A rectifier bridge power device

Abstract

The utility model relates to the field of semiconductor component, disclose a rectifier bridge power device, including a plurality of containing groove, a plurality of containing groove all are set up in the top surface of installation shell, the inside bottom surface of containing groove is set up and contains the hole, the inside setting of installation shell is in rectifier bridge body, a plurality of pins are fixed on rectifier bridge body, the pin penetrates containing hole, the pin and rectifier bridge body between electric connection, the heat dissipation subassembly, the heat dissipation subassembly sets up in the inside of installation shell, in the utility model, through the cooperation of graphene board, heat conduction plate, heat storage cavity, can guide the heat that rectifier bridge body produced in installation shell to transfer, make the heat in the inside cavity of installation shell can quickly conduct to the graphene board on, thereby the graphene board will conduct heat to the heat storage cavity, and then the heat conduction plate will conduct the heat in the heat storage cavity to installation shell outside, thereby can reduce the working temperature of rectifier bridge body.

Description

Technical Field

[0001] This utility model relates to the technical field of semiconductor components, specifically a rectifier bridge power device. Background Technology

[0002] A rectifier is a bridge structure composed of four rectifier diodes. It uses the unidirectional conductivity of diodes to rectify alternating current. Since the efficiency of bridge rectifiers in utilizing input sine waves is twice that of half-wave rectification, it is a significant improvement over diode half-wave rectification and is therefore widely used in circuits that convert alternating current to direct current.

[0003] Chinese Patent Publication No. CN209471955U discloses an ultra-thin high-power rectifier bridge component, characterized in that a first bracket and a second bracket are respectively disposed on the lower left and lower right sides near the plastic package, and the first bracket and the second bracket extend downward to the outside of the plastic package to form a first pin and a second pin as two AC input terminals; a third bracket is disposed on the upper right side near the plastic package; and a fourth bracket is disposed between the first bracket and the second bracket and extends upward to the space between the first bracket and the third bracket, and the third bracket and the fourth bracket extend upward to the outside of the plastic package to form a third pin and a fourth pin as two DC output terminals.

[0004] In the above solution, by rationally arranging the four supports in the plastic package and connecting them to the corresponding chips, the proportion of the moldable PAD surface to the package plane area can be maximized under the same plastic package size. However, it has the following disadvantages: the rectifier bridge component does not have a structure for heat dissipation, which causes the heat generated by the rectifier bridge during operation to accumulate, which can easily affect the stability and service life of the rectifier bridge. Utility Model Content

[0005] The purpose of this invention is to provide a rectifier bridge power device to solve the problem that the lack of a heat dissipation structure for the rectifier bridge components leads to the accumulation of heat generated during operation, which can easily affect the stability and service life of the rectifier bridge.

[0006] To achieve the above-mentioned utility model objectives, the present utility model adopts the following technical solution: a rectifier bridge power device, comprising a plurality of receiving slots, all of which are formed on the top surface of a mounting housing, and receiving holes formed on the inner bottom surface of the receiving slots. A rectifier bridge body is disposed inside the mounting housing, and a plurality of pins are fixed on the rectifier bridge body. The pins pass through the receiving holes and are electrically connected to the rectifier bridge body. A heat dissipation assembly is disposed inside the mounting housing for dissipating heat from the rectifier bridge body.

[0007] Preferably, the heat dissipation component includes a copper substrate, which is snapped onto the inner wall of the mounting housing. The bottom surface of the pin is fixed to the top surface of the copper substrate. A ceramic plate is fixed to the top surface of the copper substrate, and the top surface of the ceramic plate is fixed to the bottom surface of the rectifier bridge body. Mounting holes are provided on both the left and right sides of the outer wall of the mounting housing. A graphene plate is fixed to the inner wall of the mounting hole, and a heat-conducting plate is fixed to the inner wall of the mounting hole. A heat storage cavity is formed between the heat-conducting plate and the graphene plate.

[0008] Preferably, the top surface of the rectifier bridge body is covered with thermally conductive silicone.

[0009] Preferably, a varistor is fixed on the top surface of the copper substrate, and the varistor is electrically connected to the rectifier bridge body.

