of the pad electrodes PE, at least some of the guide electrodes LE may be located on both sides of one of the driver chips DIC along the second direction DR2. For example, in a plan view, the guide electrodes LE may be located on both the left and right sides of each of the driver chips DIC.

[0133] According to an embodiment of this disclosure in which the pad electrodes PE are located on both the left and right sides of each driver chip DIC in a plan view, the design of the connection wiring connecting the driver chip DIC and the pad electrodes PE is relatively easy. For example, the connection wiring can be easily designed without increasing the width of the pad area PA in the first direction DR1. For example, the dead zone of the display device DD5 can be further reduced. Accordingly, the visibility of the display device DD5 can be further improved.

[0134] Figure 19 This is a block diagram illustrating an electronic device according to an embodiment of the present disclosure. Figure 20 This is a schematic diagram illustrating an electronic device according to various embodiments.

[0135] Reference Figures 1 to 20 An electronic device 1000 according to one embodiment of the present disclosure can, for example, correspond to Figure 1 The display module 1140 of the display device shown outputs various information (e.g., images, text, music, etc.). When the processor 1110 executes an application stored in the memory 1120, the display module 1140 can provide application information to the user through the display panel 1141.

[0136] In some embodiments, the electronic device 1000 may be configured as a smartphone 10_1a, a camera, a smartwatch 10_2c, a tablet PC 10_1b, a laptop computer 10_1c, a television 10_1d (e.g., a smart TV), a desktop monitor 10_1e, or an automotive display. For example, the electronic device 1000 may be a smartphone 10_1a including a touch-sensitive display area DA for interaction and a non-display area NDA including sensors and circuitry for enhanced functionality. For example, the electronic device 1000 may be a television 10_1d or a monitor 10_1e including a large display area DA for high-resolution video playback and a non-display area NDA containing drive circuitry or connection modules for external input. For example, the electronic device 1000 may be smart glasses 10_2a, a head-mounted display 10_2b, a smartwatch 10_2c, or an automotive electronic device 10_3 including a display area DA optimized for compact and high-definition vision and a non-display area NDA integrating biosensors for health monitoring. In some cases, the electronic device 1000 can be an AR / VR headset.

[0137] In some implementations, memory 1120 may store information such as software code for operating application 1123. Application 1123 may include software designed to perform specific tasks or provide functionality to a user. Application 1123 may operate under the control of processor 1110 and utilize data stored in memory 1120 to deliver a wide range of features, such as productivity tools, multimedia streaming and playback, file or email delivery, or communication services. Application 1123 interacts seamlessly with user interface 1161 or touchscreen 1142, enabling users to launch, navigate, and use the program through user input such as touch, click, gestures, or voice interaction.

[0138] When a user selects an application via touchscreen 1142 or user interface 1161, processor 1110 can execute application program 1123 corresponding to the selected application retrieved from memory 1120 to perform the functions of that application. For example, when a user selects a camera application by clicking an icon (or camera application icon) presented on display panel 1141, processor 1110 activates the camera module. Processor 1110 can then send image data corresponding to a captured image obtained by the camera module to display module 1140. Display module 1140 can then display the image corresponding to the captured image via display panel 1141.

[0139] As another example, when a user wishes to make a phone call, the user clicks the phone icon displayed on the display module 1140, and the processor 1110 can execute the phone application stored in the memory 1120. The phone keypad can be displayed on the display panel 1141 for the user to enter a phone number to make the call.

[0140] As another example, the display module 1140 can be integrated into an electronic device 1000 such as a laptop computer, smart TV, or tablet computer. Users wishing to access multimedia streaming applications (e.g., watching music videos or movies) can do so by clicking the corresponding icon. This action activates the application, allowing the user to view the streaming content.

[0141] Processor 1110 may include a main processor 1111 and an auxiliary or coprocessor 1112. The main processor 1111 may include a central processing unit (CPU). The main processor 1111 may also include one or more of a graphics processing unit (GPU), a communication processor (CP), and an image signal processor (ISP).