[0010] Preferably, a fixing plate is fixed to both the front and rear sides of the mounting shell, and a fixing hole is opened on the top surface of the fixing plate. A fixing bolt is slidably inserted into the inner wall of the fixing hole.

[0011] Preferably, the rectifier bridge body is composed of four diodes and four thyristors, and the four diodes and four thyristors are in the same plane.

[0012] Compared with the prior art, the present invention has the following beneficial effects:

[0013] 1. By combining graphene plates, heat-conducting plates, and heat storage chambers, the heat generated by the rectifier bridge within the mounting housing can be transferred and guided. Heat within the internal cavity of the mounting housing can be rapidly conducted to the graphene plates, which in turn conduct the heat to the heat storage chamber. The heat-conducting plates then conduct the heat from the heat storage chamber to the outside of the mounting housing. This significantly reduces the operating temperature of the rectifier bridge, extends its lifespan, and improves circuit stability. The graphene plates and heat-conducting plates also distribute heat evenly across the entire heat dissipation surface, preventing localized overheating and improving the reliability of the rectifier bridge. 2. Thermally conductive silicone can rapidly transfer the heat generated by the rectifier bridge to the internal cavity of the mounting housing, allowing the graphene plates to absorb and conduct the heat, thus reducing the operating temperature of internal components. Simultaneously, the thermally conductive silicone typically has insulating properties, preventing electrical short circuits between the rectifier bridge and the heat dissipation components or mounting housing.

[0014] Second, varistors protect components such as the rectifier bridge. When the voltage in the circuit exceeds its threshold, the resistance of the varistor drops sharply, absorbing and releasing the overvoltage energy, thus protecting the rectifier bridge from voltage spikes or surges and extending its service life. Fixing bolts secure the mounting plate and housing, ensuring a stable fixation to the mounting surface, effectively improving the stability of the rectifier bridge during operation and consequently increasing its efficiency. Attached Figure Description

[0015] Figure 1 This is a three-dimensional schematic diagram of an embodiment.

[0016] Figure 2 This is a breakdown diagram of an embodiment.

[0017] Figure 3 Examples Figure 2 Enlarged diagram of point A in the middle.

[0018] In the diagram: 1. Receiving groove; 2. Mounting shell; 3. Receiving hole; 4. Rectifier bridge body; 5. Pin; 6. Copper substrate; 7. Ceramic plate; 8. Mounting hole; 9. Graphene plate; 10. Heat-conducting plate; 11. Heat storage cavity; 12. Thermally conductive silicone; 13. Varistor; 14. Fixing plate; 15. Fixing hole; 16. Fixing bolt. Detailed Implementation

[0019] The preferred embodiments of this utility model will now be described in detail with reference to the accompanying drawings.

[0020] like Figures 1-3 As shown, a rectifier bridge power device includes several receiving slots 1, all of which are formed on the top surface of a mounting housing 2. The bottom surface of each receiving slot 1 has a receiving hole 3. A rectifier bridge body 4, model MDC, is disposed inside the mounting housing 2. Several pins 5 are fixed on the rectifier bridge body 4, passing through the receiving holes 3 and electrically connected to the rectifier bridge body 4. A heat dissipation assembly is disposed inside the mounting housing 2 to dissipate heat from the rectifier bridge body 4. The device includes a copper substrate 6, which is snapped onto the inner wall of the mounting housing 2. The bottom surface of the pin 5 is fixed to the top surface of the copper substrate 6. A ceramic plate 7 is fixed to the top surface of the copper substrate 6, and the top surface of the ceramic plate 7 is fixed to the bottom surface of the rectifier bridge body 4. Mounting holes 8 are provided on both the left and right sides of the outer wall of the mounting housing 2. A graphene plate 9 is fixed to the inner wall of the mounting hole 8, and a heat-conducting plate 10 is fixed to the inner wall of the mounting hole 8. A heat storage cavity 11 is formed between the heat-conducting plate 10 and the graphene plate 9. The top surface of the rectifier bridge body 4 is covered with thermally conductive silicone 12.