[0142] The coprocessor 1112 may include a controller 1112-1. The controller 1112-1 may include interface conversion circuitry and timing control circuitry. The controller 1112-1 may receive image signals from the main processor 1111, convert the data format of the image signals to match the interface specifications of the display module 1140, and output image data. The controller 1112-1 may output various control signals to drive the display module 1140. For example, the controller 1112-1 may drive the display module 1140 to display icons suitable for user selection on the screen to execute the application program 1123.

[0143] The memory 1120 may store one or more applications 1123 and various data used by at least one component of the electronic device 1000 (e.g., processor 1110 or user interface 1161), as well as input or output data for commands associated therewith. For example, camera applications, GPS applications, augmented reality and virtual reality applications, and other applications that can be executed by the processor 1110 when a user selects a corresponding icon presented on the display screen (or display panel 1141) via the touchscreen 1142 or user interface 1161 may be stored in the memory 1120. Furthermore, various setting data corresponding to user settings may be stored in the memory 1120. The memory 1120 may include volatile memory 1121 and non-volatile memory 1122.

[0144] Display module 1140 can output visual information (images) to a user. Display module 1140 may include a display panel 1141, a gate driver, a source driver, a voltage generation circuit, and a touchscreen 1142. Display module 1140 may also include a window, a chassis, and a bracket to protect the display panel 1141. Display module 1140 may include... Figure 1 At least a portion of the configuration of the display device shown.

[0145] User interface 1161 serves as an interaction medium between the user and electronic device 1000. User interface 1161 can detect input from a part of the user's body (e.g., a finger) or from a pen or mouse, and generate electrical signals or data values ​​corresponding to the input. User interface 1161 includes a fingerprint sensor 1162, an input sensor 1163, and a digitizer 1164.

[0146] The fingerprint sensor 1162 can sense fingerprints for user biometric identification and can also measure one or more biometric signals, such as blood pressure, humidity, or weight.

[0147] Input sensor 1163 can sense user interactions including touch, click, gesture, motion, voice commands, and eye movements. Input sensor 1163 includes optical sensors for image capture, eye tracking, or motion and gesture detection. The optical sensors can be infrared or semiconductor photodetectors. Input sensor 1163 includes audio and acoustic sensors, which can be MEMS microphones for voice recognition or voice-based interaction. The audio and acoustic sensors can be mounted as part of user interface 1161 or embedded in display panel 1141.

[0148] The digitizer 1164 can generate data values ​​corresponding to the coordinate information input by a pen or mouse to control the movement of the screen cursor. The digitizer 1164 can also generate electromagnetic changes caused by the input as data values. The digitizer 1164 can detect input from a passive pen or send and receive data with an active pen or remote control.

[0149] At least one of the fingerprint sensor 1162, the input sensor 1163, and the digitizer 1164 may be implemented as a sensor layer formed on the top layer of the display panel 1141 by a process that is continuous with the process of forming the elements (e.g., light-emitting elements, transistors, etc.) included in the display panel 1141.

[0150] In addition, the user interface 1161 may also include, for example, a gesture sensor, a gyroscope sensor for sensing rotational motion, an accelerometer sensor for tracking translational motion, a grip sensor, a pressure sensor, a proximity sensor, a color sensor, an infrared (IR) emitter and camera sensor for tracking gaze direction and eye movement, a temperature sensor, or a light sensor. For example, the gyroscope sensor, accelerometer sensor, infrared emitter, and camera may be particularly suitable for AR / VR headset functionality.

[0151] Touchscreen 1142 includes a touch sensor embedded in a semiconductor layer of display panel 1141 to sense pressure applied to the top layer (screen) of display panel 1141. The touch sensor can be capacitive or resistive. Touchscreen 1142 can be used as the main interface for user selection and navigation applications, control, and interaction with electronic device 1000.

[0152] The display panel 1141 (or display) may include a liquid crystal display panel, an organic light-emitting display panel, or an inorganic light-emitting display panel, and there is no particular limitation on the type of display panel 1141. The display panel 1141 may be of a rigid type or a flexible type capable of being rolled or folded. The display module 1140 may also include a support member, bracket, heat dissipation component, etc., supporting the display panel 1141. The display panel 1141 may include... Figure 1 The display device shown.