[0021] In use, the combination of graphene plate 9, heat-conducting plate 10, and heat storage cavity 11 can transfer and guide the heat generated by the rectifier bridge body 4 inside the mounting shell 2. This allows the heat inside the cavity of the mounting shell 2 to be quickly conducted to the graphene plate 9, which in turn conducts the heat to the heat storage cavity 11. The heat-conducting plate 10 then conducts the heat from the heat storage cavity 11 to the outside of the mounting shell 2. This significantly reduces the operating temperature of the rectifier bridge body 4, extends its service life, and improves circuit stability. The graphene plate 9 and heat-conducting plate 10 can evenly distribute heat across the entire heat dissipation surface, preventing localized overheating and improving the reliability of the rectifier bridge body 4. The thermally conductive silicone 12 can quickly transfer the heat generated by the rectifier bridge body 4 to the cavity inside the mounting shell 2, allowing the graphene plate 9 to absorb and conduct the heat, thereby reducing the operating temperature of the internal components. Simultaneously, the thermally conductive silicone 12 typically has insulating properties, preventing electrical short circuits between the rectifier bridge body 4 and the heat dissipation components or the mounting shell 2.

[0022] like Figures 1-3 As shown, a varistor 13 is fixed on the top surface of the copper substrate 6. The varistor 13 is electrically connected to the rectifier bridge body 4. Fixing plates 14 are fixed on the front and rear sides of the mounting shell 2. Fixing holes 15 are opened on the top surface of the fixing plates 14. Fixing bolts 16 are slidably inserted into the inner wall of the fixing holes 15. The rectifier bridge body 4 is composed of four diodes and four thyristors. The four diodes and four thyristors are on the same plane.

[0023] During use, the varistor 13 protects components such as the rectifier bridge body 4. When the voltage in the circuit exceeds its threshold, the resistance of the varistor 13 drops sharply, absorbing and releasing the overvoltage energy, thus protecting the rectifier bridge body 4 from damage by voltage spikes or surges, and extending its service life. The fixing bolts 16 secure the fixing plate 14 and the mounting shell 2, ensuring the mounting shell 2 is stably fixed to the fixing surface, effectively improving the stability of the rectifier bridge body 4 during operation and consequently increasing its working efficiency.

[0024] The above description is only a preferred embodiment of the present utility model, but the protection scope of the present utility model is not limited thereto. Any equivalent substitutions or changes made by those skilled in the art within the technical scope disclosed in the present utility model, based on the technical solution and the inventive concept of the present utility model, should be included within the protection scope of the present utility model.

Claims

1. A rectifier bridge power device, comprising a plurality of receiving slots (1), wherein all of the plurality of receiving slots (1) are formed on the top surface of a mounting housing (2), characterized in that, The inner bottom surface of the receiving groove (1) is provided with a receiving hole (3), the inside of the mounting shell (2) is provided with the rectifier bridge body (4), a number of pins (5) are fixed on the rectifier bridge body (4), the pins (5) pass through the receiving hole (3), and the pins (5) are electrically connected to the rectifier bridge body (4). A heat dissipation assembly is disposed inside the mounting shell (2) for dissipating heat from the rectifier bridge body (4). The heat dissipation assembly includes a copper substrate (6), which is snapped onto the inner wall of the mounting shell (2). The bottom surface of the pin (5) is fixed to the top surface of the copper substrate (6). A ceramic plate (7) is fixed to the top surface of the copper substrate (6), and the top surface of the ceramic plate (7) is fixed to the bottom surface of the rectifier bridge body (4). Mounting holes (8) are provided on both the left and right sides of the outer wall of the mounting shell (2). A graphene plate (9) is fixed to the inner wall of the mounting hole (8), and a heat-conducting plate (10) is fixed to the inner wall of the mounting hole (8). A heat storage cavity (11) is formed between the heat-conducting plate (10) and the graphene plate (9). The top surface of the rectifier bridge body (4) is covered with thermally conductive silicone (12). A varistor (13) is fixed on the top surface of the copper substrate (6), and the varistor (13) is electrically connected to the rectifier bridge body (4). The rectifier bridge body (4) consists of four diodes and four thyristors, with the four diodes and four thyristors on the same plane.

2. The rectifier bridge power device according to claim 1, characterized in that: The mounting shell (2) is fixed with a fixing plate (14) on both the front and rear sides. The top surface of the fixing plate (14) is provided with a fixing hole (15), and a fixing bolt (16) is slidably inserted into the inner wall of the fixing hole (15).

Images