[0153] Power module 1150 supplies power to components of electronic device 1000. Power module 1150 may include a battery that provides a power supply voltage. The battery may include a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. Power module 1150 may include a power management integrated circuit (PMIC). The PMIC can supply optimized power to each of the aforementioned components, including display module 1140.

[0154] Figure 20 This is a schematic diagram illustrating an electronic device according to various embodiments.

[0155] Reference Figure 20 The application uses a display device according to the implementation method (e.g., Figure 1 and Figure 3 Display device DD, Figures 6 to 8 Display device DD1, Figures 11 to 14 Display device DD2, Figure 15 and Figure 16 Display device DD3, Figure 17 Display device DD4 or Figure 18 The various electronic devices (DD5) of the display device may include not only image display electronic devices such as smartphones 10_1a, tablet PCs 10_1b, laptop computers 10_1c, TVs 10_1d and desktop monitors 10_1e, but also wearable electronic devices with display modules (such as smart glasses 10_2a, head-mounted displays 10_2b and smartwatches 10_2c), and automotive electronic devices with display modules (such as car dashboards, center consoles, center information displays (CIDs) arranged on the dashboard and interior mirror displays).

[0156] Although the present disclosure has been described above with reference to exemplary embodiments, it should be understood that various modifications and changes can be made to the present disclosure by those skilled in the art without departing from the spirit and scope of the present disclosure as defined by the appended claims.

Claims

1. A display device, characterized by comprising: The display device includes: A substrate, the substrate including a display area and a pad area arranged adjacent to one side of the display area; A driver chip, the driver chip being disposed in the pad area and located in a first direction on one side of the display area; A plurality of pad electrodes are arranged in the pad region and along a second direction perpendicular to the first direction; and A circuit board including a plurality of guide electrodes connected to the plurality of pad electrodes, wherein a portion of the circuit board overlaps with at least a portion of the pad region of the substrate.

2. The display device according to claim 1, wherein The driver chip is mounted on the substrate.

3. The display device according to claim 1, wherein The plurality of pad electrodes are arranged spaced apart from the driver chip along the second direction.

4. The display device according to claim 1, wherein At least a portion of the circuit board overlaps with the driver chip in the second direction.

5. The display device according to claim 1, characterized in that, The display device further includes an adhesive film disposed between the plurality of pad electrodes and the plurality of guide electrodes for connecting the plurality of pad electrodes to the plurality of guide electrodes.

6. The display device according to claim 1, characterized in that, The circuit board is flexible.

7. The display device according to claim 1, characterized in that, The circuit board is rigid.

8. The display device according to claim 1, characterized in that, The substrate is recessed to define trenches, and The trenches are arranged in the first direction of the plurality of pad electrodes.

9. A display device, characterized in that, The display device includes: A substrate, the substrate including a display area and a pad area arranged adjacent to one side of the display area; A first driver chip and a second driver chip are arranged in the pad area and located in a first direction on one side of the display area; A plurality of first pad electrodes are arranged in the pad region adjacent to the first driver chip and along a second direction perpendicular to the first direction; A plurality of second pad electrodes, the plurality of second pad electrodes being arranged in the pad region adjacent to the second driver chip and arranged along the second direction; and A first circuit board, wherein a portion of the first circuit board overlaps with at least a portion of the pad region of the substrate and is connected to the first pad electrode.

10. An electronic device, characterized in that, The electronic device includes: processor; A memory having stored applications for execution by the processor; The display device includes: A substrate, the substrate including a display area and a pad area arranged adjacent to one side of the display area; A driver chip, the driver chip being disposed in the pad area and located in a first direction on one side of the display area; Multiple pad electrodes are arranged in the pad region and along a second direction perpendicular to the first direction; A circuit board, wherein a portion of the circuit board overlaps with at least a portion of the pad region of the substrate and is connected to the pad electrode; and A user interface configured to sense user input via touch or cursor selection of an icon presented on a display panel, wherein, upon receiving the user input, the processor executes one or more of the stored applications.

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